SSP50251P2.pdf

SSP 50251

National Aeronautics and Space Administration International Space Station Program Johnson Space Center Houston, Texas Contract No. NAS15−10000

International Space Station Program

Revision B

May 30, 2003

ARIS to Pressurized Element Interface Control Document Part 2

Japan Aerospace Exploration Agency

SSP 50251 Part 2 , Revision B May 30, 2003 ii

REVISION AND HISTORY PAGE

REV. DESCRIPTION PUB.

DATE

− Initial Revision (Reference SSCD 001529A, EFF 01/20/00 1/18/02

A Revision A, (Reference SSCD 005507, EFF 05/09/01 4/03/03

Revision A incorporates the following approved PIRNs/IRNs with the associated SSCNs.

PIRN IRN SSCN

50251−NA−2001A N/A 005507

50251−NA−2002A N/A 005507

50251−NA−2003A N/A 005507

50251−ES−2001 N/A 005507

B Revision B, (Reference SSCD 008060, EFF 08/12/03 2/10/06

Revision B incorporates the following approved PIRNs/IRNs with the associated SSCNs.

PIRN IRN SSCN

50251−NA−2004A N/A 008060

50251−NA−2005B N/A 008060

50251−NA−2007 N/A 008060

50251−NA−2008B N/A 008060

001 005504

50251−ES−2002A N/A 008060

ERU: /s/ J. Rivas 02−10−06

SSP 50251 Part 2, Revision B May 30, 2003 iii

PREFACE

The contents of this document are intended to be consistent with tasks and products to be prepared by Program participants. The Active Rack Isolation System (ARIS) Interface Control Document (ICD) Part 2 details the physical and functional interfaces necessary for the installation of an ARIS configured ISPR into the United States Laboratory (USL) Module, the Attached Pressurized Module (APM), and the Japanese Experiment Module (JEM).

This ICD shall be implemented on all new International Space Station (ISS) contractual and internal activities and shall be included in any existing contracts through contract changes. This document is under the control of the Interface Control Working Group (ICWG), and any changes or revisions will be approved by the ICWG Chairman.

SSP 50251 Part 2 , Revision B May 30, 2003 iv

INTERNATIONAL SPACE STATION PROGRAM

ACTIVE RACK ISOLATION SYSTEM TO PRESSURIZED ELEMENT ICD PART 2

MAY 15, 2003

CONCURRENCE

PREPARED BY:

SIGNATURE

PRINT NAME ORGN

DATE

CHECK BY (BOEING):

SIGNATURE

PRINT NAME ORGN

DATE

DQA:

SIGNATURE

PRINT NAME ORGN

DATE

Bonnie Johnson

Warren England

SUPERVISED BY (NASA):

SIGNATURE

PRINT NAME ORGN

DATE

Chau Hong NASA

Freddie G. Young

Muniz/OM

Boeing

Muniz/OM

/s/ Bonnie Johnson 03/11/03

/s/ Warren England 03/11/03

/s/ James Dunn for C. Hong 03−11−03

March 11, 2003/s/ Freddie G. Young

SSP 50251, Part 2, Revision B May 30, 2003 v

NASA

INTERNATIONAL SPACE STATION PROGRAM

ARIS TO PRESSURIZED ELEMENT

INTERFACE REQUIREMENTS DOCUMENT PART 2

MAY 15, 2003

DATE

Print Name/NASA/OM

Signature

/s/ Ralph Grau

/s/ Ralph Grau 5/19/00

SSP 50251, Part 2, Revision B May 30, 2003 vi

INTERNATIONAL SPACE STATION PROGRAM

ARIS TO PRESSURIZED ELEMENT

INTERFACE REQUIREMENTS DOCUMENT PART 2

May 15, 2003

CONCURRENCE

/s/ Michele Negro

ALENIA: PRINT NAME ORGN

/s/ Michele Negro 5/19/00

SIGNATURE DATE

JAXA: /s/ Yasushi Horikawa

PRINT NAME ORGN

/s/ Yasushi Horikawa 6/27/01

SIGNATURE DATE

ESA: /s/ Diego Dellantonio

PRINT NAME ORGN

/s/ Diego Dellantonio 5/19/00

SIGNATURE DATE

INTERNATIONAL SPACE STATION PROGRAM

LIST OF CHANGES

vii

ACTIVE RACK ISOLATION SYSTEM TO PRESSURIZED ELEMENT ICD PART 2

MAY 15, 2003

All changes to paragraphs, tables, and figures in this document are shown below:

SSCBD ENTRY DATE CHANGE PARAGRAPH(S)

005507 NA−2001A F:3.2.3.1.1.1−4

F:3.2.3.1.1.1−5 F:3.2.3.1.1.1−12 F:3.2.3.1.1.1−13 F:3.2.3.1.1.1−17−1 F:3.2.3.1.1.1−17−2 F:3.2.3.1.1.1−18 F:3.2.3.1.2.1−5 F:3.2.3.1.2.1−6 P:3.2.3.1.3.1 F:3.2.3.1.3.1−1−1(add) F:3.2.3.1.2.1−7 F:3.2.3.1.3.1−4 F:3.2.3.1.3.1−5 (add)

NA−2002A F:3.2.5.2−1

F:3.2.5.2−1 (add)

NA−2003A P:3.2.3.1.1.1

F:3.2.3.1.1.1−1 F:3.2.3.1.1.1−3 F:3.2.3.1.1.1−4 F:3.2.3.1.1.1−16

ES−2001 P:3.3 (add) F:3.3−1 (add) F:3.3−2 (add) F:3.3−3 (add) F:3.3−4 (add)

