AL-1887-8780A SHB pulsed RF HPA ESD.pdf

SHB pulsed HPA ESD

Release Date:

Document Number: AL-1887-8780 Revision: A

Document Status :

Document Type: SPECIFICATION

Category Code:

ALS LINAC Sub Harmonic Buncher Amplifier Systems

O ffi ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

T9

Downloaded by: Windchill Watermarker

TABLE OF CONTENTS

1 Revision History

2 Approvals

3 Abbreviations and Acronyms

4 Requirement Definitions

5 Introduction

5.1.1 HPA General Requirements

5.1.2 HPA RF Specifications

5.1.3 Environmental Parameters

5.3 RF Power Module

5.4 RF Amplifier Modules, Pre-Amplifier Modules

5.5 RF Power Combiner, Splitter, Coupler Signals

5.6 DC Power Scheme

5.7 Forced Clean Air Cooling

5.8 External Interfaces

5.9 Design and Manufacturing Requirements

5.10 Construction Requirements

5.11 Control System

5.11.1 Control System General Requirements

5.11.2 HPA FO Input signals

5.11.3 HPA FO Output Signals

6 Applicable Documents

1 REVISION HISTORY

Rev. CM Number Description of Change A AL-1887-8780 Original Release ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

2 APPROVALS

The following individual(s) shall review and approve this document:

Approver Name Project Role Benjamin Flugstad Electrical Engineering Hardware Group Lead: Engineering and ALS Divisions Qiang Du Accelerator/Advanced Technology Group Lead David Nett RF System Technical Lead EE

3 ABBREVIATIONS AND ACRONYMS

AC Alternating Current ALS Advanced Light Source

ALS-U

ANSI

Advanced Light Source Upgrade American National Standards Institute

AR

ASCE

ASME

BW

Accumulator Ring American Society of Civil Engineers American Society of Mechanical Engineers Band Width

COTS

CW

dB

DC

DFMECA

EIA

EN

Commercial Off The Shelf Continuous Wave Decibel Direct Current Design Failure Mode, Effects, and Criticality Analysis Electronic Components Industry Association European Norms

EPICS

EPS

ES&H

ESD

FCC

FDR

Experimental Physics and Industrial Control System Equipment Protection System Environment Safety and Health Engineering Specification Document Federal Communications Commission Final Design Review

FET

FO

Field Effect Transistor Fiber Optic

FPGA Field-Programmable Gate Array

FSM

GaN

Finite State Machine Gallium Nitride

HMI Human Machine Interface HPA High Power Amplifier

ID

IEC

IEEE

IP

IP

ISM

Identification International Electrotechnical Commission Institute of Electrical and Electronics Engineers Ingress Protection Internet Protocol Industrial, Scientific and Medical

LBNL Lawrence Berkeley National Laboratory ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

LCW

LED

Low Conductivity Water Light Emitting Diode

LDMOS Laterally Diffused Metal Oxide Semiconductor LLRF Low-Level RF

LOTO

MCB

MCCB

MTBF

NFPA

NIR

Lock Out Tag Out Miniature Circuit Breaker Molded Case Circuit Breaker Mean Time Between Failure National Fire Protection Association Non Ionizing Radiation

NRTL Nationally Recognized Test Laboratory

NUM

OPC-UA

OSHA

PDR

Number Open Platform Communications United Architecture Occupational Safety and Health Administration Preliminary Design Report

PIN P-type/Intrinsic/N-type semiconductor (diode)

PLC

PRF

PRI

Programmable Logic Controller Pulse Repetition Frequency Pulse Repetition Interval

PS

QCP

Power Supply Quasi Constant Power

RF

RMS

RPM

RPM

RTU

SHB

SFC

Radio Frequency Root Mean Squared Requirements and Policies Manual Revolutions Per Minute Remote Terminal Unit Sub Harmonic Buncher Sequential Function Chart

SSA

ST

TCP

UL

Solid State Amplifier Structured Text Transmission Control Protocol Underwriters Laboratories

VAC Voltage Alternating Current

VHDL

VSWR

(VHSIC-HDL) Very High Speed Integrated Circuit Hardware Description Language Voltage Standing Wave Ratio

4 REQUIREMENT DEFINITIONS

The meaning of the words used in the Requirement/ Specifications Definitions are as follows

May – is used to indicate a desire or goal of a specification. This can also be interpreted ‘as nice to have’ and are not contractually binding.

Shall – is used to indicate that a specification is contractually binding and must be implemented.

Should – is used to indicate a desire or goal of a specification. This can also be interpreted ‘as nice to have’ and are not contractually binding.

Will – is used to inform intent or declaration of purpose. This is not a specification.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5 INTRODUCTION

This document provides the engineering specifications and requirements for two RF pulsed HPA units, having flat top RF output power of 25 kW with one HPA unit operating at approximately 125

MHz and second HPA unit operating at approximately 500 MHz, to be designed and built using the latest solid state LDMOS FET OR GaN FET OR Equivalent /better FET technologies. The 125 MHz HPA unit will be hereinafter referred to as HPA-1. The 500 MHz HPA unit will be hereinafter referred to as HPA-2. When discussing specifications common to both they will be referred to simply as the HPAs in this document. These HPAs are required for providing very stable pulsed

RF high power to the two Sub Harmonic Buncher (SHB-1 and SHB-2) RF Cavities operating at nearly

125 MHz and 500 MHz respectively, in the LINAC of the Advanced Light Source (ALS) at LBNL. The new solid state HPAs will be replacing the existing tube-based pulsed HPAs for the SHB’s cavities as the existing HPAs are nearing end of their service life and they have been operating with reduced performance for quite some time.

