SSP_41002-RevR.docx

SSP 41002

Revision R International Standard Payload Rack to NASA/ESA/JAXA Modules Interface Control Document

International Space Station Program

Revision R

March 2017

This document contains information that falls under the jurisdiction of the U.S. Department of Commerce Export Administration Regulations, 15 CFR 730-774, and is classified as EAR99. The Export, Re-export or re-transmission of this document or any of the data contained therein in violation of the Export Administration Regulations or other applicable U.S. export control laws and regulations is strictly prohibited.

National Aeronautics and Space Administration International Space Station Program Johnson Space Center Houston, Texas Contract No.: NNJ12GA46C

REVISION AND HISTORY

Classified as EAR99 - Refer to Title Page

REVISION AND HISTORY - Continued Classified as EAR99 - Refer to Title Page

REVISION AND HISTORY - Continued Classified as EAR99 - Refer to Title Page

REVISION AND HISTORY - Continued Classified as EAR99 - Refer to Title Page

REVISION AND HISTORY - Continued Classified as EAR99 - Refer to Title Page

REVISION AND HISTORY - Continued Classified as EAR99 - Refer to Title Page

REVISION AND HISTORY - Continued

Revision R incorporates the following approved PIRNs:

41002-NA-0124A

41002-ND-0051

PREFACE

International Standard Payload Rack to NASA/ESA/JAXA Modules Interface Control Document The International Standard Payload Rack (ISPR) to National Aeronautics and Space Administration (NASA)/European Space Agency (ESA)/Japan Aerospace Exploration Agency (JAXA) Modules Interface Control Document (ICD) defines the physical, functional, and environmental interfaces between the ISPR and the NASA, ESA and JAXA laboratory modules for the on-orbit interfaces.

The contents of this document are intended to be consistent with the task and products to be prepared by the International Space Station (ISS) Program Partners as defined in SSP 41000, International Space Station System Specification. This ICD shall be implemented on all new ISS Program activities and shall be included in any existing contracts through contract changes. This document is under the control of the Interface Control Working Group (ICWG) as described in SSP 30459, International Space Station Interface Control Plan.

INTERNATIONAL SPACE STATION PROGRAMClassified as EAR99 - Refer to Title Page

International Standard Payload Rack to NASA/ESA/JAXA Modules Interface Control Document

CONCURRENCE

march 2017

Classified as EAR99 - Refer to Title Page

TABLE OF CONTENTS

APPENDIX

TABLE

FIGURE

Classified as EAR99 - Refer to Title Page

SSP 41002

Revision R x

INTRODUCTION

ISPR’s are defined as racks which are interchangeable between NASA, ESA, and JAXA laboratories, regardless of the provider or site of initial installation within the ISS.

PURPOSE AND SCOPE

This ICD defines the on-orbit physical, functional, and environmental interfaces between the NASA United States Laboratory (USL) module, ESA Attached Pressurized Module (APM), JAXA Japanese Experiment Module (JEM), and the ISPR. The ground handling, launch, and landing interfaces between the Mini Pressurized Logistics Module (MPLM) and the ISPR are defined in SSP 41017, Rack to Mini Pressurized Logistics Module Interface Control Document.

PRECEDENCE

The overall functional requirements at the ISPR to module interfaces are contained in SSP 41162, United States Orbital Segment Specification, in SSP 41160, Attached Pressurized Module Segment Specification, in SSP 41165, Japanese Experiment Module Segment Specification, and in SSP 41152, ISPR Interface Requirements Document and are implemented in this ICD. These documents, together, form a consistent set of requirements to be implemented by NASA, ESA, and JAXA respectively and take precedence over this document and all other SSP applicable documents, with the exception of SSP 41000.

In case of conflict between these documents and SSP 41000, Space Station System Specification, SSP 41000 takes precedence.

DELEGATION OF AUTHORITY

The responsibility for assuring the definition, control, and implementation of the interfaces identified in this document is vested with the NASA ISS Program Office, JAXA, and with ESA. This document shall be formally approved and controlled in accordance with the provisions of SSP 30459, ISS Interface Control Plan, and jointly signed by NASA, JAXA and ESA. The NASA ISS Prime Contractor, the JAXA Contractors and the ESA Prime Contractor are participants in the development of this ICD.

