Attach0023_PMP.pdf

W31P4Q-19-X-XXXX

Attachment #023 31 January 2018

13715917

Joint Attack Munition Systems (JAMS)

Parts Management Plan (PMP)

DISTRIBUTION STATEMENT C: DISTRIBUTION AUTHORIZED TO U.S. GOVERNMENT

AGENCIES AND THEIR CONTRACTORS. ADMINISTRATIVE AND OPERATIONAL USE. 9

APRIL 2015. OTHER REQUESTS FOR THIS DOCUMENT SHALL BE REFERRED TO: PROJECT

MANAGER, JOINT ATTACK MUNITION SYSTEMS PROJECT OFFICE. ATTN: SFAE-MSL-JA

REDSTONE ARSENAL, AL 35898-5610

WARNING: THIS DOCUMENT CONTAINS TECHNICAL DATA WHOSE EXPORT IS

RESTRICTED BY THE ARMS EXPORT CONTROL ACT (TITLE 22, U.S.C., SEC 2751, ET SEQ.)

OR THE EXPORT ADMINISTRATION ACT OF 1979. AS AMENDED, TITLE 50, U.S.C., APP.

2401 ET SEQ. VIOLATIONS OF THESE EXPORT LAWS ARE SUBJECT TO SEVERE CRIMINAL

PENALTIES. DISSEMINATE IN ACCORDANCE WITH PROVISIONS OF DOD DIRECTIVE

5230.25.

Attachment #023

TABLE OF CONTENTS

1.0 SCOPE

2.0 PROGRAM PHASE

3.1 COMPONENT SELECTION

3.2 Component Selection Methodology

3.3 Supplier Selection

3.4 Electrical Component Requirements

3.4.1 Component Temperature Up-rating

3.4.2 Active Semiconductor Devices

3.4.3 Component Qualification

3.4.4 Component Qualification Formula for Piece Part Test

3.4.5 Component Level PEM Confidence Test

3.4.6 CCA Elevated Temperature and Humidity Exposure

3.4.6.1 CCA Thermal Cycling Exposure

3.4.6.2 CCA Level Confidence Testing

3.4.7 Deleted

3.4.8 Deleted

3.4.9 Electrical Connectors

3.4.10 Passive Devices

3.4.11 Magnetic Devices

3.5 Mechanical Hardware

3.6 Problem Components

3.7 Problem Materials

3.8 Problem Processes

3.9 Problem Design Practices

3.10 Use of Pure Tin Plated Parts

3.10.1 Initial Component Selection

3.10.2 Tin Whisker Mitigation

3.10.3 Refinishing Pure Tin Parts

3.10.3.1 Hot Solder Dip

3.10.3.2 Stripping Pb-free tin and re-plating

3.11 Counterfeit Parts

4.1 COMPONENT RELIABILITY MONITORING

4.2 Reliability Monitoring Data

4.3 Major Changes

4.3.1 Manufacturer Part Number Changes

4.4 Proactive Obsolescence Management

4.4.1 Component Life Cycle Monitoring

4.4.2 Discontinued Parts Meeting

5.1 CIRCUIT CARD ASSEMBLY PROCESS CONTROL PLAN

5.2 Thermal Profile of Solder Process

5.3 ESD and Moisture Sensitive Part Controls

5.2.1 Pre-Solder Bake Out

Attachment #023

5.4 Rework

5.5 Failure Reporting System

6.1 SUBCONTRACTOR CONTROL

APPENDIX 1 Guideline used for developing CCA level confidence test

Attachment #023

1.0 SCOPE

This document is provided for the Parts Management of the System. This Parts Management Plan (PMP) shall define the selection process for electrical, electronic, and mechanical hardware components utilized in the System. All approved parts and electronic assemblies designed for the System shall meet the requirements of this document. The main focus shall be placed on the selection and use of commercial off-the-shelf (COTS) parts, plastic encapsulated active semiconductors, electrical connectors, passive devices, magnetic devices, printed circuit boards (PCBs) and mechanical hardware. Specific areas addressed in this document are manufacturer selection, device selection and qualification, reliability monitoring, manufacturing and assembly, and pro-active obsolescence management. Procuring agencies and subcontractors (herein listed as “Contractor”) shall use this document to identify their role and respective responsibilities. Components that do not meet the minimum requirements of this PMP shall be identified in writing, and submitted for review with technical justification to the appropriate

Contractor’s Parts Management Plan Working Group (PMPWG). This PMPWG will include the appropriate government personnel. The PMPWG will evaluate and provide recommended disposition utilizing technical input from the Program Lead Component Engineer, Electrical Design Engineering, Mechanical Design Engineering, Reliability Engineering, Product Assurance, Subcontracts (if subcontractor part) and the appropriate government personnel. Other functions will be included as required.

2.0 PROGRAM PHASE

This PMP will be used in the Development stage as well as throughout the Production Phase for newly designed or redesigned circuit card assemblies, subassemblies and new part insertion to include commercial off- the-shelf assemblies. This PMP will be used as programs are selecting new and alternate parts for new design part selections, as required for pro-active obsolescence management at part and circuit card level, for technical issues, performance, risk reduction and for producibility improvements.

3.0 COMPONENT SELECTION

The component selection for the program shall primarily be based on selecting high volume, Industrial

Grade components from manufacturers (Manufacturer identified as actual part supplier which produces the part, not a distributor) that have internal characterization, qualification, and on-going reliability monitoring programs. Goal is to select low cost components, which will meet all of the system requirements including performance, life cycle, and reliability requirements with low risk. Applications that do not lend themselves to high and medium volume Industrial Grade off-the-shelf components may utilize custom requirements, which may include preparation of engineering drawings, unique requirements, additional screening, and conformance inspection.

