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Human Space Flight Technical Integration Contract (HSFTIC) Federal contract opportunity
Solicitation number
80JSC019R0023
Issued by
National Aeronautics and Space Administration Johnson Space Center

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This federal contract opportunity notice solicits proposals for the Human Space Flight Technical Integration Contract (HSFTIC). The National Aeronautics and Space Administration Johnson Space Center plans to issue a request for proposal on or about November 1, 2019, with proposals due on or about December 11, 2019. The contract is a total small business set-aside with a North American Industry Classification System code of 541715 and size standard of 1,250 employees. The solicitation and amendments will be available on the NASA Johnson Space Center procurement website and Federal Business Opportunities website. Offerors must notify the agency of their intent to submit a proposal.

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SSP 50310

Revision B Atmosphere Revitalization Subsystem Rack to Node 3 Interface Control Document

International Space Station Program

Revision B

December 2014

National Aeronautics and Space Administration International Space Station Program Johnson Space Center Houston, Texas Contract No.: NNJ12GA46C

REVISION AND HISTORY

REV.
DESCRIPTION
PUB. DATE
-
Initial Release Reference SSCD 001786 and 006976
09-29-03
A
Revision A released per SSCN 012232, effective 05-03-10
06-03-10
Incorporates the following PIRNs associated with the appropriate IRNs and SSCNs.
PIRN 50310-ES-0001N/ASSCN 012232
PIRN 50310-NA-0001AN/ASSCN 012232
PIRN 50310-NA-0002N/ASSCN 006568
PIRN 50310-NA-0002N/ASSCN 008007
PIRN 50310-NA-0002N/ASSCN 008198
PIRN 50310-NA-0002N/ASSCN 008255
PIRN 50310-NA-0002N/ASSCN 009055
PIRN 50310-NA-0002N/ASSCN 009086
PIRN 50310-NA-0002N/ASSCN 009475
PIRN 50310-NA-0002N/ASSCN 010157
PIRN 50310-NA-0002N/ASSCN 010782
PIRN 50310-NA-0003N/ASSCN 011403

The following IRNs were closed by Revision A, but were inadvertently omitted from the Revision and History Page: 0003, 0004, 0005, 0006, and 0007.

B
Revision B (Reference SSCD 014446, EFF. 07-21-15)
08-11-15

Incorporates the following PIRNs associated with the appropriate IRNs and SSCNs.

PIRN N/AIRN 0009SSCN 011294
PIRN N/AIRN 0008SSCN 012037

PREFACE

Atmosphere Revitalization Subsystem Rack to Node 3 Interface Control Document The contents of this document are intended to be consistent with the tasks and products to be prepared by Program participants. The Atmosphere Revitalization Subsystem Rack to Node 3 Interface Control Document (ICD) shall be implemented on all new International Space Station (ISS) contractual and internal activities and shall be included in any existing contracts through contract changes. This document is under the control of the Space Station Control Board, and any changes or revisions will be approved by the National Aeronautics and Space Administration (NASA) Interface Control Working Group (ICWG) Chair (or statement to indicate the delegated authority).