The requirements & specifications cover various subsystems of the HPAs including RF, AC and DC power, cooling, construction, standards, controls, etc. in the following sections. The pulsed RF power output shall be realized by efficiently combining the pulsed RF output power from many RF Amplifier

Modules using a suitable RF power combiner.

The HPAs will follow a product life cycle managed by a single vendor as follows:

(1) Preliminary Design by the Vendor

(2) Preliminary Design Review (PDR) conducted by the Vendor together with LBNL

(3) Final Design by the Vendor

(4) Final Desk Safety Review certification by a NRTL to US standards with Vendor and LBNL

(5) Final Design Review (FDR) conducted by the Vendor together with LBNL

(6) Manufacturing of the HPAs at the Vendor

(7) Preliminary NRTL evaluation certification to US standards with Vendor and LBNL

(8) Continuous 100 hour heat run reliability test (Conducted by the Vendor and witnessed by

LBNL representative at the Vendor site)

(9) Factory Acceptance Test (Conducted by the Vendor and witnessed by LBNL at the Vendor)

(10) Shipment of HPAs from Vendor to LBNL

(11) Installation of HPAs at LBNL with guidance and oversight from vendor representative

(12) Final NRTL evaluation certification at LBNL to US standards with NRTL and vendor present

(13) Site Acceptance Tests (at LBNL with Vendor present to conduct the tests) ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

(14) Operating Phase with ongoing technical support by Vendor

The HPAs shall be designed and manufactured to meet the following requirements and specifications:

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.1 High Power Amplifier (HPA)

5.1.1 HPA General Requirements

ID NUM

(S09- 09-)

Requirement

020000 The RF pulsed HPAs shall be turn-key, modular built, fault-tolerant, self-protecting and NRTL safety approved

020005 Wherever possible the vendor shall try to adopt and implement identical engineering designs in both HPAs (HPA-1 and HPA-2) except for what is required to support the different operating frequencies.

020010 The HPAs shall be designed and built to have very high reliability with MTBF

> 150,000 hours for continuous, round the clock (24/7) indoor operation at

RF pulsed flat top output power of 25 kW. A typical operating year will have

5000-7000 hours. The HPAs shall be fault tolerant and not interrupt their RF outputs more than 4 times per year.

020015 The HPAs shall be designed and built in a modular topology with quantity S

(S ≤ 3) RF Pre-Amplifier (driver) stages, quantity P (P ≤ 10) DC Power Supply

(PS) modules and quantity T (T ≤ 40) RF Amplifier Modules. Each RF

Amplifier Module shall be based on a single LDMOS / GaN FET part OR equivalent OR better FET Transistor. The HPA shall have a suitable RF input power splitter and a suitable RF high power output combiner.

020020 The total number of RF Amplifier Modules (T) (T ≤ 40) used in the HPA should be minimized to improve reliability and serviceability due to lower quantity of parts but not to push the operating point or temperature of components to near maximum ratings.

020025 The HPAs shall have a fast acting, voltage controlled RF PIN diode switch at the HPAs RF input. It shall be an absorptive type switch having fast switching speed ≤ 200 ns, isolation ≥ 40 dB and be configured for fail safe operation.

020030 The HPAs shall incorporate a smoke detector at an appropriate internal location and implement a smoke detection interlock with sound alarm. The smoke detector shall be (1) combination type alarm (which include both photoelectric and the ionization technologies in a single device), so as to have good sensitivity to both smoldering fires including overheated cables/ electrical equipment as well as to flaming fires; (2) hard-wired powered (i.e., not battery powered); (3) have compatible control interface to HPA control system and (4) have a manufacturer warranty of 10 or more years.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

ID NUM

(S09- 09-)

Requirement

020035 As a part of reliability testing and Factory Acceptance Tests (FAT), the HPAs must be successfully tested for round the clock operation for a time period of at least 100 hours at HPA output pulse top duration = 60 us, pulse repetition frequency (PRF) = 10 Hz, pulsed flat top RF output power level = 25 kW with corresponding fixed pulsed RF input power at constant ambient temperature of 35°C. During such testing, the data for pulsed RF output power level, output-minus-input phase variations, HPA cabinet internal air temperature, and ambient air temperature shall be recorded after every 60 seconds. The HPA cabinet internal air temperature shall be < 40 °C for constant ambient temperature of 35 °C. The HPAs shall operate without any faults (caused by failures internal to HPAs) during such heat run test period and the measured data should remain within specification. The above 100 hour heat run tests shall be witnessed by LBNL representatives and the test results & data shall be written into a report by the vendor and delivered to LBNL prior to FAT.

020040 Vendor shall provide detailed HPAs Design Failure Mode, Effects, and

Criticality Analysis (DFMECA) OR Equivalent to identify the critical parts and then perform HALT testing OR Equivalent testing OR analysis on identified critical parts to ensure that it meets the reliability goals.

020045 The typical RF input to the HPAs from the LLRF systems shall be a pulsed RF carrier modulated in amplitude and phase. The HPAs shall faithfully amplify these input modulations with negligible distortions within the HPA’s power bandwidth. The vendor shall provide such test reports for review and acceptance by LBNL.

During special circumstances such as SHB cavities conditioning / degassing, the RF input signal to HPA is low power CW signal and so the HPA shall also be capable of generating the specified limited CW RF output power per the CW power requirements in section 5.1.2.2..