3.1 Component Selection Methodology

Step 1 Identify Component Requirements

Identify required component functions and technology type (memory, DSP, 1553RT, CMOS, ECL, etc.)

Identify package type (surface mount, through hole)

Attachment #023

Identify application life cycle storage and operating environmental (e.g., temperature) requirements

Step 2 Select Components

Utilize Company Preferred Standard Parts from preferred component manufacturers

Select Industrial Grade components with preference for components qualified to industry standards, such as Automotive Electronics Council (AEC) requirements.

Perform availability and price analysis

Request manufacturer’s characterization data (over temperature range), qualification data, and latest available reliability monitor data, as required

Identify critical characteristics (e.g. Strength of fasteners, moisture level of plastic encapsulated active devices, package types, etc.) needed to meet application life cycle requirements and verify application does not exceed manufacturer ratings

Step 3 Evaluate Components

Review manufacturer’s characterization, qualification, and reliability data to insure component meets system requirements. Components that do not meet the minimum requirements of the system shall be identified in writing and submitted for review with technical justification for their use to the appropriate Contractor PMPWG which will include government participation. Insure data on electrical parts includes actual electrical functioning parts in the test followed by electrical measurements in end point testing.

Categorize components for design risk (operating/storage temperature range, high reliability usage, internal construction and moisture sensitivity level)

Step 4 Additional actions (as required)

Request extended temperature test data from manufacturer

Consult product specialist Components Engineering Subject Matter Expert (SME) to determine risk and degraded performance impact

Characterize over temperature range if necessary

Survey critical component manufacturers

Perform component qualification and/or validation, if necessary

Step 5 Protect Against Assembly Induced Faults

Conduct technical evaluation of assembly-house capabilities (characterization of hand, wave, and reflow solder operations, handling of moisture sensitivity components, tin whisker mitigation for pure tin parts, use of lead free solders)

Utilize closed loop FRACAS (Failure Reporting and Corrective Action Summary) activity

Identify root cause through fault isolation, and failure analysis

Identify moisture sensitivity level (plastic encapsulated devices only)

Identify pure tin parts and lead finishes. Implement necessary mitigation strategy in accordance with paragraph 3.9.2.

3.2 Supplier Selection

The purpose of evaluating each potential manufacturer of Industrial Grade commercial products is to

Attachment #023 insure each manufacturer’s ability to reliably produce components. Components shall be procured from manufacturers producing high and medium volume commercial/industrial grade components with an in-house closed loop system, which evaluates failures, and customer returns, identifies root cause and implements corrective action. Component Engineering will verify that plastic encapsulated active components shall be selected and procured from suppliers who conduct process controls and reliability monitoring testing periodically as a normal part of their process, consisting of the following tests in

Table 1 or their equivalents as a minimum:

NOTE: Selection of suppliers not meeting the minimum reliability requirements detailed in Table 1 below will be identified in writing and submitted for review with technical justification for their use to the appropriate Contractor PMPWG which will include government participation. Components selected from suppliers not meeting these minimum requirements may warrant more extensive reliability testing at the next higher assembly level, i.e. circuit card assembly (CCA) level.

Table 1 – Minimum Manufacturer Reliability Testing Requirements

High Temperature

Operating Life Test

Test used to assure that the supplier's die fabrication process is reliable. Specific interest from this test is to assess the supplier's adequacy of burn-in and identify any potential wear out conditions. Must be performed on actual die or die family of device selected.

Temperature Cycling or Thermal Shock

Test used to determine the reliability of the manufacturer's design and assembly process techniques. Specific interest from this is the failure mechanisms resulting from the temperature coefficients of expansion for different materials. Must be performed on actual package of device selected, assembled with electrically operative die. Electrical endpoint measurements must be performed.

HAST of 85/85 or

Autoclave

Combined temperature and humidity test used to determine the adequacy of the supplier's selection of materials and manufacturing processes. Specific interest from this is failure levels and mechanisms resulting from contamination (material and external) levels and the adequacy of die coatings. Must be performed on actual package of device selected, assembled with electrically operative die. Electrical endpoint measurements must be performed.

3.3 Electrical Component Requirements

The contractor shall subject all electrical components to a parts approval evaluation (DVT or ESS, as a minimum). As a minimum, electrical parts shall:

a) operate over the temperature range of -40°C to +85°C as stated in the manufacturer’s data sheet.

b) be characterized over the operating temperature range of the end use system with self-heating and external environments included.

Attachment #023

c) be assessed to assure that they meet life-cycle environmental and operating stress application requirements.

d) be capable of surviving a storage humidity and temperature exposure equivalent to the minimum and maximum humidity and temperature induced by the system application.

Note: Existing qualification or Quality Conformance Inspection test data may be used as long as no part design changes have occurred since the data was recorded, no process changes have occurred since the data was recorded and no die changes (if applicable) have occurred since the data was recorded.

3.3.1 Component Temperature Up-rating

EIA 4900, “Use of Semiconductor Devices Outside Manufacturers’ Specified Temperature Ranges” should be used as guidance when performing component characterization beyond the manufacturers’ data sheet.

3.3.2 Active Semiconductor Devices

Active semiconductor devices include discrete semiconductors, monolithic microcircuits, and multichip devices such as DC to DC Converter Modules. All plastic encapsulated active semiconductor devices shall be qualified in accordance with paragraph 3.3.3 herein. Use of vented parts (e.g. high density

Ball Grid Array (BGA) packages) shall be identified and a validation plan developed and completed prior to use. Use of lead free BGAs shall require completion of validation plan and testing of actual solder process prior to selection. The use of vented parts or lead free BGAs requires a validation plan.

