SSP50251P1.pdf

SSP 50251, Part 1

National Aeronautics and Space Administration International Space Station Program Johnson Space Center Houston, Texas Contract No. NAS15−10000

International Space Station Program

May 30, 2003

ARIS to Pressurized Element

Interface Control Document

Part 1

Revision B

Japan Aerospace Exploration Agency

SSP 50251, Part 1, Revision B May 30, 2003 ii

REVISION AND HISTORY PAGE

REV. DESCRIPTION PUB.

DATE

− Initial Baseline Release (Reference SSCD 001529, EFF 07/30/98 01/18/02

A Revision A (Reference SSCD 005507, EFF 05/09/01 04/02/03

Revision A incorporates the following approved PIRNs/IRNs with the associated SSCNs.

PIRN IRN SSCN

50251−NA−0001A N/A 005507

50251−NA−0002 N/A 005507

50251−ND−0001A N/A 005507

50251−ES−0001 N/A 005507

B Revision B (Reference SSCD 008060, EFF 08/12/03 02/09/06

Revision B incorporates the following approved PIRNs/IRNs with the associated SSCNs.

50251−NA−0003 N/A 008060

50251−NA−0004B N/A 008060

001 005508

002 005504

50251−ES−0002 N/A 008060

ERU: /s/ J. Rivas 02−09−06 iii

PREFACE

The contents of this document are intended to be consistent with tasks and products to be prepared by Program participants. The Active Rack Isolation System (ARIS) Inter-face Control Document (ICD) Part 1 shall be implemented on all new ISS contractual and internal activities and shall be included in any existing contracts through contract changes.

This ICD defines the physical and functional interfaces necessary for the installation of an ARIS configured ISPR into the United States Laboratory Module (USL), the Attached Pressurized Module (APM), and the Japanese Experiment Module (JEM). This docu-ment is under the control of the Interface Control Working Group (ICWG), and any changes or revisions will be approved by the ICWG Chairman.

iv

INTERNATIONAL SPACE STATION PROGRAM

ACTIVE RACK ISOLATION SYSTEM TO PRESSURIZED ELEMENT ICD, PART 1

MAY 30, 2003

CONCURRENCE

PREPARED BY:

SIGNATURE

PRINT NAME ORGN

DATE

CHECK BY (BOEING):

SIGNATURE

PRINT NAME ORGN

DATE

DQA:

SIGNATURE

PRINT NAME ORGN

DATE

Bonnie Johnson

Warren England

SUPERVISED BY (NASA):

SIGNATURE

PRINT NAME ORGN

DATE

Chau Hong NASA

Freddie G. Young

Muniz/OM

Boeing

Muniz

/s/ Bonnie Johnson 8/25/03

/s/ Warren England 8/25/03

/s/ Chau Hong 8/26/03

/s/ Freddie G. Young 8/26/2003

SSP 50251, Part 1, Revision B May 30, 2003 v

NASA/JAXA/ESA/ASI APPROVAL

INTERNATIONAL SPACE STATION PROGRAM

ARIS TO PRESSURIZED ELEMENT

INTERFACE REQUIREMENTS DOCUMENT PART 1

MAY 30, 2003

Date

Print Name

NASA ICWG Chair

Print Name

Date

/s/ Ralph Grau /s/ Yasushi Horikawa

Date

Print Name

ESA Rep.

/s/ Diego Dellantonio

/s/ Diego Dellantonio

5/19/00

/s/ Ralph Grau

6/27/015/19/00

/ JEM

/ Columbus

/s/ Yasushi Horikawa

JAXA Program Manager

SSP 50251, Part 1, Revision B May 30, 2003 vi

INTERNATIONAL SPACE STATION PROGRAM

INTERNATIONAL STANDARD PAYLOAD RACK TO NASA/ESA/JAXA MODULES

INTERFACE CONTROL DOCUMENT

LIST OF CHANGES

All changes to paragraphs, tables, and figures in this document are shown below:

SSCBD ENTRY DATE CHANGE PARAGRAPH(S)

005507 NA−0001A P:3.2.2.2.1C.

P:3.2.2.2.1D.

P:3.2.2.2 1E.

F:3.2.2.2.1−1−1 F:3.2.2.2.1−1−2 F:3.2.2.2.1−2−1 F:3.2.2.2.1−2−2 F:3.2.2.2.1−3−1 F:3.2.2.2.1−3−2 F:3.2.2.2.1−4−1 F:3.2.2.2.1−4−2 F:3.2.2.2.1−6−1 F:3.2.2.2.1−6−2 F:3.2.2.2.1−7 F:3.2.2.2.1−7−1 F:3.2.2.2.1−8 F:3.2.2.2.1−13 F:3.2.2.2.1−16 (add) F:3.2.2.2.1−17 (add) T:3.2.2.5.1−1

NA−0002 P:3.2.2.2.1

F:3.2.2.2.1−16 (add)

ND−0001A P:3.2.2.5.3

T:3.2.2.5.3−5

ES−0001 P:3.3

008060 NA−0003 P:3.2.2.5

P:3.2.2.5.4 008060 NA−0004B Appendix B (add)

P:B.1.0 (add) P:B.1.1 (add) P:B.1.2 (add)

SSP 50251, Part 1, Revision B May 30, 2003 vii

P:B.1.3 (add) P:B.2.0 (add)

LIST OF CHANGES (CONTINUED)

SSCBD ENTRY DATE CHANGE PARAGRAPH(S)

P:B.2.1 (add) P:B.3.0 (add) P:B.3.1 (add) P:B.3.1.1 (add) P:B.3.1.1.1 (add) P:B.3.1.1.2 (add) P:B.3.1.1.3 (add) P:B.3.1.1.4 (add) P:B.3.1.2 (add) P:B.3.1.2.1 (add) P:B.3.1.2.2 (add) P:B.3.1.2.3 (add) P:B.3.1.3 (add) P:B.3.1.3.1 (add) P:B.3.1.3.2 (add) P:B.3.1.4 (add) P:B.3.2 (add) P:B.3.2.1 (add) P:B.3.2.1.1 (add) P:B.3.2.1.1.1 (add) P:B.3.2.1.2 (add) P:B.3.2.1.3 (add) P:B.3.2.1.3.1 (add) P:B.3.2.1.3.2 (add) P:B.3.2.1.3.3 (add) P:B.3.2.1.4 (add) P:B.3.2.1.5 (add) P:B.3.2.2 (add) P:B.3.2.2.1 (add) P:B.3.2.2.2 (add) P:B.3.2.2.2.1 (add) P:B.3.2.2.2.2 (add) P:B.3.2.2.3 (add) F:B.3.2.2.2.1−1 (add)

SSP 50251, Part 1, Revision B May 30, 2003 viii

F:B.3.2.2.2.1−2 (add) F:B.3.2.2.2.1−3 (add)

LIST OF CHANGES (CONTINUED)

SSCBD ENTRY DATE CHANGE PARAGRAPH(S)

F:B.3.2.2.2.1−4 (add) F:B.3.2.2.2.1−5 (add) F:B.3.2.2.2.1−6 (add) F:B.3.2.2.2.1−7 (add) F:B.3.2.2.2.1−8 (add) F:B.3.2.2.2.1−9 (add) F:B.3.2.2.2.1−10 (add) F:B.3.2.2.2.1−11 (add) F:B.3.2.2.2.1−12 (add) F:B.3.2.2.2.1−13 (add) F:B.3.2.2.2.1−14 (add) F:B.3.2.2.2.1−15 (add) F:B.3.2.2.2.1−16 (add) F:B.3.2.2.2.1−17 (add) F:B.3.2.2.2.1−18 (add) F:B.3.2.2.2.1−19 (add) F:B.3.2.2.2.1−20 (add) F:B.3.2.2.2.1−21 (add) F:B.3.2.2.2.1−22 (add) F:B.3.2.2.2.1−23 (add) P:B.3.2.2.4 (add) P:B.3.2.2.4.1 (add) T:B.3.2.2.4.1−1 (add) F:B.3.2.2.4.1−1 (add) P:B.3.2.2.4.2 (add) P:B.3.2.2.5 (add) P:B.3.2.2.5.1 (add) P:B.3.2.2.5.2 (add) P:B.3.2.2.5.3 (add) P:B.3.2.2.6 (add) P:B.4.0 (add) T:B.4.0−1 (add)

