DARPA_MiniTherms_-_SNL.pdf

Sandia National Laboratories is a multimission laboratory managed and operated by National Technology and Engineering Solutions of Sandia, LLC., a wholly owned subsidiary of Honeywell International, Inc., for the U.S. Department of Energy's National Nuclear Security Administration under contract DE-NA-0003525.

E x c e p t i o n a l s e r v i c e i n t h e n a t i o n a l i n t e r e s t

OVERVIEW OF SANDIA NATIONAL

LABORATORIES’ MICROFABRICATION

CAPABILITIES

Spalding Craft, R&D Manager

Sandia National Laboratories

January 27, 2023

Many thanks to Scott List, Erica Douglas, Gary Patrizi and Drew Hollowell !

SAND2022—12989 C

UNCLASSIFIED UNLIMITED RELEASE

2LOW VOLUME, HIGH MIX R&D AND HIGH RELIABILITY PRODUCTION AT SANDIA

• Mission

• MESA Complex and Technologies

• Heterogeneous Integration (HI) Capabilities

• Packaging Capabilities

• Current and Future Partnerships

• Summary

Outline:

SANDIA IS A FEDERALLY FUNDED

RESEARCH AND DEVELOPMENT CENTER

(FFRDC) MANAGED AND OPERATED BY

National Technology & Engineering Solutions of Sandia, LLC, a wholly owned subsidiary of Honeywell International Inc.

Government owned, contractor operated

FFRDCs are long-term strategic partners to the federal government, operating in the public interest with objectivity and independence and maintaining core competencies in missions of national significance

Providing what industry cannot, will not or should not do.

UNCLASSIFIED UNLIMITED RELEASE

Presenter Notes Presentation Notes

4SANDIA’S FIVE MAJOR PROGRAM PORTFOLIOS

A BROAD RANGE OF GOVERNMENT AND OTHER WORK, MUCH OF WHICH IS CLASSIFIED

• Weapon Component and System Surveillance and Assessment

• Radiation Effects and High Energy Density Physics

• Materials Science & Engineering, and Advanced Manufacturing

• Engineering Sciences and Testing

• Physical and Biological Sciences and Engineering

• Codes, Models, Data Analytics

• Advanced Experimental Diagnostics and Sensors

• Agile Component and System Surveillance and Assessment

• High Performance Computing

• Cyber and Intelligence Science

• Synergistic Global Security Engineering

• Microsystems R&D and Manufacturing

CAPABILITIES FROM OUR NUCLEAR

WEAPONS PROGRAM HELP US SOLVE

COMPLEX NATIONAL SECURITY PROBLEMS:

MICROSYSTEMS AND ENGINEERING SCIENCES APPLICATIONS (MESA)

• Advanced Computation

• Modeling & Simulation

• COTS Qualification

• Advanced Packaging

• Custom Electronic Components

• System Design & Test

Modeling, Simulation & Systems Integration

• Trusted Digital, Analog, Mixed Signal & RF Integrated Circuits Design & Fabrication

• Custom IC Design

- Secure microcontrollers

- Analog/Digital/RF

- Tamper Resistant

• Micromachining

• RAD Effects and Assurance

• Failure Analysis, Reliability

Physics

• Test & Validation

• 3-D Integration Features

Silicon Fabrication

• Compound Semiconductor Epitaxial Growth

• Photonics, Optoelectronics

• MEMS, VCSELs

• Specialized Sensors

• Materials Science

• Nanotechnology, Chem/Bio

• Mixed-Technology

Integration & Processing

• III-V Semiconductor Devices

- Neutron-Immune HBT

- Rad-hard Optical Links

- Solid-State RF Devices

Compound Semiconductor Fabrication

Materials Research

400,000 Sq-ft Complex with >650 Employees (65,000 Sq-ft cleanroom)

MESA bridges science to systems, providing an environment where multidisciplinary teams create microsystems-enabled solutions to our nation’s most challenging problems.

HETEROGENEOUS INTEGRATION AT SANDIA NATIONAL LABORATORIES

Materials Si-to-Si

Si-to-GaAs Si-to-InP

InP- LiNbO3

Bonding Techniques Direct Bond

Oxide-to-Oxide Eutectic In-to-In Cu/Au

Cu Pillar Au Stud Bumps

Au-Au, Au-Pd Thermocompression Solder Jetting

Technologies Photonics Imaging

Quantum Communication

Sandia’s role in HI as an FFRDC is to bring together multiple materials and external/internal technologies to achieve high performance, trusted, rad-hard solutions.