This plan will be identified in writing and submitted for review with technical rationale to the PMPWG.

3.3.3 Component Qualification

Plastic encapsulated active semiconductor devices shall be qualified by the manufacturer to the standard

JEDEC qualification.

3.3.4 Component Qualification Formula for Piece Part Test

Test parameters and test durations provided are derived from the Arrhenius equation and are intended to determine piece part suitability over the life of a program. Values used for activation energy are specific to plastic (epoxy) materials and are established for use in determining plastic encapsulated microcircuits

(PEM) packaging reliability.

3.3.5 Component Level PEM Confidence Test

The following confidence test flow may be performed in place of manufacturer qualification data to support the usage of a plastic encapsulated active semiconductor in the System.

This Validation test is performed on plastic encapsulated active semiconductors with a minimum of 50 samples (larger sample sizes are suggested to validate actual failure rates are less than 2%). Figure 1 documents a typical flow to increase confidence that the parts will survive system test, operation, and storage. The confidence test is considered successful with zero failures. If a failure occurs, failure

Attachment #023 analysis to determine root cause and appropriate corrective action will be required, including possible retest, prior to obtaining part approval. C-mode Scanning Acoustic Microscopy (CSAM) pre-test data shall be reviewed by the PMPWG for acceptability.

Figure 1 – PEM Component Level Confidence Test

HAST: Highly Accelerated Stress Test, JEDEC-STD 22, Method A110

DPA: Destructive Physical Analysis

3.3.6 CCA Elevated Temperature and Humidity Exposure

When component testing is performed at the CCA level this testing will follow a CCA Qualification

Test Sequence flow which requires 890 hours of HAST, 85°C/85% RH unbiased. These 890 hours are made up of 740 hours as derived from the model shown in Appendix 1 and then an additional margin of 20% or 150 hours is added to reach the total test time of 890 hours. See Figure 2. Test parameters and test durations provided for CCA level testing are also derived from the Arrhenius equation and are intended to determine PEM suitability over the life of a program. Thermal cycle temperature extremes are reduced at this higher level of testing to accommodate the CCA material and structure while the soak duration is extended to maintain the PEM packaging aging acceleration.

Sample DPA

Serialize Precondition Method

A113

HAST, 130°C/85% RH

100 hours biased

CSAM

Electrical

Electrical

HAST, 130°C/85% RH

100 hours unbiased

Electrical

-55°C/+125°C

Electrical

Temp cycle, 100 cycles -55°C/+125°C

CSAM

Attachment #023

Figure 2. CCA Level PEM Component Confidence Test Sequence

3.3.6.1 CCA Thermal Cycling Exposure

Thermal cycle testing performed at the CCA level will follow the Test Sequence flow which requires

200 thermal cycles per Figure 2. See Appendix 1 for details.

3.3.6.2 CCA Level Confidence Testing

CCA level confidence tests are performed to ensure qualified parts are successfully implemented System hardware. The test sequence in Figure 2 shall be employed to gain confidence that the CCA and its piece part level components are suitable for the System end use application over the life of the system. A statistically representative sample size (minimum of 30 parts) will be used to establish confidence during

CCA level testing.

3.3.7 Deleted

3.3.8 Deleted

3.3.9 Electrical Connectors

Electrical connectors defined in this section include electrical receptacles, plugs, and headers. All connectors shall have contacts with 50 micro inches of gold and 50 micro inches of nickel under plate on mating surfaces as a minimum. Connectors having less Au plating (for example 30 micro inches of

Au over 50 micro inches of Ni) may be considered for use if data specific to the part to be used is available and supports the connector’s reliability in the intended application. Use of connectors with

HAST, 85°C/85% RH

biased 445 hours unbiased 445 hours

Temp cycle, 100 cycles -45°C/+85°C

Temp cycle, 100 cycles -45°C/+85°C

Attachment #023 pure tin and without conformal coating on unsoldered areas shall not be allowed.

3.3.10 Passive Devices

Passive devices include resistors, capacitors and crystals. All passive devices shall be selected from high volume product lines with military pedigree/background. Use of non-hermetic tantalum capacitors shall be avoided where possible. If non-hermetic tantalum capacitors are used, special derating of 35%

(percentage of worst case operating voltage to capacitor voltage rating) shall be applied. Up to 50% derating may be required for some tantalum devices depending on the application and robustness of the particular capacitor. Careful attention should be given to tantalum during the design and selection phase.

3.3.11 Magnetic Devices

Magnetic devices include inductors, transformers, ferrite beads and passive filters. All magnetic devices shall be selected from high and medium volume product lines with military pedigree/background. Use of open core magnetic devices shall only be used with the approval of the PMPWG.

3.4 Mechanical Hardware

All high strength alloy steel fasteners (150ksi UTS/HRC 34) shall be procured from Contractor approved sources to control hydrogen embrittlement. Contact Contractor for Hydrogen Embrittlement Sensitive

(HES) Approved Source List. Unique and critical requirements shall be documented on the engineering drawing (e.g. Vendor Item Drawing).