8060 ES−0002 T:.4.0−1

ix

TABLE OF CONTENTS

PARAGRAPH PAGE

1.0 INTRODUCTION 1−1

1.1 PURPOSE AND SCOPE 1−1

1.2 PRECEDENCE 1−1

1.3 RESPONSIBILITY AND CHANGE AUTHORITY 1−1

2.0 APPLICABLE DOCUMENTS 2−1

2.1 REFERENCE DOCUMENTS 2−2

3.0 INTERFACE IMPLEMENTATION 3−1

3.1 GENERAL 3−1

3.1.1 INTERFACE DESCRIPTION 3−1

3.1.1.1 ARIS CONFIGURED ISPR DESCRIPTION 3−1

3.1.1.2 MODULE DESCRIPTION 3−1

3.1.1.3 ARIS/ISPR FUNCTIONS 3−2

3.1.1.4 MODULE FUNCTIONS 3−2

3.1.2 INTERFACE RESPONSBILITIES 3−2

3.1.2.1 RESPONSIBILITY FOR ARIS/ISPR 3−2

3.1.2.2 RESPONSIBILITY FOR USL 3−2

3.1.2.3 RESPONSIBILITY FOR APM 3−2

3.1.2.4 RESPONSIBILITY FOR JEM 3−2

3.1.3 ENGINEERING UNITS, TOLERANCES AND CONVERSIONS 3−3

3.1.3.1 ENGINEERING UNITS 3−3

3.1.3.2 CONVERSIONS 3−3

3.1.4 RESERVED 3−3

3.1.5 RESERVED 3−3

3.1.6 COORDINATE SYSTEM 3−3

3.2 INTERFACE REQUIREMENTS 3−3

3.2.1 ARIS/ISPR INTERFACE REQUIREMENTS 3−3

3.2.1.1 ENVELOPE REQUIREMENTS 3−3

3.2.1.1.1 STATIC/DYNAMIC ENVELOPE 3−3

3.2.1.2 MASS PROPERTIES 3−4

3.2.1.3 STRUCTURAL/MECHANICAL 3−4

3.2.1.3.1 LAUNCH/LANDING/ON−ORBIT TRANSFER ATTACHMENT 3−4

3.2.1.3.2 GROUND HANDLING ATTACHMENT 3−4

3.2.1.3.3 BONDING 3−4

3.2.1.4 UTILITY/SYSTEM INTERFACES 3−4

3.2.1.5 INDUCED ENVIRONMENTS 3−4

3.2.1.6 ARIS COMPONENT HEAT LOADS TO CABIN AIR 3−5

x

3.2.2 MODULE INTERFACES 3−5

3.2.2.1 ARIS/ISPR LOCATIONS 3−5

3.2.2.2 ENVELOPES 3−5

3.2.2.2.1 ON−ORBIT OPERATIONAL KEEPOUT ENVELOPES 3−5

3.2.2.2.2 LAUNCH/LANDING STATIC/DYNAMIC ENVELOPE 3−6

3.2.2.3 MASS PROPERTIES 3−6

3.2.2.4 STRUCTURAL/MECHANICAL ATTACHMENT 3−32

3.2.2.4.1 STRUCTUAL/ MECHANICAL INTERFACES 3−32

3.2.2.4.2 RESERVED 3−32

3.2.2.4.3 MINIMUM RESONANT FREQUENCY 3−32

3.2.2.4.4 BONDING 3−34

3.2.2.5 INDUCED ENVIRONMENTS 3−34

3.2.2.5.1 ISOLATION PLATE ATTACHMENT 3−34

3.2.2.5.2 UPPER PUSHROD ATTACHMENT 3−35

3.2.2.5.3 SNUBBER ATTACHMENT 3−36

3.2.2.5.4 UTILITY/SYSTEM INTERFACES 3−36

3.3 ARIS RACK BARRIER INTERFACES 3−36

4.0 INTERFACE VERIFICATION 4−1

A−1 CONTROL AUTHORITY A−1

A−2 ABBREVIATIONS AND ACRONYMS A−1

xi

APPENDIX

A ABBREVIATIONS AND ACRONYMS A − 1

B PARIS TO MODULE UNIQUE INTERFACES B − 1

xii

FIGURES

3.2.2.2.1−1−1 ISOLATION PLATE KEEPOUT ENVELOPE 3−7

3.2.2.2.1−1−2 ISOLATION PLATE KEEPOUT ENVELOPE 3−8

3.2.2.2.1−2−1 ISOLATION PLATE KEEPOUT ENVELOPE 3−9

3.2.2.2.1−2−2 ISOLATION PLATE KEEPOUT ENVELOPE 3−10

3.2.2.2.1−3−1 ISOLATION PLATE KEEPOUT ENVELOPE 3−11

3.2.2.2.1−3−2 ISOLATION PLATE KEEPOUT ENVELOPE 3−12

3.2.2.2.1−4−1 UPPER ACTUATOR AND PUSHROD KEEPOUT ENVELOPE 3−13

3.2.2.2.1−4−2 UPPER ACTUATOR AND PUSHROD KEEPOUT ENVELOPE 3−14

3.2.2.2.1−5: UPPER ACTUATOR AND PUSHROD KEEPOUT ENVELOPE 3−15

3.2.2.2.1−6−1 JEM SNUBBER KEEPOUT ENVELOPE 3−16

3.2.2.2.1−6−2 USL AND APM SNUBBER KEEPOUT ENVELOPE 3−17

3.2.2.2.1−7 ARIS CONFIGURED ISPR PROFILE 3−18

3.2.2.2.1−7−1 ARIS CONFIGURED ISPR SKIN PROFILE (DETAIL A & B) (JEM ONLY) 3−19. .

3.2.2.2.1−8 ARIS RACK SNUBBER KEEP OUT ENVELOPE ON−ORBIT (SIDE VIEW) (APM ONLY)

3−20

3.2.2.2.1−9 ARIS RACK SNUBBER KEEPOUT ENVELOPE ON−ORBIT (APM ONLY) 3−21.

3.2.2.2.1−10 ARIS RACK SNUBBER ENVELOPE ON−ORBIT (APM ONLY) 3−22

3.2.2.2.1−11 ARIS RACK SNUBBER ENVELOPE ON−ORBIT (APM ONLY) 3−23

3.2.2.2.1−12 ARIS RACK KINEMATIC ENVELOPE ON−ORBIT (APM AND USL ONLY) 3−24.

3.2.2.2.1−13 ARIS RACK KINEMATIC ENVELOPE ON−ORBIT (APM AND USL ONLY) 3−25.

3.2.2.2.1−14 ARIS RACK KINEMATIC ENVELOPE ON−ORBIT (APM AND USL ONLY) 3−26.

3.2.2.2.1−15 ARIS RACK KINEMATIC ENVELOPE ON−ORBIT (APM AND USL ONLY) 3−27.

3.2.2.2.1−16 ARIS RACK KINEMATIC ENVELOPE ON−ORBIT (JEM ONLY) 3−28

3.2.2.2.1−17 ARIS RACK KINEMATIC ENVELOPE ON−ORBIT (JEM ONLY) TBC 3−29

3.2.2.2.1−18 PAGE 1 OF 2 BRIDGE BRACKET KEEP OUT ZONE, U.S. LAB 3−30

3.2.2.2.1−18 PAGE 2 OF 2 BRIDGE BRACKET KEEP OUT ZONE, U.S. LAB 3−31

3.2.2.4.1−1 ARIS/ISPR MODULE STRUCTURAL ATTACH POINTS 3−33

xiii

TABLES

3.1.3.2−1 LINEAR TOLERANCES 3−3

3.2.2.4.1−1 ARIS/ISPR STRUCTURAL ATTACH POINT DESCRIPTIONS 3−32

3.2.2.5.1−1 ISOLATION PLATE ATTACHMENT SPRING RATES 3−34

3.2.2.5.1−2 ISOLATION PLATE ATTACHMENT FORCE REACTIONS 3−35

3.2.2.5.2−1 UPPER PUSHROD FITTING REACTIONS 3−35

3.2.2.5.2−2 UPPER PUSHROD ATTACHMENT FORCE REACTIONS 3−35

3.2.2.5.3−1 SNUBBER ATTCHMENT TRANSLATION SPRING RATES 3−36

3.2.2.5.3−2 SNUBBER ATTACHMENT ROTATION SPRING RATES 3−36

4.0−1 INTERFACE VERIFICATION 4−2

1−1

1.0 INTRODUCTION

1.1 PURPOSE AND SCOPE

The purpose of this ICD is to provide definition of the physical and functional interface requirements necessary for the installation and operation of an ARIS configured ISPR into the USL, the APM, and the JEM. Additionally, Passive Rack Isolation System (PaRIS) rack unique Interfaces for the United States Lab (USL) and Centrifuge Accom-modation Module (CAM) are defined in Appendix B. ARIS and PaRIS interface require-ments for launch and landing are defined in SSP 41017, Part 1.

1.2 PRECEDENCE

In the event of conflict between SSP 41000, Space Station System Specification, and the contents of this ICD, only the requirements of the Space Station System Specifica-tion applicable to each International Partner and to the National Aeronautics and Space Administration (NASA) will take precedence.

