Cook And Weil, Inc.
Marlboro Township, NJ
- UEI
- GJMEHZQFN2D9
- CAGE
- 0DW10
- Primary NAICS
- 334413 Semiconductor and Related Device Manufacturing
- SAM.gov registration
- Active through
Company facts
- FY2025 rankings
- Self-certified in SAM.gov
- Entity structure
- Corporate Entity (Not Tax Exempt)
- Other NAICS codes in SAM.gov
- SAM.gov registration date
- Physical address
- 704 Ginesi Dr #11, Morganville, NJ 07751, USA
- Website
- cwitechsales.com
- Founded
- 1971
- Employees
- 1-10
- Estimated annual revenue
- $0-$1M
- Industry
-
- Industrials
- Capital Goods
- Electrical Equipment
- SIC code
- 50 Wholesale Trade – Durable Goods
Registration and certifications come from SAM.gov and the SBA; company details from public web sources. Updated .
Contract obligations by fiscal year
| Fiscal year | Obligated |
|---|---|
| FY2027 To date | $0 |
| FY2026 | $40,470 |
| FY2025 | $193,598 |
| FY2024 | $59,595 |
| FY2023 | $115,735 |
Top agencies by obligations
| Rank | Agency | Obligated, FY2026–FY2027 | Share |
|---|---|---|---|
| 1 | Department of Commerce | $40,470 |
Contract awards
| Award | Agency | Obligated | Awarded |
|---|---|---|---|
| Wire bonder | National Institute of Standards and Technology | $40,470 | |
| OU68-25-new-255 | National Institute of Standards and Technology | $46,000 | |
| TPT semi-automatic heavy wire bonder | Shared Services Center | $68,845 | |
| Silicon wafer ball bonder | Shared Services Center | $30,793 | |
| TPT semi-automatic thermosonic wire bonder package | Office of Naval Research (SECNAV) | $47,960 |
Latest 5 listed here. See the rest on GovTribe.
Contract subawards
| Prime contractor | Prime award | Amount | Awarded |
|---|---|---|---|
| KBR Wyle Services, LLC | N0017322C6002 | $47,960 |
Similar vendors
| Vendor | Location | Primary NAICS |
|---|---|---|
| Hesse Mechatronics, Inc. | Irvine, CA | 333242 Semiconductor Machinery Manufacturing |
| West Bond, Inc. | Anaheim, CA | 333998 All Other Miscellaneous General Purpose Machinery Manufacturing |
| Suss Microtec Inc. | Corona, CA | 333242 Semiconductor Machinery Manufacturing |
| Manncorp Inc. | Hatboro, PA | 334418 Printed Circuit Assembly (Electronic Assembly) Manufacturing |
| MPI America Inc. | San Jose, CA | 334413 Semiconductor and Related Device Manufacturing |
About the company
Cook And Weil, Inc., doing business as Cook & Weil Inc., is a small-business manufacturers' representative that supplies specialized semiconductor and electronics manufacturing equipment to federal agencies as a prime contractor on purchase orders, with negligible subcontract footprint. The firm, based in Morganville, New Jersey, operates without SBA set-aside certifications and competes predominantly in the full-and-open market. Cook & Weil specializes in wire bonding systems — manual and semi-automatic thermosonic bonders, ball bonders, heavy-wire bonders, and wedge bonders — and related test and measurement instruments for semiconductor fabrication and research, procured under NAICS 333242 (Semiconductor Machinery Manufacturing) and related PSC codes for laboratory and test equipment.
The vendor's customer base spans research and defense agencies, with concentration in the Department of the Navy (7 awards, $340 thousand combined potential value), the National Institute of Standards and Technology (5 awards, $192 thousand combined potential value), and the National Aeronautics and Space Administration Shared Services Center (3 awards, $128 thousand combined potential value). These top five customers account for 70% of recent awards, but the potential-value ranking surfaces a $410 thousand single award from the Department of the Navy's Naval Sea Systems Command that anchors dollar concentration differently than volume. Cook & Weil has served twelve distinct customer agencies across recent activity — Navy, NIST, NASA, Army Research Development and Engineering Command, Office of Naval Research — indicating broad but shallow agency penetration.
Recent representative work includes a $46 thousand small-business set-aside purchase order from NIST (September 2025) for a manual wedge/ball wire bonder system supporting the Quantum Measurement Division's single-photon device development; a $68.8 thousand full-and-open purchase order from NASA Shared Services Center (August 2025) for a TPT semi-automatic heavy wire bonder placed in Cleveland, Ohio; and a $59.6 thousand total small-business set-aside from the Office of Naval Research (September 2024) for a semi-automatic thermosonic wire bond system with microscope and heater stage. A $115.7 thousand Army Research Development and Engineering Command award (August 2023) supplied one gold-wire ball bonder and one heavy-wire bonder, both equipped with pull testers and manual or semi-automatic control options.
Activity has been sparse and irregular — one award in 2022, one in 2023, three in 2024, three in 2025, and one in 2026 — with combined potential value of $1.6 million across all awards since the source window opened. The recompete cliff is minimal: one award (combined potential value $40 thousand) reaches ultimate completion within the next twenty-four months. Cook & Weil has placed one subcontract under KBR Wyle Services, LLC (Defense Department incremental funding, $463.9 thousand, August 2024) and operates primarily as a direct vendor to end-user agencies rather than as a subcontractor within large prime teams. The vendor's award history spans three decades (first award 1995), indicating a long tail of small, infrequent, specialized equipment purchases rather than sustained contract vehicles or recurring task-order work.
Quick answers
Is Cook And Weil, Inc. registered in SAM.gov?
Yes. Cook And Weil, Inc.'s SAM.gov registration is active through January 6, 2027.
How much has Cook And Weil, Inc. received in federal contracts?
Federal contracts obligated $193,598 to Cook And Weil, Inc. in fiscal year 2025 and $409,398 in fiscal years 2023 through 2027.
How does Cook And Weil, Inc. rank among federal contractors?
Cook And Weil, Inc. ranked #12 in NAICS 333242 in FY2025.
What is Cook And Weil, Inc.'s most recent federal award?
Cook And Weil, Inc.'s most recent federal contract award is Wire bonder (1333ND26PNB680428), from National Institute of Standards and Technology, on September 3, 2026.
On GovTribe
See Cook And Weil, Inc.'s full federal record
- Federal contract awards
- Subcontracting relationships
- Funding analysis by agency, NAICS and set-aside
- Similar vendors