Classified as EAR99 - Refer to Title Page

SSP 41002

Revision R

1-1

DOCUMENTS

applicable documents The following documents include specifications, models, standards, guidelines, handbooks, and other special publications. The documents listed in this paragraph are applicable to the extent specified herein. Inclusion of applicable documents herein does not in any way supersede the order of precedence identified in Paragraph 1.2 of this document.Classified as EAR99 - Refer to Title Page

683-16348* Rev. C May 17, 1995 Coupling, Quick Disconnect, Fluid, Self-Sealing, Internal

*Document revision applicable to existing JAXA and Boeing hardware.

683-16348** Rev. G January 26, 1998 Coupling, Quick Disconnect, Fluid, Self-Sealing, Internal

** Document revision applicable to Columbus and existing ESA hardware.

683-16348*** Rev. G, ADCN H8, H9 January 26, 1998 Coupling, Quick Disconnect, Fluid, Self-Sealing, Internal

*** Document revision applicable to new procured hardware.

ASTM E380

Rev A 1 Jan 93 Standard Practice for Use of the International System of Units (SI) (The Modernized Metric System)

COL-RQ-ESA-013

Issue 3, Rev C 06 Feb 97 Columbus Human Factors Engineering Requirements

COL-RQ-ESA-014

Issue 2, Rev B 15 Dec 95 Columbus Electromagnetic Compatibility Requirements

EIA RS-170A

Rev A 1 Nov 77 EIA Industrial Electronics Tentative Standard No. 1 - Color TV Studio Picture Line Amplifier Output Drawing

ESA/SCC 3401/056

Issue 1, April, 1993 Revision B, March, 1995 Connectors, Electrical, Circular, Triple-Start Self-Locking Coupling, Scoop-Proof, Removable Crimp Contacts, Based on MIL-C-38999 Series III

Figures 3.3.4.3.3-1, 3.3.4.3.3-2, 3.3.4.7.3-1, 3.3.4.7.3-2, 3.3.4.7.3-3, 3.3.4.7.3-4, 3.3.4.7.3-5

MIL-STD-1553B

Notice 2 8 Sep 86 Digital Internal Time Division Command/Response MultiplexData Bus

Tables 3.3.4-1, 3.3.4.3.2.1-1Classified as EAR99 - Refer to Title Page

SSP 30237*

Rev D, DCN 005, 012, 036, SSCN 6154 12 June 98 Space Station Electromagnetic Emission and Susceptibility Requirements

*Document revision applicable to JEM.

SSP 30237**

Rev H, DCN 036 15 March 2005 Space Station Electromagnetic Emission and Susceptibility Requirements

**Document revision applicable to USL.

SSP 30426

Rev D 21 Jan 94 Space Station External Contamination Control Requirements

SSP 30459

Revision G International Space Station Interface Control Plan

SSP 30482

Volume 2 Rev. A January 1994 Electric Power Specifications and Standards Volume 2: Consumer Constraints

SSP 30573

Rev. E 2 Dec. 09 Space Station Program Fluid Procurement and Use Control Specification

SSP 41017

Part 2, Rev. J 4 Feb 05 Rack to Mini Pressurized Logistics Module Interface Control Document (ICD) Part 2

SSP 41152

Current Issue

Interface Requirements Document International Standard Payload Rack (ISPR)

SSP 50005

Rev B 15 May 94 International Space Station Flight Crew Integration Standard

SSQ 21635

Rev K 29 October 2002 General Specification for Connectors and Accessories, Electrical, Circular, Miniature, IVA/EVA/Robot Compatible, Space Quality

Figures 3.3.4.3.3-1, 3.3.4.3.3-2, 3.3.4.7.3-1, 3.3.4.7.3-2, 3.3.4.7.3-3, 3.3.4.7.3-4, 3.3.4.7.3-5, 3.3.6.1.3-1 reference documents The following documents contain supplemental information to guide the user in the application of this document. These reference documents may or may not be specifically cited within the text of this document.Classified as EAR99 - Refer to Title Page Classified as EAR99 - Refer to Title Page

2-2

INTERFACE

GENERAL

interface description The NASA/ESA/JAXA modules’ interface to the ISPR consists of the mechanical attachments, utility interface panel and utilities, and restraint and mobility hardware attachment. Crew interfaces for the smoke detector visual indicator, portable fire extinguisher (PFE) insertion port and maintenance power switch are located on the ISPR front side.