008060 NA−2004A F:3.2.3.1.3.1−4

F:3.2.3.1.3.1−5

NA−2005B F:3.2..3.1.2.1−1

F:3.2.3.1.3.1−3

NA−2007 P:3.1.1

NA−2008B Appendix B

ES−2002A F:3.2.5.2−1

TABLE OF CONTENTS

PARAGRAPH PAGE

viii

1.0 INTRODUCTION 1 - 1

1.1 PURPOSE AND SCOPE 1 - 1

1.2 PRECEDENCE 1 - 1

1.3 RESPONSIBILITY AND CHANGE AUTHORITY 1 - 1

2.0 APPLICABLE DOCUMENTS 2 - 1

2.1 REFERENCE DOCUMENTS 2 - 1

2.2 REFERENCE DRAWINGS 2 −2

2.3 REFERENCE SPECIFICATIONS 2 −2

3.0 INTERFACE IMPLEMENTATION 3 - 1

3.1 GENERAL 3 - 1

3.1.1 INTERFACE DESCRIPTION 3 - 1

3.1.2 RESPONSIBILITY FOR ARIS 3 - 1

3.1.3 RESPONSIBILITY FOR USL 3 - 1

3.1.4 RESPONSIBILITY FOR APM 3 - 1

3.1.5 RESPONSIBILITY FOR JEM 3 - 1

3.1.6 COORDINATE SYSTEMS 3 - 2

3.1.7 ENGINEERING UNITS AND CONVERSIONS 3 - 2

3.1.7.1 ENGINEERING UNITS 3 - 2

3.1.7.2 CONVERSIONS 3 - 2

3.1.8 MASS PROPERTIES 3 - 2

3.2 STRUCTURAL INTERFACES 3 - 2

3.2.1 INTERFACE DESCRIPTION 3 - 2

3.2.2 ON−ORBIT OPERATIONAL KEEPOUT ENVELOPES 3 - 5

3.2.3 STRUCTURAL/MECHANICAL ATTACHMENT 3 - 5

3.2.3.1 STRUCTURAL/MECHANICAL INTERFACES 3 - 5

3.2.3.1.1 ISOLATION PLATE ATTACHMENT INTERFACES 3 - 5

3.2.3.1.1.1 MODULE INSTALLATION/INTERFACE REQUIREMENTS 3 - 5

3.2.3.1.2 UPPER ACTUATOR PUSHROD ATTACHMENT INTERFACES 3 - 27

3.2.3.1.2.1 UPPER ACTUATOR PUSHROD INSTALLATION REQUIREMENTS 3 - 27

3.2.3.1.3 SNUBBER ATTACHMENT INTERFACES 3 - 27

3.2.3.1.3.1 SNUBBER INSTALLATION REQUIREMENTS 3 - 27

3.2.3.1.4 PIVOT FITTING ATTACHMENT INTERFACES 3 - 27

3.2.3.1.4.1 PIVOT FITTING INSTALLATION REQUIREMENTS 3 - 27

3.2.4 INSTALLATION ENVELOPE 3 - 27

3.2.5 UTILITY INTERFACES 3 - 27

3.2.5.1 GROUNDING AND ISOLATION 3 - 41

3.2.5.2 BONDING 3 - 42

3.2.5.3 ARIS TO USL VACUUM SYSTEM PASS−THROUGH INTERFACES 3 - 42

3.3 ARIS RACK BARRIER INTERFACES 3 - 42

APPENDIX PAGE

A ABBREVIATIONS AND ACRONYMS A − 1

B PARIS TO MODULE UNIQUE INTERFACES B − 1

TABLE OF CONTENTS − Continued

TABLE PAGE

TABLES

ix

3.1.7.2−1 LINEAR TOLERANCES 3 - 2

3.2.3.1−1 ARIS/ISPR STRUCTURAL ATTACH POINT DESCRIPTIONS 3 - 5

3.2.5−1 MODULE SYSTEMS TO ARIS RACK INTERFACES 3 - 41

FIGURE PAGE

FIGURES

x

3.1.1−1 ARIS RACK LOCATIONS IN THE JEM PM 3 - 3

3.2.1−1 INSTALLED ARIS CONFIGURED ISPR 3 - 4

3.2.3.1−1 ARIS/ISPR MODULE STRUCTURAL ATTACH POINTS 3 - 6

3.2.3.1.1.1−1 ISOLATION PLATE INTERFACES 3 - 8

3.2.3.1.1.1−2 ISOLATION PLATE TO USL INTERFACE 3 - 9

3.2.3.1.1.1−3 ISOLATION PLATE TO APM INTERFACE 3 - 10

3.2.3.1.1.1−4 ISOLATION PLATE TO JEM INTERFACE 3 - 11

3.2.3.1.1.1−5 ISOLATION PLATE TO MODULE (CENTER ENGAGEMENT PIN) ONLY 3 - 12. .

3.2.3.1.1.1−6 ISOLATION PLATE TO MODULE INTERFACE (USL ONLY)

(CENTER ENGAGEMENT PIN, FWD AND REAR BRIDGE BRACKET) 3 - 13

3.2.3.1.1.1−7 ISOLATION PLATE TO MODULE INTERFACE

(CENTER ENGAGEMENT PIN, FWD AND REAR BRIDGE BRACKET)

(USL ONLY) 3 - 14

3.2.3.1.1.1−8 ISOLATION PLATE TO MODULE INTERFACE

(APM ONLY)(CENTER ENGAGEMENT PIN) 3 - 15

3.2.3.1.1.1−9 ISOLATION PLATE TO MODULE INTERFACE (APM ONLY)

(CENTER ENGAGEMENT PIN) 3 - 16

3.2.3.1.1.1−10 RESERVED 3 - 17

3.2.3.1.1.1−11 RESERVED 3 - 18

3.2.3.1.1.1−12 ISOLATION PLATE TO MODULE INTERFACE (JEM ONLY) 3 - 19

3.2.3.1.1.1−13 ISOLATION PLATE TO MODULE INTERFACE (JEM ONLY) 3 - 20

3.2.3.1.1.1−14 ISOLATION PLATE INTERFACES 3 - 21

3.2.3.1.1.1−15 ISOLATION PLATE TO USL INTERFACE

REAR BRIDGE BRACKET 3 - 22

3.2.3.1.1.1−16 ISOLATION PLATE TO APM INTERFACE (REAR BRIDGE BRACKET) 3 - 23

3.2.3.1.1.1−17−1 ISOLATION PLATE TO MODULE INTERFACE (JEM ONLY) 3 - 24

3.2.3.1.1.1−17−2 ISOLATION PLATE TO MODULE INTERFACE (JEM ONLY)

(CENTER ENGAGEMENT PIN) 3 - 25

3.2.3.1.1.1−18 ISOLATION PLATE TO JEM INTERFACE (REAR BRIDGE BRACKET) 3 - 26

3.2.3.1.2.1−1 UPPER ACTUATOR PUSHROD INTERFACES 3 - 28

3.2.3.1.2.1−2 UPPER ACTUATOR PUSHROD INTERFACES 3 - 29

3.2.3.1.2.1−3 UPPER ACTUATOR PUSHROD INTERFACES 3 - 30

3.2.3.1.2.1−4 UPPER ACTUATOR PUSHROD FITTING

TO STRUCTURE INTERFACE (USL ONLY) 3 - 31

3.2.3.1.2.1−5 UPPER ACTUATOR PUSHROD FITTING

TO STRUCTURE INTERFACE (APM ONLY) 3 - 32

3.2.3.1.2.1−6 UPPER ACTUATOR PUSHROD FITTING

TO STRUCTURE INTERFACE (JEM ONLY) 3 - 33

3.2.3.1.2.1−7 UPPER ACTUATOR PUSHROD FITTING TO STRUCTURE

INTERFACE (JEM ONLY) 3 - 34

3.2.3.1.3.1−1 SNUBBER INTERFACES 3 - 35

3.2.3.1.3.1−1−1 SNUBBER INTERFACE 3 - 36

3.2.3.1.3.1−2 SNUBBER INTERFACES (USL ONLY) 3 - 37

3.2.3.1.3.1−3 SNUBBER INTERFACES (APM ONLY) 3 - 38

3.2.3.1.3.1−4 SNUBBER INTERFACE (JEM ONLY) 3 - 39

3.2.3.1.3.1−5 SNUBBER INTERFACES (JEM ONLY) 3 - 40

3.2.5.2−1 ARIS/ISPR BONDING STRAP RECEPTACLE LOCATION IN THE

US LAB AND APM (PAGE 1 OF 3) 3 - 43

FIGURE PAGE

FIGURES

xi

3.2.5.2−1 ARIS/ISPR BONDING STRAP RECEPTACLE LOCATION IN THE JEM

(PAGE 2 OF 3) 3 - 44

3.2.5.2−1 ARIS/ISPR BONDING STRAP RECEPTACLE LOCATION (PAGE 3 OF 3) 3 - 45.

3.3−1 “ARIS RACK BARRIER I/FS LOCATION FOR ESA” 3 - 46

3.3−2 “ARIS RACK BARRIER I/FS LOCATION FOR ESA (DETAIL A)” 3 - 47

3.3−3 “ARIS RACK BARRIER I/FS LOCATION FOR ESA (DETAIL B)” 3 - 48

3.3−4 “ARIS SNUBBER SECTION C−C (TYP)” 3 - 49

1 - 1

1.0 INTRODUCTION

The ARIS attenuates vibratory disturbances at selected user payload locations. Attenuation is achieved by imparting a reactive force between an International Standard Payload Rack (ISPR) and module structure in response to sensed vibratory accelerations, thereby reducing disturbances to user payloads within the rack.

In addition to attenuation, the ARIS measures vibratory disturbances within the ISPR. The ARIS reports ISPR acceleration measurements to a payload controller for evaluation of ISS microgravity performance, analysis of microgravity effects on payloads, and analysis of disturbance−related anomalies.

The ARIS components are designed for compatibility with the EXPRESS (EXpedite the PRrocessing of Experiments to Space Station) and non−EXPRESS payload racks. Both configurations are based on the ISPR. The configuration described in this document applies to both configurations unless otherwise stated.

1.1 PURPOSE AND SCOPE

The purpose of this ICD is to provide definition of the physical and functional interfaces necessary for the installation and operation of an ARIS configured ISPR into the USL, the APM, and the JEM. Additionally, Passive Rack Isolation System (PaRIS) rack unique interfaces for the United States Lab (USL) and Centrifuge Accommodation Module (CAM) are defined in Appendix B. ARIS and PaRIS interfaces for launch and landing are defined in SSP 41017, Part 1.

1.2 PRECEDENCE

In the event of conflict between SSP 41000, Space Station System Specification, and the contents of this ICD, only the requirements of the Space Station System Specification applicable to each International Partner and to the National Aeronautics and Space Administration (NASA) will take precedence.

1.3 RESPONSIBILITY AND CHANGE AUTHORITY

This document is prepared and maintained in accordance with SSP 30459, International Space Station Interface Control Plan.