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.1.2 HPA RF Specifications

5.1.2.1 PULSED RF MODE OF OPERATION (ALS OPERATIONAL MODE)

ID NUM

(S09-09-)

RQMT

DEF

Requirement Description Value Unit

020100 Shall

HPA-1 Center Frequency (fc) 124.910 and 124.911

MHz

HPA-2 Center Frequency (fc) 499.642 and 499.646

MHz

020105 Shall HPAs Output Pulsed RF Peak

Power (in pulse flat top region) with < 1dB compression

≥ 25 kW

020110 Shall HPAs Input Pulsed RF power

(in pulse flat top region) for ≥

25 kW output :

≤ 0 dBm

020115 Shall HPAs Output Power P1 dB ( ≥

25 kW) Bandwidth (BW) around center frequency :

(P1dB BW)

≥ 5 MHz

020120 Shall

HPAs Output Pulsed RF flat top (ideally) duration excluding the rise, overshoot, fall times :

15 to 60 µs

020125 Shall

HPAs Pulse Repetition

Frequency (PRF) :

Also the vendor shall perform pulsed RF device testing and provide limits, if any, to the range of pulse repetition frequency and to the range of duty cycle for no damage to

LDMOS / GaN FETs due to such low frequency thermal cycling and/or fatigue.

0.5 to 10

Hz ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

(S09-09-)

RQMT

DEF

Requirement Description Value Unit

020130 Shall

HPAs Output Pulsed RF Power

Envelope Droop (in pulse flat top (ideally) region) in open loop :

< 1 %

020135

Should

HPAs Output Pulsed RF Power

Envelope Overshoot and

Undershoot :

< 5 %

020140 Shall

HPAs Output Pulsed RF Power

Envelope Rise time and Fall time (10 % to 90 % of final value) :

< 200 ns

020145 Shall

HPAs Group Delay (over the

P1 dB bandwidth of 5 MHz) :

< 100 ns

020150 Shall

HPAs Group Delay variation

(over the P1 dB bandwidth of

5 MHz) :

< 5 ns

020155 Shall

HPA Output pulsed power stability: pulse-to-pulse and also long term (8 hours)

< 2 % (short term)

< 5% (long term)

020160 Should

HPAs Output pulsed power phase stability : pulse to pulse and also long term (8 hours)

< 2 deg for 125

MHz HPA-1

< 8 deg for 500

MHz HPA-2

Deg

020165 Shall HPAs Output Reverse Power handling capability

Full 100% reflection at any phase ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

RQMT

DEF

Requirement Description Value Unit

020170 Shall

HPA Redundancy from failure of RF Amplifier Modules to maintain reduced RF output power of 20 kW minimum.

The HPA shall continue to be operational delivering reduced 20 kW RF output power with up to this volume of failed RF Amplifier modules

Up to 10 % -----

020175 Shall

HPA Redundancy from failure of DC Power Supply Modules

The HPA shall continue to be operational delivering 20 kW output power with remaining working DC PS modules

N+2

(N is minimum modules needed)

020180 Shall HPAs RF Input drive power limit for no damage to HPAs ≥ 10 dBm

020185 Shall

HPAs RF Output Power (1kW to 25 kW) Phase variation from RF Input power sweep in 10 µs : the Phase variation must be monotonic:

< 15 deg

020190 Shall

HPAs RF Output Power (

1kW -25 kW) Gain variation from RF Input power sweep in 10 µs :

the Gain Variation must be monotonic:

± 0.5 (max) dB

020195 Shall

HPAs Power Gain (over the

P1dB BW and over 15-35°C ambient temperature range)

> 74 dB ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

RQMT

DEF

Requirement Description Value Unit

020200 Should

HPAs Linearity : HPAs overall

Output referred Third Order

Intercept point power (OIP3 in dBm) relative to HPAs pulsed output power (in dBm) at 1dB compression (Pout

@1dB compression)

≥ 9 dB

020205 Shall HPAs Noise Figure over P1dB bandwidth : < 8 dB

020210 Shall

HPAs Spurious Power

(measured at 5 kW, 15 kW &

25 kW RF output, over span of

2 MHz about fc with 1 kHz

RBW

< -60 dBc

020215 Shall

HPAs Input VSWR and Output

VSWR (over P1 dB

Bandwidth) < 1.3 ----

020220 Should

HPAs DC to RF output efficiency (in pulse flat top region) :

≥ 50 % ----

020225 Should

Overall HPA DC to RF

Efficiency (in pulse and CW modes) > 25 % ----

020230 Shall

HPAs RF output Second

Harmonic at all RF output power levels :

< -40 dBc

020235 Shall

HPAs RF output Third

Harmonic at all RF output power levels :

< -60 dBc ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

RQMT

DEF

Requirement Description Value Unit

020240 Shall

HPAs cabinet highest internal air temperature at all internal locations (at 25 kW pulsed RF output at 60 us pulse ON and

PRF = 10 Hz and at 35 deg C ambient temp after 30 minutes of start)

< 40 deg C

020245 Should HPAs Overall Reliability

(MTBF)

> 150,000 Hours

020250 Shall

Audible noise Limits at all

HPA output power levels

(measured at 1 feet from cabinet on all four sides of

HPAs with doors closed ) :

< 55 dBA

5.1.2.2 HPA CW RF MODE OF OPERATION

(S09-09-)

RQMT

DEF

Requirement Description Value Unit

020300 shall HPAs shall also be capable of operating in CW mode to deliver RF Output Forward

Power with < 1 dB compression

≥ 500 W

020305 Shall CW mode Input drive limit (for

≥ 500 W CW P1dB output) ≤ -17 dBm

020310 Shall

CW mode HPAs output RF

Reverse Power handling capability.

Full 100% reflection at all phase

W ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.1.3 Environmental Parameters

(S09-09-)

RQMT

DEF

Requirement Description Value Unit

Environmental Parameters

020400 shall

Working Ambient

Temperature:

05 -35

(41-95)

°C

(°F)

020405 shall Working Elevation: (above sea level)

304.8

(1000) m

(ft)

020410 shall Working Relative Humidity: 10 – 85 % ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.2 AC Input Power

(S09- 09-)

Requirement

020500 The HPAs shall have a rated and NRTL listed, enclosed, LOTO lockable, 3-phase, 208 VAC of suitable current rating less than 35 A Molded Case Circuit

Breaker (MCCB), referred to as the Main Circuit Breaker.