The utilities interfaces are defined at the separation plane of the connectors located in the modules utility panels.

interface responsibilities NASA, ESA, and JAXA ensure that the ISPR, herein after referred to as racks, conforms to the interface definition contained within this document. NASA, ESA, and JAXA module rack locations designated for ISPRs provide interfacing hardware and utilities consistent with the definitions contained herein.

Coordinate systems The rack coordinate system is defined in SSP 41017, Rack to Mini Pressurized Logistics Module ICD.

envelope interfaces RACK Static ENVELOPE The NASA/JAXA/ESA modules accommodate the static envelope defined in SSP 41017.

mass properties mass The maximum on-orbit mass of an integrated rack is defined in SSP 41017.

Engineering Units and Tolerances Engineering Units Dimensions shown in this document are in the English (inch, pound, second) system of units followed by the equivalent International System of Units (SI) (metric) value in parentheses. Measurement may be verified in either system of units except that connector threads, tubes/ducts diameters will be verified in English standard convention of units.Classified as EAR99 - Refer to Title Page conversions and tolerances For detailed descriptions of conversions and tolerances, reference ASTM E380, Standard Practice for Use of the International System of Units (SI) (The Modernized Metric System).

environmental interfaces natural environment Not Applicable induced environment The racks are capable of operation during and after being exposed to any feasible combination of the following on-orbit environments.

rack DIFFERENTIAL PRESSURE The rack structure when exposed to pressure changes caused by fire suppression, controlled module depressurization, and controlled module repressurization will not permanently deform.

The rack structure withstands the following conditions:

· max. depressurization rate = 878 Pa/s (7.64 psi/min)

· max. repressurization rate = 230 Pa/s (2 psi/min)

· max. fire suppressant carbon dioxide (CO2) flow rate as specified in Figure 3.3.3.2.2-1 rack PRESSURE RELIEF The rack will not have dedicated pressure relief on the front of the rack.

on-orbit crew-induced loadS Racks may be subjected to an inadvertent kick or push-off. Maximum crew-induced design limit loads are given in SSP 50005, International Space Station Flight Crew Integration Standard, or COL-RQ-ESA-013, Columbus Human Factors Engineering Requirements.

shock Not Applicable contamination Not Applicable radiation Not ApplicableClassified as EAR99 - Refer to Title Page acceleration The on-orbit maximum rack center of mass acceleration environments are defined in SSP 41017.

Electromagnetic Compatibility Electromagnetic Compatibility is characterized by SSP 30237, Space Station Electromagnetic Emission and Susceptibility Requirements, or ESA document COL-RQ-ESA-014, Columbus Electromagnetic Compatibility Requirements.

MECHANICAL AND STRUCTURAL INTERFACES

MECHANICAL INTERFACES

On-orbit mechanical interfaces between the ISPR and modules consist of the rack pivot point attachment, rack upper attachment, and restraint and mobility aids hardware interfaces, which are defined in SSP 41017, and of the utility interface panel which is defined in this document in sections 3.2.2 and 3.3.

UTILITY INTERFACE PANEL

The utility interface panel location is shown in Figure 3.2.2-1, Utility Interface Panel Location and Dimensions.

STRUCTURAL INTERFACES

The module to rack structural interfaces consist of the load carrying capability associated with on-orbit attachment points as defined in SSP 41017.

FIGURE 3.2.2-1 UTILITY INTERFACE PANEL LOCATION and dimensionsClassified as EAR99 - Refer to Title Page

SYSTEM INTERFACES

The system interface plane for the rack is at the utility interface panel shown in Figure 3.2.2-1, Utility Interface Panel Location and Dimensions and Figure 3.3-1, Partner Common Panel Connector Locations; Figure 3.3-2, JAXA Life Science Rack Panel Connector Locations; Figure 3.3-3, JAXA Material Processing Rack Panel Connector Locations; Figure 3.3-4, NASA Specific Panel Connector Locations; Figure 3.3-5, ESA Specific Panel Connector Locations, Figure 3.3-6, ESA Video Rack A4 Specific Panel Connector Locations (see Table 3.3-2 for Columbus Payload Rack location nomenclature.)

