PSC 3670: Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery

Product code

Code facts

Spend category
Industrial Products & Services Machinery & Components
Contract awards
8 In the last 12 months
Contract obligations
$9,411,367 In FY2025

PSC codes and definitions come from the GSA PSC Manual and contract spending from SAM.gov/FPDS.

Contract obligations by fiscal year

Fiscal year Obligated
FY2027 To date $0
FY2026 $2,490,342
FY2025 $9,411,367
FY2024 $13,353,720
FY2023 $15,684,743

Top contractors by obligations

Rank Contractor Obligated, FY2026–FY2027 Share
1 Dynetics, Inc. $1,791,802
2 Elgin Power Solutions, Inc. $247,780
3 TTM Technologies, Inc. $231,255
4 Aim Electronics Distributors Inc. $56,917
5 Frontgrade Technologies Inc. $50,225
6 Rpmc Lasers Inc. $35,556
7 Veeco Process Equipment Inc. $29,511
8 X-Microwave, LLC $17,120
9 Stryker Sales, LLC $16,007
10 Integrated Process Systems Inc. $8,500

Top funding agencies by obligations

Rank Agency Obligated, FY2026–FY2027 Share
1 Air Force Department of Defense $1,800,302
2 Department of the Navy Department of Defense $296,322
3 National Aeronautics and Space Administration $247,780
4 Department of Transportation $107,142
5 Smithsonian Institution $17,120
6 Department of Veterans Affairs $16,007
7 Department of the Army Department of Defense $5,670

Contract obligations by state

Rank Place of performance Obligated, last 12 months Share
1 Florida $1,791,802
2 West Virginia $247,780
3 New Jersey $56,917
4 New Hampshire $50,225
5 Missouri $35,556
6 Minnesota $29,511
7 Texas $17,120
8 Michigan $16,007
9 Georgia $8,500
10 Indiana $5,670

Contract opportunities

Notice Posted Due
Custom Manual Operation Polypropylene Wet Benches Pre-Solicitation · Naval Air Warfare Center (NAVAIR)
DMEA Ball Bonder Boat workholder (26-6F0) Solicitation · Defense Microelectronics Activity
PC Board Milling Machine Solicitation · Air Education and Training Command (USAF)
Altera Development Kits Solicitation · Naval Air Warfare Center (NAVAIR)
NOTICE OF INTENT TO SOLE SOURCE one (1) vacuum reflow oven manufactured by Cook & Weil Solicitation · ACC Aberdeen Proving Ground
Printed Circuit Boards (PCB) Milling System Pre-Solicitation · Air Education and Training Command (USAF)
REQUEST FOR QUOTE (RFQ) 479034: Deep Underground Neutrino Experiment (DUNE) Far Detector in Horizontal Drift Technology (FD-HD) Printed Circuit Board (PCB) Assembly Solicitation · Office of Science
Veeco Molecular Beam Epitaxy (MBE) System Special Notice · Office of Naval Research (SECNAV)
Lpkf S104 PCB milling machine Pre-Solicitation · MICC Fort Eustis
MK55 Printed Wiring Board, Display 8566364, and Printed Wiring Board, Load Test 8566366 Solicitation · Naval Sea Systems Command (Navy)
Silicon and Silicon/Germanium Epitaxial Wafers Solicitation · National Institute of Standards and Technology
Tystar MiniTytan 4600 Furnace Service Contract Special Notice · National Institute of Standards and Technology
PCB Fabrication - 15 boards with assemblies labor and components. Solicitation · Office of Naval Research (SECNAV)
Refurbishment of ADDON effusion cell Special Notice · Office of Naval Research (SECNAV)
474299: DUNE FD-VD CRP Patch Panel IO-1889-1B PCB Assembly-Request for Quote (RFQ) Solicitation · Office of Science
1 EACH RPMC Brand WEDGE HF 532nm PLUS LASER And ACCESSORIES-- Total Small Business Set Aside--See All Attachments Solicitation · Naval Sea Systems Command (Navy)
474299 Sources Sought: DUNE FD-VD CRP Patch Panel IO-1889-1B PCB Assembly Pre-Solicitation · Office of Science
High-Speed Automatic Aluminum Fine Wire Wedge Wire Bonder Solicitation · Office of Science
Inductively Coupled Plasma Deep Reactive Ion Etch Award Notice · Office of Naval Research (SECNAV) —
Photolithography Exposure System Award Notice · Defense Health Agency · HT942525PE042 —
467862 DUNE PCB Assembly Service Pre-Solicitation · Office of Science
Photoresist Direct Write Lithography System Award Notice · Office of Naval Research (SECNAV) · N0017325Q0006 —
Circuit Card Assemblies Pre-Solicitation · Naval Air Warfare Center (NAVAIR)
Photolithography Exposure System Solicitation · Defense Health Agency · HT942525QE028
3670--Stryker Neptune Printed Circuit Board Assembly Notice of Intent to Sole Source Solicitation · Veterans Integrated Service Network 21 (VHA) · 36C26125Q0771
3670--Stryker Neptune Printed Circuit Board Assembly Notice of Intent to Sole Source Pre-Solicitation · Veterans Integrated Service Network 21 (VHA) · 36C26125Q0771
Gate arrays Limited / Sole Source Justification · Naval Sea Systems Command (Navy) · N0016425Q0757 —
Gate arrays Solicitation · Naval Sea Systems Command (Navy) · N0016425Q0757
Notice of Intent to Sole Source to Alpha Data Special Notice · Naval Information Warfare Systems Command (Navy)
Notice of Intent to Sole Source – Deep Reactive Ion Etch (ICP-DRIE) Tool Special Notice · Office of Naval Research (SECNAV)
Mask Aligner for Photolithography Solicitation · Defense Health Agency
Photoresist Direct Write Lithography System Solicitation · Office of Naval Research (SECNAV) · N0017325Q0006
25-SIMACQ-D30-0005 PCI Card RS422 Award Notice · Naval Sea Systems Command (Navy) · N6339425P0022 —
Thin-Film Lithium Niobate (TFLN) Photonic Chips Solicitation · National Institute of Standards and Technology · AMD-RFQ-25-7700689
Thin-Film Lithium Niobate (TFLN) Photonic Chips Solicitation · National Institute of Standards and Technology · NIST-RFQ-25-7700689
25-SIMACQ-D30-0005 PCI Card RS422 Solicitation · Naval Sea Systems Command (Navy) · N6339425Q0008
MK77 MOD1 Cable Assemblies & Phenolic Spacers Solicitation · Naval Sea Systems Command (Navy)
Wafer Grinder and CMP Tools Solicitation · Office of Naval Research (SECNAV) · N0017325QMB04
Wafer Grinder and CMP Tools Pre-Solicitation · Office of Naval Research (SECNAV) · N0017325RFIMB08
Electrical Connectors Solicitation · Shared Services Center
Notice of Intent to Singe Source: VS-ALS SIE Interface Electronics Assembly Special Notice · Franchise Acquisition Servies (FAA)
TPT Semi-Automatic Thermosonic Wire Bonder Package Special Notice · Office of Naval Research (SECNAV)
Notice of Intent to Sole Source Custom Sensor with Custom Filters Special Notice · Office of Naval Research (SECNAV)
Purchase of turn-key master controller circuit boa Award Notice · National Oceanic and Atmospheric Administration —
SUSS LP50 PCB Printer Solicitation · MICC Fort Drum
Circuit Board Router Special Notice · Engineer Research and Development Center (USACE)
Keyence Digital Microscope VHX-X1 Special Notice · Shared Services Center
Foundry Fabrication - Integrated Circuits - Combined Synopsis/Solicitation Solicitation · National Institute of Standards and Technology
Purchase of controller circuit boards Solicitation · National Oceanic and Atmospheric Administration
RFQ_NGIC FY24 Computerized Mat Cutter_NACIS _334118 or 333515 Solicitation · Department of the Army
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Definition