1. Three pole, fixed thermal trip, adjustable magnetic trip

2. Pad-lockable handle lock hasp, off-only version

3. Short Circuit Current Interrupt Rating: preferably ≥ 35 kA

4. The Main Circuit Breaker shall preferably be mounted near the upper right corner on the front side of the cabinet at height ≤ 1.9 m above ground. The 3-ph, 5-wire (1 wire is ground), AC input power via conduit (LBNL provided) will be connected to Line side of the Main

Circuit Breaker.

020505 The HPAs shall have a rated and NRTL listed, LOTO lockable, 1-phase, 120

VAC, 20A, MCB (miniature circuit breaker) referred to as the Control Power

MCB.

1. Short Circuit Current Interrupt Rating should be 10 kA

2. This circuit breaker shall be mounted on the front side control panel of HPA. The 1 ph, 120VAC, 3-wire (1 wire is ground), AC input power via conduit (LBNL provided) shall enter through the top of the cabinet and will be connected to the Line side of 20 A controls MCB.

020510 The HPAs shall have one rated and UL listed Voltage Test Station device for the 3-phase 208 VAC Main circuit breaker on the line side and the load side connections.

020515 The HPAs should have one rated and UL listed Voltage Test Station device for the 1-phase 120 VAC Control Power circuit breaker on the line and the load side connections.

020520 The HPAs 3-phase AC input line currents shall be balanced within 10 %

020525 Suitable UL Listed AC or DC fuses shall be incorporated in all AC or DC branch line circuits respectively for fault isolation. All such fuses shall be easily accessible for replacements, if needed, from front or rear side of HPA upon opening its doors.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

09-)

Requirement

020530 The HPAs shall not suffer any damage due to sudden power outages, brown outs or power sags events of any combination of the 3-phase 208 VAC input and 1-phase 120 VAC input sources when operating at full RF output power.

After such events get cleared, the HPA should be ready for a normal restart from the Fault state with latched interlocks. A Fault Reset is required to clear the HPAs Fault state to the OFF state.

RQMT

DEF

Requirement Description Value Unit

020600 Shall

HPAs AC Input Main power :

Will be fed from upstream 50A lockable panel mounted circuit

3 phase

208 ± 5% VAC,

60 Hz, Y-source, 5-wire (one wire is ground)

V

020605 Shall

HPAs AC Input Control power :

Will be fed from a upstream 20A lockable panel mounted circuit

1 phase

120 ± 5% VAC,

60 Hz

3-wire (one wire is ground)

V

020610 Shall

HPAs AC Input (both 3 phase and 1 phase) power factor in both pulsed and CW mode :

> 0.90 ---ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.3 RF Power Module

(S09- 09-)

Requirement

020700 The RF Amplifier Modules in the HPAs may be grouped such that each group is mounted onto a single forced air cooled heatsink and such group(s) may be referred to as RF Power Modules. The HPAs system shall be designed such that all RF Power Modules are interchangeable to any position without need of gain balancing or phasing adjustments.

020705 The interchanging/replacing of any RF Power Modules shall not adversely affect the HPAs output power. The HPAs RF output power differences / change due to such RF power module interchanges (made in HPA OFF state) shall be less than 50 W within 10 minutes after re-powering up the HPA for all output power levels 1kW to 25 kW. The RF Power Module need not be hot swappable.

020710 The RF Power Modules shall have mechanical sliding & keying mechanism for easy and correctly inserting or removal of Modules (without causing any damage to associated connectors) from the front side or rear side of the HPAs.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.4 RF Amplifier Modules, Pre-Amplifier Modules

(S09- 09-)

Requirement

020800 The Pre-Amplifier (S) (S ≤ 3) should be designed and built to have high linearity, high gain. The first pre-amplifier shall have a low noise figure and high gain. They shall be mounted on appropriate forced air cooled heat sinks.

020805 The RF Amplifier modules (excluding the RF preamplifier stage modules) used in the Driver stage and Final Amplification stage shall be based on recent / latest generation of RF LDMOS push pull FET device OR suitable latest GaN

FET OR equivalent OR better Transistor (TBD by vendor) with manufacturer part production & support longevity for at least next ten years.

020810 Each RF Amplifier module output shall incorporate a suitable RF circulator with its RF load for handling at least twice the full reverse RF power of the module’s output. In addition, the RF module circulator and its RF load shall have sufficient power rating to handle all reverse powers due to possible open/ short conditions at the HPA Output Port. This shall include reverse power from SHB cavities during operation, reverse power in the event of failures of other RF amplifier modules, and mismatches in the output power combiner.

020815 The RF Circulator at each RF Amplifier module output must have power handling capability to withstand twice the nominal forward module output power and also withstand short and open output load conditions at all phase angles.

020820 The RF Amplifier modules shall be operated in Linear Class AB operation.

020825 The RF LDMOS FET or GaN FET flange should be mounted to a copper heat spreader and the heat spreader shall be thermally bonded to appropriate forced-air cooled heat sink. The RF Transistor package shall be ceramic package due to its better pulsed mode heat endurance at low repetition rate.

020830 Each RF Amplifier module shall also have a suitable RF protection on its input side whereby the failure of any RF Amplifier module(s) shall not affect the operation of the RF input splitter and/or affect the amplitude/phase of the RF input signals to other RF Amplifier modules.