Exceptions to this interface plane are the cabin air and the crew fire suppression and maintenance interfaces. Standard utility interfaces are available at all rack locations. Standard utility interface options are available at selected rack locations. Module specific utility interfaces are available in one laboratory at selected rack locations. All the system interface utilities are documented in this section. The Module Systems-To-Rack Interfaces are tabulated in Table 3.3-1.

All utility interface panel connectors will be oriented such that their master keying is parallel and adjacent to the top edge of the utility interface panel.

Table 3.3-2 provides a cross reference between the Columbus Payload Rack location nomenclature as used by Columbus and in this document, and the ISS program rack location nomenclature per reference document SSP 30575.

POWER INTERFACES

Physical Interface The rack electrical power interface is at the rack utility interface panel shown in Figure 3.3-1 through 3.3-5. All 3 kW and 6 kW power connectors are identical.Classified as EAR99 - Refer to Title Page

FIGURE 3.3-1 partner common panel connector locationsClassified as EAR99 - Refer to Title Page

FIGURE 3.3-2 JAXA LIFE SCIENCE RACK PANEL CONNECTOR LOCATIONSClassified as EAR99 - Refer to Title Page

FIGURE 3.3-3 JAXA MATERIAL PROCESSING RACK PANEL CONNECTOR LOCATIONSClassified as EAR99 - Refer to Title Page

FIGURE 3.3-4 USL SPECIFIC PANEL CONNECTOR LOCATIONSClassified as EAR99 - Refer to Title Page

FIGURE 3.3-5 APM-SPECIFIC PANEL CONNECTOR LOCATIONSClassified as EAR99 - Refer to Title Page

FIGURE 3.3-6 APM Video Rack A4 SPECIFIC PANEL CONNECTOR LOCATIONSClassified as EAR99 - Refer to Title Page

TABLE 3.3-1 MODULE SYSTEMS-TO-RACK INTERFACES

UTILITY (1)

SPECIFIC

ESA

SPECIFIC

TCS MOD

TCS LOW

x x

GN2 (2)

x

TIME DISTRIBUTION SUPPORT (3)

(Electrical) VIDEO EL (Scar for Video MK2) J80 x 4)

VACUUM

x (7)

(5, 7) x (5, 7)

WASTE GAS

AR (2)

x

HE (2)

x

CO2 (Experiment) (2) x

x (8)

VIDEO EL

(Scar for Video MK2) J81 x (9)

Notes:

Classified as EAR99 - Refer to Title Page

TABLE 3.3-2 COLUMBUS PAYLOAD RACK LOCATION NOMENCLATURE

Columbus Payload Rack location nomenclature as identified in this document Columbus Payload Rack location nomenclature per SSP 30575

Interface Characteristics The rack electrical power interface provides the characteristics as defined in Table 3.3.1.2-1, Output Performance Characteristics of One Power Feeder (Normal Operations).

TABLE 3.3.1.2-1 Output Performance Characteristics of one Power Feeder (Normal Operations)

Fig. 3.3.1.2-4, 3 kW ISPR Interface Source Impedance for one DDCU

Fig. 3.3.1.2-5, 6 kW ISPR interface Source Impedance for one DDCU

Fig. 3.3.1.2-6, 1.2-1.44 kW ISPR Interface Source Impedance for two DDCU’s in parallel

Fig. 3.3.1.2-7, 3 kW ISPR Interface Source Impedance for two DDCU’s in parallel

Fig. 3.3.1.2-8, 6kW ISPR Interface Source Impedance for two DDCU’s in parallel

FIGURE 3.3.1.2-1 MAXIMUM INTERFACE SYSTEM RIPPLE VOLTAGE spectrumClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2-2 interface transient voltage envelopeClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2-3 1.2 - 1.44 kW ISPR INTERFACE SOURCE IMPEDANCE for one DDCUClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2-4 3 kW ISPR INTERFACE SOURCE IMPEDANCE for one ddcuClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2-5 6 kW ISPR INTERFACE SOURCE IMPEDANCE FOR ONE DDCUClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2-6 1.2-1.44 kW ISPR INTERFACE SOURCE IMPEDANCE for two DDCU’s in parallelClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2-7 3 kW ISPR INTERFACE SOURCE IMPEDANCE LIMITS for two ddcu’s in parallelClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2-8 6 KW ISPR INTERFACE SOURCE IMPEDANCE LIMITS for two DDCU’s in parallelClassified as EAR99 - Refer to Title Page

Power Handling Capability The power handling capability is shown in Table 3.3.1.2.1-1, Power Handling Capability.

