SSP_42004_Part_1_Revision_L.docx

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Human Space Flight Technical Integration Contract (HSFTIC) Federal contract opportunity
Solicitation number
80JSC019R0023
Issued by
National Aeronautics and Space Administration Johnson Space Center

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This is a notice for a Request for Proposal for the Human Space Flight Technical Integration Contract. NASA/JSC plans to issue the RFP on or about November 1, 2019, with an anticipated offer due date of December 11, 2019. The procurement is a total small business set-aside with a NAICS code of 541715 and size standard of 1,250. The contract will provide technical integration services for human space flight programs. All responsible sources may submit an offer which will be considered. The solicitation and related documents will be available at the listed websites. Prospective offerors should notify the office of their intent to submit an offer and monitor the sites for amendments.

SSP 42004 Part 1 Revision L

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Mobile Servicing System (MSS) to User (Generic) Interface Control Document Part I

International Space Station Program

Revision L

April 2018

EAR 99. This document contains data within the purview of the U.S. Export Administration Regulations (EAR), 15 CFR 730-774, and is export controlled. The document may be used only in the International Space Station (ISS) program to fulfill responsibilities of the Parties or of a Cooperating Agency of an ISS Partner in furtherance of the ISS Intergovernmental Agreement. Re-transfer or disclosure to, or use by, any persons other than citizens of ISS Program International Partner countries, or use for any other purpose, requires prior U.S. Government authorization.

National Aeronautics and Space Administration International Space Station Program Johnson Space Center Houston, Texas Contract No.: NNJ12GA46C

SSP 42004, Part 1 Revision L

REVISION AND HISTORY

REV.
DESCRIPTION
PUB. DATE
C
Totally revised Space Station Freedom Document into an International Space Station Alpha Document
03-14-94
IRN 0145 (Reference SSCD 000145, EFF. 10-31-95)
10-18-96
IRN 0102 (Reference SSCD 000102R3, EFF. 03-07-96) (Release to File)
10-29-98
IRN 0151 (Reference SSCD 000151R1, EFF. 02-18-98)
10-29-98
D
Revision D (Reference SSCD 000442, EFF. 11-22-96)
10-29-98

Incorporate the following PIRNs: 42004-CS-0004A, 42004-NA-0002, 42004-NA-0003, 42004-NA-0004, 42004-NA-0007D, 42004-NA-0008A, 42004-NA-0009C, 42004-NA-0010B, 42004-NA-0013A

E
Revision E (Reference per SSCD 000729, EFF. 09-08-98)
03-19-99

For information: The PIRNs rolled into Revision D by previously released IRNs or as part of Revision D are noted below with their associated SSCNs.

PIRN 42004-NA-0008AIRN 0145SSCN 000145
PIRN 42004-NA-0009CIRN 0102SSCN 000102
PIRN 42004-NA-0010BIRN 0102SSCN 000102
PIRN 42004-NA-0007DIRN 0151SSCN 000151
PIRN 42004-CS-0004AIRN N/ASSCN 000442
PIRN 42004-NA-0002IRN N/ASSCN 000442
PIRN 42004-NA-0003IRN N/ASSCN 000442
PIRN 42004-NA-0004IRN N/ASSCN 000442
PIRN 42004-NA-0007DIRN N/ASSCN 000442
PIRN 42004-NA-0008AIRN N/ASSCN 000442
PIRN 42004-NA-0009CIRN N/ASSCN 000442
PIRN 42004-NA-0010BIRN N/ASSCN 000442
PIRN 42004-NA-0013AIRN N/ASSCN 000442

Note: Revision E was developed in a special meeting in February 1997 with International Partners per IFM 1MSS17013-03. This document was reviewed line by line and issues worked out and agreed to. Any PIRNs outstanding were withdrawn and coordinated as part of the meeting.

REVISION AND HISTORY - Continued

REV.
DESCRIPTION
PUB. DATE
F
Revision F (Reference per SSCD 002801, EFF. 02-07-00)
06-15-00

Incorporates the following PIRNs associated with the appropriate SSCNs.

PIRN 42004-NA-0025DIRN 0001SSCN 000843
PIRN 42004-NA-0026DIRN 0001SSCN 000843
PIRN 42004-NA-0027CIRN 0001SSCN 000843
PIRN 42004-NA-0028CIRN 0001SSCN 000843
PIRN 42004-NA-0029CIRN 0001SSCN 000843
PIRN 42004-NA-0030CIRN 0001SSCN 000843
PIRN 42004-NA-0031CIRN 0001SSCN 000843
PIRN 42004-NA-0032IRN N/ASSCN 0002801
PIRN 42004-NA-0034CIRN 0001SSCN 000843
PIRN 42004-NA-0038AIRN 0001SSCN 000843
PIRN 42004-NA-0039CIRN 0001SSCN 000843
PIRN 42004-NA-0040IRN N/ASSCN 0002801
PIRN 42004-NA-0041IRN N/ASSCN 0002801
PIRN 42004-NA-0045IRN N/ASSCN 0002801
PIRN 42004-NA-0046IRN N/ASSCN 0002801
PIRN N/AIRN 0002SSCN 1214

Revision F also accounts for impacts identified in the following SSCNs: 000298, 000653, 000845, 000591, 000583, 000773, 001004, 000832, 000671, 000877, 000894, 000915, 000844, 001029, 001051, 001052, 001026, 000470, 000823, 000673, 000585, 000053, 000588, and 000554.

Revision F also closes IRN 0346 for SSCN 000346 as the PIRN 42004-NA-0020 was withdrawn.

Revision F also closes the impacts identified in SSCNs 000721 and 001127 as the impacts are overcome by events.

REV.
DESCRIPTION
PUB. DATE
G
Revision G (per SSCD 006771, EFF. 04-17-03)
07-24-03

Revision G incorporates the following approved PIRNs/IRNs associated with the appropriate SSCNs.

PIRNIRNSSCN
42004-NA-0033N/A000600
42004-NA-0035N/A006771
42004-NA-0036N/A006771
42004-NA-0042B0028000737
42004-NA-00430028000737
42004-NA-0044N/A001262
42004-NA-0049CN/A006771
42004-NA-0050AN/A006771
42004-NA-0051CN/A006771
42004-NA-0052AN/A006771
42004-NA-0053BN/A006771
42004-NA-0055BN/A006771
42004-NA-0056BN/A006771
42004-NA-0057BN/A006771
42004-NA-0058CN/A000843
42004-NA-0059CN/A006771
42004-NA-0060AN/A006771
42004-NA-0061BN/A006771
42004-NA-0062N/A006771
42004-NA-0063DN/A006771
42004-NA-0064AN/A006771
42004-NA-0065DN/A006771
42004-NA-0066CN/A006771
42004-NA-0071N/A006771
42004-NA-0072N/A006771
42004-NA-0073N/A006771
42004-NA-0074N/A006771
N/A0007001711
N/A0018001938
N/A0033002588
REV.
DESCRIPTION
PUB. DATE
G
Revision G closes the following SSCNs as they were withdrawn or overcome by events:
N/A0022002189
N/AN/A000567
N/AN/A000889
N/AN/A001481
N/AN/A001594
H
Revision H (per SSCD 008719, EFF. 05-26-05)
08-29-05

Revision H incorporates the following approved PIRNs/IRNs associated with the appropriate SSCNs.

PIRNIRNSSCN
42004-NA-0054HN/A008719
42004-NA-0069DN/A008719
42004-NA-0076DN/A008719
42004-NA-00770034/0029005645/3827
42004-NA-00780036006154
42004-NA-0079BN/A008719
42004-NA-0080BN/A008719
42004-NA-0082AN/A008719
42004-NA-0083A0038006568
42004-NA-0084CN/A008719
42004-NA-0085N/A008719
42004-NA-0086DN/A008719
42004-NA-0087AN/A008719
42004-NA-00880040004967
42004-NA-0089AN/A008719
42004-NA-0090AN/A008719
J
Revision J (per SSCD 012906, 11-03-11)
12-20-11

Revision J incorporates the following approved PIRNs/IRNs associated with the appropriate SSCNs.

PIRNIRNSSCN
42004-NA-0081CN/A012906
42004-NA-0091BN/A012906
42004-NA-0093IN/A012906
42004-NA-0094AN/A012906
42004-NA-0095EN/A012906
REV.
DESCRIPTION
PUB. DATE
PIRNIRNSSCN
42004-NA-0096AN/A012906
42004-NA-0097A0045008942
42004-NA-0098E0005001202
42004-NA-0098E0003001662
42004-NA-0098E0009001920
42004-NA-0098E0008001929
42004-NA-0098E0010002107
42004-NA-0098E0015002130
42004-NA-0098E0011002133
42004-NA-0098E0012002134
42004-NA-0098E0019002135
42004-NA-0098E0014002191
42004-NA-0098E0017002199
42004-NA-0098E0013002345
42004-NA-0098E0016002485
42004-NA-0098E0027002877
42004-NA-0098E0023002915
42004-NA-0098E0021003213
42004-NA-0098E0037003282
42004-NA-0098E0024003690
42004-NA-0098E0025003746
42004-NA-0098E0030004152
42004-NA-0098E0026004676
42004-NA-0098E0035004785
42004-NA-0098E0031005263
42004-NA-0098E0032005529
42004-NA-0098E0039005820
42004-NA-0098E0042009993
42004-NA-0098E0043010119
42004-NA-0099DN/A012906
42004-NA-0100B0041010008
42004-NA-0101N/A012906
42004-NA-0102AN/A012906
42004-NA-0103BN/A012906
42004-NA-0104A046009332
42004-NA-0105N/A012906
42004-NA-0106N/A012906
42004-NA-0107AN/A012906
42004-NA-0108CN/A012906
REV.
DESCRIPTION
PUB. DATE
K
Revision K (per SSCD 013845, effective 05-16-14)
05-16-14

Revision K incorporates the following approved PIRNs/IRNs associated with the

PIRNIRNSSCN
42004-NA-0109013845
42004-NA-0110A013845
42004-NA-0111013845
42004-NA-0112A013845
42004-NA-0113B013845
42004-NA-0114013845
42004-NA-0115A013845
L
Revision L (Reference per SSCD 15886, EFF. 05-20-18)
Program Release
09-05-18

Revision L incorporates the following approved PIRNs:

PIRNSSCN
42004-NA-011715886
42004-NA-0118C15886
42004-NA-0119A15886
42004-NA-0120A15886
42004-NA-0121A15886
42004-NA-012215886
42004-NA-0123A15886

Revision L also incorporates the following approved SSCNs:

013393, 013573

SSP 42004, Part 1 Revision L

Classified as EAR99 - Refer to Title Page

PREFACE

Mobile Servicing System (MSS) to User (generic) interface control DOCUMENT part 1 SSP 42004, Mobile Servicing System (MSS) to User Interface Control Document (ICD) Part I shall be implemented on all new Program contractual and internal activities and shall be included in any existing contracts through contract changes. This document is under the control of the Space Station Control Board (SSCB) with the concurrence of Canadian Space Agency (CSA), and any changes or revisions will be approved by the SSCB and CSA.