3.5 Problem Components

The following components are discouraged from usage in the weapon system. Use of a problem component shall be justified in writing and approved by the PMPWG.

a) aluminum electrolytic capacitors

b) silver-cased wet tantalum capacitors

c) moisture sensitive mica capacitors

d) variable capacitors

e) relays (except when required for safety purposes)

f) electro-mechanical switches

g) mechanical switches

h) circuit breakers

i) carbon composition resistors

j) potentiometers

k) fuses

l) fuse holders

m) integrated circuit and semiconductor sockets (carriers)

n) wire wrap contacts

o) magnetic components with wire size <44 AWG

p) insulation displacement connectors (IDC)

q) components with shelf life (except solderability)

Attachment #023

r) parts with thermal shutdown or turnoff devices (or that shutdown or turnoff prior to +125 deg. C case or base plate temperature)

s) circular connectors with silver plating or undercoating

t) plug-in and non hermetic crystals

u) disc style thermistors

v) metallized paper capacitors

w) batteries, except PMPWG approved batteries

x) sockets for microcircuits and semiconductors (carriers)

y) germanium semiconductors

z) diodes with “Whisker” construction

aa) metal oxide plate rectifiers

bb) hybrid micro-semiconductors

cc) card edge circuit board connectors

dd) quick release and removable panel fasteners

ee) select at test components

ff) connectors/filters that contain tubular ceramic capacitor elements

gg) non-passivated semiconductor die

hh) parts with hot welded cases without splash rings

ii) non-metallurgically bonded rectifiers and diodes (other than Schottky devices)

jj) paper capacitors or metallized paper in molded cases

kk) non-M87164 mica capacitors

ll) CKR06 style capacitors or commercial equivalent greater than .47 microfarad (particularly the 1.0 microfarad)

mm) parts, including resistor chips, with nichrome films

nn) networks with non-hermetic packages

oo) single-sealed (compression type seal) CLR79 style or commercial equivalent wet tantalum capacitors

pp) GaAs MESFETs, PHEMTs, and InP HEMP devices, without specific consideration for hydrogen poisoning. These devices shall be evaluated by existing data, analysis or testing, and approved by the PMPWG prior to use.

qq) plastic encapsulated optocouplers, without consideration of light gel materials and optocoupler design (stress applied by light gel to die and bond wires)

rr) parts containing pure tin (>97% tin) not assembled with tin-lead solder and conformal coated

ss) parts that contain tin-bismuth plated solderable terminations with bismuth % greater than 5% by weight

tt) parts that use lead-free solders, without verification, analysis, or testing to assure that the solder joint reliability will meet program requirements

uu) connectors with less than 30 micro inches gold plating on their mating contact areas

vv) discrete semiconductors not better than or equal to MIL-PRF-19500 JANTX or AEC-Q101

ww) micro circuits not equivalent to or better than MIL-PRF-38534 and MIL-PRF-38535 QML/SMD classes M,B,Q, H or AEC-Q100

xx) non-hermetic microcircuits and semiconductors without qualification to this PMP

yy) resistors using nichrome film elements

zz) crystals without adequate mounting support aaa) circuit protection fuses

Attachment #023 bbb) non-hermetically sealed plastic film capacitors ccc) polyester capacitors ddd) mechanically adjustable (variable) caps resistive and magnetic devices where value is fixed in application eee) passive components with failure rate level greater than 0.1% per 1000 hours or not manufactured for high reliability applications fff) miniature switches or connectors not environmentally protected and/or encapsulated ggg) slide or snap on BNC connectors hhh) fiber inserts, sheet spring nuts, sheet spring washers or locking devices

iii) open type magnetic devices (i.e. exposed core/coils/wire/internal elements) not environmentally protected and/or encapsulated jjj) sockets and socketed devices for any electronic device, such as relays, integrated circuits, discrete semiconductors, and CCA-level slide-on or press-fit terminations kkk) vacuum tubes lll) selenium rectifiers mmm) diodes that are not category I, metallurgically bonded nnn) parts with date codes more than 5 years old at the time of receipt ooo) reused, reinstalled, recycled, or salvaged parts and materials without a process approved by the

Program Office and the Government Contracting Officer or Contracting Officer Technical

Representative. Parts or materials previously installed or otherwise attached to another assembly are considered used and not new.

ppp) parts used outside of manufacturers specifications for the specific part or material (e.g. minimum temperature, maximum voltage etc…) qqq) parts not qualified for intended application life cycle environmental stress and duty cycle unless approved by PMPWG rrr) counterfeit parts sss) parts or materials procured from a source other than the original manufacturer or the original manufacturer’s certified/franchised distributor without a Government approved process ttt) reed relays, relays that are not hermetically sealed or relays that are not solid state uuu) tin alloy solders, coatings, and finishes with less than 3% Pb by weight that are internal and/or external to electrical, electronic, and electro-mechanical (EEE) parts/components, related hardware, and mechanical surfaces. Plating over an existing pure tin or tin alloy coating or finish with less than 3% lead. Exceptions are tin-plated insulated electrical wire compliant to applicable military or ASTM standards. Risk mitigation plans for use of pure tin or tin alloys with less than

3% Pb shall require Government approval.