1 - 2

THIS PAGE INTENTIONALLY LEFT BLANK

2 - 1

2.0 APPLICABLE DOCUMENTS

The following documents of the exact issue form a part of this document to the extent specified herein.

DOCUMENT NO. TITLE

ASTM E380 Standard Practice for Use of the International System Rev A of Units (SI) 1 Jan 93

References: Paragraph 3.1.7.2

SSP 41017 Racks to Mini Pressurized Logistics Module Interface Rev H Control Document, Part 2 18 May 01

References: Paragraph 1.1, 3.1.1, 3.1.6

SSP 30459 International Space Station Interface Control Plan Rev G 8 Nov 95

References: Paragraph 1.3

SSP 50251 ARIS to Pressurized Element ICD Part 1 Rev B 30 May 2003

References: Paragraph 3.2.2

SSP 41002 International Standard Payload Rack to Rev K NASA/ESA/NASDA Modules Interface Control Document 31 July 01

References: Paragraph 3.2.5, 3.2.5.1

2.1 REFERENCE DOCUMENTS

The following documents form part of this ICD to the extent specified herein.

DOCUMENT NO. TITLE

683−61571 Isolation Plate Assembly Rev F

683−61711 Pivot Bracket Assembly Rev K

SSP 41000 International Space Station System Specification

2 - 2

2.2 REFERENCE DRAWINGS

The following drawings form part of this ICD to the extent specified herein.

2.3 REFERENCE SPECIFICATIONS

MS51831CA108L Insert, screw−thread, locked in, key locked, heavy duty References: Figure 3.2.3.1.1.1−1

BACS12GZ3D9−10 Screw, captive, socket head, A286, CRES, #10 References: Figure 3.2.3.1.1.1−1

MS51830CA201L Insert, screw−thread, locked in, key locked, miniature and lightweight References: Figure 3.2.3.1.1.1−11, 3.2.3.1.3.1−2

BACR10AM3A Ring, retaining, captive screw, crimp−on type References: Figure 3.2.3.1.2.1−1

BACW10BP3ACU Washer, countersunk CRES References: Figure 3.2.3.1.2.1−1

MS9390−160 Pin, straight, headless−cres, AMS 5735, dowel, standard and oversize References: Figure 3.2.3.1.2.1−1

BACB28X4E050 Bushing, flanged, press fit References: Figure 3.2.3.1.3.1−2

MS51830CA202 Insert, screw−thread, locked in, key locked, miniature and lightweight References: Figure 3.2.3.1.3.1−2

3 - 1

3.0 INTERFACE IMPLEMENTATION

3.1 GENERAL

3.1.1 INTERFACE DESCRIPTION

The ARIS/ISPR to Ground Support Equipment interfaces consist of the ground handling structural/mechanical attach points E, F, G, and H as shown in SSP 41017 Part 1. The ARIS/ISPR to module interfaces consist of the operational keepout envelopes structural mechanical attachments, the installation envelopes and the utility interfaces. Passive Rack Isolatin System (PaRIS) interfaces are defined in Appendix B.

The ARIS/ISPR is compatible with 12 ISPR locations within the USL. The ARIS/ISPR is not compatible with the Nadir Window ISPR location in the USL. The ARIS/ISPR is compatible with three (3) locations within the JEM F1, A1 and A5 shown in Figure 3.1.1−1, and at the eight

(8) lateral locations within the APM.

3.1.2 RESPONSIBILITY FOR ARIS

The rack integrator will ensure that the ARIS/ISPR conforms to the interface requirements contained within this document.

3.1.3 RESPONSIBILITY FOR USL

NASA/Boeing will ensure that locations utilizing ARIS/ISPR within the USL conform to the interface definition contained within this document.

3.1.4 RESPONSIBILITY FOR APM

The European Space Agency (ESA) will ensure that locations utilizing ARIS/ISPR within the APM conform to the interface definition contained within this document.

3.1.5 RESPONSIBILITY FOR JEM

The Japan Aerospace Exploration Agency (JAXA) will ensure that locations utilizing ARIS/ISPR within the JEM conform to the interface definition contained within this document.

3 - 2

3.1.6 COORDINATE SYSTEMS

The Module Pivot Point herein corresponds to Pivot Point “I” defined in SSP 41017 Part 2, Figure 3.1.1−1, will be the origin of the coordinate system used to define all interfaces identified in this document.

Due to variance in the location of datum Pivot Point “I”, the following coordinates with respect to module point “A” defined in SSP 41017 Part 1, were used to quantify a true datum at Pivot Point “I”. Tolerances do not apply to the values below.

X: Centerline of Rack Bay Y: 24.368

(618.95) Z: 2.12

(53.85)

ARIS to module interfaces identified in this ICD will be dimensioned relative to this point.

3.1.7 ENGINEERING UNITS AND CONVERSIONS

3.1.7.1 ENGINEERING UNITS

All dimensions will be defined in the English system of units followed by the parenthetical International System of Units (SI) metric equivalent. Unless otherwise specified, dimensions will be inches (cm).

3.1.7.2 CONVERSIONS

Linear tolerances on English dimensions when not explicitly identified are indicated in Table 3.1.7.2−1. For detailed description of conversions see ASTM E380.

TABLE 3.1.7.2−1 LINEAR TOLERANCES

English Dimension Implied Tolerance (inches)

X.XX +/− 0.03

X.XXX +/− 0.010

3.1.8 MASS PROPERTIES

ARIS/ISPRs will have a maximum on orbit mass of 1773 lbs (804.2 kg).

3.2 STRUCTURAL INTERFACES

3.2.1 INTERFACE DESCRIPTION

Figure 3.2.1−1 shows a typical view of an ARIS/ISPR as it might appear installed in a module.

3 - 3

DMS 2 ECLSS

/TCS 1

ISPR (F1)

(3kw) for ARIS

Sys Stowage1

ISPR (A2)

(3kw)

EPS 1 ISPR (F2)

(3kw)

User Stowage1

ISPR (A3)

(3kw)

Sys Stowage2

ISPR (F3)

(6kw)

ICS ISPR A4

6kw

User (Refrig.)

W/S

DMS 1 EPS 2 ISPR (F5)

(3kw)

RMS ECLSS

/TCS 2

ISPR (F6)

(6kw)

Hatch

CBM

Active

EFBM

CGSE

(OVHD) (FWD)(DECK)(AFT)

ISPR (A1)

(3kw) for ARIS

ISPR (A5)

6kw for ARIS

Airlock

FIGURE 3.1.1−1 ARIS RACK LOCATIONS IN THE JEM PM

3 - 4

FIGURE 3.2.1−1 INSTALLED ARIS CONFIGURED ISPR

For Reference Only

3 - 5

3.2.2 ON−ORBIT OPERATIONAL KEEPOUT ENVELOPES

SSP 50251 Part 1 details the on−orbit operational keepout envelopes.

3.2.3 STRUCTURAL/MECHANICAL ATTACHMENT

3.2.3.1 STRUCTURAL/MECHANICAL INTERFACES

The on−orbit mechanical interfaces between the ARIS configured ISPR and module structure consist of the isolation plate attachments, upper actuator pushrod attachments, snubber attachment, utility attachments, and pivot fitting attachments. The ARIS/ISPR to module attach point locations are shown in Figure 3.2.3.1−1 and identified in Table 3.2.3.1−1.

TABLE 3.2.3.1−1 ARIS/ISPR STRUCTURAL ATTACH POINT DESCRIPTIONS

POINT DESCRIPTION

A Forward Isolation Plate Fastener

B Center Isolation Plate Locking Screw

C Rear Isolation Plate Alignment Pin

D Forward Isolation Plate Fastener

E Center Isolation Plate Locking Screw

F Rear Isolation Plate Alignment Pin

G Pushrod Fitting Interface

H Lower left Snubber Interface

I Upper left Snubber Interface

J Upper Right Snubber Interface

K Lower Right Snubber Interface

3.2.3.1.1 ISOLATION PLATE ATTACHMENT INTERFACES

The ARIS Isolation Plate is located on the lower external skin of the ISPR. The isolation plate provides a structural attachment for the ARIS/ISPR. The isolation plate will interface with module specific structure at six locations referred to hereafter as Interface Points A, B, C, D, E, and F and shown in Figure 3.2.3.1−1.

Interface points A, B, D, and E are used to secure the isolation plate to module structure during installation and setup of the ARIS.

