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FA8307-16-R-0049
FIA2T Section L Attachment L-6 - Sample Task 2 - ECCCA-ProductionDescription 28 July 2015 Instructions for Sample Task 2 Embeddable Cryptographic CCA
Draft Version 0.1
7/30/2015 9:12:00 AM
Prepared by:
Cryptologic and Cyber Systems Directorate (CCSD/HNC) 250 Hall Blvd., Suite 132 Lackland AFB, TX 78243
ATTACHMENT L-2
Sample Task Instructions Instructions This section contains instructions for preparing responses for FIA2T sample task #2. Sample task #2 requires production of an embeddable cryptographic CCA.
Sample Problem Response Content and Format The Offeror shall submit the responses to both of the sample problems in accordance with (IAW) the instructions in Section L, paragraphs 2.0 (General Instructions) and 4.0 (Volume II – Technical). All costs shall be reported in Volume IV IAW applicable Cost/Price Volume instructions. The word "shall" is used whenever a specification expresses a provision that is binding. The word “can” expresses non-mandatory provisions and optionality.
Task Descriptions Sample Task #2 The purpose of this task is to provide production planning and capability documentation. The sample task includes a Bill of Materials (BOM) and the indicated GFE and Information (GFI). The task is to outline the production of this cryptographic CCA, handling all relevant planning and security tasks. Sample Task #2 consists in producing a cryptographic CCA from an overall parts list and top level drawings to meet the production requirements for this kind of item.
Government Furnished Equipment (GFE) and Government Furnished Information (GFI) The following lists GFE to be considered as provided for performance of this task:
a) Acceptance test equipment.
b) Crypto Engine chip indicated in Parts List.
The following lists GFI to be considered as provided for performance of this task:
a) Source files (schematics, Gerber, etc. in all relevant formats and tool setup.
b) Finalized design – no TEMPEST or special security requirements.
For Sample Task #2 The Offeror shall:
Demonstrate production planning and mechanisms of the Embeddable Cryptographic CCA per the following delivery schedule and quantities:
50 ECCs to be delivered per the timeline indicated in Section L for sample task 2.
a) Part List for sourcing and planning
| Part Number |
| Qty |
| Nomenclature and Value |
| C0402C103M4RACTU |
| 25 |
| CAPACITOR, CERAMIC, CHIP - 0.01UF-20-16 |
| GRM188R71C154KA01D |
| 32 |
| CAPACITOR, CERAMIC, CHIP - 0.15UF-10-16 |
| C3216X7R1E155M160AA |
| 29 |
| CAPACITOR, CERAMIC, CHIP - 1.5UF-20-25 |
| GRM1885C1H511JA01D |
| 13 |
| CAPACITOR, CERAMIC, CHIP - 510PF-5-50 |
| T495D226M035ATE125 |
| 3 |
| CAPACITOR, TANTALUM, CHIP - 22UF-20-35 |
| T495X337K010ATE050 |
| 4 |
| CAPACITOR, TANTALUM, CHIP - 330UF-10-10 |
| IS61WV12816DBLL-10BLI-TR |
| 2 |
| CMOS STATIC RAM |
| 046288040000846+ |
| 3 |
| CONNECTOR, ZIF |
| MBR0530TPMSTR-ND |
| 3 |
| DIODE, SCHOTTKY RECTIFIER 30V, 0.5A. |
| BAT54WT1 |
| 1 |
| DIODE, SWITCHING |
