Thermal Vacuum Manuals.pdf

Effective Date: 04/28/2015 Approved by: Yan Lui Title: Code 549 Thermal Vacuum Group Lead

Code 549 Operating Manual

Title: Facility 315 Operating Manual

Table of Contents

1 Facility Description

1.1 Theory of Operation

1.2 Temperature Mode

1.3 Flux Mode

1.4 Zero-Q Mode

1.5 PLC

1.6 PLC input/output (I/O)

1.7 Current Measurement

1.8 Analog Programming

1.9 Touch Screen

1.10 SCADA

1.11 Heater Description

1.12 Control Thermocouple Placement

1.13 Thermal Stability

1.14 Operational Safety Considerations

2 Facility Operations

2.1 Prestart Checklists / Facility Data Sheets

2.2 Connecting the Heater Rack

2.3 Touch Screen Operation

2.4 Setting Up a Channel (Touchscreen)

2.5 Operating and Monitoring a Channel (Touchscreen)

2.6 Using the CAL/PID Setup Screen (Touchscreen)

2.7 Starting and Stopping the SCADA Program

2.8 SCADA Operation

2.9 SCADA Screen Navigation

2.10 SCADA Network Error Displays

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EFFECTIVE DATE: 04/28/2015

2.11 Operating and Monitoring a Channel (SCADA)

2.12 Disconnecting the Heater Rack

3 Emergency Procedures

3.1 Electrical Power Failure

3.2 PLC Failure

3.3 Thermocouple Failure

Appendix A – Definitions

Appendix B – Acronyms

Appendix C – Prestart Checklist for Facility 315

Appendix D – Manual Overrides & Interlocks

Appendix E – Touch Screen Layouts/Program

Appendix F – PLC Program

Appendix G – Electrical Diagrams

Appendix H – Interconnection Diagram

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Instructions

1 Facility Description

The Facility 315 Heater Control Unit (HCU) is a standalone 12-channel multiple mode temperature and power controller. The HCU is housed in a 19” equipment rack with a caster base. The system’s primary components are a Modicon Quantum Programmable Logic Control (PLC) and 12 Sorensen DCS 150-7E 0-150V 0-4A programmable power supplies. Maximum power is rated at 600W per channel delivered to a 37.5 resistive load. The HCU includes a front panel mounted touch-screen display for local operation and the ModBus Plus port supports remote operation through a Supervisory Control And Data Acquisition (SCADA) system. The SCADA software is an Intellution program that provides remote HCU control capability. By integrating the SCADA into the data system, heater rack data can be saved and viewed historically along with all other chamber sensors through the Thermal Vacuum Data System (TVDS). The SCADA application can monitor and control all HCU’s that are in operation.

1.1 Theory of Operation

HCU operation is based on a Proportional + Integral + Derivative (PID) closed loop control scheme. Integral action moves the proportional band to increase or decrease power in response to temperature deviation from the set point. The integrator slowly changes power output until zero deviation is achieved. Integral action cannot be faster than process response time or oscillation will occur. The HCU has three automatic operational modes: Temperature, Flux, Zero-Q and one Manual control mode. In Manual control mode, the power supply front panel voltage and current knobs are enabled and the remote programming inputs are disabled.

Manual mode is enabled by placing the PLC / Local mode switch in the Local position.

Manual mode is an emergency control mode to be used in the event of PLC failure. In all automatic modes, a 0-5VDC PLC analog output module programs the power supply output level.

1.2 Temperature Mode

In Temperature control mode, a temperature set point is entered in the PLC by touch screen or SCADA. Temperature feedback is provided by a type T thermocouple placed on the test article near the heater element. A PID ladder logic function block compares the temperature set point and control thermocouple temperature. Process temperature is maintained within +/- 2ºC of set point. Heater current and control temperature are continuously monitored for high limit conditions. A high limit alarm or open thermocouple condition results in the immediate shutdown of the affected heater channel.

1.3 Flux Mode

In Flux control mode, a wattage set point is entered at the touch screen or SCADA. The measured heater resistance is entered in the PLC prior to operation. Heater current is monitored using a shunt (i.e. precision resistance) wired in series with the heater circuit. The voltage drop across the shunt is measure by the PLC analog input module and converted to current using I = (E shunt) / (R shunt). Heater power is calculated by the PLC as I2 * R. A PID ladder logic function block compares the wattage set point and calculated heater power.

Power dissipation is maintained within 10% of set point. Heater current is continuously

Document Title: Facility 315 Operating Manual Page 4 of 24 monitored for a high limit condition. A high current limit condition results in the immediate shutdown of the affected heater channel.

1.4 Zero-Q Mode

In Zero-Q control mode, a type T reference thermocouple is placed on the test article near the thermal interface. The reference temperature can be thought of as the process set point. A heater element and type T thermocouple are placed on the ground support equipment (GSE) (i.e. harness, test stand) near the thermal interface. A PID ladder logic function block compares the reference temperature and control thermocouple temperature.

Process temperature is maintained within +/-2ºC of set point. Heater current and control temperature are continuously monitored for high limit conditions. A high limit alarm or open control or reference thermocouple condition results in the immediate shutdown of the affected heater channel.

1.5 PLC

The HCU controller is a Modicon Quantum CPU 113 03. The central processing unit (CPU) module occupies slot 1 of the 140 XBP 01000 10-slot PLC back plane. The CPU supports a maximum of 16k words of ladder logic, 8192 discrete I/Os, and 9999 registers. The CPU logic solve time is <= 1.4 ms / k words. External communication is supported by a 9-pin D-

Document Title: Facility 315 Operating Manual Page 5 of 24 shell Modbus (RS-232) serial port and by a 9-pin D-shell Modbus Plus (RS-485) network port. For complete product specifications refer to the Modicon TSX Quantum Automation Series Hardware Reference Guide, 840 USE 100 00 (Ver. 6.0).