020835 The RF Amplifier Modules shall have stable operation with a LDMOS FET OR

GaN FET Drain bias voltage of less than or equal to 50 V.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

09-)

Requirement

020840 The input matching network and output matching network including the input balun and the output baluns, should preferably be realized using planar microstrip lines, surface mount capacitors having very high component Q values and the operating values of RF current/voltage/power shall be well below device ratings. Hand formed parts /components and hand soldering should preferably be avoided.

020845 The gate bias network shall incorporate Zener diode based or other suitable overvoltage protection.

020850 Every module shall have temperature monitoring on the heat sink and suitable over temperature protection.

020855 The LDMOS FET Drain Bias from common DC bus bar to each RF Amplifier module shall be via fast-acting fuse which shall be easily accessible for replacements.

020860 The DC bulk storage capacitors utilized shall have high load life endurance rating of at least 5000 hours at 105 °C and very low ESR and positioned close to each Amplifier Module Drain Bias circuit.

020865 The RF Amplifier Module’s input port connector should be N type (F) and output port connector should be 7/16 inch DIN.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

RQMT

DEF

Requirement Description Value Unit

020900 Should

RF LDMOS FET or GaN FET maximum junction temperature (at 25 kW pulsed

RF 60 µs pulse width at 10 Hz

PRF and 500 W CW output)

< 150 °C

020905 Shall

RF Amplifier Module output

Balun temperature and/or output matching circuit components temperature (at 25 kW pulsed RF and 500 W CW output after half hour of powering up)

< 45 °C

020910 Shall

RF Amplifier Modules DC power to P1 dB RF output power efficiency (in pulse flat top region) :

≥50 %

020915 Shall

RF Amplifier Modules output power variation across

Modules ((max power - min power )/avg power) :

(over 1-25 kW HPA RF output)

≤ 5

020920 Shall

RF Amplifier Modules output phase variation across Modules

(max phase - min phase) :

(over 1- 25 kW HPA RF output)

≤ 10

Deg

020925 Should

RF Pre-Amplifier devices (S) junction temperature (at HPA

RF output of 25 kW)

< 150 °C ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.5 RF Power Combiner, Splitter, Coupler Signals

(S09- 09-)

Requirement

021000 Suitable dual directional couplers shall be utilized for monitoring the Forward and the Reverse RF powers at HPAs RF input port stage and at intermediate stage before the splitter feeding array of final RF amplifier modules and they shall be displayed in HMI.

021005 Suitable dual directional couplers shall be utilized for monitoring the Forward and the Reverse RF powers at each RF Amplifier Module downstream of module RF circulator and they shall be displayed in HMI.

021010 The sampled pulsed RF Forward Power and the sampled pulsed RF Reverse

Power in each RF Amplifier Module shall be processed through separate wideband pulsed RF envelope detectors, for use in HPA monitor & supervisory control. Such detectors should be linear, fast responding, temperature compensated envelope detectors.

021015 The RF output power from the RF Amplifier modules (total = T = M*N) should be combined utilizing a high efficiency multi-stage combiner network, having

1-5/8 inch OR 7/8 inch EIA RF output port.

021020 A suitable 1-5/8 inch OR 7/8 inch EIA coaxial line dual directional coupler shall be utilized for monitoring the Forward and the Reverse RF powers at

HPA RF output port and these power levels should be displayed on the HMI.

Small sampled RF Output Forward and Reflected powers (with coupling about

-50 dB) shall be provided on front panel with N type (F) connectors for user tests/ measurements.

RQMT

DEF

Requirement Description Value Unit

021100 Should RF High Power Combiner port isolation ≥ 20 dB ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.6 DC Power Scheme

(S09-09-) Requirement

021200 The DC pulsed power scheme for RF Amplifier modules may be based on

Quasi Constant Power (QCP) Capacitor Charging Power Supply (CCPS)

Modules. DC power supply modules shall have N+2 redundancy and they should be connected in parallel operation using MOSFET OR-ing OR preferably utilizing active current sharing mechanism, connected to a common bus bar and have fused wired connections to the local bulk storage capacitors placed close & connected to each RF Amplifier LDMOS / GaN FET drain.

021205 DC power supply modules that fault for any reason shall be seamlessly disconnected in a paralleled operation mechanism without causing any disruption to the HPA operation to continue delivering RF output power.

The fault type message, with modules numbers with fault occurrence time stamps shall be displayed and logged in the HMI.

021210 The LDMOS / GaN FET Drain DC quiescent bias current for class AB operational mode of the RF Amplifier modules should be provided from separate highly regulated, very low ripple DC PS module(s) operating in CV mode to the same user set Drain voltage value below 50 V with having parallel M+1 redundancy to another common bus. Necessary diodes (for blocking reverse currents) shall be used for each LDMOS/ GaN drain connection.

021215 The LDMOS / GaN FET Gate bias voltages for class AB operational mode of the RF Amplifier modules should be provided from separate highly regulated, very low ripple DC PS module(s) operating in CV mode with parallel P+1 redundancy to another common bus.

021220 The Gate bias voltage for each LDMOS / GaN FET must be over-voltage protected and have fine adjustability, if needed, for the RF Amplifier module set up.

021225 The aforesaid DC PS module types shall have built in Over Voltage protection, Over Current protection, Over Temperature protection, Short

Circuit Protections. They must be compact, modular, highly stable and have suitable compatible programmable controls interface for monitoring of voltage / current read backs and controls & faults signals for interfacing with HPA controls.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

Requirement

021230 Stored energies in all capacitors inside HPA shall be discharged to < 5 V and

< 10 J within < 30 seconds after turning OFF the HPAs. Then hard grounding will finish the discharge and render a system that can be safely zero-voltage and zero-energy verified, as per section 15 in LBNL Electrical Safety Manual.

The vendor must ensure conformity with requirements in LBNL Electrical

Safety Manual (Reference # [2] in Table 6.1: Applicable documents).