TABLE 3.3.1.2.1-1 POWER HANDLING CAPABILITY

Power Circuit Maximum Continuous Power (kW)

Parallel use of power feeders by NASA is allowed provided that SSP isolation and fault propagation requirements are met. Each 3, and single 6 kW power feed is accompanied by a 10 amp essentials bus (safing power). For NASA, Bus 1 or 2 is utilized for safing power.

Note 1) Two ISPR’s (position A3 and F3, see Table 3.3-2 for Columbus Payload Rack location nomenclature) in APM may share power with APM External Payload as shown in Figure 3.3.1.2.1-1. In these cases, payload switching may be restricted by Inrush current limitations.

The ISPR/EPF Power Sharing in APM to External Payloads is identified in Figure 3.3.1.2.1-1, ISPR/EPF Power Sharing in APM to External Payloads. The Allocation of Power Capability in the APM per Rack Position is identified in Figure 3.3.1.2.1-2, ISPR Power Allocation Capability in the APM.

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FIGURE 3.3.1.2.1-1 ISPR/EPF Power Sharing in APM to External PayloadsClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2.1-2 ISPR Power Allocation Capability in the APMClassified as EAR99 - Refer to Title Page

Grounding and Isolation Each power feed negative line (return) is single point grounded by structural termination at power source level.

Any power input lead of an equipment located in the ISPR has a Direct Current (DC) isolation of at least 1 MOhm to equipment chassis and between power input lead and equipment conditioned power.

Main power and essential/auxiliary power feeds are galvanically separated from each other. Any power equipment located in the ISPR and connected to both power input leads has a DC isolation of at least 1MOhm in parallel with not more than 0.03 µF of mutual capacitance between the independent power feeds. Mutual capacitance is defined as line-to-line capacitance, exclusive of the Electromagnetic Induction/Interference (EMI) input filter.

Each Active Rack Isolation System (ARIS) compatible ISPR location has an additional ARIS ground wire on pin B of J1 and J2 (instead of the SPARE pin), identified in Figures 3.3.1.3-1 and 3.3.1.5-1. The ARIS resistance (pin to rack structure) shall meet a 50 mOhm DC resistance as maximum for all possible ARIS locations. The module resistance (pin to structure) shall meet a 50 mOhm DC resistance as a maximum.

Bonding The bonding interface is as shown in Figures 3.3.1.2.3-1 through 3.3.1.2.3-3, Rack Bonding Interface Profile, and Figure 3.3.1.2.3-4, Rack Bonding Surface (Bottom View). For the profile view, use Figure 3.3.1.2.3-1 for all Modules except the JEM. For Mitsubishi Heavy Industries (MHI) or Ishikawajima-Harima Heavy Industries (IHI) rack structures in the JEM, use Figure 3.3.1.2.3-2 for the profile. For U.S. Racks in the JEM, use Figure 3.3.1.2.3-3 for the profile. The surfaces at the bonding interface are electroless nickel plated to a minimum thickness of 0.0015 (0.038). Each rack will contain two bonding interfaces as shown in Figure 3.3.1.2.3-5, Rack Bonding Interface Locations. The modules will accommodate bonding interfaces as per Table 3.3.1.2.3-1, Module Bonding Interfaces.

TABLE 3.3.1.2.3-1 module bonding interfaces

FIGURE 3.3.1.2.3-1 rack bonding interface profile - usL, apm, mplmClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2.3-2 rack bonding interface profile - mhi & ihi rack structures in the jemClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2.3-3 rack bonding interface profile - boeing rack structures in the jemClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2.3-4 rack bonding surface (bottom view)Classified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2.3-5 RACK BONDING INTERFACE LOCATIONSClassified as EAR99 - Refer to Title Page

Rack OVERLOAD Protection The power source will provide protection to the rack interface for ISPR overload conditions by means of a remote power controller.

The overload limitation characteristics of the power feeders are defined in Figures 3.3.1.2.4-1, 3.3.1.2.4-2, and 3.3.1.2.4-3, Overload Protection Characteristics.