1.6 PLC input/output (I/O)

Temperature Measurement Temperature measurement is provided by two 140 ATI 030 00 8-channel thermocouple (T/C) input modules. The T/C modules occupy slots 2 and 3 of the PLC back plane assembly. The modules are configured to read type T thermocouples in the temperature range of –270ºC to +400ºC with 0.1ºC resolution. Thermocouple measurement accuracy is rated at +/-2ºC plus +/-0.1% of reading. Thermocouple batch deviation errors are not included. Open thermocouple detection is available on the module display and error status word.

1.7 Current Measurement

Current measurements are made by two 140 AVI 030 00 8-channel analog input modules.

The analog modules occupy slots 4 and 5 of the PLC back plane assembly. The analog modules are configured for Unipolar 0-5VDC inputs with a 156.25uV resolution. Analog measurement absolute accuracy error is rated at +/-5% of full scale. Current measurement resolution is calculated as V-shunt / R-shunt or (156.25uV / 0.25625uA. Wattage measurement resolution is calculated as (625uA2 * Heater .

1.8 Analog Programming

Three 140 AVO 020 00 4-channel analog output modules provide 0-5VDC power supply programming signals. The analog output modules occupy slots 6, 7 and 8 of the PLC back plane assembly. The analog modules are configured for unipolar 0-5VDC outputs with 12-bit

Document Title: Facility 315 Operating Manual Page 6 of 24 resolution. Analog output absolute accuracy error is rated at +/-0.15% of full scale with a linearity of +/-1 LSB. The minimum power supply output level step size is defined as V-max / F-Scale counts or (150V / 4095) = 36.6mV.

1.9 Touch Screen

Rack local operations are supported by the Total Control Products 5” Quick Panel jr.

monochrome display. The Quick Panel is a resistive Liquid Crystal Display with 240H by 320W pixel resolution. The Quick Panel is equipped with a DB-25 serial communications interface and a display programming port. The PLC Modbus port is connected to the touch screen serial port. The Quick Panel Modbus display driver supports bi-directional communications. The touch screen software development editor is QuickDesigner Version

3.40 by Total Control Products, Inc. Using QuickDesigner, numeric displays and data entries can be mapped to specific PLC addresses (i.e. registers or discrete). The touch screen programming supports four primary functions: Alarms, Cal Mode, Run Mode, and Setup Mode.

1.9.1 Alarms Screen

The Alarms screen provides heater over-current and over-temperature indication and reset control.

1.9.2 Calibration Screen

The Calibration Mode display supports input of individual shunt calibration sensitivities, display of real-time shunt voltage reading, and separate gain and integral input parameters for Temperature, Zero-Q, and Flux modes.

1.9.3 Runtime Screen

The Run Mode display supports channel on / off, control mode selection, set-point entry and real time process variable temperature and power readings.

1.9.4 Setup Screen

The Setup Mode display supports measured heater resistance; max current, max temperature and power trim inputs. The setup mode also provides Zero-Q reference channel assignment and thermocouple open circuit indication.

1.10 SCADA

Remote operation of an HCU is provided through a desktop computer SCADA interface. The remote application was developed using Intellution SCADA Human Machine Interface (HMI) software. Connection to the Modbus Plus network is established through a Modicon ISA SA- 85 network adapter and communication with the PLC is maintained through an Intellution driver, which is loaded as the SCADA interface is started. For each HCU in operation, two screens provide monitoring and control of each of its twelve power supplies. Buttons provide navigation to each screen that the user must click.

1.10.1 Runtime Screen

The SCADA runtime screen provides real-time data monitoring of each power supply.

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The data monitored include each set point, process variable, mode of operation, alarms, as well as the thermal vacuum database tag names associated with power supply. Control from this screen provides On/Off control, set point adjustment, power percentage adjustment and change of mode of operation.

1.10.2 Setup Screen

The SCADA setup screen allows the operator to remotely enter or adjust maximum heater resistance and current for each supply as well as the Zero-Q channel definition.

1.10.3 Background Scheduler Task

The SCADA is responsible for logging all HCU temperature and power measurements to the thermal vacuum database. This is accomplished through Intellution’s Background Schedule Task Service, which runs in parallel to the HCU Interface.

This service maintains a time-based scheduler that writes values from the PLC to the thermal vacuum database every two minutes. This data is then accessible through TVDS. The background schedule is loaded automatically when the SCADA interface is started and requires no interaction with the operator.

1.11 Heater Description

The standard heaters used for thermal vacuum testing are Kapton polyamide film heaters.

Kapton polyamide film heaters are thin, lightweight, and NASA approved for out gassing.

Kapton polyamide film heaters feature a Resistance Temperature Coefficient (RTC) of

0.00015 ohm/ohm/°C. A 0.00015 RTC equates to a 1.5% resistance change per 100ºC. Use of heaters other than Kapton film heaters could result in greater measurement error due to higher RTCs.

1.12 Control Thermocouple Placement

Thermal lag is the product of thermal resistance and thermal capacity. A simple heating process has one resistance and one capacity. Thermal resistance is present at the heater/load interface. Capacity is the storage capacity of the load being heated. Sometimes the sensor location is distant from the heated process and this introduces a significant transfer lag or dead time. Reduction of transfer lag is essential for accurate temperature control. This is especially important when heating materials with poor thermal conductance such as stainless steel and composites. When dealing with poor thermal conductors, it is possible to generate large and potentially damaging thermal gradients. The sensor, heater and workload should be grouped as closely as possible. Remember that the controller can only respond to the information it receives from its sensor.