Includes: Substrate Preparation Equipment; Circuit Pattern Forming Equipment; Interconnecting and Packaging Equipment.

Excludes: Assembly Machines for Mounting Discrete Components on Printed Wiring Boards. This class includes, and is restricted to, equipment specifically designed for manufacturing semiconductor devices (FSC 5961), microcircuits (FSC 5962), and printed circuit boards (FSC 5998).

Excludes: items for which more suitable classes are specifically prescribed by the indexes and structure of the FSC.

Quick answers

What is PSC 3670?

PSC 3670 is Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery, a product code in PSC 36, Special Industry Machinery.

How much do federal agencies spend under PSC 3670?

Federal contracts under PSC 3670 obligated $9,411,367 in fiscal year 2025 and $40,940,173 in fiscal years 2023 through 2027.

Who are the largest contractors under PSC 3670?

The contractors with the most obligated under PSC 3670 in fiscal years 2026 and 2027 are Dynetics, Inc. ($1,791,802); Elgin Power Solutions, Inc. ($247,780); and TTM Technologies, Inc. ($231,255).

Which agencies buy the most under PSC 3670?

The agencies that obligated the most under PSC 3670 in fiscal years 2026 and 2027 are Air Force ($1,800,302), Department of the Navy ($296,322) and National Aeronautics and Space Administration ($247,780).

Which NAICS codes are used with PSC 3670?

The NAICS codes with the most obligated under PSC 3670 in fiscal years 2026 and 2027 are 541715 Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology); 334418 Printed Circuit Assembly (Electronic Assembly) Manufacturing; and 335311 Power, Distribution, and Specialty Transformer Manufacturing.

Where is the work under PSC 3670 performed?

By place of performance, the states with the most contract obligations under PSC 3670 over the last 12 months are Florida ($1,791,802), West Virginia ($247,780) and New Jersey ($56,917).

What is the latest contract opportunity under PSC 3670?

The latest contract opportunity under PSC 3670 is Custom Manual Operation Polypropylene Wet Benches, pre-solicitation from Naval Air Warfare Center (NAVAIR), posted October 14, 2026.

On GovTribe

See everything under PSC 3670

  • Federal contract opportunities, awards and IDVs under this code
  • Funding analysis by contractor, agency and set-aside
  • Contacts who buy under this code
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