SEE DIRECTIVE APPROVAL

Kirk A. Shireman ISS Program Manager National Aeronautics and Space Administration

Date

SEE DIRECTIVE APPROVAL

Kenneth J. Podwalski Director, Space Exploration Operations and Infrastructure and Program Manager, Canadian Space Station Program Canadian Space Agency

Date i

INTERNATIONAL SPACE STATION PROGRAM

Mobile Servicing System (MSS) to User (generic) interface control DOCUMENT part 1

CONCURRENCE

April 2018

Prepared by:
Gregg Singer

MAPI OP

Book coordinator/DQA Representative org

/s/ Gregg D. Singer

4/18/18 signature

DATE

Concurred by:
Walter J. Lueke

NASA-OM

nasa icwg chair

ORG

/s/ Walter J. Lueke

4/20/18

SIGNATURE

DATE

ii

TABLE OF CONTENTS

PARAGRAPHPAGE
1.0INTRODUCTIOn1-1
1.1PURPOSE and scope1-1
1.1.1SECTION A3 Purpose and Scope1-4
1.1.2SECTION B3 Purpose and Scope1-4
1.1.3SECTION C3 Purpose and Scope1-4
1.1.4SECTION D3 Purpose and Scope1-4
1.1.5SECTION E3 Purpose and Scope1-4
1.1.6SECTION F3 Purpose and Scope1-4
1.1.7SECTION G3 Purpose and Scope1-4
1.1.8Section H3 purpose and scope1-4
1.1.9SECTION I3 PURPOSE AND SCOPE1-5
1.1.10SECTION j3 PURPOSE AND SCOPE1-5
1.1.11SECTION k3 PURPOSE AND SCOPE1-5
1.1.12SECTION l3 PURPOSE AND SCOPE1-5
1.1.13SECTION m3 PURPOSE AND SCOPE1-5
1.1.14section n3 purpose and scope1-5
1.1.15section O3 purpose and scope1-5
1.1.16section P3 Purpose and Scope1-5
1.1.17section Q3 Purpose and Scope1-5
1.1.18section R3 purpose and scope1-6
1.1.19deleted1-6
1.1.20Appendix B Purpose and Scope1-6
1.1.21appendix c purpose and scope1-6
1.1.22appendix d purpose and scope1-6
1.1.23appendix e purpose and scope1-6
1.2PRECEDENCE1-6
1.3Change Authority1-6
1.4COMMONALITY OF GRAPPLE FIXTURES AND END EFFECTORS
(REFERENCE ONLY)1-6
1.5Definition of the Term “User"1-7
1.6interface responsibilities1-7
2.0DOCUMENTS2-1
2.1applicable documents2-1
2.2Reference Documents2-6
2.3drawings2-8
3.0general3-1
3.1Engineering Units and Tolerances3-1
SECTION A3PDGF TO USER INTERFACESA3-1
A3.0REQUIREMENTSA3-1
A3.1GENERALA3-1
A3.1.1INTERFACE DESCRIPTIONA3-1
A3.1.2COORDINATE SYSTEMSA3-1
A3.1.3PDGF INTERFACE FUNCTIONSA3-1
A3.1.4USER INTERFACE FUNCTIONSA3-1
A3.1.5INTERFACE RESPONSIBILITIESA3-3
A3.2INTERFACE REQUIREMENTSA3-4
A3.2.1PDGF INTERFACE REQUIREMENTSA3-4
A3.2.1.1PDGF ENVELOPESA3-4
A3.2.1.2PDGF MECHANICAL INTERFACEA3-4
A3.2.1.3PDGF STRUCTURAL INTERFACEA3-4
A3.2.1.3.1IMPACT LOADSA3-5
A3.2.1.3.2PDGF WEIGHTA3-5
A3.2.1.4PDGF ELECTRICAL INTERFACE HARDWAREA3-5
A3.2.1.4.1ELECTRICAL CONNECTORSA3-7
A3.2.1.5PDGF POWER INTERFACEA3-7
A3.2.1.5.1POWER QUALITYA3-7
A3.2.1.5.2FAULT PROTECTIONA3-8
A3.2.1.5.3DELETEDA3-8
A3.2.1.5.4ELECTRICAL CONNECTOR DEADFACINGA3-8
A3.2.1.5.5REDUNDANCYA3-8
A3.2.1.6Command & Data Handling INTERFACESA3-10
A3.2.1.6.1MIL-STD-1553b bus INTERFACESA3-10
A3.2.1.6.1.1PROVIDE OUTPUT AMPLITUDEA3-10
A3.2.1.7SYNC, CONTROL, AND VIDEO INTERFACESA3-10
A3.2.1.7.1VIDEO, SYNC, AND CONTROL TRANSMISSION AND SIGNAL CHARACTERISTICSA3-10
A3.2.1.7.2SYNC AND VIDEO POWER LEVELSA3-10
A3.2.1.8PASSIVE THERMAL INTERFACEA3-11
A3.2.1.8.1DELETEDA3-11
A3.2.1.8.2PDGF THERMAL CONDUCTANCEA3-11
A3.2.1.9ENVIRONMENTSA3-11
A3.2.1.9.1ELECTROMAGNETIC EFFECTSA3-11
A3.2.1.9.1.1ELECTROMAGNETIC COMPATIBILITYA3-11
A3.2.1.9.1.2GROUNDINGA3-11
A3.2.1.9.1.3BONDINGA3-11
A3.2.1.9.1.4CABLE AND WIRE DESIGNA3-11
A3.2.1.9.1.5ELECTROSTATIC DISCHARGEA3-11
A3.2.1.9.1.6CORONAA3-11
A3.2.2USER INTERFACE REQUIREMENTSA3-12
A3.2.2.1USER ENVELOPESA3-12
A3.2.2.1.1DELETEDA3-12
A3.2.2.2USER MECHANICAL INTERFACEA3-12
A3.2.2.3USER STRUCTURAL INTERFACEA3-12
A3.2.2.3.1IMPACT LOADSA3-15
A3.2.2.3.2USER STIFFNESS REQUIREMENTSA3-15
A3.2.2.3.3SHOCK LIMITA3-16
A3.2.2.4USER ELECTRICAL INTERFACE HARDWAREA3-16
A3.2.2.4.1ELECTRICAL CONNECTORSA3-16
A3.2.2.5USER POWER INTERFACEA3-17
A3.2.2.5.1POWER QUALITYA3-17
A3.2.2.5.2FAULT PROTECTIONA3-17
A3.2.2.5.3SSRMS SINGLE STRING POWER USERA3-17
A3.2.2.5.4ELECTRICAL CONNECTOR DEADFACINGA3-17
A3.2.2.6user Command & Data Handling INTERFACESA3-17
A3.2.2.6.1MIL-STD-1553B bus INTERFACESA3-17
A3.2.2.6.1.1BUS TERMINATIONA3-18
A3.2.2.6.1.2MIL-STD-1553b BUS ADDRESSESA3-22
A3.2.2.6.1.3PROVIDE OUTPUT AMPLITUDEA3-22
A3.2.2.6.1.4PAYLOAD RT RESPONSE TIMEA3-22
A3.2.2.7SYNC, CONTROL, AND VIDEO INTERFACESA3-22
A3.2.2.7.1VIDEO, SYNC, AND CONTROL TRANSMISSION AND SIGNAL CHARACTERISTICSA3-22
A3.2.2.7.2SYNC AND VIDEO POWER LEVELSA3-22
A3.2.2.8PASSIVE THERMAL INTERFACEA3-23
A3.2.2.8.1PDGF THERMAL CONDUCTANCEA3-23
A3.2.2.9ENVIRONMENTSA3-23
A3.2.2.9.1ELECTROMAGNETIC EFFECTSA3-23
A3.2.2.9.1.1ELECTROMAGNETIC COMPATIBILITYA3-23
A3.2.2.9.1.2GROUNDINGA3-23
A3.2.2.9.1.3BONDINGA3-23
A3.2.2.9.1.4CABLE AND WIRE DESIGNA3-23
A3.2.2.9.1.5ELECTROSTATIC DISCHARGEA3-23
A3.2.2.9.1.6CORONAA3-23
SECTION B3MCAS TO USER INTERFACEB3-1
B3.0REQUIREMENTSB3-1
B3.1GENERALB3-1
B3.1.1INTERFACE DESCRIPTIONB3-1
B3.1.1.1MCAS ACTIVE HALF DESCRIPTIONB3-1
B3.1.1.1.1GUIDE VANE ASSEMBLY DESCRIPTIONB3-2
B3.1.1.1.2CAPTURE LATCH ASSEMBLY DESCRIPTIONB3-2
B3.1.1.1.3UMBILICAL MECHANISM ASSEMBLY DESCRIPTIONB3-2
B3.1.1.2MCAS PASSIVE HALF DESCRIPTIONB3-6
B3.1.1.3EXTERNAL BERTHING CAMERA SYSTEM DESCRIPTIONB3-6
B3.1.1.3.1EBCS TARGET DESCRIPTIONB3-7
B3.1.1.3.2EBCS AVIONICS DESCRIPTIONB3-7
B3.1.1.4STRUCTURAL/MECHANICAL INTERFACE DESCRIPTIONB3-7
B3.1.1.5AVIONICS INTERFACE DESCRIPTIONB3-9
B3.1.1.5.1ELECTRICAL POWER INTERFACE DESCRIPTIONB3-9
B3.1.1.6DATA INTERFACE DESCRIPTIONB3-9
B3.1.2COORDINATE SYSTEMB3-9
B3.1.3MCAS INTERFACE FUNCTIONSB3-12
B3.1.4USER INTERFACE FUNCTIONSB3-12
B3.1.5INTERFACE HARDWARE RESPONSIBILITIESB3-12
B3.1.5.1HARDWARE OTHER THAN EBCS RELATEDB3-12
B3.1.5.2RESPONSIBILITY FOR THE EXTERNAL BERTHING CAMERA SYSTEMB3-13
B3.1.5.2.1EBCS TARGETB3-13
B3.1.5.2.2EBCS CAMERAB3-13
B3.1.6SYSTEM OPERATIONAL DESCRIPTIONB3-13