1.13 Thermal Stability

A stable thermal control requires a balance between thermal resistance and thermal capacity.

In cases where the control sensor is too far from the heater or the available power far exceeds the heat capacity of the load, it is necessary to reduce heater power to stabilize the process.

Reducing heater power is accomplished by entering the setup screen for a specific channel and setting the Heater Power percentage to a value below 100%. This process is trial and

Document Title: Facility 315 Operating Manual Page 8 of 24 error. Carefully monitor the heater zone after reducing power see if further adjustments are needed. One method would start by setting power to 50%. If the process temperature is still oscillating around the set point, try reducing power to 25%. At any point that the process is unable to achieve the temperature set point, increase the power percentage to a value between the current set point and the last set point that was too high. Two to three iterations of this adjustment method should stabilize the heater channel.

1.14 Operational Safety Considerations

When starting a heater channel for the first time, caution should be exercised until the thermal characteristics of the circuit are fully understood. It is not uncommon for a heater circuit to be oversized for the load.

The heater work order might indicate that a given heater is capable of dissipating 100 W when in fact the load requires only 10 W to achieve the set point. A circuit like this could easily overshoot set point or become unstable when making a large temperature change. It is recommended that the first temperature change made on a channel be small. Carefully observe the channel’s transition rate and any temperature overshoot. Reduce the percent output power as needed so the load transitions at a safe rate. When changing operational modes, i.e. from temperature to flux mode, it’s important to verify that the correct set point is entered for the new mode. If you are running in temperature mode with a setting of +80ºC and you change to flux mode, the channel will now have an 80 W set point. The operator should first turn off the channel, enter a 0 W set point, change the mode to flux, reenable the channel and enter the correct wattage set point.

2 Facility Operations

2.1 Pre-start Checklists / Facility Data Sheets

The pre-start checklist for this facility is included in Appendix C of this procedure. The pre-start checklist is to be performed at any time within a 24-hour window prior to the start of a test.

2.2 Connecting the Heater Rack

2.2.1 Verify that the circuit breaker is OFF (handle toward the top of the rack). NOTE: The circuit breaker in the bottom rear of the rack is installed upside down – “OFF” is toward the top of the rack, “ON” is toward the floor.

2.2.2 Connect the power cord to the receptacle on the back of the rack and plug the other end into a proper 208-volt source.

2.2.3 Connect a Modbus Plus cable from the Modbus Plus network to the connector on the top rear of the Heater Rack.

2.2.4 Connect the thermocouple cable and heater power cable to chamber feedthroughs.

2.2.5 Turn OFF the “AC Control” power switch of every power supply.

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2.2.6 Turn the Heater Rack circuit breaker ON (move the handle toward the floor).

2.2.7 For each power supply that is needed for this test, turn ON the “AC Control” power switch and immediately verify that the REM light (for REMote control operation) is lit and the DC Volts and DC Current meters are reading zero. The green light over the Voltage knob should be lit.

CAUTION: If these conditions are not true, turn off the power supply and either call for service or use a different power supply (different channel) for this test.

2.3 Touch Screen Operation

Any action taken at the Touch screen will override an existing state at the SCADA and vice versa. For example, entering a set point of +50ºC at the Touch screen and then changing it to +60ºC at the SCADA will result in a set point of +60ºC. See definitions of the Touch screen displays in Section 1.3 above.

In addition to the displays described, there is a Numeric Touch Pad which appears on the display whenever a set point or other numeric information is to be entered. To use the Touch Pad, press the backspace key as required to erase a previous value, if any, and type the desired value. Then press Enter and Done. The Numeric Touch Pad shows the allowable range of values for the parameter being entered. Those blocks on the display which are enclosed in a “window frame” are control blocks. Those with a single-line border are indicators only.

2.4 Setting Up a Channel (Touchscreen)

2.4.1 On the RUN screen for the desired channel, press the block “TEMP 1/FLUX 2/ZR-Q

3” for that channel and set the desired choice.

2.4.2 Then go to the Channel Setup screen and press the Setup key for that channel.

2.4.3 On the Setup Screen for that channel, enter the required data in each of the blocks having a white display window at the bottom of the block. (Zero-Q Ref Chan is only required when the selected mode is Zero-Q.)

2.4.4 Also on the Setup Screen, verify that the two blocks on the right show “CTRL T/C OK” and (if using Zero-Q mode) “REF T/C OK”. If either block is white, it will indicate the corresponding thermocouple is open.

2.4.5 Return to the RUN Screen.

2.5 Operating and Monitoring a Channel (Touchscreen)

2.5.1 On the appropriate RUN Screen, press the “Ch. X S/P” block for the desired channel and enter the desired Set Point.

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2.5.2 Verify that the Temperature Process Variable “TEMP P/V” block shows a temperature that you expect and that the Watts Process Variable “WATTS P/V” reads zero.

2.5.3 Press the “Ch. X” block on the extreme left side of the screen to turn ON the channel.

ON = white.

2.5.4 Press the “Ch. X” block on the extreme left side of the screen to turn OFF the channel.

OFF = black.

2.5.5 Monitor the “TEMP P/V” block and the “WATTS P/V” block to verify expected activity.

2.5.6 You can change any parameters for a given channel while the channel is ON.

2.5.7 If the heater current or temperature for the channel exceeds the maximum values entered on the Setup Screen, an alarm will occur and the channel will shut off automatically. Determine whether the limit values were chosen too low or whether there is a malfunction. When the current or temperature that caused the alarm drops below its limit, reset the alarm by pressing the appropriate block on the Alarms Screen and turn the channel back on at the RUN Screen.