1.3 RESPONSIBILITY AND CHANGE AUTHORITY

This document is prepared and maintained in accordance with SSP 30459.

1−2

THIS PAGE INTENTIONALLY LEFT BLANK

2−1

2.0 APPLICABLE DOCUMENTS

The following documents form part of this ICD to the extent specified herein.

DOCUMENT NO: TITLE

ASTM E380 Standard Practice for Use of the International System

Rev A of Units (SI)

1 Jan 93

Reference Paragraph 3.1.3.2

SSP 41017 Racks to Mini Pressurized Logistics Module Interface

Rev F Control Document, Part 1

18 May 01

Reference Paragraph 1.1, 3.1.1.1, 3.2.1.1.1, 3.2.1.5, 3.2.2.2.1, and

3.2.2.2.2

SSP 30245 Space Station Electrical Bonding Requirements

Rev D

4 June 98

Reference Paragraph 3.2.1.3.3

SSP 30459 International Space Station Control Plan Rev G 8 Nov 95 Reference Paragraph 1.3

SSP 41152 International Standard Payload Rack (ISPR) Interface

Rev D Requirements Document

31 July 01

Reference Paragraph 3.2.1.4, 3.2.2.1, 3.2.2.5.4

2−2

2.1 REFERENCE DOCUMENTS

The following reference documents form part of this ICD to the extent specified herein.

DOCUMENT NO: TITLE

SSP 41000 International Space Station System Specification

SSP 57006 ARIS Users Handbook

SSP 41002 International Standard Payload Rack to

NASA/ESA/NASDA Modules Interface Control Document

3−1

3.0 INTERFACE IMPLEMENTATION

3.1 GENERAL

3.1.1 INTERFACE DESCRIPTION

3.1.1.1 ARIS CONFIGURED ISPR DESCRIPTION

The ARIS attenuates vibratory disturbances at selected user payload locations. Attenu-ation is achieved by imparting a reactive force between an ISPR and module structure in response to sensed vibratory accelerations, thereby reducing disturbances to user payloads within the rack.

In addition to attenuation, the ARIS measures vibratory disturbances within the ISPR.

The ARIS reports ISPR acceleration measurements to a payload controller for evalua-tion of ISS microgravity performance, analysis of microgravity effects on payloads, and analysis of disturbance−related anomalies.

The ARIS is designed for compatibility with the EXPRESS (EXpedite the PRrocessing of Experiments to Space Station) or non−EXPRESS payload rack. Both configurations are based on the ISPR. The configuration described in this document applies to both configurations unless otherwise stated.

The ARIS/ISPR launch and landing interfaces to the Mini Pressurized Logistics Module (MPLM), APM and to Ground Support Equipment (GSE) will be physically identical and functionally compatible to those used during standard ISPR operations without the use of hardware adapters. The ARIS/ISPR interfaces to the MPLM consist of structural/me-chanical attachment for the launch/landing/on−orbit transfer event as described in SSP 41017, Part 1. The ARIS/ISPR interfaces to the GSE consist of structural/mechanical attachment for the ground handling event as described in SSP 41017, Part 1.

The ARIS/ISPR interfaces to ISPR locations within modules consist of the structural/ mechanical attachment during ARIS/ISPR installation, removal and on−orbit operation and utility interfaces during on−orbit operation.

3.1.1.2 MODULE DESCRIPTION

The module interfaces to the ARIS/ISPR consist of structural/mechanical attachment, installation envelopes (during ARIS/ISPR installation and removal), on−orbit operation-al keepout envelopes, and utility interfaces during on−orbit operation.

3−2

3.1.1.3 ARIS/ISPR FUNCTIONS

The ARIS/ISPR will support the following functions at the interface with the modules.

A. Structural/Mechanical Attachment

B. Utility Attachments.

3.1.1.4 MODULE FUNCTIONS

The laboratory module will support the following functions at the interfaces with the

ARIS/ISPR:

A. Structural/Mechanical Attachment

B. Utility Attachments

C. Installation Envelopes

D. On−Orbit operational keepout envelopes.

3.1.2 INTERFACE RESPONSBILITIES

3.1.2.1 RESPONSIBILITY FOR A/ISPR

The rack integrator will ensure that the ARIS/ISPR conforms to the interface require-ments contained within this document.

3.1.2.2 RESPONSIBILITY FOR USL

NASA/Boeing will ensure that locations utilizing ARIS/ISPR within the USL conform to the interface requirements contained within this document.

3.1.2.3 RESPONSIBILITY FOR APM

The European Space Agency (ESA) will ensure that locations utilizing ARIS/ISPR within the APM conform to the interface requirements contained within this document.

3.1.2.4 RESPONSIBILITY FOR JEM

The Japan Aerospace Exploration Agency (JAXA) will ensure that locations utilizing ARIS/ISPR within the JEM conform to the interface requirements contained within this document.

3−3

3.1.3 ENGINEERING UNITS, TOLERANCES AND CONVERSIONS

3.1.3.1 ENGINEERING UNITS

All dimensions will be defined in the English system of units followed by the parentheti-cal SI metric equivalent.

3.1.3.2 CONVERSIONS

Linear tolerances on English dimensions when not explicitly identified are indicated in Table 3.1.3.2−1, Linear Tolerances. Conversions will be in accordance with ASTM E380, Standard Practice for Use of the International System of Units (SI) (The Modern-ized Metric System).

TABLE: 3.1.3.2−1 LINEAR TOLERANCES

ENGLISH DIMENSIONS IMPLIED TOLERANCE (INCHES)

X.XX +/− 0.03

X.XXX +/− 0.010

3.1.4 RESERVED

3.1.5 RESERVED

3.1.6 COORDINATE SYSTEM

Coordinate System shall be as defined in section 3.1.6 of SSP50251, Part 2

3.2 INTERFACE REQUIREMENTS

3.2.1 ARIS/ISPR INTERFACE REQUIREMENTS

3.2.1.1 ENVELOPE REQUIREMENTS

3.2.1.1.1 STATIC/DYNAMIC ENVELOPE

The ARIS/ISPR static/dynamic envelope shall not exceed the envelopes defined in SSP 41017 Part 1. These envelopes are for the ARIS/ISPR in the non−operating condition

3−4 and attached to modules. The ARIS/ISPR on−orbit static and dynamic envelopes shall not exceed the envelopes defined in Section 3.2.2.2.

3.2.1.2 MASS PROPERTIES

The on−orbit mass of an integrated ARIS/ISPR (including rack structure, closeouts, ARIS components, and payload) will be less than or equal to 1773 lbs (804.2 kg).

3.2.1.3 STRUCTURAL/MECHANICAL

3.2.1.3.1 LAUNCH/LANDING/ON−ORBIT TRANSFER ATTACHMENT

ARIS/ISPRs shall incorporate structural/mechanical provisions for attachment to the MPLM and APM during the launch/landing/on−orbit transfer event.

3.2.1.3.2 GROUND HANDLING ATTACHMENT

ARIS/ISPRs shall incorporate structural/mechanical provisions for attachment to GSE during the ground handling event.

3.2.1.3.3 BONDING

ARIS/ISPRs shall provide a bonding strap for Class R bonding to laboratory modules during on−orbit operation in accordance with SSP 30245, Space Station Electrical Bonding Requirements.

3.2.1.4 UTILITY/SYSTEM INTERFACES

ARIS/ISPRs shall provide utility and system interfaces as defined in SSP 41152. The layout of the utility and system interfaces are depicted in SSP 41002. The ARIS umbili-cal set shall contain the following: bonding strap; two electrical power cables; two 1553B cables; TCS moderate loop connection; gaseous nitrogen connection; two Ether-net Local Area Network cables; waste gas system jumper; a vacuum system jumper (non−EXPRESS only); a Fire Detection System/ Power Maintenance cable; a High Rate Data cable; and a fiber optic video/sync cable.

3.2.1.5 INDUCED ENVIRONMENTS

ARIS/ISPRs shall be capable of operation (with ARIS components secured and not ac-tive) after exposure to the induced environments defined in SSP 41017 Part 1.

3−5

3.2.1.6 ARIS COMPONENT HEAT LOADS TO CABIN AIR

ARIS Heat Loads shall comply to limits as defined in SSP 41002, Section 3.3.3.5. (TBC)

3.2.2 MODULE INTERFACES

3.2.2.1 ARIS/ISPR LOCATIONS

The NASA, JAXA and ESA laboratory modules shall provide ISPR locations with utilities and system interfaces as defined in SSP 41152 for use by ARIS/ISPRs. The layout of the utility and system interfaces are depicted in SSP 41002.