3.2.3.1.1.1 MODULE INSTALLATION/INTERFACE REQUIREMENTS

Isolation plate interface points A and D consist of a #10−32 fastener mounted on the isolation plate structure (with allowable engagement of 0.25 inches (6.4) into the threaded portion of the module specific mating part) and female provisions for two (2) guide pins through which the module specific mounting brackets will be attached during setup/installation of the ARIS/ISPR in the module.

3 - 6

FIGURE 3.2.3.1−1 ARIS/ISPR MODULE STRUCTURAL ATTACH POINTS

3 - 7

Module to ARIS hardware interface characteristics for Isolation Plate interface points A and D are shown in Figure 3.2.3.1.1.1−1 along with a crosshatched mounting surface for the module specific mounting hardware. Isolation plate attachment interfaces A and D are nickel plated Aluminum 7075, and are flat to within .003 (.08).

Figure 3.2.3.1.1.1−2 shows the ARIS to USL bridge fittings used at Isolation Plate interface points A and D and the interface locations these fittings will have with the USL structure.

Figure 3.2.3.1.1.1−3 shows the Isolation Plate to APM bridge fittings used at Isolation Plate interface points A and D. Figure 3.2.3.1.1.1−4 shows the Isolation Plate to JEM bridge fittings used at Isolation Plate interface points A and D.

Isolation plate interface points B and E consist of provisions for an ARIS provided pin (Boeing P/N 683−61571−4, made from A286 Stainless Steel) which will be installed on the isolation plate for mating with a fitting on module structure. The 683−61571−4 pin is installed on the isolation plate during installation and setup of the ARIS/ISPR in the module.

To assure adequate fit of the isolation plate assembly during on−orbit operations, the module provided center isolation plate pin fitting centerline must be offset .050 (1.27) in the −Z axis.

Module interface requirements for attachment of the center isolation plate pin to module structure is shown in Figure 3.2.3.1.1.1−5 .

Module interface requirements for attachment of the isolation plate center pin, forward and rear bridge brackets to the USL is shown in Figure 3.2.3.1.1.1−6 and −7. Module interface requirements for attachment of the isolation plate center pin to the APM is shown in Figure 3.2.3.1.1.1−8 and −9. Module interface requirements for attachment of the isolation plate center pin to the JEM is shown in Figures 3.2.3.1.1.1−12, −13, −17−1 and −17−2. After installation, the 683−61571−4 pin protrudes 0.45(11.4) outboard from the Isolation Plate at interface points B and E.

The ARIS/ISPR must be centered with respect to its rack bay (x−axis), excluding APM, at installation to provide adequate clearance during on−orbit operations. Interface points C and F located at the rear of the isolation plate provide provisions for a fitting containing a guide pin to align the isolation plate in the module rack bay at the approximate center of the rack bay.

Isolation plate interface points C and F consist of an insert for a #10−32 fastener (insert is 10 threads maximum depth) and female provisions for three (3) guide pins through which the module specific mounting bracket will be attached during setup/installation of the ARIS/ISPR in the module.

Module to ARIS hardware interface characteristics for Isolation Plate interface points C and F are shown in Figure 3.2.3.1.1.1−14 along with a crosshatched mounting surface for the module specific mounting hardware. Isolation plate attachment interfaces C and F are nickel plated Aluminum 7075, and are flat to within .003 (.08).

Figure 3.2.3.1.1.1−15 shows the ARIS to USL bridge fittings used at Isolation Plate interface points C and F and the interface locations these fittings will have with the USL structure. The ARIS configuration (fittings installed at interface points C and F) in the USL consists of two

0.182 to 0.187 (4.62 to 4.75) diameter conical guide pins (one per fitting on each side of the isolation plate, P/N CA4411−4, Tridair) that engage into slots on the face of the USL standoff frames that are 0.196 to 0.199 (4.83 − 5.05) wide by 1 (25.4) long.

Figure 3.2.3.1.1.1−16 Isolation Plate to APM Interface shows the ARIS to APM bridge fittings used at Isolation Plate interface points C and F and the interface locations these fittings will have with the APM structure. Figures 3.2.3.1.1.1−17 and 1−18, Isolation Plate to JEM Interface shows the ARIS to JEM bridge fittings used at Isolation Plate interface points C and F and the inteface locations these fittings will have with the JEM structure.

3 - 8

(1

7.

(1

.4

7)

M od ul e

P iv ot

FIGURE 3.2.3.1.1.1−1 ISOLATION PLATE INTERFACES

1) USL, APM value is the operational value only. JEM value is the installation value for all modules and JEM’s operational value.

.7

(1 8.

7) A

3 - 9

BACW10BP3ACU

BACR10AM3A

BACS12GY3D3−8

(FWD BRIDGE BRACKET)

FIGURE 3.2.3.1.1.1−2 ISOLATION PLATE TO USL INTERFACE

3 - 10

.47 (12)

R.39 (10)

.525” (13.33)

MODULE INTERFACE

SURFACE − Ni plated

ARIS INTERFACE

MATERIAL − AL 7075

SURFACE − Ni plated TORQUE −30 in−lbs

� .1248 − .1243 � 3.170 − 3.197

.005 0.13

B B

C C

MATERIAL − AL7475T351

FIGURE 3.2.3.1.1.1−3 ISOLATION PLATE TO APM INTERFACE

(FWD BRIDGE BRACKET)

A

A VIEW A−A 2 Pos.

A A

3 - 11

1.030 (26.17)

FIGURE 3.2.3.1.1.1−4 ISOLATION PLATE TO JEM INTERFACE

(FWD BRIDGE BRACKET)

B A

B A

(T B

C

(T B

C

3 - 12

Y

Z

Is ol at io n P la te

P in

1) .0

Y

X

Note: 1) 0.05” offset is before pin is engaged into R&MA

FIGURE 3.2.3.1.1.1−5 ISOLATION PLATE TO MODULE

(CENTER ENGAGEMENT PIN) ONLY.

3 - 13

M O

D U

LE

FIGURE 3.2.3.1.1.1−6 ISOLATION PLATE TO MODULE INTERFACE (USL ONLY)

(CENTER ENGAGEMENT PIN, FWD AND REAR BRIDGE BRACKET)

3 - 14

M O

D U

LE

FIGURE 3.2.3.1.1.1−7 ISOLATION PLATE TO MODULE INTERFACE

(CENTER ENGAGEMENT PIN, FWD AND REAR BRIDGE BRACKET)

(USL ONLY)

3 - 15

NOTE:

1) from the edge of the isolation plate to the bottom of the I/F fitting

1)

Material − AL7475T351 Surface − Ni Plate class II grade B

FIGURE 3.2.3.1.1.1−8 ISOLATION PLATE TO MODULE INTERFACE

(APM ONLY)(CENTER ENGAGEMENT PIN)

3 - 16

10.858

(275.80)

REF. (TO MODULE PIVOT POINT)

(T O

M O

D U

LE

P

IV

O

T P

O

IN

T

FIGURE 3.2.3.1.1.1−9 ISOLATION PLATE TO MODULE INTERFACE (APM ONLY)

(CENTER ENGAGEMENT PIN)

3 - 17

FIGURE 3.2.3.1.1.1−10 RESERVED

3 - 18

FIGURE 3.2.3.1.1.1−11 RESERVED

3 - 19

Note: 1) See Figure 3.2.3.1.1.1−13 Note: 2) See Figure 3.2.3.1.1.1−4

FIGURE 3.2.3.1.1.1−12 ISOLATION PLATE TO MODULE INTERFACE (JEM ONLY)

3 - 20

Note: 1) See Figure 3.2.3.1.1.1−17−1

2) See Figure 3.2.3.1.1.1−18

FIGURE 3.2.3.1.1.1−13 ISOLATION PLATE TO MODULE INTERFACE (JEM ONLY)

3 - 21

M O

D U

LE

P

IV

O

T C

E N

T E

R

LI

N E

FIGURE 3.2.3.1.1.1−14 ISOLATION PLATE INTERFACES

3 - 22

B A

C S

G

Y 3D

9−

B A

C W

B

P 3A

C U

B A

C R

A

M 3A

P

O S

T R

ID

A

IR

C A

M S

P O

S

FIGURE 3.2.3.1.1.1−15 ISOLATION PLATE TO USL INTERFACE

REAR BRIDGE BRACKET

3 - 23

TRIDAIR

CA4411−4

ARIS MODULE

Material − AL7475T351 Surface − Ni Plate Torque − 30 in−lbs

FIGURE 3.2.3.1.1.1−16 ISOLATION PLATE TO APM INTERFACE

(REAR BRIDGE BRACKET)

Y

3 - 24

MODULE PIVOT POINT

FIGURE 3.2.3.1.1.1−17−1 ISOLATION PLATE TO MODULE INTERFACE (JEM ONLY)

Note: 1) See Figure 3.2.3.1.1.1−17−2

(1)

3 - 25

FIGURE 3.2.3.1.1.1−17−2 ISOLATION PLATE TO MODULE INTERFACE (JEM ONLY)

(CENTER ENGAGEMENT PIN)

3.898

A A

BB

A A

BB

3 - 26

FIGURE 3.2.3.1.1.1−18 ISOLATION PLATE TO JEM INTERFACE

(REAR BRIDGE BRACKET)

3 - 27

3.2.3.1.2 UPPER ACTUATOR PUSHROD ATTACHMENT INTERFACES

The pushrods required to make the upper actuators operational will require a single rigid attachment to module structure referred to hereafter as Interface Point “G” and shown in Figure 3.2.3.1−1.

