Sputtering Tool System

Argonne National Laboratory is seeking a sputtering system capable of handling multiple substrate sizes from 150mm to wafer pieces for support of laboratory users and staff scientists. The procurement is being conducted by the Department of Energy Office of Science and requires a sophisticated system with specific technical requirements including a 3" circular sputter source, four magnetrons with physical disconnect methods, power supplies operating in DC and pulsed DC modes up to 100kHz, and substrate heating capabilities reaching 800°C. The system must achieve a base pressure below 5E-8 Torr and demonstrate precise film deposition capabilities for aluminum (100 nm with 3% uniformity) and silicon dioxide (50 nm with 5% uniformity) on 150mm silicon wafers. Evaluation will prioritize technical acceptability and country of origin compliance before considering price, following a lowest price technically acceptable approach. Proposals are due to Molly Hunter at mollyhunter@anl.gov by September 26, 2025 at 5:00 PM CDT, and an addendum issued on September 23, 2025 must be included with all submissions.

This solicitation does not utilize any set-aside designations and is open to full and open competition. No incumbent contractors or current service providers are identified in the solicitation documents. While specific award values are not disclosed, the procurement includes comprehensive requirements such as installation, training on hardware and software operation, a 12-month warranty, and lifetime telephone and online support from the vendor. The vendor must demonstrate an established track record with at least 50 similar installed systems and provide three references including at least one from industry. Performance will take place at Argonne National Laboratory in Lemont, Illinois, with the system supporting nanoscale materials research activities at the Center for Nanoscale Materials.