The NASA laboratory module shall provide 12 ISPR locations for use by ARIS/ISPRs.

The JAXA laboratory shall provide 3 ISPR locations for use by ARIS/ISPRs.

The ESA laboratory module shall provide 8 lateral ISPR locations for use by ARIS/ ISPRs.

3.2.2.2 ENVELOPES

3.2.2.2.1 ON−ORBIT OPERATIONAL KEEPOUT ENVELOPES

At ISPR locations for ARIS/ISPR’s, the modules shall reserve volume for the ARIS/ ISPR on−orbit operational keepout envelopes defined as follows:

A. Isolation Plate keepout envelope (Includes keepout envelopes for the lower external actuator pair and the lower pushrods and pushrod fittings) is shown in Figures 3.2.2.2.1−1−1, 3.2.2.2.1−2−1 and 3.2.2.2.1−3−1 Isolation Plate Keepout Envelope (JEM, APM and USL installation and JEM operation only); 3.2.2.2.1−1−2, 3.2.2.2.1−2−2 and 3.2.2.2.1−3−2 Isolation Plate Keepout Envelope (APM and USL operation only).

B. Upper actuator pair and pushrod keepout envelopes are shown in Figure 3.2.2.2.1−4−1 (JEM, APM and USL installation and JEM operation only), Figure 3.2.2.2.1−4−2 (APM and USL operation only), and Figure 3.2.2.2.1−5 Upper Actua-tor and Pushrod Keepout Envelope.

C. Snubber keepout envelope is shown in Figure 3.2.2.2.1−6−1, JEM Snubber Keepout Envelope; 3.2.2.2.1−6−2, USL and APM Snubber Keepout envelope, Figures 3.2.2.2.1−8, −9, −10, −11 ARIS Rack Snubber Keepout Envelopes on Orbit (APM Only).

3−6

D. ARIS ISPR on−orbit keepout envelope for USL and APM is determined by adding 0.50” (12.7) to the +/−X, and +/−Z dimensions identified in SSP 41017 for the static envelope of the ISPR and by adding 0.50” (12.7) to the +/−Y dimension shown on the rack skin in Figure 3.2.2.2.1−7 ARIS Configured ISPR Skin Profile and adding 0.50” (12.7) to the ARIS external components not attached to the module in the +/−X, +/−Y and +/−Z directions. ARIS ISPR rack kinematic on−orbit envelopes are defined in Figures 3.2.2.2.1−12 − through 3.2.2.2.1−15 and 3.2.2.2.1−18.

E. ARIS ISPR on−orbit keepout envelopes for JEM is determined by adding 0.5” (12.7) to the following dimensions, the +/−X, +/−Y, +/−Z dimensions shown on the rack profile in Figures 3.2.2.2.1−7 and 3.2.2.2.1−7−1 ARIS Configured ISPR Profile the +/−X, +/−Y, +/−Z dimensions identified in SSP 41017 for the static envelope of the ISPR except for the dimensions defined in Figures 3.2.2.2.1−7 and 3.2.2.2.1−7−1 the ARIS external components not attached to the module in the +/−X, +/−Y, and +/−Z, directions

ARIS ISPR kinematic envelopes on−orbit for JEM are defined in Figures 3.2.2.2.1−16 and 3.2.2.2.1−17.

Envelopes shown in Figures 3.2.2.2.1−1−1 through 3.2.2.2.1−5 and 3.2.2.2.1−7 rep-resent the volume required during installation and operation of an ARIS configured ISPR. During on−orbit operation the installation envelopes will be translated (during rack repositioning) with the ISPR in the Y−axis 0.50” (12.7) (in the USL and APM only) toward the module centerline to accommodate the ARIS/ISPR on−orbit kine-matic envelope.

3.2.2.2.2 LAUNCH/LANDING STATIC/DYNAMIC ENVELOPE

Dedicated ARIS ISPR rack locations within the MPLM and APM will reserve volume for the static and dynamic envelopes of the ARIS/ISPR as defined in SSP 41017 Part 1.

3.2.2.3 MASS PROPERTIES

Each ARIS/ISPR location in the modules shall accommodate the maximum integrated ARIS/ISPR on−orbit mass of 1773 lbs (804.2 kg).

3−7

Module

Pivot

Centerline

Kinematie Envelope for Low-er Actuators and Pushrods (JEM Configuration only)

JEM

0)

0)

(535.4) 21.08

(454.2) 17.88

(454.2) 17.88

(392.4) 15.45

FIGURE 3.2.2.2.1−1−1 ISOLATION PLATE KEEPOUT ENVELOPE (INSTALLATION

CONFIGURATION FOR JEM, APM AND USL)

3−8

Kinematie Envelope for Lower Actuators and Pushrods (Op-erational Configuration only)

2x18.19 (462.0)

16.60 (421.6)

13.858.74 (222.0)

3.91 (99.3)

Module Pivot Centerline

0)

0)

(454.2) 17.88

(454.2) 17.88

(392.4) 15.45

20.58

(522.7)

13.85 (351.8)

13.49 (342.6)

16.44 (417.6)

Note: Per JEM operational configuration see Figure 3.2.2.2.1−1−1

FIGURE 3.2.2.2.1−1−2 ISOLATION PLATE KEEPOUT ENVELOPE (OPERATIONAL

CONFIGURATION FOR APM AND USL)

3−9

K in em at ic E nv el op e fo r

Lo w er E xt er na l A ct ua to rs a nd

P us hr od s O pe ra tio na l C on fig ur at io n O nl y

M od ul e

P iv ot P oi nt

7.

(1

.9

NOTE: JEM in Operational Configuration is the same as Installation Configuration JEM is Kinematic for both Operation and Installation.

FIGURE 3.2.2.2.1−2−1 ISOLATION PLA TE KEEPOUT ENVELOPE (INSTALLATION

CONFIGURATION FOR JEM, APM, AND USL)

3−10

K in em at ic E nv el op e fo r

Lo w er E xt er na l A ct ua to rs a nd

P us hr od s

.5

(5

.7

.5

(3

.1

3.

(9 9.

3) 5.

(1

.2

5.

(1

.6

7.

(1

.8

) 11 .6

(2

.1

) 12 .7

(3

.3

.4

(3

.6

.6

(3

.4

.9

(3

.2

.4

(4

.6

.6 (4

.6

.0 (4

.8

O P

E R

A T

IO

N

A L

R A

D

IU

S C

E N

T E

R

LI

N E

0.

(1 2.

7)

M od ul e

P iv ot P oi nt

Note: Per JEM operational Configuration − See Figure 3.2.2.2.1−2−1

FIGURE 3.2.2.2.1−2−2 ISOLATION PLATE KEEPOUT ENVELOPE (OPERATIONAL

3−11

.6

(4

.7

Y

+ Z

M od ul e

P iv ot P oi nt

Note: JEM in Operational Configuration is the same as Installation Configuration JEM is Kinematic for both Operation and Installation

FIGURE 3.2.2.2.1−3−1 ISOLATION PLATE KEEPOUT ENVELOPE (INSTALLATION

CONFIGURATION FOR JEM, APM AND USL)

3−12

.1

(4

.0

Y

+ Z

M od ul e

P iv ot P oi nt

.8

(3

.8

.9

(3

.2

.6

(4

.6

O P

E R

A T

IO

N

A L

R A

D

IU

S C

E N

T E

R

LI

N E

(1 2.

7) .5

NOTE: JEM Operational Configuration. See Figure 3.2.2.2.1−3−1

FIGURE 3.2.2.2.1−3−2 ISOLATION PLATE KEEPOUT ENVELOPE (OPERATIONAL

3−13

Module Pivot Point

(43.9)

(42.4)

(23.1)

Note: JEM in Operational Configuration is the same as Installation Configuration JEM is Kinematic for both Operation and Installation

FIGURE 3.2.2.2.1−4−1 UPPER ACTUATOR AND PUSHROD KEEPOUT ENVELOPE

(INSTALLATION CONFIGURATION FOR JEM, APM, AND USL)

3−14

Module Pivot Point

1.34 (34.0)

(43.9) 1

Note 1 This Keepout envelope includes the Kinematic envelope Note 2 For JEM Operational Configuration See Figure 3.2.2.2.1−4−1

FIGURE 3.2.2.2.1−4−2 UPPER ACTUATOR AND PUSHROD KEEPOUT ENVELOPE

(OPERATIONAL CONFIGURATION FOR APM AND USL)