| GFE crypto engine |
| 1 |
| GFE Crypto Engine - package size, pin count - 51pin, BGA, 35x35mm |
| FLE-105-01-G-DV-A-K-TR SOCKET |
| 1 |
| Header pins |
| MPI2520R1-100-R |
| 2 |
| INDUCTOR, CHIP, 10UH-20% |
| MPI2520R0-2R2-R |
| 2 |
| INDUCTOR, CHIP, 2.2UH-20% |
| M74VHC1GT50DFT2G |
| 3 |
| MICROCIRCUIT, BUFFER |
| LTC1540CMS8#PBF |
| 2 |
| MICROCIRCUIT, COMPARATOR, NANOPOWER |
| LT1615ES5-1 |
| 1 |
| MICROCIRCUIT, CONVERTER, DC-TO-DC |
| 24LC512-I/ST |
| 1 |
| MICROCIRCUIT, EEPROM, SERIAL, 2-WIRE 512K, 8-BIT |
| S29PL127J70BAI000 |
| 1 |
| MICROCIRCUIT, FLASH 128M 8M X 16 |
| XC2V1000-5FGG456C |
| 1 |
| MICROCIRCUIT, FPGA |
| ADR06CRZ |
| 1 |
| MICROCIRCUIT, LDO REFERENCE, 3V 3.0 V-NA-0.2%-5 |
| ISL88011IH529Z-T7A |
| 2 |
| MICROCIRCUIT, LINEAR, SUPERVISORY CIRCUIT |
| MAX6315US29D3+T |
| 1 |
| MICROCIRCUIT, Power Management |
| ADM6315-29D2ARTZR7 |
| 2 |
| MICROCIRCUIT, Power Management |
| LT1767EMS8E |
| 1 |
| MICROCIRCUIT, REGULATOR, SWITCHING, 1.2 V ADJ-NA-Ma --- x input voltage -25 |
| XC18V04VQ44C |
| 1 |
| MICROCIRCUIT, SERIAL PROM, Xilinx |
| CY7C1381C-100BZI |
| 1 |
| MICROCIRCUIT, SRAM, 36M, 512K X 36/1M X 18- |
| REG71050DDCT |
| 1 |
| MICROCIRCUIT, SWITCHED CAP VOLT REG, 60mA, 5V-NA-Max --- input voltage-5 |
| PACDN1408CG |
| 6 |
| MICROCIRCUIT, TVS ARRAY |
| ADP2108AUJZ-1.5-R7 |
| 1 |
| MICROCIRCUIT, VOLTAGE REGULATOR, 1.5-NA-max input voltage-5.5 |
| 74LVCH16245AEV,151 |
| 2 |
| MICROCIRCUIT,TRANSCEIVER, 16-BIT |
| ECS-2532HS-320-3-G |
| 1 |
| Oscillator - 32MHz, 3.3, 10ppm, 10ma |
| RC0402FR-07100RL |
| 6 |
| RESISTOR, FIXED, FILM, CHIP - 100-1-0.063 |
| AC0402FR-07100KL |
| 16 |
| RESISTOR, FIXED, FILM, CHIP - 100K-1-0.063 |
| RCG040210K0FKED |
| 53 |
| RESISTOR, FIXED, FILM, CHIP - 10K-1-0.063 |
| AC0402FR-07120RL |
| 4 |
| RESISTOR, FIXED, FILM, CHIP - 120-1-0.063 |
| AC0402FR-071KL |
| 8 |
| RESISTOR, FIXED, FILM, CHIP - 1K-1-0.063 |
| AC0402FR-071ML |
| 2 |
| RESISTOR, FIXED, FILM, CHIP - 1M-1-0.063 |
| CR0402-FX-2871GLF |
| 1 |
| RESISTOR, FIXED, FILM, CHIP - 2.87K-1-0.063 |
| ERJ-2RKF2742X |
| 1 |
| RESISTOR, FIXED, FILM, CHIP - 27.4K-1-0.1 |
| RC0402FR-0730K1L |
| 1 |
| RESISTOR, FIXED, FILM, CHIP - 30.1k-1-0.063 |
| RC0402FR-0733R2L |
| 1 |
| RESISTOR, FIXED, FILM, CHIP - 33.2-1-0.063 |
| RC0402FR-074K75L |
| 1 |
| RESISTOR, FIXED, FILM, CHIP - 4.75k-1-0.063 |
| ERJ-2RKF4701X |
| 2 |
| RESISTOR, FIXED, FILM, CHIP - 4.7K-1-0.1 |
| RC0402FR-07464KL |
| 1 |
| RESISTOR, FIXED, FILM, CHIP - 464k-1-0.063 |
| ERJ-2RKF4873X |
| 1 |
| RESISTOR, FIXED, FILM, CHIP - 487K-1-0.1 |
| FDG6303N |
| 2 |
| TRANSISTOR, N-CH, MOSFET (DUAL) |
| FDG6304P |
| 2 |
| TRANSISTOR, P-CH, MOSFET (DUAL) |
b) Layout parameters. The CCA can have parts on both sides, roughly square shape with area of 75 square cm. Thickness of PWB before solder mask shall be nominal 1.5mm.
c) Perform functional and environmental Acceptance Testing Procedures (ATP) using GFE Automated Test Equipment (ATE), for all ECCs, which takes 1 hr per unit run.
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