3.6 Problem Materials

The following materials are discouraged from usage in the Weapon System. Use of a problem material shall be justified in writing and approved by the PMPWG.

a) graphite lubricants

b) corrosive type RTV or silicone compounds (yields acetic acid during cure)

c) Teflon insulated silver plated wire (red plague)

d) Teflon insulated wire (cold flow), except cross linked ETFE or Tefzel™

Attachment #023

e) gold plated electrical contacts without nickel undercoating (except when the specific gold thickness and underplate is approved on Military or DSCC approved contacts and connectors)

f) bare corrodible metal surface

g) potting and foam material that are reversion prone

h) alloys with a stress corrosion threshold in any grain direction of less than 25 ksi

i) aluminum alloys 5083-H32, 5083-H38, 5086-H34, 5086-H38, 5456-H32 and 5456-H38, where temperatures will be greater than 150°F

j) aluminum and aluminum alloys without chemical conversion coating

k) dissimilar metallic materials, without consideration to assure than significant corrosion will not occur in the materials required throughout the program’s operating and storage environment and throughout the program’s life

l) materials that are not inherently moisture and fungus resistant

m) polyvinyl chloride (PVC) as an insulation material

n) Kapton insulated wire

o) beryllium oxide

p) magnesium and its alloys

q) asbestos

r) mercury or mercury compounds

s) zinc plating (zinc whiskers and inferior corrosion protection)

t) pure tin (greater than 97%), that will not be soldered using tin-lead solder, conformal coated.

Risk mitigation is required for all uses of pure tin.

u) tin-bismuth plated solderable terminations with bismuth % greater than 5% by weight

v) lead-free solders, without verification, analysis, or testing to assure that the solder joint reliability will meet program requirements

w) radioactive material

x) tin alloy solders, coatings, and finishes with less than 3% Pb by weight that are internal and/or external to electrical, electronic, and electro-mechanical (EEE) parts/components, related hardware, and mechanical surfaces. Plating over an existing pure tin or tin alloy coating or finish with less than 3% lead. Exceptions are tin-plated insulated electrical wire compliant to applicable military or ASTM standards. Risk mitigation plans for use of pure tin or tin alloys with less than

3% Pb shall require Government approval.

y) materials not compliant to MIL-STD-186, except as noted herein

z) materials not compliant to MIL-HDBK-1250, except as noted herein

aa) materials not compliant to the DoD Corrosion Prevention and Control Planning Guidebook, Spiral

bb) paints, finishes, coatings, and materials not adequate for corrosion/deterioration protection in the intended application, and not utilizing MIL-STD-186 and MIL-HDBK-1250 or approved equivalent

cc) solder fluxes with activity levels classified as high

dd) aluminum alloys 2024-T3 or T4 (use T6, T8, or 5000/6000 series)

ee) aluminum alloys 7001-T6, 7278-T6, 7050-T6, and 7075-T6 (use in the over-aged condition such as the T73 or T76 tempers)

ff) mercury and compounds containing mercury

gg) precipitation hardening stainless steels in the H900, H950, or H1000 tempers (use H1025 or higher temper). CRES 400 series stainless steels, without passivation and a top coating.

Attachment #023

Exceptions are fasteners in the CH950 condition, springs in the CH 900 condition, 17-4 PH castings aged at 1000 degrees F, and PH13-8Mo H1000.

hh) lubricants and greases or other materials, which contain graphite

ii) corrosive type RTV adhesives/sealants (emit acetic acid during cure)

jj) adhesives, sealants, foam, and potting materials that are susceptible to reversion

kk) rubber and plastics not protected from exposure that are susceptible to ozone damage or degrade with exposures to UV light

ll) silver-plated wire that has less than 40 micro inches of silver and without manufacturer certification for passing deterioration control tests per ASTM B298. Certification and shelf life of bulk material must be controlled. Immediately after wire samples are cut, open ends in the bulk material must be sealed against moisture intrusion. For long term storage (more than 1 year) wire must be stored in dry pack bags that are sulfur and chlorine free, PH neutral, at less than or equal to 30°C and less than 50% moisture with indicators. Before using wire samples that have been in storage for more than one year, the user must verify the manufacturer’s ASTM B298 certificate, the storage conditions, and perform solderability per J-STD-002 or newer rev with specimens from each end of the sample wire taken from the bulk material. In addition, wire stored longer than 10 years must be approved by the PMPWG.

mm) wire with polytetrafluoroethene (PTFE) insulation in applications with a high probability of producing cold flow of the insulation

nn) wire with fluoropolymer insulation, such as radiation cross-linked ethylene-tetrafluoroethylene (XL-

ETFE)

oo) bare hook-up wire with the exception of grounding straps

pp) aluminum without chromate conversion coating in accordance with MIL-DTL-5541 or equivalent, surfaces requiring low electrical resistance that are not Class 3 coated IAW MIL-DTL-5541

qq) cadmium plating not in accordance with SAE AMS-QQ-P-416 Type II (supplementary chromate treatment)

rr) zinc or zinc alloys with greater than 20% zinc, including plating. If approved by the Government for specific applications, zinc plating must have a Type II supplementary treatment.

ss) silver or silver alloys used for electrical connections, for example, inside relays, pins on connectors, terminations on chip devices, leads on electronic devices, balls on area array packages, traces on printed wiring boards (for example, Immersion silver), solder (including SAC), etc.

tt) tapes that are Kapton with silicone adhesives, fabric electrical (adhesive or friction type), or textile electrical (adhesive or friction type), including temporary usage during assembly of electronic hardware

uu) bare corrodible metal surfaces and/or galvanic metal couples with over 100mV potential difference.