B3.2INTERFACE REQUIREMENTSB3-14
B3.2.1MCAS INTERFACE REQUIREMENTSB3-14
B3.2.1.1ENVELOPE REQUIREMENTSB3-14
B3.2.1.1.1STATIC AND TRANSLATION ENVELOPEb3-18
B3.2.1.1.1.1MAXIMUM STATIC ENVELOPEb3-18
B3.2.1.1.1.2ENVELOPE FOR TRANSLATION BETWEEN PORT AND STARBOARDb3-19
B3.2.1.2MECHANICAL ATTACHMENTb3-19
B3.2.1.2.1MCAS GUIDE VANE ASSEMBLY INTERFACEb3-19
B3.2.1.2.2MCAS ACTIVE HALF CAPTURE LATCH ASSEMBLYb3-19
B3.2.1.2.3MCAS ACTIVE HALF UMAb3-23
B3.2.1.2.4MCAS ACTIVE HALF TARGET ACCOMMODATIONb3-23
B3.2.1.3STRUCTURAL LOADSb3-23
B3.2.1.3.1(RESERVED)b3-23
B3.2.1.3.2MCAS IMPACT LOADSb3-23
B3.2.1.3.2.1GVA CONTACT FORCESb3-23
B3.2.1.3.2.2CLA CONTACT FORCESb3-24
B3.2.1.3.3MCAS STIFFNESS REQUIREMENTSb3-24
B3.2.1.3.4MCAS ACTIVE HALF TO USER INTERFACE LOADSb3-24
B3.2.1.3.4.1PRELOADb3-24
B3.2.1.3.4.2INTERFACE LOADSb3-25
B3.2.1.3.4.2.1TIME CONSTRAINT INTERFACE LOADSb3-25
B3.2.1.3.4.3LOAD SPECTRAb3-25
B3.2.1.3.4.4ON-ORBIT NATURAL FREQUENCYb3-26
B3.2.1.3.5ON-ORBIT ACCELERATION WITH MATED USERb3-26
B3.2.1.3.6ACTIVE UMA LOAD <TBR b3-2>b3-26
B3.2.1.4ELECTRICAL CONNECTORSb3-26
B3.2.1.5MCAS ELECTRICAL INTERFACEb3-26
B3.2.1.5.1POWER QUALITYb3-27
B3.2.1.5.1.1POWER ALLOCATIONb3-27
B3.2.1.5.1.2KEEP ALIVE POWERb3-27
B3.2.1.5.2FAULT PROTECTIONb3-27
B3.2.1.5.3DELETEDb3-28
B3.2.1.5.4ELECTRICAL CONNECTOR DEADFACINGb3-28
B3.2.1.5.5REDUNDANCYb3-28
B3.2.1.6MCAS Command & Data Handling INTERFACEb3-28
B3.2.1.6.1PROVIDE OUTPUT AMPLITUDEb3-30
B3.2.1.6.2MIL-STD-1553b ADDRESSb3-30
B3.2.1.7SYNC, CONTROL AND VIDEO INTERFACESb3-30
B3.2.1.8ON-ORBIT THERMAL ENVIRONMENTSb3-30
B3.2.1.8.1THERMAL ENVIRONMENTb3-30
B3.2.1.8.2INDUCED THERMAL ENVIRONMENTSb3-30
B3.2.1.8.3MATING TEMPERATURE DIFFERENTIALSb3-31
B3.2.1.9ENVIRONMENTSb3-31
B3.2.1.9.1ELECTROMAGNETIC EFFECTSb3-31
B3.2.1.9.1.1ELECTROMAGNETIC COMPATIBILITYb3-31
B3.2.1.9.1.2GROUNDINGb3-31
B3.2.1.9.1.3ELECTRICAL BONDINGb3-31
B3.2.1.9.1.4CABLE AND WIRE DESIGNb3-31
B3.2.1.9.1.5ELECTROSTATIC DISCHARGEb3-32
B3.2.1.9.1.6CORONAb3-32
B3.2.1.10MASS AND CENTER OF GRAVITYb3-32
B3.2.2USER INTERFACE REQUIREMENTSb3-32
B3.2.2.1ENVELOPE REQUIREMENTSb3-32
B3.2.2.1.1MAXIMUM STATIC ENVELOPEb3-32
B3.2.2.1.2ENVELOPE FOR TRANSLATION BETWEEN PORT AND STARBOARDb3-32
B3.2.2.2MECHANICAL INTERFACEb3-33
B3.2.2.2.1MCAS GUIDE PIN ASSEMBLY INTERFACESb3-33
B3.2.2.2.2USER PASSIVE HALF CAPTURE BARb3-33
B3.2.2.2.2.1CAPTURE BAR CONTINGENCY OPERATIONb3-33
B3.2.2.2.2.2CONTACT SURFACESb3-33
B3.2.2.2.3USER PASSIVE HALF UMAb3-33
B3.2.2.2.4USER PASSIVE HALF CAMERA ACCOMMODATIONb3-33
B3.2.2.3STRUCTURAL LOADSb3-34
B3.2.2.3.1USER IMPACT LOADSb3-34
B3.2.2.3.1.1GUIDE PIN CONTACT FORCESb3-34
B3.2.2.3.1.2CAPTURE BAR CONTACT FORCESb3-34
B3.2.2.3.2USER STIFFNESS REQUIREMENTSb3-34
B3.2.2.3.3USER TO MCAS INTERFACE LOADSb3-34
B3.2.2.3.3.1PRELOADb3-34
B3.2.2.3.3.2INTERFACE LOADb3-35
B3.2.2.3.3.3LOAD SPECTRUMb3-35
B3.2.2.3.3.4ON-ORBIT NATURAL FREQUENCYb3-35
B3.2.2.3.3.5PASSIVE UMA LOAD <TBR b3-5>b3-35
B3.2.2.3.4ACCELERATION ENVIRONMENTb3-35
B3.2.2.4USER ELECTRICAL CONNECTORSb3-36
B3.2.2.5USER ELECTRICAL INTERFACEb3-36
B3.2.2.5.1POWER QUALITYb3-36
B3.2.2.5.1.1POWER ALLOCATIONb3-37
B3.2.2.5.2FAULT PROTECTIONb3-37
B3.2.2.5.3DELETEDb3-37
B3.2.2.5.4REDUNDANCYb3-37
B3.2.2.5.5DEADFACINGb3-37
B3.2.2.6USER CDH INTERFACEb3-37
B3.2.2.6.1PROVIDE OUTPUT AMPLITUDEb3-38
B3.2.2.6.2MIL-STD-1553b bus ADDRESSb3-38
B3.2.2.6.3BUS STUB LENGTHb3-38
B3.2.2.6.4MIL-STD-1553B CHARACTERISTICSb3-38
B3.2.2.6.4.1PROVIDE SIGNAL AMPLITUDEb3-38
B3.2.2.6.4.2RECEIVE SIGNAL AMPLITUDEb3-38
B3.2.2.7SYNC, CONTROL AND VIDEO INTERFACEb3-38
B3.2.2.8ON-ORBIT THERMAL ENVIRONMENTSb3-38
B3.2.2.8.1THERMAL ENVIRONMENTb3-38
B3.2.2.8.2INDUCED THERMAL ENVIRONMENTSb3-39
B3.2.2.8.3MATING TEMPERATURE DIFFERENTIALSb3-39
B3.2.2.8.4UMA PASSIVE HALF OPERATING TEMPERATUREb3-39
B3.2.2.9ENVIRONMENTSb3-39
B3.2.2.9.1ELECTROMAGNETIC EFFECTSb3-39
B3.2.2.9.1.1ELECTROMAGNETIC COMPATIBILITYb3-39
B3.2.2.9.1.2GROUNDINGb3-39
B3.2.2.9.1.3BONDINGb3-39
B3.2.2.9.1.4CABLE AND WIRE DESIGNb3-39
B3.2.2.9.1.5ELECTROSTATIC DISCHARGEb3-39
B3.2.2.9.1.6CORONAb3-39
B3.2.2.10MASS AND CENTER OF GRAVITYb3-40
B3.2.2.11USER COORDINATE SYSTEMB3-40
SECTION C3SDGF TO USER INTERFACESC3-1
C3.0REQUIREMENTSc3-1
C3.1Generalc3-1
C3.1.1Interface Descriptionc3-1
C3.1.1.1Coordinate Systemsc3-1
C3.1.1.1.1H-Fixture Operations Coordinate Systemc3-3
C3.1.1.1.2Micro Fixture Operations Coordinate Systemc3-3
C3.1.1.2SDGF INTERface layer Interface Functionsc3-3
C3.1.1.3User Interface Functionsc3-3
C3.1.2Interface Responsibilitiesc3-3
C3.2Interface Requirementsc3-6
C3.2.1SDGF Interface Requirementsc3-6
C3.2.1.1SDGF Mechanical Interfacec3-6
C3.2.1.2SDGF Structural Interfacec3-6
C3.2.1.2.1Impact Energyc3-7
C3.2.1.3SDGF thermal control interfacec3-7
C3.2.1.4Electromagnetic Environmentc3-7
C3.2.1.4.1deletedc3-7
C3.2.1.4.2deletedc3-7
C3.2.1.4.3Bondingc3-7
C3.2.1.4.4Electrostatic Dischargec3-7
C3.2.1.4.5deletedc3-7
C3.2.2User Interface Requirementsc3-8
C3.2.2.1Envelopesc3-8
C3.2.2.1.1OTCM clearance Envelopec3-8
C3.2.2.1.2TARGET VIEWINGc3-8
C3.2.2.1.3EVA contingency release Accessc3-8
C3.2.2.2User Mechanical Interfacec3-8
C3.2.2.2.1user socket interfacec3-8
C3.2.2.3User Structural Interfacec3-8
C3.2.2.3.1User 7/16 inch standard bolt head operational characteristicsc3-15
C3.2.2.3.2Impact Energyc3-15
C3.2.2.3.2.1IMPACT ENERGY DURING ROBOTIC CAPTUREc3-15
C3.2.2.3.2.2IMPACT ENERGY DURING ROBOTIC MANIPULATIONc3-15
C3.2.2.3.2.3IMPACT ENERGY AT A WORKSITEc3-16
C3.2.2.3.3user Natural Frequency (for manipulation)c3-16
C3.2.2.3.4User Stiffness (for stabilization)c3-16
C3.2.2.3.5OTCM Umbilical Mechanism Mate Loadsc3-16
C3.2.2.3.6shock limitc3-16
C3.2.2.4user Electrical connectorsc3-17
C3.2.2.5User Electrical Power Interfacec3-17
