Miniature integrated thermal management systems for 3D heterogeneous integration (MINITHERMS3D)

Active Definitive Contract Awarded Last action

Contract number
HR001124C0305
Awardee
Awarding agency
Obligated
$14,530,450

Award facts

Opportunity
Contract value 95% obligated
$15,216,059.00 Current and potential, with all options
Completion date 77% complete
Current and potential, with all options
Contracting staff
Set-aside
No set-aside
Competition
Full and Open Competition · 11 offers Basic Research
Pricing
Cost Plus Fixed Fee
Place of performance
Malibu, CA, USA
Legislative mandates

Award details come from SAM.gov/FPDS.

Transactions

Action Obligated Date
Funding Only Action P00012 $426,021
Funding Only Action P00011 $2,538,761
Funding Only Action P00010 $200,000
Supplemental Agreement for work within scope P00009 $1,502,729
Funding Only Action P00008 · Miniature integrated thermal management system for 3D heterogeneous integration (MINITHERMS3D) $1,000,000
Exercise an Option P00007 · DARPA research program $1,950,130
Other Administrative Action P00006 $0
Other Administrative Action P00005 $0
Supplemental Agreement for work within scope P00004 $299,863
Funding Only Action P00003 · Miniature integrated thermal management system for 3D heterogeneous integration (MINITHERMS3D) $585,806
Funding Only Action P00002 $1,711,709
Other Administrative Action P00001 $0
Original award $4,315,431
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About this award

The Defense Advanced Research Projects Agency awarded a $15.216 million definitive contract to HRL Laboratories, LLC for miniature integrated thermal management systems for 3D heterogeneous integration (MINITHERMS3D) on November 9, 2023, under cost-plus-fixed-fee pricing with no set-aside.

Place of performance is Malibu, California. The originating pre-solicitation, posted January 23, 2023, sought research and development of miniature thermal management systems supporting 3D heterogeneous microelectronics integration. Contract performance extends through August 31, 2027.

HRL Laboratories is a research and development laboratory jointly owned by The Boeing Company and General Motors, specializing in advanced-technology research across quantum computing, infrared sensing, additive manufacturing, and specialized electronics for defense agencies. The company competes exclusively in full-and-open procurements.

The prime contractor subcontracts work across a research consortium: Micross Advanced Interconnect Technology LLC provides wafer-level packaging and fabrication services including through-silicon via fabrication, copper pillar bumping, and redistribution layer fabrication; the University of Maryland College Park develops forced-fed heat sinks and compact air-to-liquid heat exchangers; Stanford University improves performance of microchannel embedded cooling chips; Purdue University determines reliable thermal management architectures; and Global Communication Semiconductors supplies GaN/SiC multiplex-wafer lot services.

DARPA dominates HRL's portfolio by concentration and dollar value, accounting for 57 percent of the company's $827.3 million combined potential value across 295 total federal awards. This MINITHERMS3D contract exemplifies DARPA's investment in advanced manufacturing and microelectronics integration critical to next-generation defense systems.

Subawards

Subcontractor Amount Awarded
Micross Advanced Interconnect Technology LLC MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D) Fabrication, Layout, and debonding Of 100mm Si Wafers With Cu $438,888
Global Communication Semiconductors LLC MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D) Global Communication Semi LLC will be providing Wafers with… $251,260
University Of Maryland, College Park MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D) The following objectives will be addressed by the University… $846,000
The Leland Stanford Junior University MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D) Improve the performance of the microchannel embedded cooling… $550,000
Purdue University MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D) Determine reliable architectures for thermal management of… $402,744
Micross Advanced Interconnect Technology LLC MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEM FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D) NRE and Lot processing of Wafers $61,072
Micross Advanced Interconnect Technology LLC MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEM FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D) Fabrication services - wafers $377,765
Micross Advanced Interconnect Technology LLC MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D) Wafer level packaging services including TSV fabrication, copper… $466,659
The Leland Stanford Junior University MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D) Fluidic Chips Proof-of-Concept $400,000
Global Communication Semiconductors LLC MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D) GaN/SiC MPW Lot $186,700
University Of Maryland, College Park MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D) Proof-of-concept Backside Cooler and Compact Heat Exchanger $626,814
Purdue University MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D) Thermomechanical Modeling for Baseline Architecture $286,726
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Quick answers

Who was awarded contract HR001124C0305?

HR001124C0305 was awarded to HRL Laboratories, LLC by Defense Advanced Research Projects Agency (Department of Defense) on November 9, 2023.

How much is contract HR001124C0305 worth?

The government has obligated $14,530,450 on HR001124C0305. Its current value, with exercised options, is $15,216,059.

Was contract HR001124C0305 competed?

The extent of competition for HR001124C0305 was full and open competition. The government received 11 offers.

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