Exceptions are allowed in accordance with MIL-STD-186.

vv) materials not inherently moisture and fungus resistant

ww) nickel-plated aluminum construction

xx) nickel-plated aluminum connectors

yy) polyimide (including Kapton, Upilex) as an electrical insulator

zz) desiccants, organic or polymeric materials (e.g. lacquers, varnishes, coatings, adhesives, or greases) inside cavities of packages/housings with bare microcircuit/semiconductor die, optics, or other elements. Materials compliant with MIL-STD-883 Method 5011: Evaluation and acceptance procedures for polymeric materials; or equivalent industry specification, are

Attachment #023 acceptable.

aaa) materials used in the end item configuration that may demonstrate unintended flammable properties in item-specified worst case environments bbb) cotton and linen ccc) radioisotopes/radioactive materials except as allowed by AR 11-9 ddd) Electroless Nickel Immersion Gold (ENIG) without PMPWG approved process, and storage/handling controls eee) pentachlorophenol, commonly referred to as "Penta" or "PCP" as a wood product preservative. Use

2 percent copper naphthenate, 3 percent zinc naphthenate, or 1.8 percent copper 8- quinolinolate.

fff) black metal oxide coating on metal parts as defined by MIL-DTL-13924 ggg) platinum catalyzed silicone rubber in contact with high sulfur content materials hhh) class 1 ozone depleting chemicals (ODCs) and highly toxic chemicals

3.7 Problem Processes

The following processes are discouraged from usage in the Weapon System. Use of a problem process shall be justified in writing and approved by the PMPWG.

a) solder iron mounting or rework of multilayer ceramic capacitors (MLCCs) or other ceramic parts without a customer approved and validated procedure

Rationale: MLCCs are easily damaged (e.g., microcracks, dielectric damage, etc.) by touch-up and rework with soldering irons.

b) welding operators not qualified in accordance with SAE AMS-STD-1595, and without certification level II or III NDE/NDI; operators not provided the necessary training and qualifications requirements to certify each operator and the applicable welding equipment for specific welding tasks

Rationale: This area is critical with small “mom & pop” shops that support larger subs. They need to have certified operators in the areas of welding and brazing according to the process spec. call out on the drawing. The preferred welding spec. would be AWS D17.1 and brazing spec. shall meet the requirements of the applicable AWS spec. replacement for MIL-B-7883.

c) lead forming or changes to lead finishes without adequate inspections for component degradation

Rationale: Need to follow military and industry specifications for inspections such as, seal testing, scanning acoustic microscopy, solderability, and high power visuals, and electrical testing to qualify and monitor processes. Inappropriate fixtures, handling, and processes will damage and degrade parts affecting long term reliability.

d) except as noted in this document, soldering and assembly not in accordance with IPC/EIA J-STD-

001, Class 3; visual acceptance requirements not in accordance with IPC-A-610, Class 3

Rationale: Workmanship, quality and reliability are generally not acceptable. Also refer to the companion IPC document IPC-HDBK-001.

e) except as otherwise noted in this document, printed wiring boards not in accordance with IPC 6011, 6012, 6013, 6015, 6016 and not in accordance with the visual acceptance requirements of IPC-A-600, Class 3 as applicable, except as noted herein.

Rationale: Workmanship, quality and reliability are generally not acceptable.

f) for repairing and reworking printed board assemblies, the use of IPC 7711A/7721A, Method 3.2, Method 3.5.2, Method 3.5.3, Method 4.5.2, Method 4.2.6, Method 4.2.7, Method 4.3.2, Method 4.3.3, Attachment #023

Method 4.3.4, Method 5.2, Method 5.3, Method 6.2.1, Method 6.2.2, Method 6.3.

Rationale: IPC-7711/7721 prescribes the procedural requirements, tools and materials and methods to be used in the modification, rework, repair, overhaul or restoration for all classes of electronic products. However, IPC-7711/7721 should be considered as a guideline only because the use of these procedures introduces unacceptable risk in Class 3, military hardware.

g) except as otherwise noted in this document, assembly materials not in accordance with J-STD-004, J-

STD-005, or J-STD-006.

Rationale: Use standard materials if not otherwise noted as an issue in this document or determined to be a reliability risk in high reliability applications.

h) solderability not in accordance with J-STD-002 or J-STD-003 as applicable

Rationale: Use industry accepted methods.

i) cable and wire harness not in accordance with IPC/WHMA-A-620, Class 3

Rationale: Workmanship, quality and reliability are generally not acceptable.

3.8 Problem Design Practices

The following design practices are discouraged from usage in the Weapon System. Use of a problem design practice shall be justified in writing and approved by the PMPWG.

a) not using Government approved electronic de-rating criteria

b) not using IPC design standards 2221, 2222, 2223, IAW Class 3 or additional design considerations in

IPC documents listed herein.

c) printed wiring assemblies (PWAs) without 2-4 mil urethane coat (see tin alloy restriction for type) or parylene-c conformal coatings

Rationale: Protect circuit card assemblies from exterior contaminants and handling. Conformal coating has been shown to reduce component mounting fatigue during vibration and shock. However, the coating must be compatible with rigid components like glass body diodes. Parylene is preferred and shows superior performance in the areas of protection for tin whisker, handling protection, prevention of moisture contamination, prevention of arcing, low out gassing, and ease of rework.

d) PWAs with stacked or piggybacked mounted components, or components/leads using other components/leads for support or attachment, including butt joint connections

Rationale: Difficulty with consistently mounting parts in "nonstandard" configurations leads to collateral damage. This is a serviceability issue. All components should be accessible for replacement without disturbing other components. “Piggybacking” presents reliability concerns with degrading parts and attachment areas. When stacked capacitors are approved, use stacked capacitors in accordance with MIL-PRF-49470 "T" level.

e) jumper wires not detailed on the engineering drawing and approved by the customer

Rationale: Unacceptable mounting processes, i.e., wires routed over or under components may come in contact with heat sinks or hot components and electrical interference with RF applications and easily degrade part and attach reliability.

f) glass bodied components and magnetic elements not evaluated for coefficient of thermal expansion

(CTE) matching to mounting substrate and to coating/staking materials, and not protected by buffer material when epoxy coatings are used