3−15

Note: This Keepout Envelope Includes the Kinematic Envelope

FIGURE 3.2.2.2.1−5: UPPER ACTUATOR AND PUSHROD KEEPOUT ENVELOPE

3−16

FIGURE 3.2.2.2.1−6−1 JEM SNUBBER KEEPOUT ENVELOPE

3−17

M od ul e

P iv ot

M od ul e

P iv ot C en te rli ne

FIGURE 3.2.2.2.1−6−2 USL AND APM SNUBBER KEEPOUT ENVELOPE

3−18

T B

C T

B C

Note: (1) Rear Fitting defined in SSP 41017, Part 2, Figure 3.3.1−4

(2) See Figure 3.2.2.2.1−7−1

FIGURE 3.2.2.2.1−7 ARIS CONFIGURED ISPR PROFILE

3−19

FIGURE 3.2.2.2.1−7−1 ARIS CONFIGURED ISPR SKIN PROFILE (DETAIL A & B) (JEM

ONLY) TBC

Pivot Point

3−20

2)

1)

NOTES :

1) see figure 3.2.2.2.1−9

2) see figure 3.2.2.2.1−10

3) see figure 3.2.2.2.1−11

B 3)

FIGURE 3.2.2.2.1−8 ARIS RACK SNUBBER KEEP OUT ENVELOPE ON−ORBIT

(SIDE VIEW) (APM ONLY)

3−21

Module Pivot Point

FIGURE 3.2.2.2.1−9 ARIS RACK SNUBBER KEEPOUT ENVELOPE ON−ORBIT

(APM ONLY)

3−22

1.93 (49)

FIGURE 3.2.2.2.1−10 ARIS RACK SNUBBER ENVELOPE ON−ORBIT (APM ONLY)

3−23

Module Pivot Point

FIGURE 3.2.2.2.1−11 ARIS RACK SNUBBER ENVELOPE ON−ORBIT (APM ONLY)

3−24

4)

1)

3)

2)

5)

NOTES :

1) see fig 3.2.2.2.1−14

2) see fig 3.2.2.2.1−15

3) see figure 3.2.2.2.1−13

4) see figure 3.2.2.2.1−13

5) see figure 3.2.2.2.1−4−2

5)

FIGURE 3.2.2.2.1−12 ARIS RACK KINEMATIC ENVELOPE ON−ORBIT

(APM AND USL ONLY)

3−25

Note 1) See Figure 3.2.2.2.1−5 for upper actuator and pushrod keep out envelope

FIGURE 3.2.2.2.1−13 ARIS RACK KINEMATIC ENVELOPE ON−ORBIT (APM AND USL

ONLY)

3−26

ARIS Rack Centerline

FIGURE 3.2.2.2.1−14 ARIS RACK KINEMATIC ENVELOPE ON−ORBIT (APM AND USL

ONLY)

3−27

Aris Rack Centerline

1)

1) see figure 3.2.2.2.1−5 for upper actuator and pushrod keep out envelope

FIGURE 3.2.2.2.1−15 ARIS RACK KINEMATIC ENVELOPE ON−ORBIT

(APM AND USL ONLY)

3−28

Note: (1) See Figure 3.2.2.2.1−17

FIGURE 3.2.2.2.1−16 ARIS RACK KINEMATIC ENVELOPE ON−ORBIT (JEM ONLY)

3−29

FIGURE 3.2.2.2.1−17 ARIS RACK KINEMATIC ENVELOPE ON−ORBIT (JEM ONLY) TBC

3−30

Figure 3.2.2.2.1−18 p 1 of 2 Bridge Bracket Keep Out Zone, U.S. Lab

A

A

(3 2.

4)

(5 0.

8) (5

3.

7)

3−31

Figure 3.2.2.2.1−18 p 2 of 2 Bridge Bracket Keep Out Zone, U.S. Lab

View A−A

3−32

3.2.2.4 STRUCTURAL/MECHANICAL ATTACHMENT

3.2.2.4.1 STRUCTUAL/ MECHANICAL INTERFACES

The modules shall provide structure for mechanical attachment of the ARIS/ISPR spe-cific components to the module at ISPR locations designated for ARIS/ISPR use.

The on−orbit mechanical interfaces between the ARIS configured ISPR and module structure consist of the isolation plate attachments, upper actuator pushrod attach-ments, snubber attachment, utility attachments, and pivot fitting attachments. The ARIS/ISPR to module attach point locations are shown in Figure 3.2.2.4.1−1 ARIS/ISPR Module Structural Attach Points and identified in Table 3.2.2.4.1−1 ARIS/ISPR Module Attach Point Descriptions.

ARIS to module structural interfaces consist of the load−carrying capability during on− orbit operation of an ARIS/ISPR. Interface limit loads are the maximum forces at the ARIS to module interface points.

TABLE: 3.2.2.4.1−1 ARIS/ISPR STRUCTURAL ATTACH POINT DESCRIPTIONS

POINT DESCRIPTION

A Forward Isolation Plate Fastener B Center Isolation Plate Locking

Screw C Rear Isolation Plate Alignment Pin D Forward Isolation Plate Fastener E Center Isolation Plate Locking

Screw F Rear Isolation Plate Alignment Pin G Pushrod Fitting Interface H Lower left Snubber Interface I Upper left Snubber Interface J Upper Right Snubber Interface K Lower Right Snubber Interface

3.2.2.4.2 RESERVED

3.2.2.4.3 MINIMUM RESONANT FREQUENCY

Not Applicable

3−33

FIGURE 3.2.2.4.1−1 ARIS/ISPR MODULE STRUCTURAL ATTACH POINTS

3−34

3.2.2.4.4 BONDING

The ARIS/ISPR shall provide a bonding strap for class R bonding in accordance with SSP 30245. The module shall provide an interface receptacle for bonding strap, Class R bonding in accordance with SSP 30245.

3.2.2.5 MODULE INTERFACE STIFFNESS

Module interfaces to the ARIS/ISPR shall be capable of operation during and after any feasible combination of the following environments.

3.2.2.5.1 ISOLATION PLATE ATTACHMENT

Isolation plate loads are a result of an isolated rack impacting a lower snubber after a crew push off has occurred. The module shall be capable of providing the spring rates identified in Table 3.2.2.5.1−1 and withstanding reaction forces identified in Table 3.2.2.5.1−2, at interface points A, B, C, D, E, and F, assuming infinitely stiff module boundary conditions.

Rotational Degree of Freedom (DOF) points C and F (see Table 3.2.2.4.1−1) is constrained by isolation plate. Stiffness definition at points C and F considers surface contact due to pre−load between bridge bracket and stand−off.

TABLE: 3.2.2.5.1−1 ISOLATION PLATE ATTACHMENT SPRING RATES

Isolation Plate/ Reaction Point kX (lb/in)

(kg/mm) kY (lb/in)

(kg/mm) kZ (lb/in)

(kg/mm) A,D 6,760

(121)

129,000

(2,309)

8,500

(152) B,E 4,680

(84)

133,000

(2,381)

5,910

(106) C,F N/A N/A 8950 (1)

(160)

1) +Z direction only

NA−0003

3−35

TABLE: 3.2.2.5.1−2 ISOLATION PLATE ATTACHMENT FORCE REACTIONS

Reaction Point

Reaction X

+/− lbf

(+/− N)

Reaction Y

+/− lbf

(+/− N)

Reaction Z

+/− lbf

(+/− N) A,D 101

(448.7)

(462.1)

(515.4) B,E 192

(853.0)

(853.0)

(915.2) C,F N/A N/A +54 (1)

(239.9)

(1) +Z−Direction Only

3.2.2.5.2 UPPER PUSHROD ATTACHMENT

The module shall be capable of providing the spring rates identified in Table 3.2.2.5.2−1 and withstanding reaction forces identified in Table 3.2.2.5.2−2, at interface point G, assuming infinitely stiff module boundary conditions. The maximum allowable resultant deflection at interface Point G is not to exceed .010 (.25) for any combination of forces from Table 3.2.2.5.2−1.

TABLE: 3.2.2.5.2−1 UPPER PUSHROD FITTING REACTIONS

Pushrod Fitting

Reaction Point kX (lb/in)

(kg/mm) kY (lb/in)

(kg/mm) kZ (lb/in)

(kg/mm) G 1702

(30)

(21)

(32)

TABLE 3.2.2.5.2−2 UPPER PUSHROD ATTACHMENT FORCE REACTIONS

Reaction Point Reaction X

+/− lbf

(+/− N)

Reaction Y

+/− lbf

(+/− N)

Reaction Z

+/− lbf

(+/− N) G 8.5

(38)

6.1

(27)

9.1

(40)

3−36

3.2.2.5.3 SNUBBER ATTACHMENT

The module structure shall be capable of providing the spring rates identified in Table3.2.2.5.3–1 and 3.2.2.5.3–2 Snubber Attachment Spring Rates, at Interface Points H, I, J, and K, assuming infinitely stiff module boundary conditions. The maximum allowable resultant deflection at interface Points H, I, J, and K is not to exceed .040 (1.02) for any combination of forces derived from Table 3.2.2.5.3–1.