2.6 Using the CAL/PID Setup Screen (Touchscreen)

NOTE: This screen will be used very infrequently.

CAL refers to calibration of the heater rack circuitry that measures the current going to the heater. Two blocks on the CAL/PID Setup Screen are used in the calibration process --“Shunt Voltage” and “Shunt Resistance Reciprocal”. The former is an indicator only. T he Shunt Resistance Reciprocal is a data input. Its value must never be changed except by a qualified person using an approved procedure!

PID refers to the control strategy used by the heater rack when it is controlling temperature or power. PID is the abbreviation for “Proportional plus Integral plus Derivative”. In the heater racks, only Gain (the proportional parameter) and Integral are adjustable.

For PID to work correctly with a given power level and time constant (responsiveness of the heater’s load), the PID parameters need to be correct. For the vast majority of situations, the recommended values in the table below will be satisfactory.

Should it be necessary to change a parameter, press CAL PID SETUP on the appropriate RUN screen. Then select the desired channel from the CAL PID SETUP MENU. Enter new value(s) with the Numeric Touch Pad that appears when you press the block for the desired parameter. When finished, press the Return block.

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PID PARAMETERS

PARAMETER RANGE RECOMMENDED VALUE

Temp Mode Gain 0.1 to 2000 250 Zero Q Mode Gain 0.1 to 1000 100 Flux Mode Gain 0.1 to 1.0 1.0 Temp Mode Integral 0 to 60 30 Zero Q Mode Integral 0 to 60 30 Flux Mode Integral 0 to 10 0.2

2.7 Starting and Stopping the SCADA Program

To start the SCADA program, double click the red Intellution icon on the Windows desktop.

An Intellution Start-up screen will appear and begin to load the program files. The Background Scheduler, which writes active heater rack sensors to the thermal vacuum database, will load. After a few seconds of activity, the Intellution Workspace will open and the SCADA Status screen will appear.

2.8 SCADA Operation

Any action taken at the SCADA will override an existing state at the Touch screen and vice versa. For example, entering a set point of +50ºC at the SCADA and then changing it to +55ºC at the Touch screen will result in a set point of +55ºC.

Two screens are used to monitor and control each heater rack. The STATUS screen provides data monitoring and power supply control. The SETUP screen allows each supply for a given rack to be configured prior to or modified during a test. Both screens display the rack number currently being viewed, the facility to which it is monitoring, all twelve supplies for the rack selected and the current time. To enter data on the two SCADA screens, click on the values for the appropriate power supply. A small data entry box will appear. Type the data in the box and click OK. “Reference TCs” at the bottom of the Status Screen provide temperature readings and status of the four possible Zero-Q reference thermocouples.

2.9 SCADA Screen Navigation

For each HCU, two screens are available; Status and Setup. Each screen has a cluster of 4 square buttons labeled one through four. These buttons represent each of the four heater racks. To the right of this cluster is a rectangular button labeled “Status Screen” on the SETUP screen and “Setup Screen” on the STATUS screen. Any screen can be viewed at any time by clicking the appropriate button.

2.10 SCADA Network Error Displays

When a HCU is not connected to the Modbus network, the SCADA is not able to communicate with its PLC. Viewing a Status or Setup screen for a HCU that is disconnected will display question marks (?????) is place of each data value display. Below each screen title, a blinking caption will display: “PLC NOT COMMUNICATING.” If the rack to be used for testing is in this mode of display, it must first be connected to the Modbus network as described in Section 2.

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2.11 Setting Up a Channel (SCADA)

2.11.1 Select the desired Heater Rack at the cluster of four buttons at the top of the screen.

2.11.2 On the SETUP Screen, select the facility. Then click on the Tagname block for the channel and select the Control TC and Zero-Q reference channel. (The Description column is not editable; its data will be loaded from the thermal vacuum data system.)

2.11.3 Still on the SETUP Screen, enter the heater resistance and maximum current.

2.11.4 On the STATUS Screen, select the desired mode (Temp, Flux or Zero-Q) and enter the desired set point.

2.12 Operating and Monitoring a Channel (SCADA)

2.12.1 On the STATUS Screen, verify that the Process Variable cell shows a temperature that you expect and that the Wattage cell reads zero.

2.12.2 To turn a channel ON, click on the gray block at the left end of the row and click the Turn ON button in the box that pops up. Click the O.K. The gray block will turn green.

2.12.3 To turn a channel OFF, click on the green block at the left end of the row and click the Turn OFF button in the box that pops up. Click the O.K. The green block will turn gray.

2.12.4 Monitor the Process Variable and Wattage cells to verify expected activity.

2.13 Disconnecting the Heater Rack

2.13.1 From either the Touch screen or the SCADA, turn off all channels of this Heater Rack.

2.13.2 Turn OFF the “AC Control” power switch of every power supply in this rack.

2.13.3 Turn OFF the Heater Rack circuit breaker (move the handle toward the top of the rack).

2.13.4 Disconnect the thermocouple cable and heater power cable from chamber feedthroughs.

2.13.5 Disconnect the Modbus Plus cable from the connector on the top rear of the Heater Rack.

2.13.6 Verify that the Heater Rack circuit breaker is OFF (handle toward the top of the rack) and then disconnect the plug at the free end of the power cord from the power source.

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2.13.7 Disconnect the power cord from the Heater Rack.

3 Emergency Procedures This section of the procedure details the steps that need to be taken in one of the failure modes discussed below.

3.1 Electrical Power Failure

The Heater Rack and all of its power supply outputs will de-energize upon loss of electrical power. On return of electrical power, all channels return to their last state. It is recommended that all power supplies be switched off during the power failure to prevent a large inrush current when power is restored.