INTERNATIONAL SPACE STATION PROGRAM

Atmosphere Revitalization Subsystem Rack to Node 3 Interface Control Document

CONCURRENCE

December 2014

SSP 50310

Revision B vii

TABLE OF CONTENTS

PARAGRAPHPAGE
1.0INTRODUCTION1-1
1.1Purpose AND scope1-1
1.2Precedence1-1
1.3responsibility and change authority1-1
2.0DOCUMENTS2-1
2.1Applicable Documents2-1
2.1.1Government documents2-1
2.1.1.1Government documents military Documents2-1
2.1.1.2national aeronautics and space administration2-1
2.2REFERENCE DOCUMENTS2-3
3.0Requirements3-1
3.1GENERAL3-1
3.1.1Interface Description3-2
3.1.1.1ARS rack description3-3
3.1.2Interface Responsibilities3-4
3.1.2.1ARS Rack Responsibility3-4
3.1.2.2Node 3 Provider Responsibility3-4
3.1.2.3Responsibility for Interconnecting Cabling, tubing, and
connectors3-4
3.1.3Coordinate System3-4
3.1.4Engineering units, tolerances, and conversions3-6
3.1.4.1Engineering units3-6
3.1.4.2tolerances3-6
3.2Interface requirements3-6
3.2.1Node 3 Interface Requirements3-6
3.2.1.1Envelope Requirements3-6
3.2.1.2Mass Properties3-6
3.2.1.3Structural/Mechanical Attachment3-6
3.2.1.4Rack Interface Panel3-6
3.2.1.5Fire suppressant rack port location3-8
3.2.1.6interface loads3-9
3.2.1.7smoke detection3-11
3.2.1.8Fluid Interfaces3-12
3.2.1.8.1Supply Low Temperature Coolant3-12
3.2.1.8.1.1Node 3 LTL Heat Transport Capability3-12
3.2.1.8.1.2Supply LTL Coolant Characteristics3-12
3.2.1.8.1.2.1Supply LTL Coolant Specification3-12
3.2.1.8.1.2.1.1Supply LTL Coolant free gas content3-12
3.2.1.8.1.2.2Supply LTL Coolant Temperature3-12
3.2.1.8.1.2.3Supply LTL Coolant Pressure3-12
3.2.1.8.1.2.4Supply LTL Coolant Flow Rate3-12
3.2.1.8.1.2.5Supply LTL Coolant Pressure Drop3-12
3.2.1.8.1.2.6supply ltl coolant quantity3-13
3.2.1.8.1.2.7Supply LTL Coolant Leakage Rate3-13
3.2.1.8.1.3Supply LTL Coolant Connector3-13
3.2.1.8.2Receive LTL Coolant Return3-14
3.2.1.8.2.1Receive LTL Coolant Return Characteristics3-14
3.2.1.8.2.1.1Receive LTL Coolant Return Specification3-14
3.2.1.8.2.1.1.1Receive LTL Coolant free gas content3-14
3.2.1.8.2.1.2Receive LTL Coolant Return Temperature3-14
3.2.1.8.2.1.3Receive LTL Coolant pressure3-14
3.2.1.8.2.1.4Receive LTL Coolant flow rate3-14
3.2.1.8.2.2Receive LTL Coolant Return Connector3-14
3.2.1.8.3Supply Moderate Temperature Coolant3-14
3.2.1.8.3.1Node 3 MTL Heat Transport Capability3-14
3.2.1.8.3.2Supply MTL Coolant Characteristics3-15
3.2.1.8.3.2.1Supply MTL Coolant Specification3-15
3.2.1.8.3.2.1.1Supply MTL Coolant free gas content3-15
3.2.1.8.3.2.2Supply MTL Coolant Temperature3-15
3.2.1.8.3.2.3Supply MTL Coolant Pressure3-15
3.2.1.8.3.2.4Supply MTL Coolant Flow Rate3-15
3.2.1.8.3.2.5Supply MTL Coolant Pressure Drop3-15
3.2.1.8.3.2.6Supply MTL coolant quantity3-15
3.2.1.8.3.2.7Supply MTL Coolant Leakage Rate3-15
3.2.1.8.3.3Supply MTL Coolant Connector3-15
3.2.1.8.4Receive MTL Coolant Return3-16
3.2.1.8.4.1Receive MTL Coolant Return Characteristics3-16
3.2.1.8.4.1.1Receive MTL Coolant Return Specification3-16
3.2.1.8.4.1.1.1Receive MTL Coolant free gas content3-16
3.2.1.8.4.1.2Receive MTL Coolant Return Temperature3-16
3.2.1.8.4.1.3Receive mTL Coolant pressure3-16
3.2.1.8.4.1.4Receive mTL Coolant flow rate3-16
3.2.1.8.4.1.5Receive MTL Coolant Return Connector3-16
3.2.1.8.5Receive Waste Carbon Dioxide3-16
3.2.1.8.5.1Receive Waste Carbon Dioxide Characteristics3-17
3.2.1.8.5.1.1Receive Waste Carbon Dioxide Temperature3-17
3.2.1.8.5.1.2CO2 maximum flow resistance3-17
3.2.1.8.5.1.3Receive Waste Carbon Dioxide Maximum Design Pressure3-17
3.2.1.8.5.1.4Receive Waste Carbon Dioxide Flow Rate3-17
3.2.1.8.5.2Receive Waste Carbon Dioxide Connector3-19
3.2.1.8.6Receive MCA Vent Gas3-19
3.2.1.8.6.1Receive MCA Vent Gas Characteristics3-19
3.2.1.8.6.2Receive MCA Vent Gas Temperature3-19
3.2.1.8.6.2.1Receive MCA Vent Gas Pressure3-19
3.2.1.8.6.2.2Receive MCA Vent Gas Maximum Design Pressure3-19
3.2.1.8.6.3Receive MCA Vent Gas Connector3-19
3.2.1.8.7Supply Cabin Air3-19
3.2.1.8.8Supply THC Process Air3-19
3.2.1.8.8.1Supply THC Process Air Characteristics3-19
3.2.1.8.8.1.1Supply THC Process Air Temperature3-19
3.2.1.8.8.1.2Supply THC Process Air Dew Point3-20
3.2.1.8.8.1.3Supply THC Process Air Pressure3-20
3.2.1.8.8.1.4Supply THC Process Air Flow Rate3-20
3.2.1.8.8.2Supply THC Process Air Connector3-20
3.2.1.8.9Receive THC Process Air Return3-20
3.2.1.8.9.1Receive THC Process Air Return Characteristics3-20
3.2.1.8.9.1.1Receive THC Process Air Return Temperature3-20
3.2.1.8.9.1.2Receive THC Process Air Return Pressure Drop3-23
3.2.1.8.9.1.3Receive process air return dewpoint3-23
3.2.1.8.9.1.4Receive THC Process Air Return Flow Rate3-25
3.2.1.8.9.1.5receive thc process air return heat load3-25
3.2.1.8.9.2Receive THC Process Air Return Connector3-25
3.2.1.8.10Supply Sample Air3-25
3.2.1.8.10.1Supply Sample Air Temperature3-25
3.2.1.8.10.1.1Supply Sample Air Pressure Drop3-25
3.2.1.8.10.1.1.1Node 3 Zenith Bulkhead to ARS Rack3-25
3.2.1.8.10.1.1.2Node 3 Forward Bulkhead to ARS Rack3-25
3.2.1.8.10.1.1.3Node 3 Port Bulkhead to ARS Rack3-25
3.2.1.8.10.1.1.4Node 3 Starboard Bulkhead to ARS Rack3-26
3.2.1.8.10.1.1.5Node 3 Cabin Sample Port to ARS Rack3-26
3.2.1.8.10.1.2Supply Sample Air Maximum Design Pressure3-26
3.2.1.8.10.1.3Supply Sample Air Flow Rate3-26
3.2.1.8.10.2Supply Sample Air Connector3-26
3.2.1.9Electrical Interfaces3-26
3.2.1.9.1Supply Power3-26
3.2.1.9.1.1Supply Power Connector3-26
3.2.1.9.1.2Supply Power Quality3-27
3.2.1.9.1.3Supply Power Control Protection3-27
3.2.1.9.2Data Interfaces3-27
3.2.1.9.2.1MDM Hardwire Interface Connectors3-27
3.2.1.9.2.1.1MDM Hardwire Interface Connector, P20/J203-28
3.2.1.9.2.1.2MDM Hardwire Interface Connector, P21/J213-28
3.2.1.9.2.1.3MDM Hardwire Interface Connector, P22/J223-28
3.2.1.9.2.2MIL-STD-1553B Interfaces3-28
3.2.1.9.2.2.1MIL-STD-1553B Bus Standard Format3-28
3.2.1.9.2.2.2MIL-STD-1553B Bus Signal Characteristics3-28
3.2.1.9.2.2.3MIL-STD-1553B Bus Coupling3-28
3.2.1.9.2.2.4Terminal Operations3-28
3.2.1.9.2.2.51553B Bus Interface Connectors3-29
3.2.1.9.2.2.5.1MIL-STD-1553B Interface, Connector J33-29
3.2.1.9.2.2.5.2MIL-STD-1553B Interface, Connector J43-29
3.2.1.9.3Rack power draw3-37
3.2.1.10Software Interfaces3-37
3.2.1.11Environments3-37
3.2.1.11.1Electromagnetic Compatibility3-37
3.2.1.11.2Electrical Grounding Isolation3-37
3.2.1.11.3bonding3-37
3.2.1.11.3.1bonding strap3-38
3.2.1.11.4Cable and Wire Design3-38
3.2.1.11.5Electromagnetic Interference3-38
3.2.1.11.6Electrostatic discharge3-38
3.2.1.11.7Corona3-38
3.2.1.11.8Rack Accelerations3-38
3.2.1.11.9Vibroacoustics3-39
3.2.1.11.10Atmosphere3-39
3.2.1.11.10.1Atmosphere Temperature3-39
3.2.1.11.10.2Atmosphere Pressure3-39
3.2.1.11.10.3Atmosphere Humidity3-39
3.2.1.11.10.4Atmosphere Oxygen Concentration3-39
3.2.1.11.10.5atmosphere pressure change rate3-39
3.2.1.11.10.6Rack acoustic signature3-40

APPENDIX

aAcronyms and abbreviationsa-1
bglossary <Reserved>b-1
copen workc-1

TABLE

3.1.4.2-1LINEAR TOLERANCES3-6
3.2.1.6-1NODE 3 DESIGN LIMIT INTERFACE FORCES, ARS RACK3-11
3.2.1.8.1.3-1FLUID INTERFACE CONNECTORS3-13
3.2.1.9.1.1-1J1 MAIN POWER CONNECTOR DESCRIPTION AND PIN ASSIGNMENTS3-27
3.2.1.11.8-1ARS RACK ACCELERATIONS (MAXIMUM PREDICTED LEVEL)3-39
C-1to be determined itemsc-1
C-2TO BE RESOLVED ISSUESc-1

FIGURE

3.1-1PRIMARY ARS RACK SUBASSEMBLY INTERFACES3-2
3.1.1-1NODE 3 TO ARS RACK FUNCTIONAL INTERFACE DIAGRAM3-3
3.1.3-1ARS RACK INTERFACE UTILITY PANEL3-5
3.2.1.4-1ARS RACK INTERFACE CONTROL PANEL3-7
3.2.1.5-1ARS RACK FIRE SUPPRESSANT PORT AND TCCS INLET COORDINATES3-8
3.2.1.6-1NODE 3 LOCATION AND DIRECTION OF INTERFACE FORCES3-10
3.2.1.8.5.1.4-1RECEIVE WASTE CARBON DIOXIDE FLOW RATE PROFILE3-18
3.2.1.8.9.1.1-1THC PROCESS AIR TEMPERATURE CABIN AIR 80 DEGREES fahrenheit
PROFILE3-21
3.2.1.8.9.1.1-2THC PROCESS AIR TEMPERATURE CABIN AIR 65 DEGREEs fahrenheit
PROFILE3-22
3.2.1.8.9.1.3-1RECEIVE THC PROCESS AIR RETURN DEW POINT PROFILE3-24
3.2.1.9.2.1.1-1NODE 3 TO ARS RACK P20/J20 CONNECTOR PIN ASSIGNMENTS3-30
3.2.1.9.2.1.1-2NODE 3 TO ARS RACK P20/J20 CONNECTOR PIN ASSIGNMENTS3-31
3.2.1.9.2.1.2-1NODE 3 TO ARS RACK P21/J21 CONNECTOR PIN ASSIGNMENTS3-32
3.2.1.9.2.1.2-2NODE 3 TO ARS RACK P21/J21 CONNECTOR PIN ASSIGNMENTS3-33
3.2.1.9.2.1.2-3NODE 3 TO ARS RACK P21/J21 CONNECTOR PIN ASSIGNMENTS3-34
3.2.1.9.2.1.3-1NODE 3 TO ARS RACK P22/J22 CONNECTOR PIN ASSIGNMENTS3-35
3.2.1.9.2.2.5.1-1NODE 3 TO ARS RACK P3/J3, P4/J4 CONNECTOR PIN ASSIGNMENTS3-36

