Eden_and_Fab_Slides_Minitherms3d.pdf

This presentation includes research developed with funding from the Defense Advanced Research Projects Agency (DARPA) (as well as other agencies of the US Government)

The views, opinions and/or findings expressed are those of the author and should not be interpreted as representing the official views or policies of the Department of Defense or the U.S. Government

Distribution Statement A – Approved for Public Release, Distribution Unlimited

Distribution Statement A – Approved for Public Release Distribution Unlimited

The success of the original DARPA-MTO Diamond 3-D MCM program led another US Government agency to fund a follow-on effort to fly a Diamond 3-D packaged Cray Supercomputer on an operational military aircraft. The following charts are of flight hardware from that 3-D Diamond Cube Supercomputer demonstration.

These charts were furnished by the prime contractor for this effort, E-Systems Garland Division. (Toward the end of the program, in April 1995, E-Systems was purchased by Raytheon.)

Cray Research supplied the supercomputer design and chipset.

Norton Diamond Film supplied the high-k diamond substrates.

Texas Instruments made the 2-sided thru-via diamond-substrate copper-polyimide MCM’s (multi-chip modules).

Isothermal Systems Research supplied the Fluorinert spray cooling technology and hardware.

Distribution Statement A –

Approved for Public Release, Distribution

Unlimited

2-D thermal simulation of diamond substrate MCM by Richard C. Eden

Statement A – Approved for

Public Release, Unlimited

Statement A – Approved for Public Release, Distribution Unlimited 40

• Fabrication could be done using the Global Foundries (GF) 12LP 12nm FinFET process. This is technology transitioned from the 14LPP flow

• The Defense Microelectronics Activity in Sacramento, California manages the fabrication access thru their Trusted Access Program Office (TAPO):

• https://www.dmea.osd.mil/

• There are multiple technologies available for use thru TAPO. These are described on the TAPO link in the far right on the page banner

• TAPO is the government funded entity to facilitate access to technology nodes for use in research and as well as production

• Two things to be aware of:

• Pricing for a potential proposal is coordinated directly thru TAPO

• There is a calendar of available technologies today, but more GF technologies can be requested

Fabrication Introduction

Distribution Statement A – Approved for Public Release, Distribution Unlimited 41

Tapeouts in GF12 or Others

Sign up for DMEA Access You will need to get a PKI certificate for access You can sign up at:

https://www.dmea.osd.mil/TAPOCreateAccount.aspx?area=T APO%20Create%20Account

This page will explain how to get a PKI and then register

Get a PKI Certificate (example) Go to either IdenTrust or ORC For IdenTrust:

https://www.identrust.com/certificates-portfolio Select the ECA for DoD applications. Scroll down and select the DoD

DMEA, and click next.

Most other items will be default. Select ECA MEDIUM TOKEN ASSURANCE.

Select how many years it will be valid.

New PKIs will need to be installed onto either a SmartCard or USB Token.

Go through steps to get verified and purchase.

For ORC:

https://eca.orc.com/token-identity-encryption-certificates/ Proceed to Step 1 to read the requirements

For questions, please contact:

Saverio Fazzari Saverio.Fazzari.ctr@darpa.mil

Other Information For the mission impact statement: work is fundamental research

This is not a DoD end use program

Please list the PM as the government sponsor

Sign up for the 23 RR1 run and get a Customer Request Form (CRF) number sent to Saverio Fazzari https://www.dmea.osd.mil/TAPOCreateAccount.aspx?area=TAPO%20Create%20Account https://www.identrust.com/certificates-portfolio https://eca.orc.com/token-identity-encryption-certificates/ mailto:Saverio.Fazzari.ctr@darpa.mil