3.2.3.1.2.1 UPPER ACTUATOR PUSHROD INSTALLATION REQUIREMENTS

The upper pushrod pair will be attached to an ARIS provided fitting defined in Figures 3.2.3.1.2.1−1, 3.2.3.1.2.1−2 and 3.2.3.1.2.1−3. This fitting will attach to structure using a module provided fitting shown in Figures 3.2.3.1.2.1−4, 3.2.3.1.2.1−5, and 3.2.3.1.2.1−6 and −7 .

3.2.3.1.3 SNUBBER ATTACHMENT INTERFACES

The snubber cup(s) provide containment of the ARIS/ISPR during on−orbit operation of the ARIS. Each of these snubber cups will each require a single rigid attachment to module structure referred to hereafter as Interface Points H, I, J, and K and shown in Figure 3.2.3.1−1.

3.2.3.1.3.1 SNUBBER INSTALLATION REQUIREMENTS

Each of the 4 snubber cups will require a single attachment to module structure. The locations of these module interfaces are identified in Figure 3.2.3.1.3.1−1 for USL, APM and JEM A5 and Figure 3.2.3.1.3.1−1−1 for JEM A1 and F1. For USL snubber details, refer to Figure 3.2.3.1.3.1−2. For APM, refer to Figure 3.2.3.1.3.1−3 and for the JEM, refer to Figures 3.2.3.1.3.1−4 and −5.

3.2.3.1.4 PIVOT FITTING ATTACHMENT INTERFACES

ARIS/ISPRs located in the USL utilize a pivot bracket designed to provide rotation capabilities for ARIS/ISPRs and non−ARIS/ISPRs. This pivot bracket will provide identical capabilities as the existing ISS pivot bracket while not violating the dynamic envelope of the ARIS/ISPR. The pivot brackets used to rotate an ARIS/ISPR rack are shown in Boeing drawing 683−61711.

3.2.3.1.4.1 PIVOT FITTING INSTALLATION REQUIREMENTS

The pivot fittings will be attached to module structure at two places using the same interface for the lower snubbers. The locations of these interfaces are identified in Figure 3.2.3.1.3.1−1 as Points H, I, J, and K.

3.2.4 INSTALLATION ENVELOPE

The ARIS components mounted on the upper surface of the ISPR are contained within the sweep envelope that occurs during installation of the ISPR in the USL, APM, or JEM.

3.2.5 UTILITY INTERFACES

The module provides the ARIS/ISPR with ISPR utilities in accordance with SSP 41002. The ARIS utility umbilical assemblies (with known characteristics for umbilical bias force and spring rate between the module and the ARIS/ISPR) provide User Payloads access to module−provided system utilities. The utility umbilical assembly interfaces with the module at the utility interface panel connectors as defined in SSP 41002, paragraph 3.2.2.

The ARIS/ISPR will accommodate the module provided utilities identified by “X” in Table 3.2.5−1.

3 - 28

Note: All material is aluminum 7075 with nickel plating surface

ARIS Pushrod Interface PlaneARIS Pushrod Interface Plane

FIGURE 3.2.3.1.2.1−1 UPPER ACTUATOR PUSHROD INTERFACES

3 - 29

.1

/.1

(4 .4

5/ 4.

.1

/.1

(4 .4

5/ 4.

FIGURE 3.2.3.1.2.1−2 UPPER ACTUATOR PUSHROD INTERFACES

.5

(1 2.

2X R

M ax

.1

/.1

(4 .6

2/ 4.

.1

/.1

(4 .6

2/ 4.

2X R

M ax

3 - 30

MODULE PIVOT

FIGURE 3.2.3.1.2.1−3 UPPER ACTUATOR PUSHROD INTERFACES

3 - 31

FIGURE 3.2.3.1.2.1−4 UPPER ACTUATOR PUSHROD FITTING

TO STRUCTURE INTERFACE (USL ONLY)

3 - 32

FIGURE 3.2.3.1.2.1−5 UPPER ACTUATOR PUSHROD FITTING

TO STRUCTURE INTERFACE (APM ONLY)

M od ul e

A R

IS

M at er ia l −

A L7

5−

T

S ur fa ce

N i P la te

0.

M od ul e

A R

IS

0.130−0.127

C

(1 4.

0.

A

(5 .0

8)

(3.30−3.22)

(6 .3

5)(0 .1

3)

B

3 - 33

FIGURE 3.2.3.1.2.1−6 UPPER ACTUATOR PUSHROD FITTING

TO STRUCTURE INTERFACE (JEM ONLY)

Y

Note: (1) See Figure 3.2.3.1.2.1−7

3 - 34

FIGURE 3.2.3.1.2.1−7 UPPER ACTUATOR PUSHROD FITTING TO STRUCTURE

INTERFACE (JEM ONLY)

0.555 (14.10)

M O

D U

LE

P

IV

O

T P

O

IN

T

0.

(0 .5

A A

B B C C

3 - 35

M O

D U

LE

P

IV

O

T C

E N

T E

R

LI

N E

M O

D U

LE

P

IV

O

T C

E N

T E

R

LI

N E

Z

X

2.

(7

1.

.0

1.

FIGURE 3.2.3.1.3.1−1 SNUBBER INTERFACES

3 - 36

FIGURE 3.2.3.1.3.1−1−1 SNUBBER INTERFACE

3 - 37

FIGURE 3.2.3.1.3.1−2 SNUBBER INTERFACES (USL ONLY)

3 - 38

.2

0/ .2

(6 .6

/6

.4

D ia

.2

0/ .2

(6 .6

/6

.4

D ia

FIGURE 3.2.3.1.3.1−3 SNUBBER INTERFACES (APM ONLY)

3 - 39

3.2.3.1.3.1−4 SNUBBER INTERFACE (JEM ONLY)

3 - 40

3.2.3.1.3.1−5 SNUBBER INTERFACE (JEM ONLY)

3 - 41

TABLE 3.2.5−1 MODULE SYSTEMS TO ARIS RACK INTERFACES

UTILITY ARIS Accommodation

MAIN POWER J1 X

ESSENTIAL/AUXILIARY POWER J2 X

TCS MOD X

TCS LOW

GN2 X

1553B BUS−A (USL Standard Bus) J3 X 1553B BUS−B (USL Standard Bus) J4 X

P/L EWACS J45

LAN−1 (USL) J46 X

LAN−2 (USL, JEM) J47 X

TIME DISTRIBUTION SUPPORT

FDS/POWER MAINTENANCE J43 X

(OPTICAL) VIDEO/SYNC J16 X

(ELECTRICAL)VIDEO/SYNC J77

HRD (TX to/RX from APS) J7 X

VACUUM X

WASTE GAS X

AR

HE

CO2

3.2.5.1 GROUNDING AND ISOLATION

ARIS/ISPRs are grounded using the J1 and J2 umbilicals (provided as part of the ARIS kit).

Each umbilical includes an 8 gauge wire designed to provide a ground path for fault current.

