The MINITHERMS3D program seeks to significantly reduce thermal resistances within the 3D stack and external to the stack of 3DHI systems, while increasing volumetric heat removal.
Active Definitive Contract Awarded Last action
- Contract number
- HR001124C0307
- Awardee
-
Teledyne Scientific & Imaging, LLC UEI WQKMXY9FRUC5 Part of Teledyne Technologies Incorporated
- Awarding agency
-
Defense Advanced Research Projects Agency
Department of Defense
- Obligated
- $14,639,502
Award facts
- Opportunity
-
- Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D) Pre-Solicitation · HR001123S0019 · Posted Jan 23, 2023
- Contract value 86% obligated
-
- $17,041,613.00 Current, with exercised options
- $17,041,613.02 Potential, with all options
- Completion date 71% complete
- Current and potential, with all options
- Contracting staff
- NAICS code
- 541715 Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
- Set-aside
- No set-aside
- Competition
- Full and Open Competition · 11 offers Basic Research
- Pricing
- Cost Plus Fixed Fee
- Place of performance
- Thousand Oaks, CA 91360, USA
- Legislative mandates
-
- Employment Eligibility Verification (E-Verify) FAR subpart 22.18
Award details come from SAM.gov/FPDS.
Transactions
| Action | Obligated | Date |
|---|---|---|
| Other Administrative Action | $0 | |
| Funding Only Action | $599,000 | |
| Funding Only Action | $3,486,936 | |
| Funding Only Action | $2,832,054 | |
| Supplemental Agreement for work within scope | $519,428 | |
| Supplemental Agreement for work within scope | $600,000 | |
| Other Administrative Action | $0 | |
| Funding Only Action | $853,067 | |
| Funding Only Action | $1,758,637 | |
| Funding Only Action | $649,118 | |
| Original award | $3,341,262 |
Show all 11
About this award
The Defense Advanced Research Projects Agency awarded a $17.04 million definitive contract to Teledyne Scientific & Imaging, LLC for the MINITHERMS3D program on November 9, 2023, under cost-plus-fixed-fee pricing with no set-aside used.
The program seeks to significantly reduce thermal resistances within three-dimensional heterogeneous integration (3DHI) stacks and externally to the stack while increasing volumetric heat removal. Work is performed in Thousand Oaks, California. The contract ceiling is $17,041,613.02 with an ultimate completion date of January 29, 2028.
Teledyne Scientific & Imaging subcontracted to Micross Advanced Interconnect Technology LLC for silicon through-silicon via (TSV) processing development and to Kyocera International Inc. for post-process assembly of 3DHI tile stacks to printed circuit board using solder ball bonding. The originating solicitation was posted January 23, 2023, with a due date of April 11, 2023, as a pre-solicitation opportunity with no set-aside used.
Subawards
| Subcontractor | Amount | Awarded |
|---|---|---|
| Kyocera International Inc. | $33,000 | |
| Micross Advanced Interconnect Technology LLC | $292,460 |
Quick answers
Who was awarded contract HR001124C0307?
HR001124C0307 was awarded to Teledyne Scientific & Imaging, LLC by Defense Advanced Research Projects Agency (Department of Defense) on November 9, 2023.
How much is contract HR001124C0307 worth?
The government has obligated $14,639,502 on HR001124C0307. Its current value, with exercised options, is $17,041,613. Its potential value, with all options, is $17,041,613.
Was contract HR001124C0307 competed?
The extent of competition for HR001124C0307 was full and open competition. The government received 11 offers.
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