Rationale: Breakage of components at low temperature, and temperature cycling in general. See

Attachment #023

2003 GIDEPs for 4148 diodes. High modulus encapsulants or coatings have been known to crack devices.

g) parts or components overhanging the edge of a PWA

Rationale: Overhanging can cause damage to parts and possible installation interference.

h) through-hole components mounted on both sides of a PWA

Rationale: Double-sided mounting introduces susceptibilities to wave solder damage and must be mounted by hand which is labor intensive and operator sensitive.

i) large-bodied components mounted without adequate support and staking

Rationale: Lack of adequate support leads subject to damage or breakage under vibration environment.

j) high heat-dissipation components mounted without adequate heat sinks

Rationale: Heat degrades surrounding components, creates hot spots and degrades reliability of most

EEE components. Need to pay attention to surrounding materials and temperature sensitive parts and may require exotic cooling techniques. May be difficult to meet component derating guidelines.

Refer to manufacturers’ application notes for best heat sinking.

k) multiple leads or wires mounted in a single plated through hole

Rationale: All components should be accessible for replacement without disturbing other components. Can be difficult to get a good solder joint and can easily degrade the integrity of the joint and the hole.

l) crimped aluminum electrical aircraft wire

Rationale: Due to high CTE of aluminum, thermal cycling causes loosing of crimps resulting in increased electrical resistance. This could result in a possible fire hazard from overheating at wire junctions due to corrosion of aluminum wire and increased junction resistance.

m) traps or crevices susceptible to moisture collection

Rationale: These areas are overly prone to corrosion conditions.

n) unsealed permanent fasteners

Rationale: Installing with wet primer of polysulfide sealant extends life by helping to prevent accelerated corrosion.

o) unprotected bearings

Rationale: Use of protected bearings helps prevent shortened life.

p) untested adhesively bonded designs

Rationale: Long term/accelerated environment testing such as temperature cycling, humidity and vibration must be considered. These connections/interfaces are difficult to model and characterization is not adequately performed by the manufacturer for many applications.

q) lead forming or changes to lead finishes without adequate inspections for component degradation

Rationale: Devices are susceptible to breakage and degradation from fixtures, handling, and heat

Need to follow military and industry specifications for inspections such as seal testing, scanning acoustic microscopy, solderability, and high power visuals, and electrical testing to qualify and monitor processes. Inappropriate fixture, handling, and processes will damage and degrade parts affecting long term reliability.

r) maintenance procedures for corrosion protection without customer logistics and product assurance program approval

Rationale: These procedures can become unacceptable cost and personnel burdens to the

Government and must be coordinated with the responsible agencies.

s) use of tantalum capacitors without surge testing and adequate series impedance

Attachment #023

Rationale: Tantalum capacitors are increasingly being used in low impedance circuits, and In Circuit

Test machinery (ICTs) and fast rise time functional testers for board test purposes. As a result they are more likely to see a surge condition. Surge testing should not be done in parallel charge circuits.

Surge testing on 100% of capacitors at the manufacture simulates worst case conditions normally seen by the user. Extra derating in the application and series impedance can reduce the concern. The reason for including a separate resistance into the circuit is to act as protection against voltage spikes and limit current surges to the capacitor. Additionally, in high ripple applications, it acts as an external heat sink and limits thermal stress to the dielectric by sharing the load. In practice, its inclusion may degrade the circuit performance in certain applications, e.g., in power supply o/p filtering. Also, as boards become more densely packed and inter component tracks lengths reduced, the capacitors are given greater visibility of any surges or spikes.

3.9 Use of Pure Tin Plated Parts

The use of pure tin plated parts presents a risk to the long term integrity of electronics. The growth of pure tin dendrites (“tin whiskers”) is a well-known and documented phenomenon that is eliminated with the inclusion of at least 3% lead (Pb) into the plating chemistry. However, finding tin-lead (SnPb) plated components is becoming increasingly difficult, and in some cases impossible, since many vendors are eliminating SnPb finishes from their inventory, mostly to comply with the European Restrictions of

Hazardous Substances (RoHS) Act. The JAMS PMO has a three (3) part program to manage the threat of tin whisker development from pure tin plated parts.

3.9.1 Initial Component Selection

Program personnel will select electronic and mechanical parts with a preference toward non-pure tin platings whenever cost, schedule and availability permit. BGA packaged integrated circuits (ICs) shall only utilize SnPb finishes with 3% Pb or greater.

3.9.2 Tin Whisker Mitigation

When the use of components plated with pure tin cannot be avoided, the risk of tin whisker formation shall be mitigated by at least two (2) of the following:

1) Tin-Lead solder and solder paste shall be used. The standard solder composition for use is 63% tin with 37% lead (Sn63Pb37) or 60% tin with 40% lead (Sn60Pb40). However, any solder composition containing at least 3% Pb is acceptable for tin whisker mitigation. Chip components 8mm x 5mm (0805 package size) or smaller, or those with bottom terminations (QFN or LGA), have been demonstrated to alloy plated surfaces with Pb during the normal soldering process when SnPb solder is utilized. A risk assessment must be performed on other package types to verify complete coverage. Parts that can be proven to alloy 100% of the exposed tin plated surfaces shall be accepted as conforming to the requirements of 3.9.1.

2) Spray applied conformal coating at the next higher assembly (NHA) shall be in accordance with J-

STD-001, Class3, except the minimum thickness shall be 0.002 inch. Silicone material shall not be used.

A risk assessment shall be performed to classify risk based on minimum conductor spacing of devices with less than 0.020 inch (about 0.040 inches pitch) and package sizes greater than 0805.