3.2 PLC Failure

The power supply outputs will drop to zero volts in the event of a PLC failure. If it is necessary to apply power to the heater circuits, the power supply manual override switch must be placed in the LOCAL position. Caution should be exercised when running heaters in a manual control mode not to exceed the maximum safe current for the circuit as listed on the Heater Work Order. As control thermocouples are unavailable, related payload temperature elements “PTEs” should be closely monitored to ensure payload safety.

3.3 Thermocouple Failure

An open thermocouple condition for a channel operating in either temperature or Zero-Q mode results in the immediate shutdown of the affected channel. If it is necessary to apply power to the effected circuit, the channel must be placed in flux control mode, and an appropriate wattage set point should be input. Open thermocouples are indicated on the touch screen channel setup screen. An open thermocouple is indicated by a temperature value of – 327.6ºC on the run screen or at SCADA.

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Flow Diagram

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Appendix A – Definitions

N/A

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Appendix B – Acronyms

AC Alternating Current CPU Central Processing Unit DC Direct Current GSE Ground Support Equipment HCU Heater Control Unit I² Amperage Square I/O Input/Output PID Proportional Integral Derivative PLC Program Logic Control PTE Payload Temperature Element P/V Process Variable RTC Resistive Temperature Coefficient SCADA Supervisory Control And Data Acquisition VDC Volts Direct Current W Watts

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Appendix C – Prestart Checklist for Facility 315

PRESTART CHECKLIST

FOR FACILITY 315

PROJECT: TECHNICIAN:

W/D NO.: DATE:

Inform the shift leader that you are doing the PRE-START.

Check facility log book for status of facility.

Prior to energizing heater rack verify the following:

1. Verify that the circuit breaker is OFF (handle toward the top of the rack).Note: The circuit breaker in the bottom rear of the rack is installed upside down -“OFF” is toward the top of the rack, “ON” is toward the floor. _____

2. Then connect the power cord to the receptacle on the back of the rack and plug the other end into a proper 208-volt source. _____

3. Connect a Modbus Plus cable from the Modbus Plus network to the connector on the top rear of the Heater Rack. _____

4. Connect the thermocouple cable and heater power cable to chamber feedthroughs. _____

5. Turn OFF the “AC Control” power switch of every power supply. _____

6. In the rear of the rack verify all PLC / LOCAL switches are in the PLC position. _____

7. Turn the voltage and current control knobs of every power supply to the fully counter clockwise position. _____

8. Turn ON the Heater Rack circuit breaker (move the handle toward the floor). _____

9. For each power supply that is needed for this test, turn ON the “AC Control” power switch and immediately verify that the REM light (for REMote control operation) is lit and the DC Volts and DC Current meters are reading zero. The green light over the Voltage knob should be lit. _____

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Appendix D – Manual Overrides & Interlocks

Manual Override List for Facility 315

Manual Override Switch Nomenclature

Description

LOCAL position enables power supply #1 voltage and current knobs.

PLC position enables power supply #1 remote programming input.

LOCAL position enables power supply #2 voltage and current knobs.

PLC position enables power supply #2 remote programming input.

LOCAL position enables power supply #3 voltage and current knobs.

PLC position enables power supply #3 remote programming input.

LOCAL position enables power supply #4 voltage and current knobs.

PLC position enables power supply #4 remote programming input.

LOCAL position enables power supply #5 voltage and current knobs.

PLC position enables power supply #5 remote programming input.

LOCAL position enables power supply #6 voltage and current knobs.

PLC position enables power supply #6 remote programming input.

LOCAL position enables power supply #7 voltage and current knobs.

PLC position enables power supply #7 remote programming input.

LOCAL position enables power supply #8 voltage and current knobs.

PLC position enables power supply #8 remote programming input.

LOCAL position enables power supply #9 voltage and current knobs.

PLC position enables power supply #9 remote programming input.

LOCAL position enables power supply #10 voltage and current knobs.

PLC position enables power supply #10 remote programming input.

LOCAL position enables power supply #11 voltage and current knobs.

PLC position enables power supply #11 remote programming input.

LOCAL position enables power supply #12 voltage and current knobs.

PLC position enables power supply #12 remote programming input.

Interlock List for Facility 315

Heater rack interlocks are dependent on the operational mode of a given channel. It should be noted that each channels interlocks are fully independent of other channels.

Interlocks – Temperature Mode

Power supply #n will not output unless: Thermocouple #n is not open, and Thermocouple #n temperature is less than the heater high limit set point, and Heater circuit #n wattage is less than the high power limit set point.

Interlocks – Zero-Q Mode

Power supply #n will not output unless: Thermocouple #n and the selected reference thermocouple are not open, and Thermocouple #n temperature is less than the heater high limit set point, and Heater circuit #n wattage is less than the high power limit set point.

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Interlocks – Flux Mode

Power supply #n will not output unless: Heater circuit #n wattage is less than the high power limit set point.

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Appendix E – Touch Screen Layouts/Program

Electronic Copies are located in the archive section of the Code 549 Engineering Server.