C3.2.2.5.1power qualityc3-17
C3.2.2.5.2Fault protectionc3-17
C3.2.2.5.3Electrical Connector Deadfacingc3-18
C3.2.2.6User Data Interfacec3-18
C3.2.2.6.1provide output amplitudec3-18
C3.2.2.6.2bus stub lengthc3-18
C3.2.2.6.3bus addressesc3-18
C3.2.2.7user Video Interfacec3-18
C3.2.2.8User Thermal Control Interfacec3-18
C3.2.2.9Electromagnetic Environmentc3-18
C3.2.2.9.1Electromagnetic Compatibilityc3-18
C3.2.2.9.2Groundingc3-18
C3.2.2.9.3Bondingc3-18
C3.2.2.9.4Cable and Wire Designc3-19
C3.2.2.9.5Electrostatic Dischargec3-19
C3.2.2.9.6Coronac3-19
SECTION D3MICRO CONICAL FITTING TO USER INTERFACESD3-1
D3.0REQUIREMENTSD3-1
D3.1GENERALD3-1
D3.1.1INTERFACE DESCRIPTIONd3-1
D3.1.1.1COORDINATE SYSTEMSd3-3
D3.1.1.1.1MCF OPERATING COORDINATE SYSTEMd3-3
D3.1.1.2MCF INTERFACE FUNCTIONSd3-5
D3.1.1.3USER INTERFACE FUNCTIONSd3-5
D3.2INTERFACE REQUIREMENTSd3-5
D3.2.1MCF INTERFACE REQUIREMENTSd3-5
D3.2.1.1MCF MECHANICAL INTERFACEd3-5
D3.2.1.2MCF STRUCTURAL INTERFACEd3-6
D3.2.1.2.1IMPACT ENERGYd3-6
D3.2.1.3MCF THERMAL CONTROL INTERFACEd3-6
D3.2.1.4ELECTROMAGNETIC ENVIRONMENTd3-6
D3.2.1.4.1BONDINGd3-6
D3.2.1.4.2ELECTROSTATIC DISCHARGEd3-7
D3.2.2USER INTERFACE REQUIREMENTSd3-7
D3.2.2.1ENVELOPESd3-7
D3.2.2.1.1OTCM/TOOL CLEARANCE ENVELOPEd3-7
D3.2.2.1.2TARGET VIEWINGd3-7
D3.2.2.2USER MECHANICAL INTERFACEd3-7
D3.2.2.2.1USER SOCKET INTERFACEd3-7
D3.2.2.3USER STRUCTURAL INTERFACEd3-7
D3.2.2.3.1USER BOLT HEAD OPERATIONAL CHARACTERISTICSd3-14
D3.2.2.3.2IMPACT ENERGYd3-14
D3.2.2.3.2.1IMPACT ENERGY DURING ROBOTIC CAPTUREd3-14
D3.2.2.3.2.2IMPACT ENERGY DURING ROBOTIC MANIPULATIONd3-14
D3.2.2.3.2.3IMPACT ENERGY AT A WORKSITEd3-15
D3.2.2.3.3shock limitd3-15
D3.2.2.4USER THERMAL CONTROL INTERFACEd3-16
D3.2.2.5ELECTROMAGNETIC ENVIRONMENTd3-16
D3.2.2.5.1BONDINGd3-16
D3.2.2.5.2ELECTROSTATIC DISCHARGEd3-17
SECTION E3SPDM OTP TO USER INTERFACESE3-1
E3.0REQUIREMENTSE3-1
E3.1GENERALE3-1
E3.1.1INTERFACE DESCRIPTIONe3-1
E3.1.1.1COORDINATE SYSTEMSe3-1
E3.1.1.1.1OTP OPERATING COORDINATE SYSTEMe3-1
E3.1.1.2OTP INTERFACE FUNCTIONSe3-1
E3.1.1.3USER INTERFACE FUNCTIONSe3-4
E3.1.2INTERFACE RESPONSIBILITIESe3-4
E3.2INTERFACE REQUIREMENTSe3-4
E3.2.1OTP INTERFACE REQUIREMENTSe3-4
E3.2.1.1ENVELOPESe3-4
E3.2.1.1.1OTP ENVELOPEe3-7
E3.2.1.1.2OTP PASSIVE CSI RELEASE ENVELOPEe3-7
E3.2.1.2OTP MECHANICAL INTERFACEe3-7
E3.2.1.3OTP STRUCTURAL INTERFACEe3-7
E3.2.1.3.1IMPACT ENERGYe3-7
E3.2.1.4OTP THERMAL CONTROL INTERFACEe3-7
E3.2.1.5ENVIRONMENTSe3-8
E3.2.1.5.1ELECTROMAGNETIC EFFECTSe3-8
E3.2.1.5.1.1BONDINGe3-8
E3.2.1.5.1.2ELECTROSTATIC DISCHARGEe3-8
E3.2.1.5.1.3DELETEDe3-8
E3.2.2USER INTERFACE REQUIREMENTSe3-8
E3.2.2.1ENVELOPESe3-8
E3.2.2.1.1OTP ENVELOPESe3-8
E3.2.2.1.2OTP RELEASE ENVELOPEe3-8
E3.2.2.1.3VERTICAL EXTRACTIONe3-8
E3.2.2.1.4SIDE ACCESSe3-18
E3.2.2.2USER HARDWARE MECHANICAL INTERFACEe3-20
E3.2.2.3USER HARDWARE STRUCTURAL INTERFACEe3-20
E3.2.2.3.1IMPACT ENERGYe3-20
E3.2.2.4USER THERMAL CONTROL INTERFACEe3-20
E3.2.2.5ENVIRONMENTSe3-21
E3.2.2.5.1ELECTROMAGNETIC EFFECTSe3-21
E3.2.2.5.1.1BONDINGe3-21
E3.2.2.5.1.2ELECTROSTATIC DISCHARGEe3-21
E3.2.2.5.1.3DELETEDe3-21
SECTION F3SPDM TOOL HOLDER ASSEMBLY (THA) TO USER TOOL HOLSTER INTERFACESF3-1
F3.0REQUIREMENTSf3-1
F3.1GENERALf3-1
F3.1.1INTERFACE DESCRIPTIONf3-1
F3.1.1.1COORDINATE SYSTEMSf3-1
F3.1.1.1.1THA OPERATIONS COORDINATE SYSTEMf3-1
F3.1.1.2THA INTERFACE FUNCTIONSf3-1
F3.1.1.3USER INTERFACE FUNCTIONSf3-4
F3.1.2INTERFACE RESPONSIBILITIESf3-4
F3.2INTERFACE REQUIREMENTSf3-4
F3.2.1THA INTERFACE REQUIREMENTSf3-4
F3.2.1.1ENVELOPESf3-4
F3.2.1.1.1THA ENVELOPEf3-4
F3.2.1.1.2EVA ENVELOPESf3-4
F3.2.1.1.2.1EVA CLEARANCE ENVELOPE - RMCT HOLSTER LAUNCH RESTRAINTSf3-4
F3.2.1.2THA MECHANICAL INTERFACEf3-9
F3.2.1.3THA STRUCTURAL INTERFACEf3-10
F3.2.1.3.1IMPACT ENERGYf3-11
F3.2.1.4THERMAL CONTROL INTERFACEf3-11
F3.2.1.5ENVIRONMENTSf3-11
F3.2.1.5.1ELECTROMAGNETIC EFFECTSf3-11
F3.2.1.5.1.1BONDINGf3-11
F3.2.1.5.1.2ELECTROSTATIC DISCHARGEf3-11
F3.2.1.5.1.3CORONAf3-11
F3.2.2USER INTERFACE REQUIREMENTSf3-12
F3.2.2.1USER ENVELOPESf3-12
F3.2.2.1.1USER TOOL HOLSTER ENVELOPESf3-12
F3.2.2.1.2USER EVA ENVELOPESf3-12
F3.2.2.2TOOL HOLSTER MECHANICAL INTERFACEf3-12
F3.2.2.3TOOL HOLSTER STRUCTURAL INTERFACEf3-12
F3.2.2.3.1IMPACT ENERGYf3-12
F3.2.2.4TOOL HOLSTER THERMAL CONTROL INTERFACEf3-12
F3.2.2.5ENVIRONMENTSf3-13
F3.2.2.5.1ELECTROMAGNETIC EFFECTSf3-13
F3.2.2.5.1.1BONDINGf3-13
F3.2.2.5.1.2ELECTROSTATIC DISCHARGEf3-13
F3.2.2.5.1.3CORONAf3-13
SECTION G3SOCKET EXTENSION TOOL TO USER INTERFACESG3-1
G3.0REQUIREMENTSG3-1
G3.1GENERAlg3-1
G3.1.1INTERFACE DESCRIPTIONg3-1
G3.1.1.1COORDINATE SYSTEMSg3-1
G3.1.1.1.1SBH COORDINATE SYSTEMg3-1
G3.1.1.2SET INTERFACE FUNCTIONSg3-1
G3.1.1.3USER INTERFACE FUNCTIONSg3-3
G3.1.2INTERFACE RESPONSIBILITIESg3-4
G3.2INTERFACE REQUIREMENTSg3-4
G3.2.1SET INTERFACE REQUIREMENTSg3-4
G3.2.1.1SET MECHANICAL INTERFACEg3-4
G3.2.1.2SET OPERATIONAL LOADSg3-4
G3.2.1.2.1IMPACT ENERGYg3-4
G3.2.1.3SET THERMAL CONTROL INTERFACEg3-6
G3.2.1.4ELECTROMAGNETIC ENVIRONMENTg3-6
G3.2.1.4.1BONDINGg3-6
G3.2.1.4.2ELECTROSTATIC DISCHARGEg3-7
G3.2.2USER INTERFACE REQUIREMENTSg3-7
G3.2.2.1ENVELOPESg3-7
G3.2.2.1.1SET CLEARANCE ENVELOPEg3-7
G3.2.2.1.2TARGET VIEWINGg3-7
G3.2.2.2USER MECHANICAL INTERFACEg3-7
G3.2.2.3USER OPERATIONAL LOADSg3-7
G3.2.2.3.1IMPACT ENERGYg3-8
G3.2.2.4USER THERMAL CONTROL INTERFACEg3-8
G3.2.2.5ELECTROMAGNETIC ENVIRONMENTg3-8
G3.2.2.5.1BONDINGg3-8
G3.2.2.5.2ELECTROSTATIC DISCHARGEg3-9
SECTION H3MODIFIED MICRO FIXTURE TO USER INTERFACESH3-1
H3.0REQUIREMENTSh3-1
H3.1GENERALh3-1
H3.1.1INTERFACE DESCRIPTIONh3-1
H3.1.1.1COORDINATE SYSTEMSh3-2
H3.1.1.1.1MODIFIED MICRO FIXTURE OPERATIONS COORDINATE SYSTEMh3-2
H3.1.1.2MODIFIED MICRO FIXTURE INTERFACE LAYER INTERFACE FUNCTIONSh3-2