Attachment #023

3) Vapor deposited paraxylene conformal coating at the NHA, applied to a thickness no less than .001 inches. Due to paraxylene’s ability to penetrate very small openings, risk assessment for small lead spacing or large package sizes is not required. Full encapsulation (potting) at the NHA after soldering with processes that assures no voids large enough to bridge component leads. Risk assessment for this mitigation step is not required. Note: Mechanical parts not used within .250 inches of electrically active circuitry are exempt from these requirements. Those which are within .250 inches or are part of an electrical circuit (lugs) must be over-coated after assembly to comply.

3.9.3 Refinishing Pure Tin Parts

Components which are only available with pure tin finishes and do not meet the mitigation requirements of 3.9.1 or 3.9.2 will be removed from design consideration and a substitute part must be selected. When that is not possible, the component must be replated with a non-pure tin finish. Due to the risk potential, the process for replating parts must be fully analyzed and is only permitted with agreement of the Parts

Management Plan Working Group (PMPWG).

3.9.3.1 Hot Solder Dip

Tin plated surfaces can be dipped into SnPb solder to alloy the Pb-free tin with Pb. If solder dipping is employed, the process must be reviewed to determine the potential for affecting the reliability of the original product (e.g., preventing thermally induced damage, loss of hermeticity, ingress of fluxes and flux compounds into the component). Post process analysis must be performed to ensure the entire tin surface is alloyed with at least 3% Pb to prevent tin whiskers.

3.9.3.2 Stripping Pb-free tin and re-plating

Some manufacturers may be willing to strip the Pb-free tin from finished products and re-plate using a suitable alternate material, such as SnPb or nickel/palladium/gold (NiPdAu). Such processes are to be reviewed to determine the potential for affecting the reliability of the original product (e.g., chemical attack on component materials and induced thermal stresses). Post process analysis must be performed to ensure the entire pure tin plating has been replaced.

3.10 Counterfeit Parts

The contractor shall establish and maintain a Counterfeit Parts Prevention and Control strategy which meets the requirements of Industry Standard AS-5553 or Government approved internal process. The contractor shall participate in the Government-Industry Data Exchange Program (GIDEP) and shall use the GIDEP process to alert the industry of encountered counterfeit parts. Any parts not purchased from the original manufacturer or manufacturer franchised distributor shall require Government approval.

4.0 COMPONENT RELIABILITY MONITORING

The contractor shall implement a proactive Component Reliability Monitoring program to support the program for non-qualified JEDEC suppliers. Regular scheduled reviews to discuss component reliability shall be held at the contractor’s facility. The reviews shall continue through the last contractual hardware delivery. The contractor shall identify, track, and monitor component reliability for

Attachment #023 plastic encapsulated semiconductor devices with usage in all deliverable equipment configurations. The latest reliability and/or re-qualification data provided by the device manufacturer shall be reviewed periodically (data is typically available in quarterly reports) to ensure continued product integrity. If the manufacturer’s data indicated anomalous conditions, a determination should be made regarding the appropriateness of implementing corrective actions (e.g. data code restrictions, screening, etc.). The contractor shall submit a periodic report listing changes in component reliability monitoring. Corrective action required to supply production units shall be the responsibility of the contractor.

4.1 Reliability Monitoring Data

The contractor shall obtain and evaluate reliability data for each electrical component as part of the selection process. Plastic encapsulated active semiconductors data shall include as a minimum:

a) lot information (e.g. date code or manufacturing lot numbers)

b) complete part number

c) package identification (e.g. VQ 100 TQFP)

d) sample configuration, size and sample(s) failed

e) test conditions

f) test duration

g) date tested (year/quarter)

h) acceptance method

4.2 Major Changes

The Program shall establish a mechanism to assure that major changes (such as die or encapsulation materials) to the plastic encapsulated active semiconductors selected for use are identified and that such changes are assessed for impact to performance, reliability, and re-qualified if required. Plastic encapsulated active semiconductors shall be procured only from the manufacturer or a distributor approved by the manufacturer. Product Change Notices will be monitored to identify any implemented or planned changes.

4.2.1 Manufacturer Part Number Changes

The Program shall evaluate all part manufacturer part number changes. If necessary, parts shall be evaluated and tested in hardware to validate compatibility and performance prior to addition to the

Engineering parts list or Engineering drawing.

4.3 Proactive Obsolescence Management

A proactive part obsolescence management program will be utilized to support production. An

Obsolescence working group (OWG) consisting of contractor and government members will be formed.

The OWG will define the roles and responsibilities of members as well as the obsolescence management process to be used. Regular scheduled reviews (determined by OWG) to discuss the availability of parts identified as becoming obsolete shall be held at the contractor’s facility. The reviews shall continue through the last contractual hardware delivery. The contractor shall identify, track, and monitor part obsolescence for electrical parts with usage in all deliverable equipment configurations. The contractor shall submit a periodic (frequency defined by OWG) report listing current availability status of parts and

Attachment #023 make recommendations for potential and actual obsolete parts. The contractor shall initiate engineering activities necessary to develop and verify potential solutions for confirmed obsolete parts to insure a procurable technical data package. Changes required to supply the production unit shall be the responsibility of the contractor.

Missile obsolescence management initiative is a three-step Component Life Cycle Monitoring process that takes proactive measures to identify obsolete components.

1. Contractor receives manufacturers’ alerts and/or the Product Discontinuance issued in the GIDEP system, attends DMS (Diminishing Manufacturing Sources) conferences, shares data within Contractor and Subcontractor Obsolescence…