INTRODUCTION

Purpose AND scope The purpose of this document is to provide definition of the physical, functional and environmental interfaces that Node 3 will provide in order to accommodate the as-built Atmosphere Revitalization Subsystem (ARS) Rack inside Node 3.

The scope of this document is limited to the Node 3 interface and the as-built ARS Rack that support the launch/landing/on-orbit events.

Precedence In the event of conflict between SSP 50318, Prime Item Development Specification for Node 3, and the contents of this flight ICD, the requirements of that Prime Item Development Specification shall take precedence.

responsibility and change authority This document is prepared and maintained in accordance with SSP 30459, International Space Station Interface Control Plan. The Prime Contractor shall delegate the responsibility for preparation and maintenance of this flight ICD.

SSP 50310

Revision B

1-1

DOCUMENTS

Applicable Documents The following documents, of the exact issue shown, or if no issue is specified, the latest issue in effect of those documents form a part of this document to the extent specified herein. In the event of conflict between documents referenced here and the contents of Section 3, the order of precedence shall be as stated in paragraph 1.2 of this document.

Government documents Government documents military Documents

DOCUMENT NO.
TITLE

MIL-STD-1553B

Notice 2 Sept 8, 1986 Digital Time Division Command/Response Multiplex Data Bus Paragraphs: 3.2.1.9.2.2, 3.2.1.9.2.2.1, 3.2.1.9.2.2.2, 3.2.1.9.2.2.3, 3.2.1.9.2.2.4, 3.2.1.9.2.2.5.1, 3.2.1.9.2.2.5.2

MIL-STD-1686
Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices)

Paragraph: 3.2.1.11.6 national aeronautics and space administration

DOCUMENT NO.
TITLE

NSTS-21000-IDD-ISS

Rev A March 3, 1999 International Space Station Interface Definition Document Paragraph: 3.2.1.11.9

SSP 30237

Rev G, DCN 029, 037 May 2, 2002 Space Station Electromagnetic Emission and Susceptibility Requirements Paragraph: 3.2.1.11.5

SSP 30240

Rev D, DCN 009, 010 July 31, 2002 Space Station Grounding Requirements Paragraph: 3.2.1.11.2

SSP 30242

Rev K January 20, 2010 Space Station Cable/Wire Design and Control Requirements for Electromagnetic Compatibility

SSP 30243

Rev G, DCN 017, DCN TBD (SSCN 11294) July 31, 2002 Space Station Requirements for Electromagnetic Compatibility Paragraphs: 3.2.1.11.1, 3.2.1.11.6, 3.2.1.11.7

SSP 30245

Rev E, DCN 017, 023, 027 October 15, 1999 Space Station Electrical Bonding Requirements Paragraph: 3.2.1.11.3

SSP 30261:002

Rev L May 22, 2000 Space Station Program Space Station Multiplexer/Demultiplexer (SSMDM) Standard Interface Control Document Paragraph: 3.2.1.9.2.1

SSP 30482 Volume 1 Rev C July 7, 1996 Electrical Power Specifications and Standards Volume 1: EPS Electrical Performance Specifications Paragraphs: 3.2.1.9.1, 3.2.1.9.1.2

SSP 30573

Rev E December 2, 2009 Space Station Program Fluid Procurement and Use Control Specification Paragraphs: 3.2.1.8.1.2.1, 3.2.1.8.2.1.1, 3.2.1.8.3.2.1, 3.2.1.8.4.1.1

SSP 41002

Rev M, IRN 055 June 21, 2006 International Standard Payload Rack to NASA/ESA/JAXA Modules Interface Control Document Paragraph: 3.2.1.11.3

SSP 41017 Part 1 Rev G February 4, 2005 Rack to Mini Pressurized Logistics Module Interface Control Document (ICD) Part 1 Paragraph: 3.2.1.1

SSP 41017 Part 2 Rev J, IRN 021 February 4, 2005 Rack to Mini Pressurized Logistics Module Interface Control Document (ICD) Part 2 Paragraphs: 3.1.3, 3.2.1.3; Figure 3.1.3-1

SSQ 21635

Rev K October 29, 2002 Connectors and Accessories, Electrical, Circular, Miniature, IVA/EVA Compatible, Space Quality, General Specification For Table 3.2.1.9.1.1-1; Figures: 3.2.1.9.2.1.1-1, 3.2.1.9.2.1.1-2, 3.2.1.9.2.1.2-1, 3.2.1.9.2.1.2-2, 3.2.1.9.2.1.2-3, 3.2.1.9.2.1.3-1, 3.2.1.9.2.2.5.1-1

SSQ 21655

Rev F November 15, 2000 Cable, Electrical, MIL-STD-1553 Databus, Space Quality, General Specification For Paragraph: 3.2.1.9.2.2.3

SSQ 21676

Rev C May 16, 1997 Coupler, Data Bus, MIL-STD-1553B, Space Quality, General Specification For Paragraph: 3.2.1.9.2.2.3

REFERENCE DOCUMENTS

The following documents are referenced in this ICD for context and user convenience.

DOCUMENT NO.
TITLE
683-15204
Avionics Air Assembly, Boeing-Hamilton Standard Interface Definition Drawing

Paragraph: 3.1

683-16348
COUPLING, QUICK DISCONNECT, FLUID,

SELF–SEALING, INTERNAL

683-19702
CDRA TO AR RACK, BOEING-AlliedSignal INTERFACE DEFINITION DRAWING

Paragraph: 3.1

683-19801
TRACE CONTAMINANT CONTROL SUBASSEMBLY TO ATMOSPHERE REVITALIZATION RACK, BOEING-LMSC, INTERFACE DEFINITION DRAWING

Paragraph: 3.1

683-19910
MCA TO AR RACK, BOEING-ORBITAL SCIENCES INTERFACE DEFINITION DRAWING

Paragraph: 3.1

ASTM E380
Standard Practice for Use of the International System of Units (SI) (the Modernized Metric System)

Paragraph: 3.1.4.2

D683-14719-1-9
US Lab Architecture Control Document Volume 9: Air Revitalization System

Paragraph: 3.1

RR00022V2
Component Data Interface Format Specification - Volume 2: Remote Power Control Module

Paragraph: 3.2.1.10

SSP 30459
International Space Station Interface Control Plan

Paragraph: 1.3

SSP 41178-12
Software Interface Control Document Internal Multiplexer/Demultiplexer to International Space Station Book 12, Major Constituent Analyzer Interface

Paragraph: 3.2.1.10

SSP 50318
Prime Item Development Specification for Node 3

Paragraph: 1.2

SSP 50405-08
Software Interface Control Document Hub Control Zone (HCZ) Multiplexer/Demultiplexer (MDM) to International Space Station (ISS) Book 8 Pump/Fan Motor Controller (PFMC) Interface

Paragraph: 3.2.1.10

2-3

Requirements

GENERAL

The Atmosphere Revitalization Subsystem Subassemblies residing in the ARS Rack are a part of the International Space Station Environmental Control Life Support System. The purpose of the ARS is to revitalize the habitable atmosphere by removing carbon dioxide, potentially hazardous gaseous trace contaminants generated by crew metabolic processes and equipment off-gassing such that cabin contaminant levels are maintained within acceptable limits. The carbon dioxide removed from the module atmosphere is vented to space. The ARS also monitors the cabin atmosphere for major constituents (O2, N2, CO2, H2, CH4, H2O). D683-14719-1-9, US Lab Architecture Control Document Volume 9: Air Revitalization System, provides an overview of the ARS Rack subsystems with software and hardware descriptions.