RQMT

DEF

Requirement Description Value Unit

021300 shall DC PS modules Efficiency (AC to

DC)

> 85 %

021305 shall DC PS modules Ripple voltage

(peak to peak) (5 Hz to 1 MHz)

< 100 mV

021310 shall Reliability MTBF of DC PS modules > 100000 Hours ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.7 Forced Clean Air Cooling

(S09- 09-)

Requirement

021400 The HPAs shall implement forced clean air cooling using fans for providing adequate airflow for cooling and all internal components power dissipations including the DC PS modules and RF Amplifier Modules.

021405 The fans used for forced clean airflow cooling should preferably implement variable speed control.

021410 For effective airflow management, appropriate baffles shall be utilized inside the cabinet to seal any openings which would allow the airflow to bypass the heat generating equipment’s inside cabinet.

021415 The HPAs cabinet shall incorporate appropriate dust filters, to provide clean and dust free airflow.

021420 The airflow inlet fan filter should be near bottom on front side and exhaust outlet vent should be on near top on the rear side of HPAs.

021425 The fans used for forced clean airflow cooling shall make low audible noise so as to meet the overall HPAs audible noise specification.

021430 The fans used for cooling should have high reliability (MTBF) > 100000 hours ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.8 External Interfaces

(S09- 09-)

Requirement

021500 3 ph 208V, 5-wire, AC input power fed via metal conduit on HPA top side.

021505 1 ph, 120V, 3-wire, AC input power fed via metal conduit on HPA top side

021510

The various input-output signal cables (RF / FO / Ethernet / USB etc) interface connectors on HPAs should preferably be mounted onto a recessed panel which is accessible from openable HMI mounted window door on HPA front panel except for AC power input cables. All such input output signal cables (except AC power input cables) should be entered through suitable

Roxtec cable entry seals located on HPA front panel.

021515 RF Input Drive Connector N type (F). There shall be an attached mechanical fixture to lock the RF Input drive cable connector in place after installation.

021520

RF Output Port 1-5/8 inch or 7/8 inch EIA with end flange connector shall be mechanically secured to withstand insertion or extraction forces of at least 10 kgf and transverse forces of at least 5 kgf.

021525 Human Machine Interface (HMI) 15” Color (preferably from Allen Bradley) touch screen display for control and monitor

021530

Fiber Optic (FO) External Fault Input Signals Receivers Ports and the FO

Internal Fault Output Signals Transmitters Ports, preferably on recessed panel (accessible behind openable HMI window door)

021535 One 1000 Base-T (Gigabit) Ethernet port for interfacing with EPICS IOC

09-)

RQMT

DEF

Requirement Description

Value Unit

021600 Shall RF Input connector Coaxial N type (F) on the recessed panel on front side of HPA

021605 Shall

RF Output connector

1-5/8” OR 7/8 inch EIA Coaxial

Transmission Line oriented vertically on top side of HPA. The output RF transmission line is to protrude vertically outside the

HPA cabinet for length 10.2cm-

15.2cm (4-6 inches)

Inch ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

09-)

RQMT

DEF

Requirement Description

Value Unit

021610 Shall

HPA Maximum

Overall Cabinet

Dimensions

1.16m (W) x 0.76m (D) x 2.37m

(H) (maximum)

(Equivalently 46” (W) * 30” (D) *

93.5” (H) (maximum)

Important Note: The bottom 8 inches from ground (zero) level in above overall 93.5” height from ground level shall be left vacant for passing over of some existing installed cables at site.

Width (W): horizontal along front

Depth (D): horizontal along side.

Height (H): vertical on any side.

m

021615 Shall

Quantity Four, Fiber Optic Input

Receivers Ports.

Quantity Four, Fiber Optic Output

Transmitters Ports

FO Receiver, Avago part number

AFBR-2624Z

FO Transmitter, Avago part number AFBR-1624Z ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.9 Design and Manufacturing Requirements

09-)

Requirement

021700 The vendor shall ensure to establish a contract with an OSHA approved NRTL company early on in design phase for all of following :

(a) Desk review of vendor HPAs design documents and approval certification by the NRTL prior to conducting Final Design Review (FDR)

(b) Preliminary NRTL field inspection of both HPAs to applicable US standards at vendor factory site prior to conducting FAT tests

(c) Final NRTL field inspection of both HPAs to applicable US standards at

LBNL site with successful NRTL field evaluated label applied on both HPA’s

The NRTL approval report of both HPA’s desk review, preliminary field inspection and final field inspection at LBNL with successful NRTL evaluated label applied to both HPAs shall be deliverable items by the vendor for final acceptance of HPAs This shall be fully vendor responsibility and LBNL will only provide non-financial support, as might be needed.

For smoothly carrying out aforesaid NRTL inspections to US standards, the vendor is strongly advised to establish a contract with a reputed NRTL company having worldwide business operations including in the vendor’s country and in the USA. Further the vendor must ensure that no disagreements arise between NRTL inspectors conducting such desk and preliminary inspection at the vendor site and conducting final inspection at

LBNL site.

021705 Such NRTL desk review and two field evaluations certifications of HPAs shall be to applicable US standards which are to include but not limited to NFPA

70, NFPA 70E, UL- 508A, UL-61010-1, UL- 60950-1 etc. This shall be vendor responsibility.

021710 The vendor shall ensure that HPAs are designed and built in conformity with various LBNL specific engineering standards / requirements and safety documents as referenced in Reference # [1] through [11] in Table 6.1 in the

Applicable Documents section. This shall be vendor responsibility.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

09-)

Requirement

021715 HPA cabinet must successfully obtain the structural integrity including lifting/ rigging and seismic integrity & cabinet base anchoring certification as per relevant California code standards from a California licensed engineer. This shall be fully Vendor responsibility. LBNL will only provide non-financial support in collaborative and iterative feedback in carrying out review & eventual concurrence from LBNL mechanical / structural engineer in such process leading up to final certification from California licensed engineer.