TABLE 3.2.2.5.3–1 SNUBBER ATTCHMENT TRANSLATION SPRING RATES

Snubber Reaction Point kX (lb/in) (kg/mm) kY (lb/in) (kg/mm)

KZ (lb/in) (kg/mm)

H, I, J, K 7,047 (126)

6720 (APM)

(115)

10,000 (179)

9,459 (169)

TABLE 3.2.2.5.3–2 SNUBBER ATTACHMENT ROTATION SPRING RATES

Snubber

Reaction Point wx (lb–in/rad)

(kg–m/rad) wy (lb–in/rad)

(kg–m/rad) wz (lb–in/rad)

(kg–m/rad) H, I, J, K 459,125

(5,290)

152,759 (JEM)

(1,760)

129,233 (1,489)

60,756 (JEM)

(700 )

129,216 (1,489)

102,418 (JEM)

(1,180)

3.2.2.6 UTILITY/SYSTEM INTERFACES

The module shall provide utility and system interfaces as defined in SSP 41152. The layout of utility and system interfaces are depicted in SSP 41002.

3.3 ARIS RACK BARRIER INTERFACES

The APM shall provide the interfaces necessary for the installation of the Rack Barrier.

Details are described in SSP 50251, Part 2, Section 3.3.

NA−0003

4−1

4.0 INTERFACE VERIFICATION

There will be no requirements that require joint verification for this interface. Verification of requirements will be performed separately by the rack provider, and the element pro-vider, according to the verification responsibility matrix reported in Table 4.0−1.

4−2

TABLE 4.0−1 INTERFACE VERIFICATION

PARAGRAPH VERIFICATION RESPONSIBILITY

NUMBER ARIS PROVIDER ELEMENT PROVIDER NO VERIFICATION

APM JEM USL REQUIRED

1 X

1.1 X

1.2 X

1.3 X

2 X

2.1 X

3 X

3.1 X

3.1.1 X

3.1.1.1 X

3.1.1.2 X

3.1.1.3 X

3.1.1.4 X

3.1.2 X

3.1.2.1 X

3.1.2.2 X

3.1.2.3 X

3.1.2.4 X

3.1.3 X

3.1.3.1 X

3.1.3.2 X

3.2 X

3.2.1 X

3.2.1.1 X

3.2.1.1.1 X

3.2.1.2 X

3.2.1.3 X

3.2.1.3.1 X

3.2.1.3.2 X

3.2.1.3.3 X

3.2.1.4 X

3.2.1.5 X

3.2.1.6 X

3.2.2 X

3.2.2.1 X X X

3.2.2.2 X

3.2.2.2.1 X X X

3.2.2.2.2 X

3.2.2.3 X X X

3.2.2.4 X

3.2.2.4.1 X X X

3.2.2.4.2 X

3.2.2.4.3 X

4−3

PARAGRAPH VERIFICATION RESPONSIBILITY

NUMBER ARIS PROVIDER ELEMENT PROVIDER NO VERIFICATION

APM JEM USL REQUIRED

3.2.2.4.4 X X X X

3.2.2.5 X X X

3.2.2.5.1 X X X

3.2.2.5.2 X X X

3.2.2.5.3 X X X

3.2.2.6 X X X

4 X

1)

1) ESA qualification responsibility is limited to inspection of critical dimensions and surface fin-ishes. ES−0002

4−4

THIS PAGE INTENTIONALLY LEFT BLANK

A−1

APPENDIX A − ABBREVIATIONS AND ACRONYMS

A−1 CONTROL AUTHORITY

Appendix A is not subject to ICWG change control. Responsibility for control of configu-ration management abbreviations and acronyms changes is delegated to Configuration Management.

This appendix will be revised as required, and changes will be issued a s replacement pages or by complete revision of the appendix as appropriate. All requested changes will be directed to Configuration Management.

A−2 ABBREVIATIONS AND ACRONYMS

APM Attached Pressurized Module

ARIS Active Rack Isolation System

CAM Centrifuge Accommodation Module

ESA European Space Agency

EXPRESS Expedite the Processing of Experiments to Space Station

GSE Ground Support Equipment

ICD Interface Control Document

ICWG Interface Control Working Group

ISPR International Standard Payload Rack

ISS International Space Station

JAXA Japan Aerospace Exploration Agency

JEM Japanese Experiment Module

MPLM Mini Pressurized Logistics Module

NASA National Aeronautics and Space Administration

PaRIS Passive Rack Isolation System

TBC To Be Confirmed

A−2

USL United States Laboratory Module

SSP 50251, Part 1, Revision B May 30, 2003

B−1

APPENDIX B

PaRIS to Module Unique Interfaces NA−0004

SSP 50251, Part 1, Revision B May 30, 2003

B−2

International Space Station Program

October 01, 2001

ARIS to Pressurized Element Interface Control Document, Part I Appendix B, PaRIS to Module Unique Interfaces

National Aeronautics and Space Administration International Space Station Program Johnson Space Center Houston, Texas

Japan Aerospace Exploration Agency

NA−0004

SSP 50251, Part 1, Revision B May 30, 2003

B−3

CONCURRENCE

INTERNATIONAL SPACE STATION PROGRAM

PARIS TO MODULE

INTERFACE CONTROL DOCUMENT

NASA ICWG Chairman

Representative for Concurrence DATE

Chau Hong

Boeing ICWG Chairman

Representative for Concurrence DATE

Quentin Henry

JAXA Centrifuge Project

Representative for Concurrence Tetsuya Sakashita

DATE

SSP 50251, Part 1, Revision B May 30, 2003

B−4

TABLE OF CONTENTS

PARAGRAPH PAGE

B−1.0 INTRODUCTION B−7

B−1.1 PURPOSE AND SCOPE B−7

B−1.2 PRECEDENCE B−7

B−1.3 RESPONSIBILITY AND CHANGE AUTHORITY B−7

B−2.0 APPLICABLE DOCUMENTS B−8

B−2.1 REFERENCE DOCUMENTS B−8

B−3.0 INTERFACE B−9

B−3.1 GENERAL B−9

B−3.1.1 INTERFACE DESCRIPTION B−9

B−3.1.1.1 PARIS CONFIGURED ISPR DESCRIPTION B−9

B−3.1.1.2 MODULE DESCRIPTION B−9

B−3.1.1.3 PARIS/ISPR FUNCTIONS B−9

B−3.1.1.4 MODULE FUNCTIONS B−10

B−3.1.2 INTERFACE RESPONSIBILITIES B−10

B−3.1.2.1 RESPONSIBILITY FOR PARIS/ISPR B−10

B−3.1.2.2 RESPONSIBILITY FOR USL B−10

B−3.1.2.3 RESPONSIBILITY FOR CAM B−10

B−3.1.3 ENGINEERING UNITS, TOLERANCES AND CONVERSIONS B−10

B−3.1.3.1 ENGINEERING UNITS B−10

B−3.1.3.2 CONVERSIONS B−10

B−3.1.4 COORDINATE SYSTEM B−11

B−3.2 INTERFACE REQUIREMENTS B−11

B−3.2.1 PARIS/ISPR INTERFACE REQUIREMENTS B−11

B−3.2.1.1 ENVELOPE REQUIREMENTS B−11

B−3.2.1.1.1 STATIC/DYNAMIC ENVELOPE B−11

B−3.2.1.2 MASS PROPERTIES B−11

B−3.2.1.3 STRUCTURAL/MECHANICAL B−11

B−3.2.1.3.1 LAUNCH/LANDING/ON−ORBIT TRANSFER ATTACHMENT B−11

B−3.2.1.3.2 GROUND HANDLING ATTACHMENT B−11

B−3.2.1.3.3 BONDING B−11

B−3.2.1.4 UTILITY/SYSTEM INTERFACES B−12

B−3.2.1.5 INDUCED ENVIRONMENTS B−12

B−3.2.2 MODULE INTERFACES B−12

B−3.2.2.1 PARIS/ISPR LOCATIONS B−12

B−3.2.2.2 ENVELOPES B−12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NA−0004

SSP 50251, Part 1, Revision B May 30, 2003

B−5

B−3.2.2.2.1 ON−ORBIT OPERATIONAL KEEPOUT ENVELOPES B−12

B−3.2.2.2.2 LAUNCH/LANDING STATIC/DYNAMIC ENVELOPE B−13

B−3.2.2.3 MASS PROPERTIES B−13

B−3.2.2.4 STRUCTURAL/MECHANICAL ATTACHMENT B−37

B−3.2.2.4.1 STRUCTURAL/MECHANICAL INTERFACES B−37

B−3.2.2.4.2 BONDING B−39

B−3.2.2.5 MODULE INTERFACE STIFFNESS B−39

B−3.2.2.5.1 ISOLATION PLATE ATTACHMENT B−39

B−3.2.2.5.2 UPPER ISOLATION UNIT ATTACHEMENT B−39

B−3.2.2.5.3 SNUBBER ATTACHMENT B−39

B−3.2.2.6 UTILITY/SYSTEM INTERFACES B−39

B−4.0 INTERFACE VERIFICATION B−40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NA−0004