H3.1.1.3USER INTERFACE FUNCTIONSh3-2
H3.1.2INTERFACE RESPONSIBILITIESh3-2
H3.2INTERFACE REQUIREMENTSh3-4
H3.2.1MODIFIED MICRO FIXTURE INTERFACE REQUIREMENTSh3-4
H3.2.1.1MODIFIED MICRO FIXTURE MECHANICAL INTERFACEh3-4
H3.2.1.2MODIFIED MICRO FIXTURE STRUCTURAL INTERFACEh3-4
H3.2.1.2.1IMPACT ENERGYh3-5
H3.2.1.3MODIFIED MICRO FIXTURE THERMAL CONTROL INTERFACEh3-5
H3.2.1.4ELECTROMAGNETIC ENVIRONMENTh3-5
H3.2.1.4.1BONDINGh3-5
H3.2.1.4.2ELECTROSTATIC DISCHARGEh3-5
H3.2.2USER INTERFACE REQUIREMENTSh3-6
H3.2.2.1ENVELOPESh3-6
H3.2.2.1.1OTCM CLEARANCE ENVELOPEh3-6
H3.2.2.1.2TARGET VIEWINGh3-6
H3.2.2.1.3EVA CONTINGENCY RELEASE ACCESSh3-6
H3.2.2.2USER MECHANICAL INTERFACEh3-15
H3.2.2.2.1USER SOCKET INTERFACEh3-16
H3.2.2.3USER STRUCTURAL INTERFACEh3-16
H3.2.2.3.1USER BOLT HEAD OPERATIONAL CHARACTERISTICSh3-17
H3.2.2.3.2IMPACT ENERGYh3-17
H3.2.2.3.2.1IMPACT ENERGY DURING ROBOTIC CAPTUREh3-18
H3.2.2.3.2.2IMPACT ENERGY DURING ROBOTIC MANIPULATIONh3-18
H3.2.2.3.2.3IMPACT ENERGY AT A WORKSITEh3-18
H3.2.2.3.3USER NATURAL FREQUENCY (FOR MANIPULATION)h3-18
H3.2.2.3.4shock limith3-18
H3.2.2.4USER THERMAL CONTROL INTERFACEh3-19
H3.2.2.5ELECTROMAGNETIC ENVIRONMENTh3-19
H3.2.2.5.1BONDINGh3-19
H3.2.2.5.2ELECTROSTATIC DISCHARGEh3-20
SECTION I3FLIGHT RELEASABLE GRAPPLE FIXTURE TO USER INTERFACESI3-1
I3.0REQUIREMENTSi3-1
I3.1GENERALi3-1
I3.1.1INTERFACE DESCRIPTIONi3-3
I3.1.2COORDINATE SYSTEMSi3-3
I3.1.3FRGF INTERFACE FUNCTIONSi3-3
I3.1.4USER INTERFACE FUNCTIONSi3-3
I3.1.5INTERFACE RESPONSIBILITIESi3-6
I3.2INTERFACE REQUIREMENTSi3-7
I3.2.1FRGF INTERFACE REQUIREMENTSi3-7
I3.2.1.1FRGF ENVELOPESi3-7
I3.2.1.2FRGF MECHANICAL INTERFACEi3-7
I3.2.1.3FRGF STRUCTURAL INTERFACEi3-8
I3.2.1.3.1IMPACT LOADSi3-8
I3.2.1.3.2massi3-8
I3.2.1.4PASSIVE THERMAL INTERFACEi3-8
I3.2.1.5ENVIRONMENTSi3-9
I3.2.1.5.1BONDINGi3-9
I3.2.2USER INTERFACE REQUIREMENTSi3-10
I3.2.2.1USER ENVELOPESi3-10
I3.2.2.2USER MECHANICAL INTERFACEi3-11
I3.2.2.3USER STRUCTURAL INTERFACEi3-13
I3.2.2.3.1IMPACT LOADSi3-14
I3.2.2.3.2USER STIFFNESS REQUIREMENTSi3-15
I3.2.2.3.3shock limiti3-15
I3.2.2.4PASSIVE THERMAL INTERFACEi3-16
I3.2.2.5ENVIRONMENTSi3-17
I3.2.2.5.1BONDINGi3-17
SECTION J3ROBOT OFFSET SOCKET TOOL TO MODIFIED MICRO FIXTURE INTERFACESJ3-1
J3.0REQUIREMENTSj3-1
J3.1GENERALj3-1
J3.1.1INTERFACE DESCRIPTIONj3-1
J3.1.1.1COORDINATE SYSTEMSj3-1
J3.1.1.1.1ROST COORDINATE SYSTEMSj3-1
J3.1.1.2ROST INTERFACE FUNCTIONSj3-4
J3.1.1.3USER INTERFACE FUNCTIONSj3-4
J3.1.2INTERFACE RESPONSIBILITIESj3-4
J3.2INTERFACE REQUIREMENTSj3-4
J3.2.1ROST INTERFACE REQUIREMENTSj3-4
J3.2.1.1ENVELOPESj3-4
J3.2.1.1.1DELETEDj3-4
J3.2.1.1.2DELETEDj3-5
J3.2.1.2ROST SOCKET MECHANICAL INTERFACEj3-5
J3.2.1.2.1DELETEDj3-7
J3.2.1.3ROST OPERATIONAL LOADS CHARACTERISTICSj3-7
J3.2.1.3.1IMPACT ENERGYj3-8
J3.2.1.3.2OTCM SOCKET FAILURE MODE TORQUEj3-8
J3.2.1.4ROST THERMAL CONTROL INTERFACEj3-8
J3.2.1.5ELECTROMAGNETIC ENVIRONMENTj3-8
J3.2.1.5.1BONDINGj3-8
J3.2.1.5.2ELECTROSTATIC DISCHARGEj3-8
J3.2.2USER INTERFACE REQUIREMENTSj3-9
J3.2.2.1USER ENVELOPEj3-9
J3.2.2.2USER MECHANICAL INTERFACEj3-12
J3.2.2.3USER OPERATIONAL LOADS CHARACTERISTICSj3-12
J3.2.2.3.1IMPACT ENERGYj3-13
J3.2.2.4USER THERMAL CONTROL INTERFACEJ3-13
J3.2.2.5ELECTROMAGNETIC ENVIRONMENTj3-13
J3.2.2.5.1BONDINGj3-13
J3.2.2.5.2ELECTROSTATIC DISCHARGEj3-13
SECTION K3MODIFIED MICRO CONICAL FITTING TO USER INTERFACESK3-1
K3.0REQUIREMENTSk3-1
K3.1GENERALk3-1
K3.1.1INTERFACE DESCRIPTIONk3-1
K3.1.1.1COORDINATE SYSTEMSk3-1
K3.1.1.1.1MMCF OPERATING COORDINATE SYSTEMk3-1
K3.1.1.2MODIFIED MCF INTERFACE FUNCTIONSk3-1
K3.1.1.3USER INTERFACE FUNCTIONSk3-3
K3.1.2INTERFACE RESPONSIBILITIESk3-4
K3.2INTERFACE REQUIREMENTSk3-4
K3.2.1MODIFIED MCF INTERFACE REQUIREMENTSk3-4
K3.2.1.1MODIFIED MCF MECHANICAL INTERFACEk3-4
K3.2.1.2MODIFIED MCF STRUCTURAL INTERFACEk3-4
K3.2.1.2.1IMPACT ENERGYk3-4
K3.2.1.3MODIFIED MCF THERMAL CONTROL INTERFACEk3-5
K3.2.1.4ELECTROMAGNETIC ENVIRONMENTk3-5
K3.2.1.4.1BONDINGk3-5
K3.2.1.4.2ELECTROSTATIC DISCHARGEk3-5
K3.2.2USER INTERFACE REQUIREMENTSk3-5
K3.2.2.1ENVELOPESk3-5
K3.2.2.1.1OTCM/TOOL CLEARANCE ENVELOPEk3-5
K3.2.2.1.2TARGET VIEWINGk3-5
K3.2.2.2USER MECHANICAL INTERFACEk3-11
K3.2.2.2.1USER SOCKET INTERFACEk3-11
K3.2.2.3USER STRUCTURAL INTERFACEk3-11
K3.2.2.3.1USER BOLT HEAD OPERATIONAL CHARACTERISTICSk3-11
K3.2.2.3.2IMPACT ENERGYk3-14
K3.2.2.3.2.1IMPACT ENERGY DURING ROBOTIC CAPTUREk3-14
K3.2.2.3.2.2IMPACT ENERGY DURING ROBOTIC MANIPULATIONk3-14
K3.2.2.3.2.3IMPACT ENERGY AT A WORKSITEk3-14
K3.2.2.3.3shock limitk3-14
K3.2.2.4USER THERMAL CONTROL INTERFACEk3-15
K3.2.2.5ELECTROMAGNETIC ENVIRONMENTk3-15
K3.2.2.5.1BONDINGk3-15
K3.2.2.5.2ELECTROSTATIC DISCHARGEk3-16
SECTION L3SPDM OTCM TO USER INTERFACESL3-1
L3.0REQUIREMENTSl3-1
L3.1GENERALl3-1
L3.1.1INTERFACE DESCRIPTIONl3-1
L3.1.1.1COORDINATE SYSTEMSl3-3
L3.1.1.1.1OTCM OPERATIONS COORDINATE SYSTEMl3-3
L3.1.1.2OTCM INTERFACE FUNCTIONSl3-3
L3.1.1.3SDGF INTERFACE FUNCTIONSl3-3
L3.1.2INTERFACE RESPONSIBILITIESl3-5
L3.2INTERFACE REQUIREMENTSl3-5
L3.2.1OTCM INTERFACE REQUIREMENTSl3-5
L3.2.1.1ENVELOPESl3-5
L3.2.1.1.1OTCM ENVELOPEl3-5
L3.2.1.1.2EVA CONTINGENCY RELEASE ENVELOPEl3-5
L3.2.1.2OTCM MECHANICAL INTERFACEl3-9
L3.2.1.2.1OTCM GRIPPER JAW INTERFACEl3-10
L3.2.1.2.2OTCM SOCKET INTERFACEl3-10
L3.2.1.2.3OTCM UMBILICAL CONNECTOR INTERFACEl3-13
L3.2.1.2.4OTCM EVA HANDLING TOOL INTERFACEl3-13
L3.2.1.3OTCM STRUCTURAL INTERFACEl3-14
L3.2.1.3.1IMPACT ENERGYl3-15
L3.2.1.3.2OTCM SOCKET OPERATIONAL CHARACTERISTICSl3-15
L3.2.1.3.3OTCM UMBILICAL MECHANISM MATE LOADSl3-16
L3.2.1.4OTCM ELECTRICAL CONNECTORSl3-16
L3.2.1.5OTCM ELECTRICAL POWER INTERFACEl3-16
L3.2.1.5.1POWER QUALITYl3-17
L3.2.1.5.1.1range of steady state voltagel3-17
L3.2.1.5.1.2current ratingl3-17
L3.2.1.5.1.3impedancel3-18