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Appendix F – PLC Program

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Appendix G – Electrical Diagrams

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CHANGE HISTORY LOG

Revision Effective Date Description of Changes

Baseline 04/28/2015 Initial Release

Effective Date: 03/12/2015 Approved by: Yan Lui Title: Code 549 Thermal Vacuum Group Lead

Code 549 Operating Manual

Title: Facility 290 Operating Manual

Table of Contents

1 Facility Description

1.1 Vacuum System

1.1.1 Roughing System

1.1.2 Cryopump System

1.1.3 Turbomolecular Pumping System

1.1.4 Seal Pump System

1.2 PLC Control System

1.2.1 PLC Control Architecture

1.2.2 CPU

1.2.3 Power Supply

1.2.4 Memory

1.2.5 Input / Output Modules

1.2.6 Communications

1.2.7 Hot Backup

1.2.8 PLC Management of the process

1.3 Intellution Software Display

1.4 Auxiliary Systems

1.4.1 Cold Finger

1.4.2 Scavenger Plate

1.4.3 Thermoelectric Quartz Crystal Microbalance (TQCM)

1.4.4 Residual Gas Analyzer (RGA) Location

1.4.5 System Control Alarm Monitor (SCAM)

1.5 Thermal System

2 Vacuum System

2.1 Prestart Checklists / Facility Data Sheets

2.2 Operation

2.2.1 Establish Cryopump System Mechanical Pumps (Remote Operation)

2.2.2 Establish Cryopump System Mechanical Pumps (Local Operation)

2.2.3 Establishing the Cryopumps (Remote Operation)

2.2.4 Establishing the Cryopumps (Local Operation)

2.2.5 Establishing the Turbomolecular Pump (Remote Operation)

2.2.6 Establishing the Turbomolecular Pump (Local Operation)

2.2.7 Chamber Roughing System Start Up (Remote Operations)

2.2.8 Chamber Roughing System Start up (Local Operation)

Document Title: Facility 290 Operating Manual Page 2 of 184

EFFECTIVE DATE: 03/12/2015

2.2.9 Chamber Pumpdown (Local Operation)

2.2.10 Foreline Cold Trap Operation (Local Operation Only)

2.2.11 Seal System Pumpdown (Remote Operation)

2.2.12 Seal System Pumpdown (Local Operation)

2.2.13 Chamber Pumpdown to High Vacuum (Remote Operation)

2.2.14 Chamber Pumpdown to High Vacuum (Local operation)

2.2.15 Secure Chamber Roughing System No.1 with Non-Active or Active Coldtrap (Remote Operation)

2.2.16 Secure Chamber Roughing System No.2 with Non-Active Cold Trap (Remote Operation)

2.2.17 Secure Chamber Roughing System No.3 with Non-Active or Active Coldtrap (Remote Operation)

2.2.18 Secure Chamber Roughing System No.4 with Non-Active or Active Cold Trap (Remote Operation)

2.2.19 Secure Chamber Roughing System No.1 with Non-Active or Active Coldtrap (Local Operation)

2.2.20 Secure Chamber Roughing System No.2 with Non-Active Cold Trap (Local Operation)

2.2.21 Secure Chamber Roughing System No.3 with Non-Active or Active Coldtrap (Local Operation)

2.2.22 Secure Chamber Roughing System No.4 with Non-Active or Active Cold Trap (Local Operation)

2.2.23 Secure Turbomolecular Pumping System (Remote Operation)

2.2.24 Secure Turbomolecular Pumping System (Local Operation)

2.2.25 Securing Cryopumping Systems No.1 through No.7 (Remote Operation)

2.2.26 Securing Cryopumping Systems No.1 through No.7 (Local Operation)

2.2.27 Regenerating Cryopump System No.1 to No.7 (Remote Operation)

2.2.28 Regenerating Cryopump System No.1 to No.7 (Local Operation)

2.2.29 Shutdown Cryopump System Mechanical Pumps (Remote Operation)

2.2.30 Shutdown Cryopump System Mechanical Pumps (Local Operation)

2.2.31 Secure Seal Pumping System (Remote Operation)

2.2.32 Secure Seal Pumping System (Local Operation)

2.3 Thermal System Operations

2.3.1 GN2 Skid Startup

2.3.2 GN2 MODE Startup

2.3.3 GN2 MODE Shutdown

2.3.4 LN2 Skid Start Up

2.3.5 Flood/LN2 Mode Start Up

2.3.6 LN2 MODE Shutdown

2.3.7 LN2 Skid Shutdown

2.3.8 LN2 Purge Mode

2.3.9 GN2 Mode Startup after LN2 Flood and Purge Mode

2.3.10 Return to Safe State

2.4 Auxiliary Systems Operations

Document Title: Facility 290 Operating Manual Page 3 of 184

2.4.1 Cold Finger Operations

2.4.2 Scavenger Plate Operations

2.4.3 TQCM Operations

2.4.4 Chamber GN2 Backfill Procedure

2.4.5 Chamber Fresh Air Port Procedure

2.4.6 Chamber Dome Closing

2.4.7 Chamber Dome Opening Procedure

2.4.8 Chamber Dome Closing Procedure

3 Emergency Procedures

3.1 Failure

3.1.1 Electrical Power Failure

3.1.2 GN2 Compressor failure

3.1.3 Process Water Failure

3.1.4 Mechanical Pump Failure

3.1.5 Main Valve Failure – Fails to Close

3.1.6 Loss of Facility LN2

3.1.7 Loss of Facility GN2

3.1.8 Loss of Facility Compressed Air

Appendix A – Definitions

Appendix B – Acronyms

Appendix C – Facility 290 Pre-Start Checklist

Appendix D – Manual Override & Interlock Lists

Appendix E – PLC Program

Document Title: Facility 290 Operating Manual Page 4 of 184

1 Facility Description

Facility 290 is a vertical, cylindrical, 27-foot diameter by 40-foot high working volume Space Environment Simulator (SES). The test chamber is capable of vacuum pressures of approximately 10-8 Torr. Thermal control capability is from +75oC to –190oC. Test articles are loaded through the top of the chamber using the Building 10 crane. Personnel entry is through a side opening clean anteroom (ISO Class 7) per ISO 14644-1. The chamber is used for thermal vacuum, thermal balance testing, and the bake out of very large test articles.