The Major Subassemblies of the ARS Rack are the Carbon Dioxide Removal Assembly (CDRA) (IDD 683-19702, CDRA TO AR RACK, BOEING-AlliedSignal INTERFACE DEFINITION DRAWING), the Trace Contaminant Control Subassembly (TCCS) (IDD 683-19801, TRACE CONTAMINANT CONTROL SUBASSEMBLY TO ATMOSPHERE REVITALIZATION RACK, BOEING-LMSC, INTERFACE DEFINITION DRAWING), the Major Constituent Analyzer (MCA) (IDD 683-19910, MCA TO AR RACK, BOEING-ORBITAL SCIENCES INTERFACE DEFINITION DRAWING), the Avionics Air Assembly (AAA) (IDD 683-15204, Avionics Air Assembly, Boeing-Hamilton Standard Interface Definition Drawing), the Sample Delivery System (SDS), and distribution hardware. The referenced Interface Definition Documents (IDD) define the functional and physical compatibility between each of the interfacing subassemblies within the ARS Rack.

The CDRA and TCCS process the cabin air to remove carbon dioxide and gaseous trace contaminants, respectively. The MCA monitors the levels of major atmospheric constituents in the cabin. The partial pressure data from the MCA for O2 is used by the Atmosphere Control and Supply subsystem for O2 partial pressure control. The SDS and distribution hardware provide functional fluid interconnections between the TCCS, MCA, CDRA, cabin atmosphere, and other subsystems and systems. The AAA part of Temperature and Humidity Control (THC), and associated ducting transports the internal rack air for processing within the ARS Rack. The carbon dioxide vent assembly delivers carbon dioxide from the CDRA to space vacuum.

Process air is pulled into the CDRA from the cabin air THC for removal of carbon dioxide. Processed air is subsequently returned to the cabin air return duct. The TCCS draws air directly from the Element atmosphere through an inlet grill on the face of the ARS Rack for removal of gaseous trace contaminants. The TCCS returns processed air to the CDRA return line. Figure 3.1-1 illustrates the primary ARS rack subassembly interfaces.

The ARS rack is built by the Boeing Company for NASA. NASA will provide an existing ARS rack to Alenia for installation and integration into Node 3.

FIGURE 3.1-1 PRIMARY ARS RACK SUBASSEMBLY INTERFACES

Interface Description The interfaces specified herein are applicable to the as built ARS Rack and to the Node 3. The Node 3 will provide power, data, coolant, cabin air, THC process air, sample air, environmental, and structural/mechanical interfaces at the ARS Rack location. The ARS Rack will provide data, return coolant, waste carbon dioxide, MCA vent gas, return process air, and structural/mechanical interfaces to Node 3. A functional interface diagram is shown in Figure 3.1.1-1, Node 3 to ARS Rack Functional Interface Diagram.

FIGURE 3.1.1-1 NODE 3 TO ARS RACK FUNCTIONAL INTERFACE DIAGRAM

ARS rack description The ARS Rack is a six-post systems rack containing a CDRA, TCCS, MCA, SDS valves, Remote Power Distribution Assembly (RPDA), area smoke detector, coldplates, AAA, and a rack power switch. The ARS Rack is fully compatible with the Standard Equipment Rack attachment mechanisms and envelopes for ground handling, launch, landing, and on-orbit events.

Interface Responsibilities ARS Rack Responsibility Unless otherwise noted herein, Boeing/NASA is responsible for providing the existing ARS Rack to Alenia for integration into Node 3.

Node 3 Provider Responsibility Unless otherwise noted herein, the Node 3 provider is responsible for designing the element to accommodate the as built ARS interface requirements as defined in this document.

Responsibility for Interconnecting Cabling, tubing, and connectors Node 3 shall provide interconnecting cabling, tubing, and connectors to the rack interface panel. The ARS Rack is responsible for providing rack interface panel connectors. Receptacles are provided at the rack interface panel, shown in Figure 3.2.1.4-1, ARS Rack Interface Control Panel. Plugs shall be provided by Node 3.

Coordinate System The coordinate system applicable to the Node 3 to ARS Rack interface shall be as defined in SSP 41017, Part 2, Rack to Mini Pressurized Logistics Module Interface Control Document (ICD) Part 2, paragraph 3.1.3. Figure 3.1.3-1, ARS Rack Interface Utility Panel, describes the ARS stayout zone and center point of the rack surface interface panel.

FIGURE 3.1.3-1 ARS RACK INTERFACE UTILITY PANEL

Engineering units, tolerances, and conversions Engineering units Dimensions in this document are shown in the English (inch, pound, second) system of units followed by the equivalent SI (metric) value in parentheses. Measurements may be verified in either system of units.

tolerances Linear tolerances on English dimensions are as indicated in Table 3.1.4.2-1. Linear tolerances on metric dimensions are derived from English measurements and tolerances as defined in ASTM E380, Standard Practice for Use of the International System of Units (SI) (the Modernized Metric System), section 4.5. Angular tolerances are plus or minus 0.1 degrees on all angles unless otherwise stated.

TABLE 3.1.4.2-1 LINEAR TOLERANCES

ENGLISH DIMENSION
IMPLIED TOLERANCE (INCHES)
X.XX
+/- 0.030
X.XXX
+/- 0.010

Interface requirements Node 3 Interface Requirements Envelope Requirements The Node 3 shall reserve volume for the ARS rack envelope as defined in SSP 41017, Part 1, Rack to Mini Pressurized Logistics Module Interface Control Document (ICD) Part 1, paragraph 3.2.2.1.

Mass Properties The Node 3 shall accommodate the maximum mass of the integrated ARS Rack which does not exceed the weight of 1275 lbs (578.3 kg).

Structural/Mechanical Attachment The Node 3 structural/mechanical interface is as defined in SSP 41017, Part 2, paragraphs 3.2 and 3.3.

Rack Interface Panel The Node 3 shall interface with the ARS rack interface panel for connection of utilities between Node 3 and the ARS Rack. The ARS Rack to Node 3 interface panel as shown in Figure 3.2.1.4-1, defines the rack interface panel and the corresponding connector receptacle location.

FIGURE 3.2.1.4-1 ARS RACK INTERFACE CONTROL PANEL

Fire suppressant rack port location Figure 3.2.1.5-1, ARS Rack Fire Suppressant Port and TCCS Inlet Coordinates, defines the location of the fire extinguishing port on the front panel of the ARS Rack.

FIGURE 3.2.1.5-1 ARS RACK FIRE SUPPRESSANT PORT AND TCCS INLET COORDINATES

interface loads The interface loads for launch and landing are the static, dynamic and pressure loads exchanged between Node 3 and the ARS Rack through attach points A, B, P, Q and W. Interface loads imposed by Node 3 on the ARS Rack, for all flight and ground events, will not exceed the interface loads defined in Table 3.2.1.6-1, Node 3 Design Limit Interface Forces, ARS Rack.

