Attachment_4_-_Government_Furnished_Equipment_Rev_01.pdf
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Attachment 4 - Government Furnished Equipment Rev 01
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Attachment 4 - Government Furnished Equipment Rev 01
Enclosure 4 1
Part Number Description Quantity Due Date 8210807-1 MK54 LWT Array Nose Assembly (ANA) 1 50 DAC 7315811 MK54 LWT Transmitter 1 50 DAC 8210992-101 MK54 MOD 0 Processor Group Assembly (PGA) 1 50 DAC 8325634-200 MK54 MOD 0 Control Group Assembly (CGA) 1 50 DAC
8290962-100 MK54 LWT IMU 1 50 DAC
8325557-1 MK54 MOD 0 W4 Cable 1 50 DAC
8325479-1 MK54 LWT CIC 1 50 DAC
2847086 MK103 Inert Warhead 1 50 DAC 7085257 MK54 LWT Warshot Fuel Tank 1 50 DAC 8226481-1 AutoLITS 2 5 MAC 8226481-1 AutoLITS 1 10 MAC 8226481-1 AutoLITS 1 12 MAC
Pressure Switch Kit1 9 50 DAC
Pressure Switch Kit1 TBD2 22 MAC/MAOE
Note 1 - Pressure Switch Kit contains a Coupling (PN 2048499-2) and Pressure Switch (PN 2539095) Note 2 - Quantity will be equal to quantity of kits procured under CLINs 0003 (AND IF OPTIONS EXERCISED) 0103, 0203, 0303 and 0403
Attachment 4 - Government Furnished Equipment Rev 01
Enclosure 4 2
Commercial Part Number Item Description Manufactuer Part Number Quantity PPCFA Data Processor Components
C-IC0000319-C02
KWK-IC0000319-C02
IC,SYNCBURSTSRAM,128Kx36,222
MHZ IND,T
IS61LPS12836A-200TQLI
IS61LPS12836A-200TQLI TDB1
C-TFM000042-001 LF-TFM,H0022NL,0C/+70C H0022NL(T) TDB1
C-IC0000068-C01
IC,FDC37C935/932,REV-
J,PQFP,0C/+70C
FDC37C935-QS
FDC37C932-QS
FDC37C932-QFP
TDB1
C-IC0000068-C02
IC,FDC37C935/932,REV-
J,PQFP,0C/+70C FDC37C932-QFP TDB1
C-IC0001177-I01 IC,GD82551IT,PBGA,-40C/+85C
GD82551IT S L77C
GD82551IT S L77D TDB1
C-IC0000074-C01 IC,W83C553F,PQFP,0C/+70C
W83C553F W83C553F-G
W83C553FY-G
TDB1
C-IC0000281-C01 IC,GAL22LV10-4LK,SSOP,0C/+70C ISPGAL22LV10-4LK TDB1
C-IC0000281-C02 IC,GAL22LV10-5LK,SSOP,0C/+70C ISPGAL22LV10-5LK TDB1
C-IC0002298-C01 LF-IC,5601,SOIC,0C/+70C UC5601DWP(TR)(G4) TDB1
C-IC0000208-004
IC,XPC107APX100LC,PBGA,0C/+105
C TSI107D-100JE TDB1
C-IC0000186-I04 IC,M4A5-192/96,TQFP,-40C/+85C M4A5-192/96-10VI TDB1
C-IC0000075-I01 IC,M4A3-32/32,TQFP,-40C/+85C M4A3-32/32-10VI48 TDB1
G4ADSP Signal Processor Components
C-IC0001111-001 IC,XC2S200,BGA,-40C/+100C XC2S200E-6FT256I TDB1
C-IC0001345-C02
LF-
IC,RAM,DDR1,512Mb,x16,TSOP,DD
R333 K4H511638D-UCB3/
K4H5116
TDB1
C-IC0001833-C01 LF-IC,PI6CV855L,TSSOP,0C/+70C PI6CV855LE(X) TDB1
C-IC0000925-C01 IC,EPLD,LC4256B,3,TQFP,0C/+70C LC4256B-3T176C TDB1
C-IC0001733-C03 LF-IC,MV64460-C200,BGA,0C/+70C MV64460-B1NBAY1C200 TDB1
C-IC0001213-I01 C,PROM,XC18V02,VQFP,-40C/+85C XC18V02VQ44C TDB1
C-IC0001329-I01 IC,PCI6540-CB13BI,BGA,-40C/+85C PCI6540-CB13BI TDB1
C-IC0000791-C01 IC,MPC942CFA,TQFP,0C/+70C MPC942CAC TDB1
PMCF3 Components
C-IC0001350-C01 IC,PCI6150-BB66BC,BGA,0C/+70C PCI6150-BB66BC TDB1
Note 1 - Quantity furnished will be commensurate to quantity of kits procured under CLINs 0004 (AND IF OPTIONS EXERCISED) 0104, 0204, 0304 and 0404
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