For current limiting switches, the drawn regions in the figure show the current limit regions from the time the protection devices start to control the current within the specified range, to the maximum time where the protection device trips and interrupts the current flow.

For non-current limiting switches, the drawn regions in the figure show the range of the over-current threshold from minimum trip decision time, to the maximum trip decision time.

Table 3.3.1.2.4-1 defines the major characteristics of the remote power controllers.

The curve defines the trip region for Remote Power Converter/Controllers (RPCs) connected to ISPR locations in the JEM, APM and USL Modules.

USL: ISPR locations are connected to non-current limiting RPCs for 3 and 6 kW feeds, and to current limiting RPCs for 1.44 kW (Auxiliary) feeds. Nominal current ratings are 25, 50, and 12 amperes respectively.

For the non-current limiting RPCs:

For the current limiting RPCs on the 1.44 kW feeds:

APM: All ISPR locations are connected to current limiting solid state power controllers (SSPCs). Current limit levels and trip times are defined in Table 3.3.1.2.4-1. Trip coordination (selective protection) is achieved by utilization of Payload provided downstream protection devices with a current limit below the current limit region of the SSPCs or with a trip time of 1 ms (or shorter). The SSPC will trip if overload is not removed before decision time.

Continuous power interface current below ICL (ICL MIN ≤ ICL ≤ ICL MAX; see Figure 3.3.1.2.43; dependent on component accuracy) will not cause SSPC tripping, i.e. rating of downstream ISPR wiring up to next protection level has to be compliant with ICL MAX.Classified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2.4-1 USL Overload Protection CharacteristicsClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2.4-2 JEM Overload Protection CharacteristicsClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2.4-3 APM OVERLOAD PROTECTION Characteristics (CURRENT LIMITATION CHARACTERISTICS OF ONE POWER FEEDER)Classified as EAR99 - Refer to Title Page

TABLE 3.3.1.2.4-1 Detailed Upstream Protection Characteristics

36.0 A

(2) N/A

39.6 A

(2) N/A

N/A N/A 27.5

1.5 ms (2) 40 ms

3.5 ms (2) 48 ms

72.0 A

(3) N/A

79.2 A

(3) N/A

N/A N/A

55.0 A

1.5 ms (3) 40 ms

3.5 ms (3) 48 ms

12 kW ISPR USL FEED A/Bus 1 FEED B/Bus 2

N/A N/A

N/A N/A

55.0 A

55.0 A

40 ms 40 ms

48 ms 48 ms

NOM.

POWER

ISPR

APM Lateral APM Overhead

JEM

USL

1.2 kW

1.2 kW

1.2 kW

1.44 kW

26.1 A

18.0 A

(4)

13.2 A

29.7 A

19.8 A

(4)

14.4 A

1.5 ms

1.5 ms (4) 31 ms

3.5 ms

3.5 ms (4) 38 ms

Notes:

(1) trip decision time within range of min. and max. limiting/trip threshold

(2) see Figure 3.3.1.2.4-2 apply 25A RPC characteristics

(3) see Figure 3.3.1.2.4-2 apply 50A RPC characteristics

(4) see Figure 3.3.1.2.4-2 apply 25A RPC characteristics for JEM ISPR JPM1F2 and JPM1A5 locations and apply 10A RPC characteristics for the other locations

Rack Inrush/Initializing Current The peak amplitude and rate of change of the inrush current allowed for rack power start-up does not exceed the values listed in Table 3.3.1.2.4.1-1, Rack Inrush/Initialization Current, for the maximum duration of 10 ms. The module electrical power systems are designed to accommodate this capability.Classified as EAR99 - Refer to Title Page

TABLE 3.3.1.2.4.1-1 rack inrush current

*) APM Racks O1 and O2: 18 A (See Table 3.3-2 for Columbus Payload Rack location nomenclature.)

For 6 kW and 12 kW racks, step changes in power demand by the integrated rack (including the initial power application to the load) will not exceed 3 kW on a single feed. The inrush current as defined in SSP 30482 and COL-RQ-ESA-014 respectively (see Table 3.3.1.2.4.1-1 above) applies for all these step load changes.

module “power off” residual voltage level After switching module Remote Power Control in “OFF-”state, the module still provides an residual voltage at the ISPR interface. Table 3.3.1.2.5-1, defines the characteristics.