FIGURE 3.2.1.6-1 NODE 3 LOCATION AND DIRECTION OF INTERFACE FORCES

TABLE 3.2.1.6-1 NODE 3 DESIGN LIMIT INTERFACE FORCES, ARS RACK

EVENT5
Limit Load N (Lbs)
ATTACH POINT LOCATIONS
Component
A
B
P
Q
W
Launch
X
Max
20310 (4564)
0
63

(14)

16330 (3670)
20

(4.5)

Min
-8664

(-1947)

0
-99

(-22) -8685 (-1952) -1 (-0.22)

Y
Max
6429

(1445) 12680 (2850) (2061) 10510 (2362) (2184)

Min
-9763

(-2194) -8653 (-1945) -13040 (-2930) -5591 (-1256) -11820 (-2656)

Z
Max
10530

(2366) 17280 (3833) (3.6) (9) (4)

Min
-9613

(-2160) -23160 (-5205) -17 (-3.8) -43 (-10) -19 (-4.3)

Landing
X
Max
8051

(1809)

0
58

(13) (1787) (1.4)

Min
-10710

(-2407)

0
-55

(-12) -8577 (-1927) -5 (-1.1)

Y
Max
4462

(1003) (1025) (1483) (1153) (1391)

Min
-5701

(-1281) -8120 (-1825) -8287 (-1862) -5547 (-1247) -7955 (-1788)

Z
Max
7374

(1657) 14510 (3261) (3.4) (7) (3.1)

Min
-4158

(-934) -5382 (-1209) -6 (-1.4) -14 (-3.1) -6 (-1.4)

NOTE: See Figure 3.2.1.6-1 for Node 3, Location and Direction of Forces, ARS Rack smoke detection Smoke detection and the fan for smoke detection air flow are internal to the ARS rack. Node 3 shall provide control of the smoke detection and control of the fan for smoke detection air flow support. Node 3 shall monitor the fan and control the red light emitting diode smoke indicator located on the front of the ARS rack.

Fluid Interfaces Supply Low Temperature Coolant The Node 3 shall supply single-phase low temperature loop coolant to the ARS Rack for active heat acquisition and transport. The supply Low Temperature Loop (LTL) coolant interface is at the rack interface panel shown in Figure 3.2.1.4-1.

Node 3 LTL Heat Transport Capability The Node 3 shall accommodate a maximum LTL heat load from the ARS Rack of 500 Watts.

Supply LTL Coolant Characteristics Supply LTL Coolant Specification The single-phase LTL coolant supplied by Node 3 shall comply with the requirements of SSP 30573, Space Station Program Fluid Procurement and Use Control Specification.

Supply LTL Coolant free gas content The Node 3 shall provide low temperature water coolant to the ARS Rack with a maximum of 0.5 percent by volume of air as free gas at 70 degrees Fahrenheit and 21 psia (21.1 degrees Celsius and 144,829 Pa), or equivalent.

Supply LTL Coolant Temperature The Node 3 shall supply LTL coolant to the ARS Rack at a temperature range from 38 degrees Fahrenheit to 44 degrees Fahrenheit (3.3 degrees Celsius to 6.7 degrees Celsius).

Supply LTL Coolant Pressure The Node 3 shall nominally supply low temperature coolant to the ARS Rack at a pressure range from 18 psia to 100 psia (124,139 Pa to 689,660 Pa).

Supply LTL Coolant Flow Rate The Node 3 shall supply LTL coolant to the ARS Rack at a flow rate of 262 to 288.2 lb/hr (119 to 130.9 kg/hr).

Supply LTL Coolant Pressure Drop The Node 3 shall accommodate a pressure drop no greater than 14.5 psid (99.974 Pa) across the ARS Rack to Node 3 LTL interface, when supply coolant at:

A.The maximum flow rate specified in 3.2.1.8.1.2.4 (288.2 lb/hr or 130.9 kg/hr).
B.And at a temperature of 40 degrees Fahrenheit (4.4 degree Celsius).

The above interface requirements addresses the parameters at which the ARS Rack’s LTL Manual Flow Control Valve (MFCV) shall be adjusted - calibrated - for integration in Node 3.

supply ltl coolant quantity Node 3 shall accommodate an LTL coolant quantity of 10 lbs (4.95kg).

Supply LTL Coolant Leakage Rate The Node 3 shall accommodate an ARS Rack LTL coolant leakage rate of .018 cubic centimeters of water per hour at the maximum pressure defined in paragraph 3.2.1.8.1.2.3.

Supply LTL Coolant Connector The Node 3 shall supply LTL coolant at the ARS Rack interface panel via the Thermal Control System (TCS) Low Temp Supply connector defined in Table 3.2.1.8.1.3-1, Fluid Interface Connectors.

TABLE 3.2.1.8.1.3-1 FLUID INTERFACE CONNECTORS

Connection
Category (1)
Keying
QD Body Size
Rack Side Part Number
Node 3 Side Vendor Part Number
TCS Low Temp Supply
(6)
(B)
0.5 in
683-16348-218
2000-A12C-T06B
TCS Low Temp Return
(6)
(C)
0.5 in
683-16348-234
2000-A12C-T06C
TCS Mod Temp Supply
(6)
(B)
0.5 in
683-16348-218
2000-A12C-T06B
TCS Mod Temp Return
(6)
(C)
0.5 in
683-16348-234
2000-A12C-T06C
CO2 Vent
(2)
(A)
0.5 in
683-16348-26
2000-A12C-C02A
MCA Vent
(3)
(B)
1.0 in
683-16348-57
2000-A16C-M03B
THC Air Supply
N/A
N/A
1.75 in
Flange 14F02-28A

(2)(4) Part of 683-19332-1 14F02-28A (4)

THC Air Return
N/A
N/A
1.75 in
Flange 14F02-28A

(3)(4) Part of 683-53057-1 14F02-28A (4)

Sample Air
N/A
N/A
0.125 in
683-19364-1
683-19363-1
Notes:
(1)Categories as defined in Boeing drawing 683-16348.
(2)The end of the flange is at 1.894 in (48.1 mm) from external surface of RIP.
(3)The end of the flange is at 1.76 in (44.8 mm) from external surface of RIP.
(4)The coupling assembly (P/N 15J02-28A) and the O-ring (P/N AS568A-224) is provided by Alenia.

Receive LTL Coolant Return The Node 3 shall receive low temperature coolant returned from the ARS Rack. The receive coolant return interface is at the rack interface panel shown in Figure 3.2.1.4-1.

Receive LTL Coolant Return Characteristics Receive LTL Coolant Return Specification The Node 3 shall receive coolant that meets the requirements of SSP 30573.

Receive LTL Coolant free gas content The Node 3 shall receive low temperature water coolant from the ARS Rack with a maximum of 3.2 percent by volume of air as free gas at 70 degrees Fahrenheit and 21 psia (21.1 degrees Celsius and 144,829 Pa), or equivalent distributed in the connected water volume.

The AR rack shall not insert an air slug larger in volume than 0.3 cubic inches at 70degrees Fahrenheit and 21 psia into the Node 3 LTL.

Receive LTL Coolant Return Temperature The Node 3 shall receive LTL coolant returned from the ARS Rack at a temperature range of 38 degrees Fahrenheit to 51 degrees Fahrenheit (3.3 degrees Celsius to 10.6 degrees Celsius).

Receive LTL Coolant pressure The Node 3 shall receive LTL coolant returned from the ARS Rack at a pressure range from 18 psia to 100 psia (124,139 Pa to 689,660 Pa).

Receive LTL Coolant flow rate The Node 3 shall receive LTL coolant returned from the ARS Rack at a flow rate of 262 to 288.2 lb/hr (119 to 130.9 kg/hr).