L3.2.1.5.2FAULT PROTECTIONl3-18
L3.2.1.5.3DELETEDl3-18
L3.2.1.5.4UMBILICAL CONNECTOR DEADFACINGl3-18
L3.2.1.5.5CABLE SHIELD TERMINATIONl3-18
L3.2.1.6OTCM CDH INTERFACEsl3-18
L3.2.1.6.1PROVIDE OUTPUT AMPLITUDEl3-18
L3.2.1.6.2BUS STUB LENGTHl3-18
L3.2.1.7OTCM VIDEO INTERFACEl3-19
L3.2.1.7.1VIDEO, SYNC, AND CONTROL TRANSMISSION AND SIGNAL CHARACTERISTICSl3-20
L3.2.1.7.2OTCM OPTICAL INTERFACEl3-21
L3.2.1.7.2.1OTCM CAMERA FIELD OF VIEWl3-21
L3.2.1.8OTCM THERMAL CONTROL INTERFACEl3-25
L3.2.1.9ELECTROMAGNETIC ENVIRONMENTl3-25
L3.2.1.9.1ELECTROMAGNETIC COMPATIBILITYl3-25
L3.2.1.9.2GROUNDINGl3-25
L3.2.1.9.3BONDINGl3-25
L3.2.1.9.4ELECTROSTATIC DISCHARGEl3-25
L3.2.1.9.5CORONAl3-25
L3.2.1.9.6CABLE AND WIRE DESIGNl3-25
L3.2.2USER INTERFACE REQUIREMENTSl3-25
L3.2.2.1SDGF MECHANICAL INTERFACEl3-25
L3.2.2.1.1SDGF SOCKET INTERFACEl3-26
L3.2.2.2SDGF STRUCTURAL INTERFACEl3-26
L3.2.2.2.1IMPACT ENERGYl3-29
L3.2.2.2.1.1IMPACT ENERGY DURING ROBOTIC CAPTUREl3-29
L3.2.2.2.1.2IMPACT ENERGY DURING ROBOTIC MANIPULATIONl3-29
L3.2.2.2.1.3IMPACT ENERGY AT A WORKSITEl3-30
L3.2.2.3USER TARGET INTERFACEl3-30
L3.2.2.3.1DEXTEROUS TARGETSl3-30
L3.2.2.3.2OPTICAL FEATURES AND LOCATION OF DEXTEROUS TARGETl3-30
L3.2.2.4USER THERMAL CONTROL INTERFACEl3-34
L3.2.2.5ELECTROMAGNETIC ENVIRONMENTl3-34
L3.2.2.5.1BONDINGl3-34
L3.2.2.5.2ELECTROSTATIC DISCHARGEl3-34
L3.2.2.5.3ELECTROMAGNETIC COMPATiBILITYl3-34
L3.2.2.5.4bonding and GROUNDINGl3-34
L3.2.2.5.5CORONAl3-34
L3.2.2.5.6electromagnetic interferencel3-35
L3.2.2.6USER UMBILICAL INTERFACEl3-35
L3.2.2.6.1USER UMBILICAL STRUCTURAL INTERFACEl3-35
L3.2.2.6.2USER ELECTRICAL POWER INTERFACEl3-35
L3.2.2.6.2.1POWER QUALITYl3-35
L3.2.2.6.2.1.1range of steady state voltagel3-35
L3.2.2.6.2.1.2current ratingl3-35
L3.2.2.6.2.1.3transient voltagel3-36
L3.2.2.6.2.1.4load impedancel3-36
L3.2.2.6.2.2FAULT PROTECTIONl3-37
L3.2.2.6.3USER cdh INTERFACEsl3-38
L3.2.2.6.3.1PROVIDE OUTPUT AMPLITUDEl3-38
L3.2.2.6.3.2BUS STUB LENGTHl3-38
L3.2.2.6.3.3mil-std-1553b BUS ADDRESSESl3-38
L3.2.2.6.4USER VIDEO INTERFACEl3-39
L3.2.2.6.5CABLE AND WIRE DESIGNl3-39
SECTION m3ROBOT MICRO CONICAL TOOL TO MICRO CONICAL FITTING INTERFACEM3-1
M3.0REQUIREMENTSm3-1
M3.1GENERALm3-1
M3.1.1INTERFACE DESCRIPTIONm3-1
M3.1.1.1COORDINATE SYSTEMSm3-1
M3.1.1.1.1RMCT COORDINATE SYSTEMSm3-1
M3.1.1.2RMCT INTERFACE FUNCTIONSm3-4
M3.1.1.3MCF INTERFACE FUNCTIONSm3-4
M3.1.2INTERFACE RESPONSIBILITIESm3-4
M3.2INTERFACE REQUIREMENTSm3-4
M3.2.1RMCT INTERFACE REQUIREMENTSm3-4
M3.2.1.1ENVELOPESm3-4
M3.2.1.1.1RMCT ENVELOPEm3-4
M3.2.1.1.2EVA CONTINGENCY RELEASE ACCESSm3-10
M3.2.1.2RMCT MECHANICAL INTERFACEm3-10
M3.2.1.2.1RMCT SOCKET INTERFACEm3-10
M3.2.1.3RMCT STRUCTURAL INTERFACEm3-10
M3.2.1.3.1IMPACT ENERGYm3-10
M3.2.1.3.2RMCT SOCKET OPERATIONAL CHARACTERISTICSm3-15
M3.2.1.4RMCT THERMAL CONTROL INTERFACEm3-15
M3.2.1.5ELECTROMAGNETIC ENVIRONMENTm3-15
M3.2.1.5.1BONDINGm3-15
M3.2.1.5.2ELECTROSTATIC DISCHARGEm3-15
M3.2.2MCF INTERFACE REQUIREMENTSm3-15
M3.2.2.1MCF MECHANICAL INTERFACEm3-15
M3.2.2.2MCF STRUCTURAL INTERFACEm3-15
M3.2.2.2.1IMPACT ENERGYm3-15
M3.2.2.3USER THERMAL CONTROL INTERFACEm3-16
M3.2.2.4ELECTROMAGNETIC ENVIRONMENTm3-16
M3.2.2.4.1BONDINGm3-16
M3.2.2.4.2ELECTROSTATIC DISCHARGEm3-16
SECTION N3PVGF TO USER INTERFACESN3-1
N3.0REQUIREMENTSn3-1
N3.1GENERALn3-1
N3.1.1INTERFACE DESCRIPTIONn3-2
N3.1.2COORDINATE SYSTEMSn3-4
N3.1.3PVGF INTERFACE FUNCTIONSn3-5
N3.1.4USER INTERFACE FUNCTIONSn3-5
N3.1.5INTERFACE RESPONSIBILITIESn3-6
N3.2INTERFACE REQUIREMENTSn3-6
N3.2.1PVGF INTERFACE REQUIREMENTSn3-6
N3.2.1.1PVGF ENVELOPESn3-6
N3.2.1.2PVGF MECHANICAL INTERFACEn3-7
N3.2.1.3PVGF STRUCTURAL INTERFACEn3-7
N3.2.1.3.1IMPACT LOADSn3-7
N3.2.1.3.2massn3-7
N3.2.1.4PVGF ELECTRICAL INTERFACE HARDWAREn3-7
N3.2.1.4.1ELECTRICAL CONNECTORSn3-7
N3.2.1.5PVGF POWER INTERFACEn3-7
N3.2.1.5.1POWER QUALITYn3-7
N3.2.1.5.2FAULT PROTECTIONn3-9
N3.2.1.5.3REDUNDANCYn3-9
N3.2.1.5.4ELECTRICAL CONNECTOR DEADFACINGn3-9
N3.2.1.6CDH INTERFACESn3-10
N3.2.1.6.1MIL-STD-1553b bus INTERFACESn3-11
N3.2.1.6.1.1PROVIDE OUTPUT AMPLITUDEn3-11
N3.2.1.7SYNC, CONTROL, AND VIDEO INTERFACESn3-11
N3.2.1.7.1VIDEO, SYNC, AND CONTROL TRANSMISSION AND SIGNAL CHARACTERISTICSn3-11
N3.2.1.7.2SYNC AND VIDEO POWER LEVELSn3-11
N3.2.1.8PASSIVE THERMAL INTERFACEn3-11
N3.2.1.9ENVIRONMENTSn3-12
N3.2.1.9.1ELECTROMAGNETIC EFFECTSn3-12
N3.2.1.9.1.1ELECTROMAGNETIC COMPATIBILITYn3-12
N3.2.1.9.1.2GROUNDINGn3-12
N3.2.1.9.1.3BONDINGn3-12
N3.2.1.9.1.4CABLE AND WIRE DESIGNn3-12
N3.2.1.9.1.5ELECTROSTATIC DISCHARGEn3-12
N3.2.1.9.1.6CORONAn3-12
N3.2.2USER INTERFACE REQUIREMENTSn3-12
N3.2.2.1USER ENVELOPESn3-12
N3.2.2.2USER MECHANICAL INTERFACEn3-14
N3.2.2.3USER STRUCTURAL INTERFACEn3-15
N3.2.2.3.1LOADSn3-15
N3.2.2.3.2impact loadsn3-16
N3.2.2.3.3shock limitn3-16
N3.2.2.3.4user stiffness requirementsn3-17
N3.2.2.4USER ELECTRICAL INTERFACE HARDWAREn3-18
N3.2.2.4.1ELECTRICAL CONNECTORSn3-18
N3.2.2.5USER POWER INTERFACEn3-19
N3.2.2.5.1POWER QUALITYn3-19
N3.2.2.5.2FAULT PROTECTIONn3-19
N3.2.2.5.3SINGLE STRING POWER USERn3-19
N3.2.2.5.4ELECTRICAL CONNECTOR DEADFACINGn3-19
N3.2.2.6user CDH INTERFACESn3-19
N3.2.2.6.1MIL-STD-1553b bus INTERFACESn3-20
N3.2.2.6.1.1BUS TERMINATIONn3-20
N3.2.2.6.1.2MIL-STD-1553b DATA BUS ADDRESSESn3-20
N3.2.2.6.1.3PROVIDE OUTPUT AMPLITUDEn3-20
N3.2.2.6.1.4PAYLOAD RT RESPONSE TIMEn3-21
N3.2.2.7SYNC, CONTROL, AND VIDEO INTERFACESn3-23
N3.2.2.7.1VIDEO, SYNC, AND CONTROL TRANSMISSION AND SIGNAL CHARACTERISTICSn3-23
N3.2.2.7.2SYNC AND VIDEO POWER LEVELSn3-23
N3.2.2.8PASSIVE THERMAL INTERFACEn3-23
N3.2.2.9ENVIRONMENTSn3-24
N3.2.2.9.1ELECTROMAGNETIC EFFECTSn3-24
N3.2.2.9.1.1ELECTROMAGNETIC COMPATIBILITYn3-24
N3.2.2.9.1.2GROUNDINGn3-24
N3.2.2.9.1.3BONDINGn3-24