The two wires combined provide the grounding capability as defined in SSP 41002. ARIS/ISPR grounding will be accomplished using the “B” pins shown in SSP 41002, Figure 3.3.1.3−1 and SSP 41002, Figure 3.3.1.5−1. Each pin is capable of grounding up to 44 A. To complete the ground path for an ARIS/ISPR, the module provider must install an 8 gauge (or larger) wire in the J1 and J2 receptacles (“B” Pin) of the utility interface panel (mounted in the standoff) and terminate these wires to a suitably prepared surface on module structure.

3 - 42

3.2.5.2 BONDING

Bonding for ARIS/ISPRs is accomplished through the use of a mesh strap that is provided as part of the ARIS standard umbilical assembly (which is part of the ARIS Kit). ARIS/ISPRs are bonded through an interface on the ISPR utility interface panel and on the utility interface panel on the module standoff.

The location of the bonding interface and receptacle on module structure is defined in SSP 41002, Figures 3.3−2, 3.3−3, 3.3−4 and 3.3−5. The receptacle part number is 991R2−1BP (built by Camlock Germany) and will be supplied and installed by the module provider.

The ARIS provided bonding strap will include captive fasteners used for mating the bonding strap to the module provided receptacle. Bonding strap mating surface shall be nickel plated on the module side to assure conductivity. ARIS Ground Strap is shown on Figure 3.2.5.2−1 ARIS/ISPR Bonding Strap Receptacle.

3.2.5.3 ARIS TO USL VACUUM SYSTEM PASS−THROUGH INTERFACES

The ARIS umbilical assembly provides a vacuum system pass−through interface from the module utility interface panel to the user payload at the utility panel mounted in the ISPR.

Vacuum Resource is not a standard umbilical for ARIS EXPRESS ISPR configurations.

3.3 ARIS RACK BARRIER INTERFACES

The APM Rack Barrier Interface details are shown in Figures 3.3−1 through 3.3−4.

3 - 43

FIGURE 3.2.5.2−1 ARIS/ISPR BONDING STRAP RECEPTACLE LOCATION IN THE US

LAB AND APM (PAGE 1 OF 3)

AA

3 - 44

FIGURE 3.2.5.2−1 ARIS/ISPR BONDING STRAP RECEPTACLE LOCATION IN THE JEM

(PAGE 2 of 3)

AA6.

(1

.2

1.

(3 3.

0) 3.

(7

6.

2)

3 - 45

View A−A

(2.54)

(2.79−2.41)

FIGURE 3.2.5.2−1 ARIS/ISPR BONDING STRAP RECEPTACLE LOCATION (PAGE 3 OF 3 )

1)

1) Surface properties in APM:

Material: 7075T73 (QQ−A−250/12) Ni−plated acc. to MIL 26074 Class 2 Grade B Flatness: 0.008 (0.20) Roughness: 128 (3.2 micro) Area: 2,5” x 2,5”, center as defined for ARIS bonding in Figure 3.3−5 of SSP 41002

3 - 46

FIGURE 3.3−1 “ARIS RACK BARRIER I/Fs LOCATION FOR ESA”

N O

T E fo r de ta il

A s ee fi gu re

.3

−2 fo r de ta il B s ee fi gu re

−3 fo r se ct io n C

−C s ee fi gu re

−4

3 - 47

FIGURE 3.3−2 “ARIS RACK BARRIER I/Fs LOCATION FOR ESA (DETAIL A)”

3 - 48

FIGURE 3.3−3 “ARIS RACK BARRIER I/Fs LOCATION FOR ESA (DETAIL B)”

3 - 49

FIGURE 3.3−4“ARIS SNUBBER SECTION C−C (TYP)”

A - 1

APPENDIX A ABBREVIATIONS AND ACRONYMS

A.1 ABBREVIATIONS AND ACRONYMS

Appendix A is not subject to ICWG change control. Responsibility for control of configuration management abbreviations and acronyms changes is delegated to Configuration Management.

This appendix will be revised as required, and changes will be issued as replacement pages or by complete revision of the appendix as appropriate. All requested changes will be directed to Configuration Management.

APM Attached Pressurized Module

ARIS Active Rack Isolation System

CAM Centrifuge Accommodation Module

ESA European Space Agency

EXPRESS Expedite the Processing of Experiments to Space Station

ICD Interface Control Document

ICWG Interface Control Working Group

ISPR International Standard Payload Rack

ISS International Space Station

JAXA Japan Aerospace Exploration Agency

JEM Japanese Experiment Module lbs. Pounds

MPLM Mini Pressurized Logistics Module

NASA National Aeronautics and Space Administration

PaRIS Passive Rack Isolation System

SI International System of Unit

TBC To Be Confirmed

TBD To Be Determined

USL United States Laboratory Module

B−1

APPENDIX B

PaRIS to Module Unique Interfaces

B−2

International Space Station Program

October 01, 2001

ARIS to Pressurized Element Interface Control Document, Part 2 Appendix B, PaRIS to Module Unique Interfaces

National Aeronautics and Space Administration International Space Station Program Johnson Space Center Houston, Texas

Japan Aerospace Exploration Agency

B−3

CONCURRENCE

INTERNATIONAL SPACE STATION PROGRAM

PARIS TO MODULE

INTERFACE CONTROL DOCUMENT

NASA ICWG Chairman

Representative for Concurrence DATE

Chau Hong

Boeing ICWG Chairman

Representative for Concurrence DATE

Quentin Henry

JAXA Centrifuge Project

Representative for Concurrence DATE

Tetsuya Sakashita

B−4

TABLE OF CONTENTS

PARAGRAPH PAGE

B−1.0 INTRODUCTION B−6

B−1.1 PURPOSE AND SCOPE B−6

B−1.2 PRECEDENCE B−6

B−1.3 RESPONSIBILITY AND CHANGE AUTHORITY B−6

B−2.0 APPLICABLE DOCUMENTS B−7

B−2.1 REFERENCE DOCUMENTS B−7

B−3.0 INTERFACE IMPLEMENTATION B−9

B−3.1 GENERAL B−9

B−3.1.1 INTERFACE DESCRIPTION B−9

B−3.1.2 IRESPONSIBILITIES FOR PARIS B−9

B−3.1.3 RESPONSIBILITY FOR USL B−9

B−3.1.4 RESPONSIBILITY FOR CAM B−9

B−3.1.5 COORDINATE SYSTEM B−9

B−3.1.6 ENGINEERING UNITS AND CONVERSIONS B−10

B−3.1.6.1 ENGINEERING UNITS B−10

B−3.1.6.2 CONVERSIONS B−10

B−3.2 STRUCTURAL REQUIREMENTS B−10

B3.2.1 INTERFACE DESCRIPTION B−10

B−3.2.2 ON−ORBIT OPERATIONAL KEEPOUT ENVELOPES B−12

B−3.2.3 STRUCTURAL/MECHANICAL ATTACHMENT B−12

B−3.2.3.1 STRUCTURAL/MECHANICAL INTERFACES B−12

B−3.2.3.1.1 ISOLATION PLATE ATTACHMENT INTERFACES B−12

B−3.2.3.1.1.1 MODULE INSTALLATION/INTERFACE REQUIREMENTS B−14

B−3.2.3.1.2 UPPER ISOLATION UNIT ATTACHMENT INTERFACES B−17

B−3.2.3.1.2.1 UPPER ISOLATION UNIT INSTALLATION REQUIREMENTS B−17

B−3.2.3.1.3 SNUBBER ATTACHMENT INTERFACES B−20

B−3.2.3.1.3.1 SNUBBER INSTALLATION REQUIREMENTS B−20

B−3.2.3.1.4 PIVOT FITTING ATTACHMENT INTERFACES B−20

B−3.2.3.1.4.1 PIVOT FITTING INSTALLATION REQUIREMENTS B−20

B−3.2.4 INSTALLATION ENVELOPE B−20

B−3.2.5 UTILITY INTERFACES B−20

B−3.2.5.1 GROUNDING AND ISOLATION B−21

B−3.2.5.2 BONDING B−21

B−5

FIGURES

B−3.2.1−1 INSTALLED PARIS CONFIGURED ISPR B−11

B−3.2.3.1−1 PARIS/ISPR MODULE STRUCTURAL ATTACH POINTS B−13

B−3.2.3.1.1.1−1 ISOLATION PLATE INTERFACES B−16

B−3.2.3.1.2.1−1 UPPER ISOLATION PLATE UNIT INTERFACE B−18

B−3.2.3.1.2.1−2 UPPER ISOLATION UNIT INTERFACE SUPPORT BRACKET (CAM) B−19

TABLES

B−3.2.3.1−1 PARIS/ISPR STRUCTURAL ATTACH POINT DESCRIPTIONS B−12

B−3.2.5−1 MODULE SYSTEMS TO RACK INTERFACES B−21

B−6

B−1.0 INTRODUCTION

The Passive Rack Isolation System (PaRIS) attenuates vibratory disturbances at se-lected user payload locations. By suspending the integrated payload rack from the ISS module structure using passive dampers, it will attenuate vibratory accelerations above 1 Hz to the user payloads.