Receive LTL Coolant Return Connector The Node 3 shall receive LTL coolant returned from the ARS Rack via the TCS Low Temp Return connector defined in Table 3.2.1.8.1.3-1.

Supply Moderate Temperature Coolant The Node 3 shall supply single-phase moderate temperature loop coolant to the ARS Rack for active heat acquisition and transport. The supply Moderate Temperature Loop (MTL) coolant interface is at the rack interface panel shown in Figure 3.2.1.4-1.

Node 3 MTL Heat Transport Capability The Node 3 shall accommodate a maximum MTL heat load from the ARS Rack of 229 Watts, assuming adiabatic conditions.

Supply MTL Coolant Characteristics Supply MTL Coolant Specification The single-phase MTL coolant supplied by Node 3 shall comply with the requirements of SSP 30573.

Supply MTL Coolant free gas content The Node 3 shall provide moderate temperature water coolant to the ARS Rack with a maximum of 0.5 percent by volume of air as free gas at 70 degrees Fahrenheit and 21 psia (21.1 degrees Celsius and 144,829 Pa) or equivalent.

Supply MTL Coolant Temperature The Node 3 shall supply MTL coolant to the ARS Rack at a temperature range from 61 degrees Fahrenheit to 65 degrees Fahrenheit (16.1 degrees Celsius to 18.3 degrees Celsius).

Supply MTL Coolant Pressure The Node 3 shall nominally supply moderate temperature coolant to the ARS Rack at a pressure range from 18 psia to 100 psia (124,139 Pa to 689,660 Pa).

Supply MTL Coolant Flow Rate The Node 3 shall supply MTL coolant to the ARS Rack at a flow rate of 132 to 145.2 lb/hr (60 to 66 kg/hr).

Supply MTL Coolant Pressure Drop The Node 3 shall accommodate a pressure drop no greater than 10.3 psid (71.016 Pa) across the ARS Rack to Node 3 MTL interface, when supplying coolant at:

A.The maximum flow rate specified in 3.2.1.8.3.2.4 (145.2 lb/hr).
B.and at a temperature of 63 degrees Fahrenheit (17.2 degrees Celsius).

The above interface requirements addresses the parameters at which the ARS Rack’s MTL MFCV shall be adjusted - calibrated - for integration in Node 3).

Supply MTL coolant quantity Node 3 shall accommodate an MTL coolant quantity of 4.2 lbs (1.9 kg).

Supply MTL Coolant Leakage Rate The Node 3 shall accommodate an ARS Rack MTL coolant leakage rate of .021 cc water/hr at the maximum pressure defined in paragraph 3.2.1.8.3.2.3.

Supply MTL Coolant Connector The Node 3 shall supply MTL coolant at the ARS Rack interface panel via the TCS Moderate Temperature Supply connector defined in Table 3.2.1.8.1.3-1.

Receive MTL Coolant Return The Node 3 shall receive moderate temperature coolant returned from the ARS Rack. The receive coolant return interface is at the rack interface panel shown in Figure 3.2.1.4-1.

Receive MTL Coolant Return Characteristics Receive MTL Coolant Return Specification The Node 3 shall receive coolant that meets the requirements of SSP 30573.

Receive MTL Coolant free gas content The Node 3 shall receive moderate temperature water coolant from the ARS Rack with a maximum of 3.2 percent by volume of air as free gas at 70 degrees Fahrenheit and 21 psia (21.1 degrees Celsius and 144,829 Pa) or equivalent, distributed in the connected water volume.

The Atmosphere Revitalization (AR) rack shall not insert an air slug larger in volume than 0.3 cubic inches at 70 degrees Fahrenheit and 21 psia into the Node 3 MTL.

Receive MTL Coolant Return Temperature The Node 3 shall receive MTL coolant returned from the ARS Rack at a temperature range of 61 degrees Fahrenheit to 78 degrees Fahrenheit (16.1 degrees Celsius to 25.6 degrees Celsius) Receive mTL Coolant pressure The Node 3 shall receive MTL coolant returned from the ARS Rack at a pressure range from 18 psia to 100 psia (124139 Pa to 689660 Pa).

Receive mTL Coolant flow rate The Node 3 shall receive MTL coolant returned from the ARS Rack at a flow rate of 132 to 145.2 lb/hr (60 to 66 kg/hr).

Receive MTL Coolant Return Connector The Node 3 shall receive MTL coolant returned from the ARS Rack via the TCS Moderate Temperature Return connector defined in Table 3.2.1.8.1.3-1.

Receive Waste Carbon Dioxide The Node 3 shall receive waste carbon dioxide from the ARS Rack. The carbon dioxide interface is at the rack interface panel shown in Figure 3.2.1.4-1.

Receive Waste Carbon Dioxide Characteristics Receive Waste Carbon Dioxide Temperature The Node 3 shall receive waste carbon dioxide from the ARS Rack at a temperature from 70 degrees Fahrenheit to 88 degrees Fahrenheit (21 degrees Celsius to 31.1 degrees Celsius).

CO2 maximum flow resistance The Node 3 shall provide a CO2 vent line with a maximum equivalent line length of 22 feet (6.70m) from Rack Interface Panel (RIP) plane up to Node 3 gore panel (venting device excluded) for a .43 in (10.9 mm) inside diameter.

Receive Waste Carbon Dioxide Maximum Design Pressure The Node 3 shall receive waste carbon dioxide from the ARS Rack at a nominal operating pressure of 0 to 1psia (6,895 Pa) subject to the vent flow resistance requirement of 3.2.1.8.5.1.2.

The Node 3 non-operating pressure shall be 0 to 15.2 psia (104,828 Pa).

Receive Waste Carbon Dioxide Flow Rate The Node 3 shall receive waste carbon dioxide from the ARS Rack at a maximum flow rate of 2 lb/hr (0.91 kg/hr) with the flow rate profile defined in Figure 3.2.1.8.5.1.4-1. The profile in Figure 3.2.1.8.6.1.4-1 represents one complete CDRA half cycle.

FIGURE 3.2.1.8.5.1.4-1 RECEIVE WASTE CARBON DIOXIDE FLOW RATE PROFILE

Receive Waste Carbon Dioxide Connector The Node 3 shall receive waste carbon dioxide from the ARS Rack via the CO2 vent connector defined in Table 3.2.1.8.1.3-1.

Receive MCA Vent Gas The Node 3 shall receive MCA vent gas from the ARS Rack. The MCA vent gas interface is at the rack interface panel shown in Figure 3.2.1.4-1.

Receive MCA Vent Gas Characteristics The Node 3 MCA vent gas composition is cabin air.

Receive MCA Vent Gas Temperature The Node 3 shall receive MCA vent gas from the ARS Rack at a temperature from 65 degrees Fahrenheit to 80 degrees Fahrenheit (18.3 degrees Celsius to 26.7 degrees Celsius).

Receive MCA Vent Gas Pressure The Node 3 shall provide an MCA vacuum interface pressure at the ARS Rack RIP of 2.2 mtorr or less for a throughput up to 0.22 mtorr liters per second.

Receive MCA Vent Gas Maximum Design Pressure The Node 3 shall receive MCA vent gas from the ARS Rack at a maximum design pressure of 15.2 psia (104,828 Pa).

Receive MCA Vent Gas Connector The Node 3 shall receive MCA vent gas from the ARS Rack via the MCA vacuum connector defined in Table 3.2.1.8.1.3-1.

Supply Cabin Air Node 3 cabin air, at ambient conditions, enters the ARS Rack Trace Contaminant Control Subsystem through an opening in the rack faceplate as shown in Figure 3.2.1.51. The cabin air flow rate into the TCCS is 9 cfm (0.25 M3/minute).