Test articles are attached to the payload table or internal fixturing. An external clean air supply provides fresh air that is temperature and humidity controlled during pre and post-test activities.

1.1 Vacuum System

The vacuum system evacuates gas within the chamber, the outgassing load and the payload gas load. The vacuum system is comprised of eight (8) mechanical pumping systems, seven

(7) 48” diameter cryopumps, and one (1) turbomolecular pump.

1.1.1 Roughing System

The chamber is initially evacuated to 50 microns by the eight (8) mechanical pump systems located in the basement of Building 10.

Each pump system consists of a manifolded pair of Stokes 615 ROOTS blowers backed by a pair of Stokes 412h–10 rotary piston mechanical pumps. Each roughing train evacuates the chamber through a 10” diameter carbon steel foreline that is isolated by a 10” diameter GNB high vacuum gate valve. Backstreaming is prevented by a 10” diameter GNB LN2 cold trap on three of the four available forelines. The roughing trains are controlled and monitored at the vacuum console located in the basement of Building 10. Pirani gauges provide pressure readouts over the full roughing pressure range.

1.1.2 Cryopump System

Ultimate pressures of 10-3 to 10-8 Torr are achieved with seven (7) 48” diameter cryopumps. The cryopumps condense gas from the chamber to achieve low pressures. Each cryopump consists of a front baffle, internal radiation shield, and two (2) cryosails attached to two (2) coldheads. The coldheads generate the low temperatures necessary to condense oxygen, nitrogen, and argon on the cryosails.

The cryosails are covered with charcoal to increase the surface area available to condense gases such as helium, neon, and hydrogen. When pumping air gases, the cryosail temperature should remain below 25K. Each cryopump is equipped with a silicon diode thermocouple to monitor cryosail temperatures. There are two (2) silicon diodes for each coldhead that may be monitored by means of the Supervisory Control and Data Acquisition (SCADA) or Thermal Vacuum Data System (TVDS).

The cryosail is shielded by the front baffle and internal radiation shield. These surfaces are cooled with LN2 to condense/freeze water vapor. The cryopump requires a helium compressor and a roughing pump to operate. A single compressor

Document Title: Facility 290 Operating Manual Page 5 of 184 supplies high-pressure helium to each pair of coldheads. Each cryopump is isolated from the chamber by a 48” GNB high vacuum gate valve. When the cryosail temperature or the ultimate pressure of the cryopump begins to increase during operation, the cryopump condensing surfaces have become saturated and are in need of regeneration. The roughing pumps are used for the initial evacuation of the pump prior to LN2 cooldown of the front baffle and internal radiation shields. Two (2) roughing pumps are used to evacuate all eight (8) cryopumps.

System one (1) evacuates cryopumps #1 through #4 and system two (2) evacuates cryopumps #5 through #8. System one (1) is evacuated by chamber Roughing Pump #4. System two (2) is evacuated by chamber Mechanical Pump #6. Both pumps are Stokes 412-H mechanical pumps. The foreline valves to mechanical pumps #4 and #6 are interlocked to prevent the use of these pumps for chamber pumpdown while in use for cryoroughing. Each cryopump roughing system consists of a mechanical pump, a coalescing oil trap, and a high vacuum valve. Pirani gauges provide pressure readouts for the roughing pressure range. Cabinets 8 and 9 control and monitor the LN2 fill system, the regeneration heater, and baffle temperature. The SCADA system may also be used to operate these cryosystems remotely.

Cryopumps are “capture” type pumps which store rather than continuously vent process gases. Thus, hazardous gases become concentrated in cryopumps. During regeneration or during a power failure, the pump warms and these gases are released in high concentrations. For this reason, flammable and pyrophoric gases should not be pumped in this facility.

1.1.3 Turbomolecular Pumping System

The turbomolecular pumping system is used to enhance the pumping speed of gases such as hydrogen, neon, and helium. The system is also used in leak checking the chamber. The turbomolecular pumping system consists of a Varian V6000 turbo pump, a Varian V6000 frequency controller, and a Leybold Heraeus D65B two stage backing pump. The system can be established when foreline pressures of less than

0.75 Torr can be achieved. A 20" diameter GNB high vacuum gate valve isolates the turbopump from the chamber. The turbomolecular pumping system is controlled from Cabinet 10 of the vacuum console or remotely from the SCADA computer system.

Pirani gauges provide pressure readouts over the full roughing pressure range and an ionization gauge provide pressure reading through the high vacuum range.

1.1.4 Seal Pump System

The seal pump system is used to reduce air leaks into the chamber by evacuating the air space between two concentric o-rings on a large number of the facility penetrations. The largest penetration pumped is the dome seal. This seal must be pumped to provide a leak tight seal. Consequently the seal system is used when the chamber is under vacuum. The seal system consists of a single Stokes 412-H rotary piston mechanical pump and tubing to the various flanges. The seal pump is located in the sub-basement area of the chamber. The seal pumping system is controlled from

Document Title: Facility 290 Operating Manual Page 6 of 184

Cabinet 10 of the vacuum console or remotely from the SCADA computer system.

Pirani gauges provide pressure readouts over the full roughing pressure range.

1.2 PLC Control System

The device used to control SES Vacuum System is a Programmable Logic Controller (PLC), AEG Modicon Model 984. PLC is a microprocessor-based device, programmed to replace complex logic and interlock circuits that used to be commonly implemented with electromechanical relays. Programs are entered into the PLC memory through a general-purpose personal computer.

The PLC can operate at an ambient temperature from 0oC to 60oC and the storage temperature requirements are -40oC to +85oC. The PLC hardware can function continuously in the relative humidity range of 5% to 95% with no condensation.