021720 The vendor shall ensure that HPAs are designed and manufactured to conform with LBNL Non-Ionizing Radiation (NIR) safety document as referenced in

Reference # [12] in Table 6.1 (Applicable Documents section). The HPA shall be surveyed for NIR levels at various locations both internal and external to the HPA cabinets/rack and the NIR power density shall be less than 1 mW/cm2 for HPA-1 and 1.67 mW/cm2 for HPA-2 time averaged over 6 minutes at all

HPA RF output power levels and PRF ranges. The vendor shall provide such

NIR test certifications for LBNL review and acceptance .

021725 The vendor shall ensure that the HPAs are designed and manufactured in conformity with standard UL-94 for safety of flammable materials. The vendor shall provide the necessary documentation for LBNL review and acceptance.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.10 Construction Requirements

(S09- 09-)

Requirement

021800 The HPAs cabinet shall be accessible from Front side and Rear sides only. The

Left and Right sides are blocked by other cabinets and therefore inaccessible.

The Front and Rear sides shall have latch-able (not keys locks) doors

(swinging outwards). All components inside HPA must be easily accessible and be removed or installed quickly from Front and Rear sides only.

021805 The various types of modules inside the HPAs shall be easily accessible for making any connections / disconnections and they should be easily inserted / removed from the front or rear side only of the rack/cabinet.

021810 All electrical equipment, components, cables, conductors etc., used in HPAs must be UL Listed / Certified wherever available.

021815 Vendor shall provide certification that critical fasteners like used for HPA mechanical cabinet integrity, seismic anchoring, electrical high current contacts in HPA etc., are not counterfeit.

021820 The vendor shall provide a lift test certificate of the fully loaded HPAs with all its internal components. The vendor shall provide the Center of Gravity (CG) location of HPAs cabinet with fully assembled internal parts and the full weight of HPAs with all parts.

021825 All materials used for construction of cabinet/racks and accessories shall be non-corroding and non-rusting when installed in an indoor location.

021830 Ingress Protection (IP) rating of HPAs cabinets shall be IP 51 (min).

021835 All the screws mounting the modules shall be captured such that they remain attached to the module panel when loosened and the module is removed.

021840 All wires/cables in the HPAs shall have proper wire labelling with wire identification sleeves and proper terminal/ Input-Output device identification for ease of troubleshooting & maintenance.

021845 HPAs Cabinet shall have an M8x1 (5/16-18 equivalent) grounding stud(s).

This is to apply building ground to the HPAs cabinets.

021850 The HPAs cabinets ground shall have good electrical continuity with all metal parts of the enclosure by means of metal-to-metal contact (no non-conductive plating or paint on the metal-to-metal contact surfaces) Alternatively, an internal ground bonding conductor using ring terminals shall be used.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

09-)

Requirement

021855 The HPAs cabinets/racks shall have four swivel base lifting bales (not eye bolts) of appropriate size to lift HPA cabinets/racks by crane. The swivel base lifting bales shall be certified and certification document shall be delivered to

LBNL. The swivel lifting bales shall conform with the standard ASME B30.26, on rigging hardware.

021860 The HPAs cabinet base shall have provisions for forklifting & pallet-jack lifting from front and rear sides and the HPA cabinet shall be capable of being forklifted & pallet-jack lifted when it is fully loaded. Forklift channels shall not have any obstructions (e.g., protruding bolts). The flatness of the bottom of the HPA base shall be within ± 1.6 mm (± 1/16”) from a horizontal plane.

021865 There should be hinged, latched metal doors (no locks) on the front and rear sides of HPAs cabinet. Each door should extend from the bottom opening of the cabinet to the panel at the top of the cabinet.

021870 All electrical wires/ cables and materials should be Zero Halogen Low Smoke and fire retardant /non-flammable.

021875 The vendor shall provide good workmanship in neatly laying out the components and also properly segregating and routing the cables.

021880 HPAs should be shipped by vendor as a completely assembled unit.

021890 HPAs cabinets paint color shall be RAL 9002 - Gray/White.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.11 Control System

5.11.1 Control System General Requirements

ID NUM

(S09- 09-)

Requirement

022000 The HPAs control system architecture should be distributed control system implemented using suitable PLC (preferably Allen Bradley) and/or suitable

FPGA controllers. It shall have all requisite control, monitor, display, interlock, logging, self-protection etc, logic and functionality

022005 The control system shall be fault tolerant to failures or physical removal of RF

Amplifier Modules and/or DC PS Modules having redundancy and it shall seamlessly continue HPA operation to deliver RF output power.

022010 The HPAs control system shall be operable in two modes i.e., either from local

HMI (Local mode) or from remote EPICS IOC (Remote mode) using

EtherNet/IP protocol. The HPAs control system shall allow the HPAs to operate in CW mode in Local mode only. The HPAs control system shall allow the HPAs to operate in pulsed RF mode in both Local and Remote modes.

022015 The HPAs controls shall be compatible for remote mode EPICS IOC based full status reporting and read capability using EtherNet/IP protocol over fast

Ethernet 6 interface to the HPAs to remotely read only all HPA PLC registers pertaining to various signal parameters readings, status, interlocks, time stamps etc. The HPAs controls shall have remote mode EPICS IOC based limited write capability of the HPA PLC registers for the states commands and the Fault Reset only.

022020 HPAs shall have 15" color HMI (preferably from Allen Bradley) with main / home page and other navigation pages for controls interface and display of

HPA states & display of signals readings with latched interlocks status of various HPA signals & parameters.