Supply THC Process Air The Node 3 shall supply THC process air to the ARS Rack. The THC process air supply interface is at the rack interface panel shown in Figure 3.2.1.4-1.

Supply THC Process Air Characteristics Supply THC Process Air Temperature The Node 3 shall supply THC process air to the ARS Rack at a temperature of 37 to 53 degrees Fahrenheit (2.8 to 11.7 degrees Celsius).

Supply THC Process Air Dew Point The Node 3 shall supply THC process air to the ARS Rack at a dew point of 37 to 53 degrees Fahrenheit (2.8 to 11.7 degrees Celsius).

Supply THC Process Air Pressure The Node 3 shall supply THC process air to the ARS Rack at a pressure of 13.9 to 15.2 psia (95,863 Pa to 104,828 Pa). The process air pressure shall be greater than or equal to cabin pressure at a volume flow of 21 cfm.

Supply THC Process Air Flow Rate The Node 3 shall supply THC process air to the ARS Rack at a flow rate range of 11 to 27.4 cfm (0.31 m3/minute to 0.78 m3/minute). The actual flow rate shall be determined by the CDRA blower speed.

Supply THC Process Air Connector The Node 3 shall supply THC process air to the rack interface panel via the THC Air Supply connector defined in Table 3.2.1.8.1.3-1.

Receive THC Process Air Return The Node 3 shall receive THC process air returned from the ARS Rack. The return process air interface is at the rack interface panel shown in Figure 3.2.1.4-1.

Receive THC Process Air Return Characteristics Receive THC Process Air Return Temperature The Node 3 shall receive THC process air from the ARS Rack at a temperature of 30 to 125 degrees Fahrenheit (-1.1 to 51.6 degrees Celsius) with a cabin air temperature of 80 degrees Fahrenheit (26.6 Celsius) per the profile shown in Figure 3.2.1.8.9.1.1-1 and 65 degrees Fahrenheit (18.3 Celsius) cabin air per the profile in Figure 3.2.1.8.9.1.1-2. Both profiles represent one CDRA half cycle.

FIGURE 3.2.1.8.9.1.1-1 THC PROCESS AIR TEMPERATURE CABIN AIR 80 DEGREES fahrenheit PROFILE

FIGURE 3.2.1.8.9.1.1-2 THC PROCESS AIR TEMPERATURE CABIN AIR 65 DEGREEs fahrenheit PROFILE Receive THC Process Air Return Pressure Drop The Node 3 shall receive process air pressure less than or equal to cabin pressure at a volume flow of 21 cfm (0.59 M3/minute).

Receive process air return dewpoint The Node 3 shall receive THC process air from the ARS Rack at a dew point between -10 degrees Fahrenheit and 80 degrees Fahrenheit (-23 degrees Celsius and 27 degrees Celsius) per the profile shown in Figure 3.2.1.8.9.1.3-1. The profile represents one CDRA half cycle.

FIGURE 3.2.1.8.9.1.3-1 RECEIVE THC PROCESS AIR RETURN DEW POINT PROFILE

Receive THC Process Air Return Flow Rate The Node 3 shall receive THC process air returned from the ARS Rack at a flow rate of 30 cfm (0.85 M3/minute). The THC maximum return flow rate is 36.4 cfm (1.03 m3/minute).

receive thc process air return heat load The Node 3 shall receive an average THC process air return heat load of 160 watts (sensible; average latent contribution is zero) from the ARS Rack. This load is further defined as follows:

A.CDRA load - The time average process air heat load is 40 watts. The supply is from the Common Cabin Air Assembly ARS port at 48 degrees Fahrenheit with a flow rate of 95 lb/hr (21 cfm).
B.TCCS load - The process air heat load is 120 watts. The supply is from the cabin ambient at 80 degrees Fahrenheit with a flow rate of 9 cfm.

Receive THC Process Air Return Connector The Node 3 shall receive THC process air returned from the ARS Rack at the rack interface panel via the THC Air Return connector defined in Table 3.2.1.8.1.3-1.

Supply Sample Air The Node 3 shall supply sample air to the ARS Rack. The air sample supply interface is at the rack interface panel shown in Figure 3.2.1.4-1.

Supply Sample Air Temperature The Node 3 shall supply sample air to the ARS Rack at a temperature from 65 to 80 degrees Fahrenheit (18.3 to 26.7 degrees Celsius).

Supply Sample Air Pressure Drop Node 3 Zenith Bulkhead to ARS Rack The sample line pressure drop from the Node 3 zenith bulkhead to the ARS Rack interface panel shall not exceed 0.15 psid (1,034 Pa) at the maximum flow rate specified in paragraph 3.2.1.8.10.1.3.

Node 3 Forward Bulkhead to ARS Rack The sample line pressure drop from the Node 3 forward bulkhead to the ARS Rack interface panel shall not exceed 1.3 psid (8,966 Pa) at the maximum flow rate specified in paragraph 3.2.1.8.10.1.3.

Node 3 Port Bulkhead to ARS Rack The sample line pressure drop from the Node 3 port bulkhead to the ARS Rack interface panel shall not exceed 1.15 psid (7,931 Pa) at the maximum flow rate specified in paragraph 3.2.1.8.10.1.3.

Node 3 Starboard Bulkhead to ARS Rack The sample line pressure drop from the Node 3 starboard bulkhead to the ARS Rack interface panel shall not exceed 1.3 psid (8,966 Pa) at the maximum flow rate specified in paragraph 3.2.1.8.10.1.3.

Node 3 Cabin Sample Port to ARS Rack The sample line pressure drop from the Node cabin sample port to the ARS Rack interface panel shall not exceed 1.4 psid (9,655 Pa) at the maximum flow rate specified in paragraph 3.2.1.8.10.1.3.

Supply Sample Air Maximum Design Pressure The Node 3 shall supply sample air to the ARS Rack at a maximum design pressure of 15.2 psia (104,828 Pa).

Supply Sample Air Flow Rate The Node 3 shall supply sample air to the ARS Rack at a flow rate of 100 to 400 sccm.

Supply Sample Air Connector The Node 3 shall supply sample air to the ARS Rack at the rack interface panel via the sample air connector defined in Table 3.2.1.8.1.3-1.

Electrical Interfaces Supply Power The Node 3 shall supply electrical power per SSP 30482, Volume 1, Electrical Power Specifications and Standards Volume 1: EPS Electrical Performance Specifications, to the ARS Rack on connector J1 at the rack interface panel. The power to the rack shall be a single 3kW power feed with the steady state voltage of that stated in SSP 30482, Volume 1, for an Interface B (116 to 126 Vdc inclusive).

Supply Power Connector The supply power connector and its pin assignments are defined in Table 3.2.1.9.1.1-1, J1 Main Power Connector Description and Pin Assignments.

TABLE 3.2.1.9.1.1-1 J1 MAIN POWER CONNECTOR DESCRIPTION AND PIN ASSIGNMENTS

Connector ID: J1 Power

Mating Cable Connector Part No. (Node 3 Cable)
NATC06G25LN7SN

Per SSQ 21635

Wire Harness Part Number (ARS)
22506-1
Connector Part No. (ARS Rack)
NATC07T25LN7PN

Per SSQ 21635

Insert Arrangement
A and G

Pin Function

Cont ID
Signal Function
EMC Class
AWG
Wire Type
Wire P/N
A
Main Power Return
EO
8
SSQ 21652
NSFW-SIL-8
B
Not used
EO
N/A
N/A
N/A
C
Not used
EO
N/A
N/A
N/A
D
Not used
EO
N/A
N/A
N/A
E
Not used
EO
N/A
N/A
N/A
F
Not used
EO
N/A
N/A
N/A
G
Main Power Supply
EO
8
SSQ 21652
NSFW-SIL-8

Notes:

Supply Power Quality Electrical power supplied by Node 3 to the ARS Rack shall meet the power quality requirements of SSP 30482, Volume 1, for Interface B.