N3.2.2.9.1.4CABLE AND WIRE DESIGNn3-24
N3.2.2.9.1.5ELECTROSTATIC DISCHARGEn3-24
N3.2.2.9.1.6CORONAn3-25
SECTION OSPDM EOTP TO USER INTERFACESO3-1
O3.0REQUIREMENTSo3-1
O3.1GENERALo3-1
O3.1.1INTERFACE DESCRIPTIONo3-3
O3.1.1.1COORDINATE SYSTEMSo3-4
O3.1.1.1.1EOTP OPERATING COORDINATE SYSTEMo3-4
O3.1.1.2EOTP INTERFACE FUNCTIONSo3-7
O3.1.1.2.1EOTP STANCHION INTERFACE FUNCTIONSo3-7
O3.1.1.2.2EOTP PFRAM INTERFACE FUNCTIONSo3-7
O3.1.1.3EOTP USER INTERFACE FUNCTIONSo3-7
O3.1.1.3.1USER STANCHION INTERFACE FUNCTIONSo3-7
O3.1.1.3.2USER FRAM INTERFACE FUNCTIONSo3-7
O3.1.2EOTP CARGO ACCOMMODATIONSo3-8
O3.1.3EOTP RESPONSIBILITIESo3-9
O3.2INTERFACE REQUIREMENTSo3-9
O3.2.1EOTP INTERFACE REQUIREMENTSo3-9
O3.2.1.1EOTP ENVELOPESo3-9
O3.2.1.1.1EOTP STANCHION INTERFACE ENVELOPESo3-9
O3.2.1.1.2EOTP PFRAM INTERFACE ENVELOPESo3-9
O3.2.1.1.3EOTP EXTRACTION DISTANCESo3-12
O3.2.1.2EOTP STANCHION INTERFACE REQUIREMENTSo3-13
O3.2.1.2.1EOTP STANCHION MECHANICAL INTERFACEo3-17
O3.2.1.2.2VISUAL CUES/MARKINGS FOR STANCHIONSo3-18
O3.2.1.2.3EOTP STRUCTURAL INTERFACEo3-18
O3.2.1.2.4IMPACT ENERGYo3-24
O3.2.1.2.5EOTP THERMAL CONTROL INTERFACEo3-24
O3.2.1.2.6ELECTROMAGNETIC EFFECTSo3-24
O3.2.1.2.6.1BONDINGo3-24
O3.2.1.2.6.2ELECTROSTATIC DISCHARGEo3-24
O3.2.1.2.6.3CORONAo3-24
O3.2.1.3EOTP PFRAM INTERFACE REQUIREMENTSo3-24
O3.2.1.3.1EOTP PFRAM MECHANICAL INTERFACEo3-24
O3.2.1.3.2VISUAL CUES/MARKINGS AND GUIDES FOR EOTP PFRAMSo3-25
O3.2.1.3.3PFRAM STRUCTURAL INTERFACEo3-27
O3.2.1.3.4IMPACT ENERGYo3-28
O3.2.1.3.5EOTP PFRAM THERMAL CONTROL INTERFACEo3-28
O3.2.1.3.6ELECTROMAGNETIC ENVIRONMENTo3-28
O3.2.1.3.6.1GROUNDINGo3-28
O3.2.1.3.6.2BONDINGo3-28
O3.2.1.3.6.3ELECTROSTATIC DISCHARGEo3-28
O3.2.1.3.6.4CORONAo3-28
O3.2.1.3.7EOTP PFRAM ELECTRICAL INTERFACEo3-29
O3.2.1.3.7.1ELECTRICAL CONNECTORSo3-29
O3.2.1.3.7.2POWER QUALITYo3-29
O3.2.1.3.7.3FAULT PROTECTIONo3-29
O3.2.2EOTP USER INTERFACE REQUIREMENTSo3-29
O3.2.2.1USER ENVELOPE REQUIREMENTSo3-29
O3.2.2.1.1USER STORU ENVELOPESo3-29
O3.2.2.1.2USER AFRAM ENVELOPESo3-30
O3.2.2.2USER STANCHION INTERFACE REQUIREMENTSo3-30
O3.2.2.2.1USER STORU MECHANICAL INTERFACEo3-30
O3.2.2.2.2USER VISUAL CUES/MARKINGS FOR STORUo3-30
O3.2.2.2.3USER STORU STRUCTURAL INTERFACEo3-32
O3.2.2.2.4impact energyo3-32
O3.2.2.2.5USER STORU THERMAL CONTROL INTERFACEo3-32
O3.2.2.2.6USER STORU ELECTROMAGNETIC EFFECTSo3-32
O3.2.2.2.6.1BONDINGo3-32
O3.2.2.2.6.2ELECTROSTATIC DISCHARGEo3-32
O3.2.2.2.6.3CORONAo3-33
O3.2.2.3USER AFRAM INTERFACE REQUIREMENTSo3-33
O3.2.2.3.1USER AFRAM MECHANICAL INTERFACEo3-33
O3.2.2.3.2USER VISUAL CUES/MARKING AND GUIDES FOR AFRAMo3-33
O3.2.2.3.3USER AFRAM STRUCTURAL INTERFACEo3-33
O3.2.2.3.4IMPACT ENERGYo3-33
O3.2.2.3.5USER AFRAM THERMAL CONTROL INTERFACEo3-33
O3.2.2.3.6USER AFRAM ELECTROMAGNETIC EFFECTSo3-34
O3.2.2.3.6.1BONDINGo3-34
O3.2.2.3.6.2ELECTROSTATIC DISCHARGEo3-34
O3.2.2.3.6.3CORONAo3-34
O3.2.2.3.7USER AFRAM ELECTRICAL INTERFACEo3-34
O3.2.2.3.7.1ELECTRICAL CONNECTORSo3-34
O3.2.2.3.7.2POWER QUALITYo3-34
O3.2.2.3.7.3FAULT PROTECTIONo3-35
SECTION P3SPDM TO EOTP INTERFACEP3-1
P3.0REQUIREMENTSp3-1
P3.1GENERALp3-1
P3.1.1INTERFACE DESCRIPTIONp3-1
P3.1.1.1COORDINATE SYSTEMSp3-1
P3.1.1.2SPDM INTERFACE FUNCTIONSp3-1
P3.1.1.3EOTP INTERFACE FUNCTIONSp3-1
P3.1.2INTERFACE RESPONSIBILITIESp3-5
P3.2INTERFACE REQUIREMENTSp3-5
P3.2.1SPDM INTERFACE REQUIREMENTSp3-5
P3.2.1.1ENVELOPESp3-5
P3.2.1.1.1EVA ENVELOPESp3-5
P3.2.1.2SPDM MECHANICAL INTERFACEp3-5
P3.2.1.3VISUAL CUES / MARKINGSp3-7
P3.2.1.4SPDM / EOTP STRUCTURAL INTERFACEp3-7
P3.2.1.5SPDM ELECTRICAL INTERFACEp3-7
P3.2.1.6THERMAL CONTROL INTERFACEp3-8
P3.2.1.7ENVIRONMENTSp3-8
P3.2.1.7.1ELECTROMAGNETIC EFFECTSp3-8
P3.2.1.7.1.1BONDINGp3-8
P3.2.1.7.1.2ELECTROSTATIC DISCHARGEp3-8
P3.2.2EOTP INTERFACE REQUIREMENTSp3-8
SECTION Q3OTP to user INTERFACEsQ3-1
Q3.0REQUIREMENTSq3-1
Q3.1GENERALq3-1
Q3.1.1INTERFACE DESCRIPTIONq3-1
Q3.1.1.1COORDINATE SYSTEMSq3-2
Q3.1.1.1.1OTP OPERATING COORDINATE SYSTEMq3-2
Q3.1.1.2OTP INTERFACE FUNCTIONSq3-3
Q3.1.1.3PASSIVE SGI INTERFACE FUNCTIONSq3-3
Q3.1.2INTERFACE RESPONSIBILITIESq3-3
Q3.2INTERFACE REQUIREMENTSq3-3
Q3.2.1OTP INTERFACE REQUIREMENTSq3-3
Q3.2.1.1ENVELOPESq3-3
Q3.2.1.2OTP MECHANICAL INTERFACEq3-3
Q3.2.1.3OTP STRUCTURAL INTERFACEq3-5
Q3.2.1.3.1IMPACT ENERGYq3-5
Q3.2.1.4OTP THERMAL CONTROL INTERFACEq3-6
Q3.2.1.5ENVIRONMENTSq3-6
Q3.2.1.5.1BONDINGq3-6
Q3.2.1.5.2ELECTROSTATIC DISCHARGEq3-6
Q3.2.1.6ALIGNMENT MARKSq3-6
Q3.2.2PASSIVE SGI INTERFACE REQUIREMENTSq3-7
Q3.2.2.1ENVELOPESq3-7
Q3.2.2.2PASSIVE SGI MECHANICAL INTERFACEq3-8
Q3.2.2.3PASSIVE SGI STRUCTURAL INTERFACEq3-8
Q3.2.2.3.1IMPACT ENERGYq3-9
Q3.2.2.4PASSIVE SGI THERMAL CONTROL INTERFACEq3-9
Q3.2.2.5ENVIRONMENTSq3-9
Q3.2.2.5.1BONDINGq3-9
Q3.2.2.5.2ELECTROSTATIC DISCHARGEq3-9
Q3.2.2.6PASSIVE SGI ALIGNMENT MARKSq3-9
Q3.2.2.6.1ALIGNMENT MARK POSITIONq3-9
SECTION r3latchable grapple fixture to user INTERFACEsr3-1
R3.0REQUIREMENTSr3-1
R3.1GENERALr3-1
R3.1.1INTERFACE DESCRIPTIONr3-3
R3.1.2COORDINATE SYSTEMSr3-3
R3.1.3LGF INTERFACE FUNCTIONSr3-3
R3.1.4USER INTERFACE FUNCTIONSr3-3
R3.1.5INTERFACE RESPONSIBILITIESr3-6
R3.2INTERFACE REQUIREMENTSr3-7
R3.2.1LGF INTERFACE REQUIREMENTSr3-7
R3.2.1.1LGF ENVELOPESr3-7
R3.2.1.2LGF MECHANICAL INTERFACEr3-7
R3.2.1.3LGF STRUCTURAL INTERFACEr3-9
R3.2.1.3.1IMPACT LOADSr3-9
R3.2.1.3.2massR3-9
R3.2.1.4PASSIVE THERMAL INTERFACEr3-9
R3.2.1.5ENVIRONMENTSr3-9
R3.2.1.5.1BONDINGr3-9
R3.2.2USER INTERFACE REQUIREMENTSr3-9
R3.2.2.1USER ENVELOPESr3-9
R3.2.2.2USER MECHANICAL INTERFACEr3-10
R3.2.2.3USER STRUCTURAL INTERFACEr3-12
R3.2.2.3.1LOADSr3-12
R3.2.2.3.2impact loadsr3-13
R3.2.2.3.3shock limitr3-13
R3.2.2.3.4user stiffness requirementsr3-14
R3.2.2.4PASSIVE THERMAL INTERFACEr3-15
R3.2.2.5ENVIRONMENTSr3-16
R3.2.2.5.1BONDINGr3-16