PLC system is modular and field expandable which allows it to be tailored to the SES control application and future expansion.

1.2.1 PLC Control Architecture

A programmable controller consists of the following five subsystems:

Central Processing Unit (CPU) Power supply Memory Input/Output modules Communications interface

1.2.2 CPU

The CPU model 984 is a redundant 24 bit CPU with the following performance and capacity characteristics:

Addresses 8192 discrete input, 8192 discrete output points, 8500 analog and thermocouple channels;

Is self-contained and slot mounted in an I/O housing, supporting all logic, memory and CPU support modules.

1.2.3 Power Supply

The power supply is capable of supplying power to the CPU operating system, I/O scanners and LAN interface modules, main memory, and provide sufficient current for logic power to the input/output chassis. Auxiliary power supplies provide power to remotely located racks. Both main and auxiliary power supplies monitor the incoming AC line voltage for proper levels. The system can function properly from 97VAC to 132VAC. If the voltage level is out of range, the power supply automatically shuts down the system and remains disabled until the proper voltage level returns. In addition, the power supply provides surge protection, isolation, and outage carryover.

1.2.4 Memory

The program storage media is solid state battery backed RAM. The memory capacity

Document Title: Facility 290 Operating Manual Page 7 of 184 of the PLC is 32K. The memory contains on-board battery back up capable of retaining all stored program data through a continuous power outage for 12 months under worst case conditions. All batteries can be removed from the system without removing system power.

1.2.5 Input / Output Modules

All input and output modules are the self-contained units housed within an I/O housing enclosure. Each module within the system performs internal diagnostics and gives visual indication when a fault is detected. Isolation between all internal logic and external power circuits is 1500 VRMS. It is possible to replace any I/O module without disturbing field wiring. Each I/O module contains a visual indicator to display ON/OFF status of individual input or output points. Power switching output modules are provided with self-contained fuses for overload and short-circuit protection of the module. All wiring to the I/O modules is done through a heavy-duty terminal strip.

The system contains the following modules manufactured by AEG:

B807-032 AC input used for control switches, which operate at 120 VAC, 60 Hz.

B806-032 AC output for pilot lights and relays, which operate at 120 VAC, 50/60Hz.

B802-008 Fused AC output capable of switching 120 VAC, 2 Amps power and inductive loads, used to operate solenoid valves and motor starters.

B883-200 Thermocouple type "T" compatible input module which can write direct temperature readings into the PLC data table.

B829-016 TTL (5 VDC) input for transistor- transistor logic, true high logic, compatible with Baratron readouts.

B828-016 TTL (5 VDC) output for transistor-transistor logic, true high logic, utilized to handle digital displays.

B873-011 Analog input which accepts analog signals and converts them to 4-digit

BCD, or twelve bit binary values. Voltage range of this unit is -10 to +10 VDC.

Its application is to input data from ionization gauge controllers, convectron gauge controllers, and turbomolecular pump controller.

B885-002 I/O module, which provides an interface between the controller and an ASCII peripheral device. Its function is to display Facility 290 pressure in different areas around the chamber.

1.2.6 Communications

There are two communication networks associated with the PLC: (1) one that links the CPUs and the remote I/O racks and (2) one that links the CPUs and the color graphic systems. The latter is called ModBus Plus.

1.2.7 Hot Backup

Two CPUs monitor the same I/O data, run identical user programs, and have a means of exchanging an entire memory register's contents. Upon fault detection in the primary system, the secondary assumes control of the I/O. The switchover takes 48 mSec and does not disturb the controlled process. During the switchover the outputs

Document Title: Facility 290 Operating Manual Page 8 of 184 are held in their last state, no input signals are lost provided they lasted longer than 48 mSec. Upon assuming control, the secondary CPU locks the primary CPU out and continues processing. This status is maintained until the faulty processor is replaced.

It does not require an operator's immediate attention other than acknowledgment of an alarm generated by user's logic. Once the faulty system has been replaced and brought back on line, it is automatically recognized by the running system as a "back-up processor" without shutting down the process. It is possible to manually cause a transfer to take place.

1.2.8 PLC Management of the process

PLC, through its input modules, accepts inputs from such devices as control switches, position indication (limit) switches, flow switches, pressure switches, thermocouples, vacuum and temperature instrumentation; alarm relays set by cryogenic and turbomolecular pump controllers. PLC monitors the state of field devices by receiving signals from its input modules, solves a user logic program via its CPU component, and directs further field device activity by sending control signals to its output modules. These control signals start and stop pumps, open and close valves, display process variables, set off the alarms, and communicate the information to the SCADA displays.

1.3 Intellution Software Display

The Intellution system is run by Dell PII/500 personal computers. The systems are identical and totally independent. Their main role in the SES control process is to gather the real time information and display it on the screen.

The Intellution Software System provides an operator interface that uses real-time color graphics. The System has no control functions and is used for monitoring only. The System has two operator interface stations. One station is located at the vacuum console, and the other is located at the SES console. Status data is read from the PLC into a real time database in each color graphics system. This status data is processed by the FactoryLink System and presented on the monitor in a graphical format.

1.4 Auxiliary Systems

1.4.1 Cold Finger

The cold finger is a stainless steel cylinder mounted inside the chamber near the personnel door. Prior to the chamber being closed for operation, it is cleaned with a detergent and rinsed several times with alcohol. During chamber operation, the cold finger is cooled to LN2 temperatures to collect the condensable materials emitted by the payload. When the chamber is opened, the cold finger is rinsed again with alcohol which is bottled and analyzed for contaminates which may prove detrimental to the function or operation of any component on the payload.

1.4.2 Scavenger Plate

The scavenger plate…