022025 The HMI shall have Password protected access in Local Mode only to the HMI configuration settings page for setting / changing the parameter set values, warnings limits, interlocks limits etc.

022030 All HMI display parameters and values should be updated at a rate of 20 Hz or higher rate. They should also be logged/ stored in the HPA controlled storage device (like SSD) every 2 seconds with date & timestamps for later troubleshooting.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

09-)

Requirement

022035 The HPAs controls shall chronologically display in HMI and also log/ store in storage device, all the event actions on HPA made by operator and also fault occurrence description with signal name, parameter values with respective date & time stamps for later troubleshooting.

022040 The HPAs control signals must be implemented as failsafe positive logic i.e., absence of voltage is considered as fault and will disable the system operation.

Similarly absence of light in FO is considered as fault and will disable the system operation.

022045 The various monitor & control signals with parameter values & their status with latched interlocks that should be in such HMI display pages are to include but not limited to following

(1) Finite State Machine operation (FSM States : Off, Standby, DC, RF, Fault)

(2) Pulsed / CW operation mode selection,

(3) RF input Overdrive

(4) Fault Reset,

(5) 3-Ph AC input line voltages & line currents, Over and Under voltages

(6) Various DC PS module-wise status & DC output voltages & currents

(7) HPA RF Output Forward & Reflected powers

(8) Set Drain Voltage

(9) Cooling Fans status and speeds

(10) Internal cabinet air temperature, humidity, smoke detector

(11) RF amplifier (including preamplifier) module-wise parameters like drain voltage & currents, Module Output Forward & Reflected powers etc.

(12) RF combiner temperature

(13) FO signals status indicators for all FO input and all FO output signals

The HPAs control system shall have relevant latched interlocks status when signals value is out of range and protections logic for aforesaid signals for self-protection of the HPA.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

09-)

Requirement

022050 The HPAs control system shall utilize separate two redundant DC power supply modules operating in parallel for powering the PLC system and associated controls hardware modules.

022055 The HPAs PLC & associated control system modules should be capable of rebooting and also have firmware and program updates through password protected access from the Ethernet port OR USB port located on the front panel.

022060 The HPAs Control system modules/hardware shall be sufficiently electromagnetically shielded from the RF signals, so that the RF signals do not cause any unwanted interference and/or affect the functionality of the control system. All susceptible signals/wire connections to and from the control system shall be RF filtered.

022065 Vendor shall provide complete HPAs control system PLC program code in

Ladder Logic and FPGA program code in Verilog (if used) along with any other associated relevant firm wares, if any. Such control program code shall be modular structure with sufficient annotations for easy understanding of program code workings.

RQMT

DEF Requirement Description Value Unit

Control Parameters

022100 Should PLC scan rate ≥ 20 Hz

022105 Should HMI display parameters update rate ≥ 20 Hz

022110 Shall ADC resolution ≥ 12 Bits

022115 Shall DAC resolution ≥ 12 Bits

022120 Shall

Measurement accuracy of the various

AC/DC Voltage, AC/DC Current, Temperature, Humidity, Fan speed monitor signals values in HMI display

(in both Pulsed RF and CW RF modes)

≤ 10 % ---

022125 Shall

Measurement accuracy of the various RF

Forward and Reverse power monitor signals values in HMI display

(in both Pulsed RF and CW RF modes)

≤ 0.25 dB ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

RQMT

DEF Requirement Description Value Unit

022130 Should Slow Interlocks response speed using PLC < 100 ms

022135 Shall

Fast Interlocks (for FO input / output signals and RF input /output power signals) response speed using FPGA or otherwise

< 10 µs ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

5.11.2 HPA FO Input signals

Input # FO Input Signal Functionality

1 HPAs Permit (from Master

Interlock PLC to HPAs )

When FO light is present, the HPAs operation is enabled to deliver RF output.

When FO light is absent, the HPAs operation is disabled to deliver RF output power but HPAs shall NOT go into Fault state. The relevant FO indicator in HMI to show its status with text message & time stamp in HMI

2 HPAs Oscillation detection and

Permit (from LLRF to HPA)

When FO light is present, the HPAs operation is enabled to deliver RF output.

When FO light is absent the HPAs operation is disabled to deliver RF output power and

HPAs shall go into Standby or Fault state.

The relevant FO indicator in HMI to show its status with text message & time stamp in HMI

3,4 Spare & Un-assigned When FO light is present, the HPA operation is enabled. When FO light is absent, the HPA operation is disabled

5.11.3 HPA FO Output Signals

Output # FO Output Signal Functionality

1 HPAs healthiness / internal fault

(from HPAs to Master PLC)

FO light shall be present when the HPAs are in any of the No-Fault states i.e., operational states. FO light shall be absent when the HPAs are in Fault state.

2,3, 4 Dummy Tests Use (for providing temporary loopback FO signals

FO light shall be present when the respective FO output button in HMI is toggled to ON. The FO light shall be absent ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U during local troubleshooting / testing) when such respective FO button is toggled to OFF.

ci al ly R el ea se d

To th e

LB

N L

D oc um en t C on tr ol

C en te r

Re le as ed

: M ar ch

3r d, D

C C

A ut h K ey : 1

5J

U

Advanced Light Source Upgrade Project

Lawrence Berkeley National Laboratory

6 APPLICABLE DOCUMENTS

This section identifies applicable documents that are considered to be a part of this document.

Referen ce

Number

Document Name / Number Title/ Description

LBNL Engineering Division

Electrical Equipment Build

Standard (Revision 6) including its

Appendices A, B, C and D

Electrical Equipment Build Standard

LBNL Electrical Safety Manual

(Revision 1) Electrical Safety Manual

LBNL RPM on Safe…