Supply Power Control Protection The Node 3 shall control the supply of power to the ARS Rack by providing 25A overcurrent protection equivalent to a Type 6 Remote Power Control Module.

Data Interfaces MDM Hardwire Interface Connectors Node 3 shall exchange Multiplexer/Demultiplexer (MDM) hardwire data with ARS Rack components in accordance with SSP 30261:002, Space Station Program Space Station Multiplexer/Demultiplexer (SSMDM) Standard Interface Control Document. The MDM hardwire interfaces are located on the rack interface panel J20, J21, J22 connectors. They are shown in Figure 3.2.1.4-1.

MDM Hardwire Interface Connector, P20/J20 The MDM interface connector, P20/J20, is defined in Figures 3.2.1.9.2.1.1-1, Node 3 to ARS Rack P20/J20 Connector Pin Assignments, and 3.2.1.9.2.1.1-2, Node 3 to ARS Rack P20/J20 Connector Pin Assignments.

MDM Hardwire Interface Connector, P21/J21 The MDM interface connector, P21/J21, is defined in Figure 3.2.1.9.2.1.2-1, Node 3 to ARS Rack P21/J21 Connector Pin Assignments, 3.2.1.9.2.1.2-2, Node 3 to ARS Rack P21/J21 Connector Pin Assignments, and 3.2.1.9.2.1.2-3, Node 3 to ARS Rack P21/J21 Connector Pin Assignments.

MDM Hardwire Interface Connector, P22/J22 The MDM interface connector, P22/J22 is defined in Figure 3.2.1.9.2.1.3-1, Node 3 to ARS Rack P22/J22 Connector Pin Assignments.

MIL-STD-1553B Interfaces Node 3 shall provide MIL-STD-1553B, Digital Time Division Command/Response Multiplex Data Bus, data interfaces via connectors J3 and J4 on the rack interface panel.

MIL-STD-1553B Bus Standard Format The Node 3 to ARS Rack data interface format shall meet the requirements of MIL-STD-1553B.

MIL-STD-1553B Bus Signal Characteristics The Node 3 to ARS Rack interface signal characteristics shall meet the requirements of MIL-STD-1553B.

MIL-STD-1553B Bus Coupling

A.The Node 3 to ARS Rack 1553B interfaces shall be transformer coupled on the Node 3 side of the interface in accordance with MIL-STD-1553B utilizing databus couplers per SSQ 21676, Coupler, Data Bus, MIL-STD-1553B, Space Quality, General Specification For, and 22 gauge, 75 ohm controlled impedance electrical cabling per SSQ 21655, Cable, Electrical, MIL-STD-1553 Databus, Space Quality, General Specification For.
B.The Node 3 1553B bus stub length to ARS Rack shall be a maximum of 7 feet (2.13 meters) as measured from the coupling transformer to the rack interface panel.

Terminal Operations The Node shall provide bus control to the ARS Rack components with software in accordance with MIL-STD-1553B.

1553B Bus Interface Connectors MIL-STD-1553B Interface, Connector J3 The MIL-STD-1553B, Bus A connector is defined in Figure 3.2.1.9.2.2.5.1-1, Node 3 to ARS Rack P3/J3, P4/J4 Connector Pin Assignments.

MIL-STD-1553B Interface, Connector J4 The MIL-STD-1553B, Bus B connector is defined in Figure 3.2.1.9.2.2.5.1-1.

FIGURE 3.2.1.9.2.1.1-1 NODE 3 TO ARS RACK P20/J20 CONNECTOR PIN ASSIGNMENTS

FIGURE 3.2.1.9.2.1.1-2 NODE 3 TO ARS RACK P20/J20 CONNECTOR PIN ASSIGNMENTS

FIGURE 3.2.1.9.2.1.2-1 NODE 3 TO ARS RACK P21/J21 CONNECTOR PIN ASSIGNMENTS

FIGURE 3.2.1.9.2.1.2-2 NODE 3 TO ARS RACK P21/J21 CONNECTOR PIN ASSIGNMENTS

FIGURE 3.2.1.9.2.1.2-3 NODE 3 TO ARS RACK P21/J21 CONNECTOR PIN ASSIGNMENTS

FIGURE 3.2.1.9.2.1.3-1 NODE 3 TO ARS RACK P22/J22 CONNECTOR PIN ASSIGNMENTS

FIGURE 3.2.1.9.2.2.5.1-1 NODE 3 TO ARS RACK P3/J3, P4/J4 CONNECTOR PIN ASSIGNMENTS Rack power draw The maximum power usage of the ARS Rack shall not exceed 2696 watts at 124 Vdc input (nominal DC to DC Converter Unit (DDCU) output voltage) during CDRA initialization, not to exceed 25 minutes duration.

The maximum power usage of the ARS Rack during nominal operation shall not exceed 1,870 watts at 124 Vdc input (nominal DDCU output voltage).

The standby mode power usage of the ARS Rack, defined by the following rack configuration, Remote Power Control Module (RPCM) powered, Smoke Detector status of Monitoring, AAA State of Operational, MCA State of Idle, TCCS State of Standby, and CDRA State of Standby shall not exceed 200 Watts at 124 Vdc input (nominal DDCU output voltage).

Software Interfaces Software interfaces for the ARS Rack are defined in the following documents:

SSP 50405-08, Software Interface Control Document Hub Control Zone (HCZ) Multiplexer/Demultiplexer (MDM) to International Space Station (ISS) Book 8 Pump/Fan Motor Controller (PFMC) Interface.

SSP 41178-12, Software Interface Control Document Internal Multiplexer/Demultiplexer to International Space Station Book 12, Major Constituent Analyzer Interface.

RR00022V2, Component Data Interface Format Specification - Volume 2: Remote Power Control Module.

Environments Electromagnetic Compatibility The ARS is electromagnetically self-compatible. The Node 3 shall be electromagnetically compatible with the ARS. The ARS rack shall meet the requirements of SSP 30243, Space Station Requirements for Electromagnetic Compatibility.

Electrical Grounding Isolation The ARS and its equipment meet the requirements of SSP 30240, Space Station Grounding Requirements, including approved tailoring and interpretation agreements. The Node 3 grounding isolation at the ARS interface shall meet or exceed the requirements of SSP 30240 at the ARS interface.

bonding Node 3 shall meet ARS rack classes R and H bonding requirements as defined in SSP 30245, Space Station Electrical Bonding Requirements. Implementation is shown in SSP 41002, International Standard Payload Rack to NASA/ESA/JAXA Modules Interface Control Document, paragraph 3.3.1.2.3. Electrical bonding between the ARS and Node 3 is provided via the bonding strap.

bonding strap Node 3 shall provide the ARS Rack bonding strap. Node 3 shall be capable of receiving a fault current of 95 amp for 40 msec or 26 amps continuous.

Cable and Wire Design The ARS and its equipment meet the requirements of SSP 30242, Space Station Cable/Wire Design and Control Requirements for Electromagnetic Compatibility. The Node 3 shall meet the cable and wire design requirements of SSP 30242 at the ARS interface.

Electromagnetic Interference The ARS and its equipment meet the requirements of SSP 30237, Space Station Electromagnetic Emission and Susceptibility Requirements, including approved tailoring and interpretation agreements. The Node 3 electromagnetic environment shall not exceed the requirements of SSP 30237 at the ARS interface and location.

Electrostatic discharge The ARS contains equipment which may be sensitive to electrostatic discharge (ESD) levels below 15 kV as specified in SSP 30243, paragraph 3.2.9, individually, and at the ARS electrical and electronic interfaces.

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