TABLE 3.3.1.2.5-1 Residual voltage Characteristics at the ISPR Interface

REVERSE CURRENT CHARACTERISTICS AT ISPR INTERFACE

Electrical current can flow in the reverse direction (from the load towards the source) under various fault and transient conditions. In order to ensure compatibility at the ISPR and load interfaces, it is necessary to characterize the capability of the source switchgear to carry reverse current and to limit the amount of reverse current that may be provided by a load or ISPR.

Switch gear reverse current capability is defined in 3.3.1.2.6.1 below. ISPR and load reverse current limits are defined in 3.3.1.2.6.2.

REVERSE CURRENT CAPABILITY OF ISPR INTERFACE

The reverse current capability of the power system upstream of the ISPR interface is listed in Table 3.3.1.2.6.1-1. The values shown are the demonstrated capabilities of the system to conduct current pulse transient and steady state currents that could flow from the ISPR, back through the protective switches when a fault occurs upstream of these switches under otherwise normal operating conditions.Classified as EAR99 - Refer to Title Page Classified as EAR99 - Refer to Title Page

TABLE 3.3.1.2.6.1-1 POWER SYSTEM REVERSE CURRENT CAPABILITY

( t > 1 s )

Notes:

1) s = microsecond, ms = millisecond, s = second, N/S = not specified

REVERSE CURRENT CHARACTERISTICS of ISPR and loads The ISPR and load assemblies will limit reverse current transients that can occur when a hard fault occurs across the power source. The transient currents will decay and be mostly contained within the applicable transient envelope shown in Figures 3.3.1.2.6.2-1, 3.3.1.2.6.2-2 and 3.3.1.2.6.2-3. These envelopes bound a range of pulses of various widths, all having a current-squared-time integral (I2 t) approximate equivalent to the respective pulses in Table 3.3.1.2.6.1-1.

For purposes of this Interface definition, the fault is 10 mΩ or less applied within 2 µs or less. For ISPR and load assemblies exhibiting reverse current transient peaks within +/-100 amperes, the fault resistance is 40 mΩ or less.Classified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2.6.2-1 reverse current envelope, t < 300 µsClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2.6.2-2 REVERSE CURRENT ENVELOPE, 300 µs < t < 10 msClassified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2.6.2-3 REVERSE CURRENT ENVELOPE, 10 ms < t < 300 msClassified as EAR99 - Refer to Title Page transient partially contained within the envelope The transients may exceed the envelope limits of 3.3.1.2.6.2 for one or more short time intervals, provided the transient peak current and the ratio of the items of intersection with the envelope satisfy the limit.

Where ln represents the natural logarithm, t1, and t2 correspond to the beginning and end times, respectively, of each interval when the transient is outside the envelope, ipk is the peak of the transient occurring between t2 and t1, and ie is the point on the envelope at the time of the peak ipk. For multiple intervals in which the envelope is exceeded, the left-hand side of this expression will be evaluated for each interval and the sum of all such results will total less than unity. This criterion is based on approximation of the real transient by a vertical-sided pulse which begins at t1, follows a t-2 function through the ipk point, and ends at t2. This vertical-sided pulse has the stress property (current-squared time integral) as the test pulses in Table 3.3.1.2.6.1-1.

An example of such a case is illustrated in Figure 3.3.1.2.6.2.1-1 where the transient for a hypothetical Load “A” is overlaid with the envelope for a US Type II Remote Power Control Module (RPCM). The figure shows the transient crossing the envelope at times t1 = 5.1 ms and t2 = 7.1 ms and an envelope value, ie = 21 A. Substituting these values into the relationship of 3.3.1.2.6.2.1 leads to ( ipk / ie ) 2 x ln(7.1 / 5.1) = ( 27.5 / 21 )2 x 0.331 = 0.567 which satisfies the inequality, and since there are no additional envelope crossings, this calculation demonstrates compatibility.Classified as EAR99 - Refer to Title Page

FIGURE 3.3.1.2.6.2.1-1 an example of load partially contained within the envelope

LOADS HAVING LOW CAPACITANCE INPUT FILTERS

Loads having input connected capacitances, the aggregate total of which is less than 25 µF, will satisfy the limits of 3.3.1.2.6.2 above for US Type I RPCMs.