SSP 50251, Part 1, Revision B May 30, 2003

B−6

FIGURES

B−3.2.2.2.1−1 LOWER PARIS KEEPOUT ENVELOPE (ISO VIEW) B−14

B−3.2.2.2.1−2 LOWER PARIS KEEPOUT ENVELOPE (FRONT VIEW) B−15

B−3.2.2.2.1−3 LOWER PARIS KEEPOUT ENVELOPE (TOP VIEW) B−16

B−3.2.2.2.1−4 LOWER PARIS KEEPOUT ENVELOPE (TOP VIEW) B−17

B−3.2.2.2.1−5 LOWER PARIS KEEPOUT ENVELOPE (FRONT VIEW DETAIL) B−18

B−3.2.2.2.1−6 LOWER PARIS KEEPOUT ENVELOPE (SECTION D_D DETAIL) B−19

B−3.2.2.2.1−7 LOWER PARIS KEEPOUT ENVELOPE (SECTION E−E, F−F, &G−G DETAIL) B−20

B−3.2.2.2.1−8 UPPER PARIS KEEPOUT ENVELOPE (SIDE VIEW) B−21

B−3.2.2.2.1−9 UPPER PARIS KEEPOUT ENVELOPE (ISO & SIDE DETAIL) B−22

B−3.2.2.2.1−10 UPPER PARIS KEEPOUT ENVELOPE (TOP VIEW) B−23

B−3.2.2.2.1−11 UPPER PARIS KEEPOUT ENVELOPE (FRONT VIEW) B−24

B−3.2.2.2.1−12 PARIS SNUBBER KEEPOUT ENVELOPE (SIDE VIEW) B−25

B−3.2.2.2.1−13 PARIS SNUBBER KEEPOUT ENVELOPE (ISO & TOP VIEW) B−26

B−3.2.2.2.1−14 PARIS UPPER SNUBBER KEEPOUT ENVELOPE (FRONT VIEW) B−27

B−3.2.2.2.1−15 PARIS KINEMATIC ENVELOPE ON−ORBIT (SIDE VIEW) B−28

B−3.2.2.2.1−16 PARIS RACK KINEMATIC ENVELOPE ON−ORBIT (FRONT VIEW) B−29

B−3.2.2.2.1−17 PARIS RACK KINEMATIC ENVELOPE ON−ORBIT (LOWER FRONT VIEW) B−30

B−3.2.2.2.1−18 PARIS RACK KINEMATIC ENVELOPE ON−ORBIT (SECTION H−H VIEW) B−31. . .

B−3.2.2.2.1−19 PARIS RACK KINEMATIC ENVELOPE ON−ORBIT (LOWER SIDE DETAIL) B−32. .

B−3.2.2.2.1−20 PARIS RACK KINEMATIC ENVELOPE ON−ORBIT (UPPER TOP VIEW) B−33. .

B−3.2.2.2.1−21 PARIS RACK KINEMATIC ENVELOPE ON−ORBIT (UPPER FRONT VIEW) B−34

B−3.2.2.2.1−22 PARIS RACK KINEMATIC ENVELOPE ON−ORBIT (UPPER SIDE DETAIL) B−35

B−3.2.2.2.1−23 PARIS RACK KINEMATIC ENVELOPE ON−ORBIT (SECTION J−J VIEW) B−36.

B−3.2.2.4.1−1 PARIS/ISPR MODULE STRUCTURAL ATTACH POINTS B−38

TABLES

B−3.2.2.4.1−1 PARIS/ISPR STRUCTURAL ATTACH POINT DESCRIPTIONS B−37

B−4.0−1 INTERFACE VERIFICATION B−40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NA−0004

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B−1.0 INTRODUCTION

B−1.1 PURPOSE AND SCOPE

The purpose of this ICD is to provide definition of the physical and functional interface requirements necessary for the installation of a PaRIS configured ISPR into the USL and the Centrifuge Accommodation Module (CAM). PaRIS interface requirements for launch and landing are similar to ARIS and are defined in SSP 41017, Part 1. Imple-mentation details are contained in SSP 50251, Part 2, Appendix B.

B−1.2 PRECEDENCE

In the event of conflict between SSP 41000, Space Station System Specification, and the contents of this ICD, only the requirements of the Space Station System Specifica-tion applicable to each International Partner and to the National Aeronautics and Space Administration (NASA) will take precedence.

B−1.3 RESPONSIBILITY AND CHANGE AUTHORITY

This document is prepared and maintained in accordance with SSP 30459. NA−0004

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B−2.0 APPLICABLE DOCUMENTS

The following documents form part of this ICD to the extent specified herein.

DOCUMENT NO: TITLE

ASTM E380 Standard Practice for Use of the International System

Rev A of Units (SI)

1 January 1993 Reference: Paragraph B−3.1.3.2

SSP 30245 Space Station Electrical Bonding Requirements

Rev E References: Paragraphs B−3.2.1.3.3, B−3.2.2.4.2

15 October 1999

SSP 30459 International Space Station Control Plan Rev H Reference: Paragraph B−1.3 20 April 1999

SSP 41017 Racks to Mini Pressurized Logistics Module Interface

Rev F Control Document, Part 1

18 May 2001 References: Paragraphs B−1.1, B−3.1.1.1, B−3.2.1.1.1, B−3.2.1.5, B−3.2.2.2.1, and B−3.2.2.2.2

SSP 41152 International Standard Payload Rack (ISPR) Interface

Rev D Requirements Document

31 July 2001 References: Paragraphs B−3.2.1.4, B−3.2.2.1, and B−3.2.2.6

SSP 50251 ARIS to Pressurized Element ICD, Part 2, Appendix B References: Paragraphs B−1.1 and B−3.1.

B−2.1 REFERENCE DOCUMENTS

The following reference documents form part of this ICD to the extent specified herein.

DOCUMENT NO: TITLE

SSP 41000 International Space Station System Specification Rev AE Reference: Paragraph B−1.2 28 Sept. 2001

SSP 41002 International Standard Payload Rack to NASA Rev K /ESA/NASDA Modules Interface Control Document 31 July 2001 References: Paragraphs B−3.2.1.4, B−3.2.2.1 and B−3.2.2.6 NA−0004

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B−3.0 INTERFACE

B−3.1 GENERAL

B−3.1.1 INTERFACE DESCRIPTION

B−3.1.1.1PARIS CONFIGURED ISPR DESCRIPTION

The Passive Rack Isolation System (PaRIS) attenuates vibratory disturbances at se-lected user payload locations. By suspending the integrated payload rack from the ISS module structure using passive dampers, it will attenuate vibratory accelerations above 1 Hz to the user payloads.

The combination of integrated rack and PaRIS provides vibration isolation in both dy-namic load path directions (i.e. attenuating vibrations imposed on the rack by the ISS vehicle as well as attenuating vibrations induced on the ISS vehicle by the rack) without consuming any ISS power, thermal, or data/command system resources.

The utility umbilical assembly provides a low bias force and spring rate connection be-tween the module structure and the payload rack structure for utility pass–through.

The PaRIS/ISPR launch and landing interfaces to the Mini Pressurized Logistics Mod-ule (MPLM) and to Ground Support Equipment (GSE) will be physically identical and functionally compatible to those used during standard ISPR operations without the use of hardware adapters. The PaRIS/ISPR interfaces to the MPLM consist of structural/ mechanical attachment for the launch/landing/on−orbit transfer event are similar to ARIS and are defined in SSP 41017, Part 1. The PaRIS/ISPR interfaces to the GSE consist of structural/mechanical attachment for the ground−handling event are similar to ARIS and are defined in SSP 41017, Part 1.

The PaRIS/ISPR interfaces to ISPR locations within modules consist of the structural/ mechanical attachment during PaRIS/ISPR installation, removal and on−orbit operation and utility interfaces during on−orbit operation.

B−3.1.1.2 MODULE DESCRIPTION

The module interfaces to the PaRIS/ISPR consist of structural/mechanical attachment, installation envelopes (during PaRIS/ISPR installation and removal), on−orbit opera-tional keepout envelopes, and utility interfaces during on−orbit operation.

B−3.1.1.3 PARIS/ISPR FUNCTIONS

The PaRIS/ISPR will support the following functions at the interface with the modules.