APPENDIX

adeleteda-1
bAcronyms and abbreviationsb-1
cissue sheetsc-1
dopen workd-1
espdm oru/manipulated hardwaree-1

TABLE

1.6-1interface responsibilities1-8
A3.1.5-1PDGF TO USER INTERFACE HARDWARE RESPONSIBILITYA3-4
A3.2.1.3-1PDGF TO USER STRUCTURAL LOADSa3-5
A3.2.1.5.1-1PDGF TO USER ELECTRICAL INTERFACE PARAMETERSa3-8
B3.1.1.3-1SSRMS/EBCS OPERATIONAL ACCURACYb3-7
B3.1.5.1-1INTERFACE HARDWARE design RESPONSIBILITYb3-13
B3.2.1.3-1DELETEDb3-23
B3.2.1.3.1-1DELETEDb3-23
B3.2.1.3.2.1-1GVA IMPACT LOADS (LBS)b3-24
B3.2.1.3.2.2-1CLA IMPACT LOAD (LBS)b3-24
B3.2.1.3.4.2-1INTERFACE LIMIT LOADS (LATCH ENGAGED)b3-25
B3.2.1.3.4.2.1-1TIME CONSTRAINT INTERFACE LOADSb3-25
B3.2.1.3.4.3-1MECHANICAL LOAD SPECTRA FOR ON-ORBIT EVENTSb3-26
B3.2.1.5.1-1DELETEDb3-27
B3.2.1.5.2-1MCAS TO USER ELECTRICAL INTERFACE REQUIREMENTSb3-28
B3.2.1.8.1-1HOT AND COLD NATURAL THERMAL ENVIRONMENTSb3-30
B3.2.1.8.2-1INDUCED THERMAL ENVIRONMENTSb3-31
B3.2.2.3.3.5-1UMA PASSIVE HALF MOUNTING BRACKET STIFFNESSb3-35
B3.2.2.5.1-1DEFINED PRIME OR REDUNDANT UPSTREAM POWER SOURCEb3-36
C3.1.2-1SDGF to user INTERFACE COMPONENT RESPONSIBILITIESc3-6
C3.2.1.1-1SDGF to user Mechanical interfacec3-6
C3.2.1.2-1SDGF STRUCTURAL INTERFACE LOADSc3-7
c3.2.2.3.6-1user to sdgf interface shock limitc3-16
D3.1.2-1mcf to user interface responsibilitiesd3-5
D3.2.1.1-1MCF Mechanical interfaced3-6
D3.2.1.2-1MCF TO USER STRUCTURAL LOADSd3-6
d3.2.2.3.3-1user to mcf interface shock limitd3-15
E3.1.2-1OTP TO user INTERFACE RESPONSIBILITIESe3-4
E3.2.1.3-1OTP STRUCTURAL INTERFACE LOADSe3-7
E3.2.2.1.4-1POSSIBLE SIDE ACCESS LOCATIONS AND DEPTH IN INCHESe3-20
F3.1.2-1DELETEDf3-4
F3.2.1.3-1SPDM THA AND USER TOOL HOLSTER STRUCTURAL LOADSf3-11
G3.1.2-1SET TO USER INTERFACE RESPONSIBILITIESg3-4
G3.2.2.2-1user Mechanical interfaceg3-7
G3.2.2.3-1USER OPERATIONAL LOADSg3-8
H3.1.2-1Modified micro fixture to user interface component
responsibilitiesh3-4
H3.2.1.1-1Modified Micro fixture to user Mechanical interfaceh3-4
H3.2.1.2-1Modified Micro fixture STRUCTURAL INTERFACE LOADSh3-5
h3.2.2.3.4-1user to mmf interface shock limith3-18
I3.1.5-1FRGF TO USER INTERFACE HARDWARE RESPONSIBILITYi3-7
i3.2.2.3.2-1user stiffness valuesi3-15
I3.2.2.4-1frgf temperature limitsi3-17
J3.1.2-1ROST TO MODIFIED MICRO FIXTURE INTERFACE RESPONSIBILITIESj3-4
J3.2.1.3-1ROST SOCKET OPERATIONAL CHARACTERISTICSj3-8
K3.2.1.1-1Modified MCF Mechanical interfacek3-4
K3.2.1.2-1Modified MCF TO USER STRUCTURAL LOADSk3-4
k3.2.2.3.3-1user to mmcf interface shock limitk3-14
L3.1.2-1OTCM to user INTERFACE COMPONENT RESPONSIBILITIESl3-5
L3.2.1.2-1OTCM Mechanical interfacel3-10
L3.2.1.3-1OTCM STRUCTURAL INTERFACE LOADS during MANIPULATIONl3-15
L3.2.1.3-2OTCM STRUCTURAL INTERFACE LOADS during STABILIZATIONl3-15
L3.2.1.3-3OTCM STRUCTURAL INTERFACE LOADS during graspingl3-15
L3.2.1.3.2-1OTCM socket OPERATIONAl CHaracteristicsl3-16
L3.2.1.7.1-1Video, Sync, and control transmission and signal characteristics
(2 pages)l3-20
M3.1.2-1RMCT to MCF interface responsibilitiesm3-4
M3.2.1.3-1RMCT TO MCF STRUCTURAL LOADSm3-10
M3.2.1.3.2-1RMCT socket OPERATIONAl CHaracteristicsm3-15
n3.1.5-1pvgf to user interface hardware responsibilityn3-6
N3.2.1.5.1-1PVGF TO USER ELECTRICAL INTERFACE PARAMETERSn3-9
N3.2.2.3.4-1USER STIFFNESS VALUESn3-18
n3.2.2.8-1pvgf temperature limitsn3-24
O3.1.2-2Possible EOTP SPU Payload Locationso3-8
O3.1.3-1Hardware Interface Responsibilitieso3-9
O3.2.1.1.3-1SPDM Arm Reach to various EOTP operational positiono3-12
O3.2.1.3.7.2-1EOTP to User Electrical Interface Parameterso3-29
o3.2.2.3.7.3-1maximum overload interrupt times for eotp user fault protectiono3-35
P3.1.2-1SPDM TO EOTP INTERFACE RESPONSIBILITIESp3-5
P3.2.1.2-1SPDM / EOTP Mechanical interface DRawingsp3-5
P3.2.1.4-1SPDM to EOTP Lug / Clevis interface loads <TBC P3-1>p3-7
P3.2.1.4-2SPDM to eotp Input Drive loads <TBC P3-2>p3-7
P3.2.1.5-1spdm to eotp electrical interface parametersp3-8
Q3.1.2-1OTP TO SGI INTERFACE RESPONSIBILITIESq3-3
Q3.2.1.3-1OTP STRUCTURAL INTERFACE LOADSq3-5
Q3.2.2.2-1PASSIVE SGI MOUNTING HARDWAREq3-8
R3.1.5-1LGF TO USER INTERFACE HARDWARE RESPONSIBILITYr3-6
R3.2.2.3.1-1LGF to Cargo Element Operating Load Limitsr3-13
R3.2.2.3.4-1USER STIFFNESS VALUESr3-15
R3.2.2.4-1LGF TEMPERATURE LIMITSr3-16
D-1to be determined itemsd-1
D-2TO BE RESOLVED ISSUESd-1
D-3TO BE confirmED ISSUESd-2
app. e 3.1-1spdm oru/manipulated hardware (3 pages)e-1

FIGURE

1.1-1mobile servicing system to user icd sections1-2
1.1-2spdm otcm/tools to user interface planes1-3
a3.1.2-1pdgf coordinate systema3-2
a3.1.2-2lee operating coordinate systema3-3
a3.2.1.3.1-1pdgf impact loadsa3-6
a3.2.1.5-1pdgf to user electrical interfacesa3-7
A3.2.1.5.4-1CONNECTOR DEADFACING REQUIREMENTSa3-9
a3.2.2.1-1ssrms lee approach envelope (static)a3-13
a3.2.2.1-2ssrms lee approach envelope (dynamic/free flyer)a3-14
a3.2.2.1-3poa approach envelopea3-15
a3.2.2.3.3-1user to pdgf interface shock limita3-16
a3.2.2.6.1.1-1generic module during installationa3-19
a3.2.2.6.1.1-2apm module keep alive during installationa3-20
a3.2.2.6.1.1-3generic payloada3-21
B3.1.1.1-1mcas active halfb3-1
b3.1.1.1.1-1guide vane assemblyb3-3
b3.1.1.1.2-1capture latch assemblyb3-4
b3.1.1.1.3-1umbilical mechanism assemblyb3-5
b3.1.1.2-1mcas passive halfb3-6
b3.1.1.3-1external berthing camera systemb3-8
b3.1.2-1mcas operating coordinate systemb3-10
b3.1.2-2mcasocs relationship with mrsocsb3-11
b3.1.6operational sequence (1 of 4)b3-15
b3.1.6operational sequence (2 of 4)b3-16
b3.1.6operational sequence (3 of 4)b3-17
b3.1.6operational sequence (4 0f 4)b3-18
B3.2.1.1-1MCAS USER ENVELOPE (deleted)b3-18
B3.2.1.1.1.1-1MCAS MAXIMUM ALLOWABLE USER VOLUME FOR TRANSLATION THROUGH
ISS CORRIDOR (1 OF 3)b3-20
B3.2.1.1.1.1-1MCAS MAXIMUM ALLOWABLE USER VOLUME FOR TRANSLATION THROUGH
ISS CORRIDOR (2 OF 3)b3-21
B3.2.1.1.1.1-1MCAS MAXIMUM ALLOWABLE USER VOLUME FOR TRANSLATION THROUGH
ISS CORRIDOR (3 OF 3)b3-22
b3.2.1.1.1.1-2deletedb3-23
b3.2.1.1.1.2-1deletedb3-23

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