Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D)
Closed Pre-Solicitation Posted
- Solicitation number
- HR001123S0019
- Agency
- Defense Advanced Research Projects Agency Department of Defense
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 541713 Research and Development in Nanotechnology
- PSC
- A Research And Development
Notice details come from SAM.gov. Updated .
Notice text
The Minitherms3D program seeks to revolutionize thermal management for three-dimensional heterogeneous integration (3DHI). This program seeks to significantly reduce thermal resistances within the 3D stack and external to the stack of 3DHI systems, while increasing volumetric heat removal.
Attachments
| File | Type | Posted |
|---|---|---|
| Minitherms3D_FAQ_04102023_Updated.pdf | ||
| Minitherms3D_FAQ_03162023_Updated.pdf | ||
| Eden_and_Fab_Slides_Minitherms3d.pdf | ||
| DARPA_MiniTherms_-_SNL.pdf | ||
| DARPA_Minitherms3D_ProposersDay_MITLL_20230127_b.pdf | ||
| Minitherms3D_FAQ_Final.docx | DOCX document | |
| Proposers_Day_Attendees_Contact_List.pdf | ||
| Minitherms3D_Proposers_Day_Slides.pdf | ||
| HR001123S0019.pdf | ||
| HR001123S0019_Attachment_5_DARPA_Standard_Cost_Proposal_Spreadsheet.xlsx | XLSX spreadsheet | |
| HR001123S0019_Attachment_4_OT_Certs_Template.docx | DOCX document | |
| HR001123S0019_Attachment_1_Cost_Volume_Proposer_Checklist.pdf | ||
| HR001123S0019_Attachment_3_General_MTO_Controlled_Unclassified_Information_Guide__CUIG_.pdf | ||
| HR001123S0019_Attachment_2_Proposal_Summary_Chart.pptx | PPTX presentation |
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