MESA has suite of HI tools for co-located R&D & production

REPRESENTATIVE MESA HI CAPABILITIES

Bonding

• Wafer-to wafer DBI

• Die-to-wafer DBI

• Bump Bonding

• Oxide bonding

• Thermo-compression bonding

• Vacuum reflow

• Epoxy underfill and cure

Planarization

• Chemical Mechanical Polish of Silicon

Oxide and metal Micron scale mechanical milling for bulk removal

• Wet chemical thinning

Metallization

• Thermal Evaporation for complex metal stacks

• Sputter deposition for stoichiometric and novel metal films

• Plating for Through Silicon Via, Direct Bond Interconnect, bump bonding

• Indium Plating

Metrology

• Atomic Force Microscopy

• Confocal Scanning Acoustic Microscope

• 3D contour mapping

• Infrared inspection

• Scanning Electron Microscopy

• Energy Dispersive X-ray Spectroscopy

• Focused Ion Beam-SEM cross-sectioning

• Automated on-wafer test up to 300mm

Etch

• Deep-Si etch

• Bosch etch

• XeF2

• Atomic Layer Etch

• Metal etch

Thin Films

• Oxide & Nitride deposition (PECVD and Thermal)

• Atomic Layer Deposition

Singulation

• Wafer Dicing

• IR wafer alignment for meeting front-side trench

• Wafer Coring

• Pick-and-place

Solder Jetting

• C4 solder jetting

HETEROGENEOUS INTEGRATION FOR NATIONAL SECURITY

Optical Data Communications Heterogeneous III-V/CMOS Microelectronics

IR Imagers Optical and MEMS-based Microsensors

• complementary integration of GaAs and InP microelectronics

• III-V microelectronics circuitry on CMOS ASICs integration substrate (CMOS, AlN, etc.)

underfill

III-V chiplet

100 µm

III

-V m es as

TaN resistor metal 1 m et al ca rr ie r m et al

• GaAs- and InP-based VCSELs, modulators, photodiodes

• dense integration onto 32-nm and 45-nm CMOS

• GaSb-based MWIR/LWIR detector arrays for large-format FPAs

• 10µm indium bump bonding, underfill, thinning, AR coating

• hybridization to silicon ROICs with >99.99% interconnect yield

• chemical and bio sensors using MEMS and SAW devices

• g-hard optical microsensors with in-house photonics

• hybrid device integration with custom micro-optics

OFFICIAL UUNCLASSIFIED UNLIMITED RELEASE

SE ONLY

SNL MESA production capabilities

“When industry can’t, won’t, or shouldn’t”

• Si Electronics

• III-V Electronics

• III-V Optoelectronics

• MEMS

• FPA/ Sensors

• Heterogeneous Integration capabilities

• Si Photonics (potential in future)

• Quantum (potential in future)

SNL MESA HI ENABLES CURRENT & FUTURE APPLICATIONS

HI will enable future National Security needs through tight integration of commercial technologies with MESA’s trusted and rad-hard technologies

Enabling Expertise:

• Heterogeneous Integration

• Deep subject matter expertise (SME) in diverse range of technologies

• CMOS, III-Vs, RF Microsystems, MEMS, Si photonics, FPAs/Sensors, Quantum, HI technologies

• Modeling & Simulation

• Materials Characterization

• Processing and integration

• Assembly

External Supplier Production capabilities

• State of the Art CMOS

• Commercial foundries (CMOS, III-V,…)

• Assembly

• Heterogeneous integration capabilities

• KCNSC system integration

NNSA Products and Applications

SNL MESA Design and prototyping

OFFICIAL UUNCLASSIFIED UNLIMITED RELEASE

SE ONLY

SANDIA’S COLLABORATIONS

• Sandia currently has many industrial partnerships in the RF, CMOS, HI, system integration and packaging spaces to meet its current and future mission needs.

• Sandia works closely with KCNSC to integrate our components into robust systems.

• Our partnerships generally require:

• trusted / DMEA facilities

• low volume / high reliability processing capabilities

• long term stability / commitments (10-30 years).

• In the near term, Sandia anticipates a growing need for partnerships to meet increasingly demanding system requirements.

• Sandia is also actively participating in collaborations involving future CHIPS+ funding.

• Sandia provides what industry cannot, will not or should not do.UNCLASSIFIED UNLIMITED RELEASE

SUMMARY

• Sandia’s extensive technology portfolio, co-located R&D with production, as well as national security mission has provided unique capabilities for tackling unique HI applications.

• Sandia’s role is to integrate multiple materials and external/internal technologies to achieve high performance, trusted, reliable, rad-hard solutions.

• Sandia developed low volume internal packaging capabilities to ensure long term access to trusted packaging.

• Sandia partners with industry whenever possible and anticipates a large increase in partnerships for both SOTA chips and HI capabilities in the near future.

• Please contact me directly if you have interests in partnering in this unique product space- hscraft@sandia.gov.