HBr-Cl-based ICP Silicon Etch System and DRIE-based ICP Silicon Etch System

Awarded Award Notice Posted

Solicitation number
NB680000-23-00677
Agency
National Institute of Standards and Technology Department of Commerce
Awarded
to Plasma-Therm LLC
Set-aside
No set-aside

Opportunity facts

Contract number
1333ND23PNB680350 Federal contract award
NAICS code
333242 Semiconductor Machinery Manufacturing
PSC
3424 Metal Heat Treating And Non-Thermal Treating Equipment
Place of performance
Gaithersburg, Maryland 20899, United States

Notice details come from SAM.gov. Updated .

About this opportunity

This Award Notice from the Department of Commerce National Institute of Standards and Technology announces a non-competitive contract awarded to Plasma-Therm LLC for the purchase of one HBr-Cl-based inductively coupled plasma silicon etch system and one deep reactive ion etching-based inductively coupled plasma silicon etch system with four-year warranties, for a total estimated value of $1,411,586. The justification document approved the sole source procurement from Plasma-Therm LLC for the specialized equipment required by NIST.

Notice text

Award notice per FAR 5.301. Redacted justfication attached per FAR 6.305

Awarded contract 1333ND23PNB680350 to PLASMA-THERM LLC for 1411586.00 on 2023-08-09.

Attachments

Files attached to this notice, newest first
File Type Posted
JOFOC 23-00677_Redacted.pdf PDF

Notice history

Notices posted for this opportunity, newest first
Notice Type Posted
NOTICE OF INTENT TO SOLE SOURCE: RIE05-Electrical Static Chuck Based Deep Reactive Ion Etching System Latest Award Notice
HBr-Cl-based ICP Silicon Etch System and DRIE-based ICP Silicon Etch System Limited / Sole Source Justification
HBr-Cl-based ICP Silicon Etch System and DRIE-based ICP Silicon Etch System This notice Award Notice
NOTICE OF INTENT TO SOLE SOURCE: RIE05-Electrical Static Chuck Based Deep Reactive Ion Etching System Latest special notice Special Notice
NOTICE OF INTENT TO SOLE SOURCE: Plasma-Therm LLC HBr-Cl-based ICP Silicon Etch System and DRIE-based ICP Silicon Etch System Special Notice
Inductively Coupled Plasma Reactive Ion Etcher for Etching Silicon with Hydrogen Bromide and Chlorine Original Pre-Solicitation

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