The combination of integrated rack and PaRIS provides vibration isolation in both dy-namic load path directions (i.e. attenuating vibrations imposed on the rack by the ISS vehicle as well as attenuating vibrations induced on the ISS vehicle by the rack) without consuming any ISS power, thermal, or data/command system resources.

The utility umbilical assembly provides a low bias force and spring rate connection be-tween the module structure and the payload rack structure for utility pass–through.

B−1.1 PURPOSE AND SCOPE

The purpose of this ICD is to provide definition of the physical and functional interfaces necessary for the installation and operation of a PaRIS configured ISPR into the USL and the CAM. PaRIS interface requirements for launch and landing are the same as for ARIS, which are defined in SSP 41017, Part 1.

B−1.2 PRECEDENCE

In the event of conflict between SSP 41000, Space Station System Specification, and the contents of this ICD, only the requirements of the Space Station System Specifica-tion applicable to each International Partner and to the National Aeronautics and Space Administration (NASA) will take precedence.

B−1.3 RESPONSIBILITY AND CHANGE AUTHORITY

This document is prepared and maintained in accordance with SSP 30459, Internation-al Space Station Interface Control Plan.

B−7

B−2.0 APPLICABLE DOCUMENTS

The following applicable documents of the exact issue shown in the current issue of SSP 50257 form a part of this ICD to the extent specified herein. Inclusion of applicable documents herein does not in any way supersede the order of precedence identified in Paragraph B−1.2. The references show where each applicable document is cited in this document.

B−2.1 REFERENCE DOCUMENTS

The following documents are referenced in this specification as a guide for user context and user convenience.

DOCUMENT NO: TITLE

ASTM E380 Standard Practice for Use of the International System

Rev A of Units (SI)

1 January 1993 Reference: Paragraph B−3.1.6.2

BACR10AM3A Ring, retaining, captive screw, crimp–on type Reference: Figure B−3.2.3.1.2.1–1

BACS12GZ3D9–10 Screw, captive, socket head, A286, CRES, #10 Reference: Figure B−3.2.3.1.1.1–1

BACS12GYD9–10 Screw, captive, socket head, A286, CRES, #10 Reference: Figure B−3.2.3.1.2.1–1

BACW10BP3ACU Washer, countersunk CRES Reference: Figure B−3.2.3.1.2.1–1

MS51831CA108L Insert, screw–thread, locked in, key locked, heavy duty Reference: Figure B−3.2.3.1.1.1–1

SSP 30459 International Space Station Interface Control Plan Rev H Reference: Paragraph B−1.3 20 April 1999

SSP 41000 International Space Station System Specification Rev AE Reference: Paragraph B−1.2

B−8

SSP 41002 International Standard Payload Rack to Rev K NASA/ESA/NASDA Modules Interface Control 31 July 2001 Document

References: Paragraphs B−3.2.5 and B−3.2.5.1

SSP 41017 Racks to Mini Pressurized Logistics Module Interface Rev F Control Document, Part 1 18 May 2001 References: Paragraphs B−1.1, B−3.1.1, B−3.1.5

SSP 41017 Racks to Mini Pressurized Logistics Module Interface Rev H Control Document, Part 2 18 May 2001 Reference: Paragraph B−3.1.5

SSP 50251 ARIS to Pressurized Element ICD, Part 1, Appendix B Reference: Paragraph B−3.2.2

683−61571 Isolation Plate Assembly Rev L (Parts List) Reference: Paragraph B−3.2.3.1.1.1 Rev M (Sheet 3)

683–61711 Pivot Bracket Assembly Rev P (Parts List) Reference: Paragraph B−3.2.3.1.3 Rev R (Sheet 1)

B−9

B−3.0 INTERFACE IMPLEMENTATION

B−3.1 GENERAL

B−3.1.1 INTERFACE DESCRIPTION

The PaRIS/ISPR to Ground Support Equipment (GSE) interfaces consist of the ground handling structural/mechanical attach points E, F, G and H as shown in SSP 41017 Part

1. The PaRIS/ISPR to module interfaces consist of the operational keepout envelopes, structural mechanical attachments, the installation envelopes and the utility interfaces.

The PaRIS/ISPR is compatible with 12 (TBR) ISPR locations within the USL. The PaR- IS/ISPR is not compatible with the Nadir Window ISPR location in the USL. The PaRIS/ ISPR is compatible with two (2) locations within the CAM.

B−3.1.2 RESPONSIBILITY FOR PARIS

The rack integrator will ensure that the PaRIS/ISPR conforms to the interface require-ments contained within this document.

B−3.1.3 RESPONSIBILITY FOR USL

NASA/Boeing will ensure that locations utilizing PaRIS/ISPR within the USL conform to the interface requirements contained within this document.

B−3.1.4 RESPONSIBILITY FOR CAM

The Japan Aerospace Exploration Agency (JAXA) will ensure that locations utilizing PaRIS/ISPR within the CAM conform to the interface requirements contained within this document.

B−3.1.5 COORDINATE SYSTEM

The Module Pivot Point herein corresponds to Pivot Point “I” defined in SSP 41017 Part 2, Figure 3.1.1−1, and will be the origin of the coordinate system used to define all inter-faces identified in this document.

Due to variance in the location of datum Pivot Point “I”, the following coordinates with respect to module point ”A” defined in SSP 41017 Part 1, were used to quantify a true datum at Pivot Point “I”. Tolerances do not apply to the values below.

X: Centerline of Rack Bay

Y: 24.368” (618.95 mm)

Z: 2.12” (53.8 mm)

B−10

PaRIS to module interfaces identified in this ICD will be dimensioned relative to this point.

B−3.1.6 ENGINEERING UNITS AND CONVERSIONS

B−3.1.6.1ENGINEERING UNITS

All dimensions will be defined in the English system of units followed by the parentheti-cal International System of Units (SI) metric equivalent. Unless otherwise specified, di-mensions will be inches (mm).

B−3.1.6.2 CONVERSIONS

Linear tolerances on English dimensions when not explicitly identified are indicated in Table 3.1.7.2−1, Linear Tolerances. Conversions will be in accordance with ASTM E380, Standard Practice for Use of the International System of Units (SI) (The Modern-ized Metric System).

B−3.2 STRUCTURAL REQUIREMENTS

B−3.2.1 INTERFACE DESCRIPTION

Figure B−3.2.1−1 shows a typical view of a PaRIS/ISPR as it might appear installed in a module.

B−11

FOR REFERENCE ONLY

FIGURE B−3.2.1−1 INSTALLED PARIS CONFIGURED ISPR

B−12

B−3.2.2 ON−ORBIT OPERATIONAL KEEPOUT ENVELOPES

SSP 50251 Part 1 App. B details the on−orbit operational keepout envelopes.

B−3.2.3 STRUCTURAL/MECHANICAL ATTACHMENT

B−3.2.3.1 STRUCTURAL/MECHANICAL INTERFACES

The on−orbit mechanical interfaces between the PaRIS configured ISPR and module structure consist of the isolation plate attachments, upper isolation unit attachments, snubber attachment, utility attachments, and pivot fitting attachments. The PaRIS/ISPR to module attach point locations are shown in Figure B−3.2.3.1−1 (PaRIS/ISPR Module Structural Attach Points) and identified in Table B−3.2.3.1−1 (PaRIS/ISPR Module Structural Attach Point Descriptions).