A. Structural/Mechanical Attachment NA−0004

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B. Utility Attachments.

B−3.1.1.4 MODULE FUNCTIONS

The laboratory module will support the following functions at the interfaces with the PaRIS/ISPR:

A. Structural/Mechanical Attachment

B. Utility Attachments

C. Installation Envelopes

D. On−Orbit operational keepout envelopes.

B−3.1.2 INTERFACE RESPONSIBILITIES

B−3.1.2.1 RESPONSIBILITY FOR PARIS/ISPR

The rack integrator will ensure that the PaRIS/ISPR conforms to the interface require-ments contained within this document.

B−3.1.2.2 RESPONSIBILITY FOR USL

NASA and Boeing will ensure that locations utilizing PaRIS/ISPR within the USL con-form to the interface requirements contained within this document.

B−3.1.2.3 RESPONSIBILITY FOR CAM

The Japan Aerospace Exploration Agency (JAXA) will ensure that locations utilizing PaRIS/ISPR within the CAM conform to the interface requirements contained within this document.

B−3.1.3 ENGINEERING UNITS, TOLERANCES AND CONVERSIONS

B−3.1.3.1 ENGINEERING UNITS

All dimensions will be defined in the English system of units followed by the parentheti-cal SI metric equivalent.

B−3.1.3.2 CONVERSIONS

Linear tolerances on English dimensions when not explicitly identified are indicated in Table 3.1.3.2−1, Linear Tolerances. Conversions will be in accordance with ASTM NA−0004

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E380, Standard Practice for Use of the International System of Units (SI) (The Modern-ized Metric System).

B−3.1.4 COORDINATE SYSTEM

The Coordinate System shall be as defined in section B−3.1.5 of SSP 50251, Part 2, Appendix B.

B−3.2 INTERFACE REQUIREMENTS

B−3.2.1 PARIS/ISPR INTERFACE REQUIREMENTS

B−3.2.1.1 ENVELOPE REQUIREMENTS

B−3.2.1.1.1 STATIC/DYNAMIC ENVELOPE

The PaRIS/ISPR non−operating static/dynamic envelope shall not exceed the enve-lopes defined in SSP 41017 Part 1 (TBC1). These envelopes are for the PaRIS/ISPR attached to the module. The PaRIS/ISPR on−orbit static and dynamic envelopes shall not exceed the envelopes defined in Section B−3.2.2.2.

B−3.2.1.2 MASS PROPERTIES

The on−orbit mass of an integrated PaRIS/ISPR (including rack structure, closeouts, PaRIS components, and payload) will be less than or equal to 1,773 lbs (804.2 kg).

B−3.2.1.3 STRUCTURAL/MECHANICAL

B−3.2.1.3.1 LAUNCH/LANDING/ON−ORBIT TRANSFER ATTACHMENT

The PaRIS/ISPR shall incorporate structural/mechanical provisions for attachment to the MPLM during the launch/landing/on−orbit transfer event.

B−3.2.1.3.2 GROUND HANDLING ATTACHMENT

The PaRIS/ISPR shall incorporate structural/mechanical provisions for attachment to GSE during the ground−handling event.

B−3.2.1.3.3 BONDING

The PaRIS/ISPR shall provide a bonding strap for Class R bonding to laboratory mod-ules during on−orbit operation in accordance with SSP 30245, Space Station Electrical Bonding Requirements. NA−0004

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B−3.2.1.4 UTILITY/SYSTEM INTERFACES

The PaRIS/ISPR shall provide utility and system interfaces as defined in SSP 41152.

The layout of the utility and system interfaces are depicted in SSP 41002. The PaRIS umbilical set shall contain the following: bonding strap; two electrical power cables; two 1553B cables; TCS moderate loop connections; TCS low temperature loop connec-tions; two Ethernet LAN cables; a Fire Detection System/ Power Maintenance cable; a High Rate Data cable; and a fiber optic video/sync cable.

B−3.2.1.5 INDUCED ENVIRONMENTS

The PaRIS/ISPR shall be capable of operation (with PaRIS components secured and not active) after exposure to the induced environments defined in SSP 41017 Part 1.

B−3.2.2 MODULE INTERFACES

B−3.2.2.1 PARIS/ISPR LOCATIONS

The USL and CAM laboratory modules shall provide ISPR locations with utilities and system interfaces as defined in SSP 41152 for use by PaRIS/ISPRs. The layout of the utility and system interfaces are depicted in SSP 41002.

The USL laboratory module shall provide 12 (TBR) ISPR locations for use by PaRIS/ ISPRs.

The CAM laboratory shall provide two (2) ISPR locations for use by PaRIS/ISPRs.

B−3.2.2.2 ENVELOPES

B−3.2.2.2.1 ON−ORBIT OPERATIONAL KEEPOUT ENVELOPES

At ISPR locations for PaRIS/ISPRs, the modules shall reserve volume for the PaRIS/ ISPR on−orbit operational keepout envelopes defined as follows:

A. Isolation Plate keepout envelope (includes keepout envelopes for the lower isolation units and attachment brackets) is shown in Figures B−3.2.2.2.1−1 to B−3.2.2.2.1−7 (Lower PaRIS Keepout Envelope).

B. Upper isolation unit and attachment brackets keepout envelope for the USL and the CAM is shown in Figures B−3.2.2.2.1−8 to B−3.2.2.2.1−11 (Upper PaRIS Keepout Envelope).

C. Upper snubber keepout envelopes are shown in Figures B−3.2.2.2.1−12 to B−3.2.2.2.1−14 (PaRIS Upper Snubber Keepout Envelope) and applies to the USL NA−0004

SSP 50251, Part 1, Revision B May 30, 2003

B−13 and the CAM. Lower snubber keepout envelopes are contained in Figures B−3.2.2.2.1−1 to B−3.2.2.2.1−7 (Lower PaRIS Keepout Envelope).

D. PaRIS ISPR on−orbit keepout envelope for the USL and the CAM is determined by adding 0.50” (12.7mm) to the +X, and +Z dimensions identified in SSP 41017 for the static envelope of the ISPR and by adding 0.50” (12.7mm) to the +Y dimension shown on the rack skin in Figure 3.2.2.2.1−7 (ARIS Configured ISPR Skin Profile) and adding 0.50” (12.7mm) to the PaRIS external components not attached to the module in the +X, +Y and +Z directions. Note: The detail in Figure 3.2.2.2.1−7−1 is not utilized since the necessary clearances are already incorporated in the lower PaRIS envelopes, i.e., Figures B−3.2.2.2.1−1 to B−3.2.2.2.1−7. PaRIS ISPR rack kinematic on–orbit envelopes are defined in Figures B−3.2.2.2.1–15 through B−3.2.2.2.1–22.

Envelopes shown in Figures B−3.2.2.2.1−1 through B−3.2.2.2.1−23 and Figure 3.2.2.2.1−7 represent the volume required during installation of a PaRIS configured ISPR. During on−orbit operation these envelopes will be translated (during rack reposi-tioning) with the ISPR in the Y−axis 0.50” (12.7mm) toward the module centerline to ac-commodate the PaRIS/ISPR on−orbit dynamic envelope.

Electronic models of these envelopes are available upon request in Unigraphics, STEP and IGS formats.

B−3.2.2.2.2 LAUNCH/LANDING STATIC/DYNAMIC ENVELOPE

The PaRIS/ISPR will fit within the volume reserved for the static and dynamic envelopes as defined in SSP 41017 Part 1 (TBC1).

B−3.2.2.3 MASS PROPERTIES

Each PaRIS/ISPR location in the modules shall accommodate the maximum integrated PaRIS/ISPR on−orbit mass of 1,773 lbs (804.2 kg). NA−0004

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F

IG

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−3 .2

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FIGURE B−3.2.2.2.1−2 LOWER PaRIS KEEPOUT ENVELOPE (FRONT VIEW)

Note:

Dimensions are for Operational Configuration.

Installation Configuration (Rack attached to module; Paris not attached to module) dimen− sions are 0.50 inch farther aft (+Y); i.e., 0.50 inch greater than shown above.

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N ot e:

D im en si on s ar e fo r O pe ra tio na l c on fig ur at io n.

In st al la tio n C on fig ur at io n

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F

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Note: Dimensions are for Operational Configuration. Installation Configuration (Rack attached to module; PaRIS not attached to module.) dimensions are 0.50 inch farther aft (+Y); i.e., 0.50 inch greater than shown above.

FIGURE B−3.2.2.2.1−4 LOWER PaRIS KEEPOUT ENVELOPE (TOP VIEW)

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F

IG

U R

E B

−3 .2

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.1 −5

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In st al la tio n C on fig ur at io n

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Note: Dimensions are for Operational Configuration.