TABLE B−3.2.3.1−1: PaRIS/ISPR STRUCTURAL ATTACH POINT DESCRIPTIONS

POINT DESCRIPTION

A Forward Isolation Plate Fastener

B Center Isolation Plate Locking Pin

C Rear Isolation Plate Alignment Pin

D Forward Isolation Plate Fastener

E Center Isolation Plate Locking Pin

F Rear Isolation Plate Alignment Pin

G Upper Isolation Unit Interface

H Lower Left Snubber Interface

I Upper Left Snubber Interface

J Upper Right Snubber Interface

K Lower Right Snubber Interface

B−3.2.3.1.1 ISOLATION PLATE ATTACHMENT INTERFACES

The PaRIS Isolation Plate is located on the lower external skin of the ISPR. The isola-tion plate provides a structural attachment for the PaRIS/ISPR. The isolation plate will interface with module structure at six locations referred to hereafter as Interface Points A, B, C, D, E, and F and shown in Figure B−3.2.3.1−1 (PaRIS/ISPR Module Structural Attach Points).

Interface points A, B, D, and E are used to secure the isolation plate to module struc-ture during installation and setup of the PaRIS.

B−13

LEFT SIDE

LEFT SIDE

LEFT SIDE

FIGURE B−3.2.3.1−1 PaRIS/ISPR MODULE STRUCTURAL ATTACH POINTS

B−14

B−3.2.3.1.1.1 MODULE INSTALLATION/INTERFACE REQUIREMENTS

Isolation plate interface points A and D consist of a #10−32 fastener mounted on the isolation plate structure (with allowable engagement of 0.25 inches (6.4 mm) into the threaded portion of the module mating part) and female provisions for two (2) guide pins through which the module mounting brackets will be attached during setup/installation of the PaRIS/ISPR in the module.

Module to PaRIS hardware interface characteristics for Isolation Plate interface points A and D are shown in Figure B−3.2.3.1.1.1−1 (Isolation Plate Interfaces) along with a crosshatched mounting surface for the module mounting hardware. Isolation plate at-tachment interfaces A and D are nickel plated Aluminum 7075, and are flat to within 0.003” (0.08 mm).

Figure 3.2.3.1.1.1−2 (Isolation Plate to USL Interface) shows the ARIS to USL bridge fittings used at Isolation Plate interface points A and D and the interface locations these fittings will have with the USL structure. The bridge fittings and their locations are the same for PaRIS. The interface is the same for the CAM.

Isolation plate interface points B and E consist of provisions for a PaRIS provided pin (Boeing P/N 683−61571−4 made from A286 Stainless Steel) which will be installed on the isolation plate for mating with a fitting on module structure. The 683−61571−4 pin is installed on the isolation plate during installation and setup of the PaRIS/ISPR in the module.

To assure adequate fit of the isolation plate assembly during on−orbit operations, the module provided center isolation plate pin fitting centerline must be offset .050” (1.27

mm) in the negative Z axis. Module interface requirements for attachment of the center isolation plate pin to module structure is the same as for ARIS and is shown in Figure 3.2.3.1.1.1−5 (Isolation Plate to Module Interfaces).

Module interface requirements for attachment of the isolation plate center pin, forward and rear bridge brackets to the USL is the same as for ARIS and is shown in Figure 3.2.3.1.1.1−6 and −7 (Isolation Plate to Module Interfaces − USL Only). The interface is the same for the CAM.

The PaRIS/ISPR must be centered with respect to its rack bay (x−axis) at installation to provide adequate clearance during on−orbit operations. Interface points C and F lo-cated at the rear of the isolation plate provide provisions for a fitting containing a guide pin to align the isolation plate in the module rack bay at the approximate center of the rack bay.

Isolation plate interface points C and F consist of an insert for a #10−32 fastener (insert is 10 threads maximum depth) and female provisions for three (3) guide pins through

B−15 which the module mounting bracket will be attached during setup/installation of the PaRIS/ISPR in the module.

Module to PaRIS hardware interface characteristics for Isolation Plate interface points C and F are the same as for ARIS and is shown in Figure 3.2.3.1.1.1−14 (Isolation Plate Interfaces) along with a crosshatched mounting surface for the module mounting hard-ware. Isolation plate attachment interfaces C and F are nickel plated Aluminum 7075, and are flat to within 0.003” (0.08 mm).

Figure 3.2.3.1.1.1−15 (Isolation Plate to USL Interface) shows the ARIS to USL bridge fittings used at Isolation Plate interface points C and F and the interface locations these fittings will have with the USL structure. The bridge fittings and their locations are the same for PaRIS. The PaRIS configuration (fittings installed at interface points C and F) in the USL consists of two 0.182” to 0.187” (4.62 mm to 4.75 mm) diameter conical guide pins (one per fitting on each side of the isolation plate, P/N CA4020−4, Tridair) that engage into slots on the face of the USL standoff frames that are 0.196” to 0.199” (4.83 mm to 5.05 mm) wide by 1.0” (25.4 mm) long. The interface is the same for the

CAM.

B−16

U S

L an d C

A M

7.184 (182.47)

P aR

IS

D

IA

T H

R U

.1

(3

.1 9)

.1

(3

.1 8)

A

0.

(1

8.

7)

FIGURE B−3.2.3.1.1.1−1 ISOLATION PLATE INTERFACES

B−17

B−3.2.3.1.2 UPPER ISOLATION UNIT ATTACHMENT INTERFACES

The upper isolation units will require a single rigid attachment to module structure re-ferred to hereafter as Interface Point “G” and shown in Figure B−3.2.3.1−1 (PaRIS/ISPR Module Structural Attach Points).

B−3.2.3.1.2.1 UPPER ISOLATION UNIT INSTALLATION REQUIREMENTS

The upper isolation units will be attached to a PaRIS provided fitting defined in Figure B−3.2.3.1.2.1−1 (Upper Isolation Unit Interface). This fitting will attach to structure us-ing a module provided fitting shown in Figures 3.2.3.1.2.1−4 (for the USL) and B−3.2.3.1.2.1−2 (for the CAM).

B−18

FIGURE B−3.2.3.1.2.1−1 UPPER ISOLATION PLATE UNIT INTERFACE

B−19

−C−

−A−

−B−

0.40 (10.15)

+Z

+Z

+X

+Y

CAM STRUCTURE

I/F PLANE (REF)

CAM

CAM

PARIS

PARIS

RACK CENTER

LINE

MS51830CA201L 1 PL

RACK CENTER LINE

MODULE PIVOT

POINT

FULL RADIUS

0.368 (REF)

(9.35)

0.20 (5.08)

0.374 (9.50)

0.127 0.130

(3.226) (3.302)

75.850 (REF)

(1926.59)

0.063 (1.60)

DETAIL K

−B−

0.555 (14.10)

0.02

(0.50)

A

A

B

B

C

CO

O

FIGURE B−3.2.3.1.2.1−2 UPPER ISOLATION UNIT INTERFACE SUPPORT BRACKET (CAM)

B−20

B−3.2.3.1.3 SNUBBER ATTACHMENT INTERFACES

The snubber cup(s) provide containment of the PaRIS/ISPR during on−orbit operation of the PaRIS. Each of these snubber cups will each require a single rigid attachment to module structure referred to hereafter as Interface Points H, I, J, and K and shown in Figure B−3.2.3.1−1 (PaRIS/ISPR Module Structural Attach Points).

B−3.2.3.1.3.1 SNUBBER INSTALLATION REQUIREMENTS

Each of the four snubber cups will require a single attachment to module structure. The locations of these module interfaces are identified in Figure 3.2.3.1.3.1−1, for all mod-ules and 3.2.3.1.3.1−2 (Snubber Interfaces − USL Only). The interfaces are the same for the CAM.

B−3.2.3.1.4 PIVOT FITTING ATTACHMENT INTERFACES

PaRIS/ISPRs located in the USL and the CAM utilize a pivot bracket designed to pro-vide rotation capabilities for PaRIS/ISPRs and non−PaRIS/ISPRs. This pivot bracket will provide identical capabilities as the existing ISS pivot bracket while not violating the dynamic envelope of the PaRIS/ISPR. The PaRIS/ISPR pivot bracket configuration is shown in Boeing drawing 683−61711.

B−3.2.3.1.4.1 PIVOT FITTING INSTALLATION REQUIREMENTS

The pivot fittings will be attached to module structure at two places using the same in-terface as was used for the lower snubbers. The locations of these interfaces are iden-tified in Figure B−3.2.3.1−1 (Snubber Interfaces) as Points H, I, J, and K.

B−3.2.4 INSTALLATION ENVELOPE

The PaRIS components mounted on the upper surface of the ISPR are contained within the sweep envelope that occurs…