SSP_42007-Part_1-RevK.pdf

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Human Space Flight Technical Integration Contract (HSFTIC) Federal contract opportunity
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80JSC019R0023
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National Aeronautics and Space Administration Johnson Space Center

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This is a notice for a Request for Proposal for the Human Space Flight Technical Integration Contract. NASA/JSC plans to issue the RFP on or about November 1, 2019, with an anticipated offer due date of December 11, 2019. The procurement is a total small business set-aside with a NAICS code of 541715 and size standard of 1,250 employees. The contract will provide technical integration services for human space flight programs. All responsible sources may submit an offer which will be considered. The solicitation and related documents will be available on the listed websites. Prospective offerors shall notify the office of their intent to submit an offer and are responsible for monitoring the site for amendments.

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Text version

SSP 42007 Part 1

Revision K

United States On−orbit Segment to Permanent Multi-Purpose Module Interface Control Document Part 1

International Space Station Program

January 2018

National Aeronautics and Space Administration International Space Station Program Johnson Space Center Houston, Texas Contract No.: NNJ12GA46C

REVISION AND HISTORY

REVISION AND HISTORY - CONTINUED

REVISION AND HISTORY - CONTINUED

REV. DESCRIPTION PUB.

DATE

K Revision K (Reference per SSCD 15736, EFF 09-21-17)

Program Release 01-24-18

Revision K incorporates the following approved PIRNs:

PIRN SSCN

42007-NA-0113B 013565

42007-NA-0114

Revision K closes PIRN 42007-NA-0112A and SSCN 012693 as they were overcome by events.

i

PREFACE

UNITED STATES ON-ORBIT SEGMENT TO PERMANENT MULTI-PURPOSE MODULE

INTERFACE CONTROL DOCUMENT PART 1

SSP 42007, United States On-Orbit Segment to Permanent Multi-purpose Module Interface Control Document Part 1, depicts the interface connections between the Permanent Multi-purpose Module and Node 3 of the International Space Station (ISS).

This document is under the control of the Space Station Control Board (SSCB); any changes or revisions will be approved by the SSCB.

See Directive Approval

09-21-17

Kirk A. Shireman ISS Program Manager National Aeronautics and Space Administration

Date ii

INTERNATIONAL SPACE STATION PROGRAM

UNITED STATES ON-ORBIT SEGMENT TO PERMANENT MULTI-PURPOSE MODULE

INTERFACE CONTROL DOCUMENT PART 1

CONCURRENCE

SEPTEMBER 2017

iii

INTERNATIONAL SPACE STATION PROGRAM

UNITED STATES ON-ORBIT SEGMENT TO PERMANENT MULTI-PURPOSE MODULE

INTERFACE CONTROL DOCUMENT PART 1

CONCURRENCE

SEPTEMBER 2017

iv

TABLE OF CONTENTS

PARAGRAPH PAGE

1.0 INTRODUCTION ................................................................................................................... 1-1

1.1 PURPOSE & SCOPE ............................................................................................................ 1-1

1.2 PRECEDENCE ...................................................................................................................... 1-1

1.3 RESPONSIBILITY AND CHANGE AUTHORITY ................................................................... 1-1

2.0 DOCUMENTS ....................................................................................................................... 2-1

2.1 APPLICABLE DOCUMENTS................................................................................................. 2-1

2.2 REFERENCE DOCUMENTS ................................................................................................ 2-8

3.0 INTERFACES ........................................................................................................................ 3-1

3.1 GENERAL ............................................................................................................................. 3-1

3.1.1 INTERFACE DESCRIPTION ................................................................................................. 3-1

3.1.1.1 USOS DESCRIPTION ........................................................................................................... 3-1

3.1.1.2 PMM DESCRIPTION ............................................................................................................. 3-2

3.1.1.3 INTERFACE PLANES DESCRIPTION .................................................................................. 3-2

3.1.1.4 COORDINATE SYSTEM ....................................................................................................... 3-12

3.1.1.5 USOS INTERFACE FUNCTIONS ......................................................................................... 3-16

3.1.1.6 PMM INTERFACE FUNCTIONS ........................................................................................... 3-16

3.1.2 INTERFACE RESPONSIBILITIES ........................................................................................ 3-16

3.1.2.1 RESPONSIBILITY FOR USOS AND PMM............................................................................ 3-16

3.1.2.2 RESPONSIBILITY FOR UTILITY CONNECTORS ................................................................ 3-17

3.1.3 ENGINEERING UNITS .......................................................................................................... 3-17

3.1.4 TOLERANCES ...................................................................................................................... 3-17

3.2 INTERFACE REQUIREMENTS ............................................................................................ 3-18

3.2.1 USOS INTERFACE REQUIREMENTS ................................................................................. 3-18

3.2.1.1 ENVELOPE REQUIREMENTS ............................................................................................. 3-18

3.2.1.1.1 ACCESS ENVELOPE ........................................................................................................... 3-18

3.2.1.2 STRUCTURAL/MECHANICAL ATTACHMENT ..................................................................... 3-18

3.2.1.2.1 DELETED .............................................................................................................................. 3-18

3.2.1.2.2 BERTHING/ATTACHMENT MECHANISM(S) ....................................................................... 3-18

3.2.1.2.3 STRUCTURAL ...................................................................................................................... 3-18

3.2.1.2.4 FRACTURE CONTROL ........................................................................................................ 3-18

3.2.1.2.5 INTERCONNECTING UTILITY HARDWARE ........................................................................ 3-19

3.2.1.2.5.1 ACCESSIBILITY .................................................................................................................... 3-19

3.2.1.2.5.2 REDUNDANCY ..................................................................................................................... 3-19

3.2.1.2.5.3 ELECTRICAL CONNECTORS .............................................................................................. 3-19

3.2.1.2.5.4 FLUID FITTINGS ................................................................................................................... 3-19

3.2.1.2.5.4.1 FITTINGS MATING ............................................................................................................... 3-20

3.2.1.2.5.4.2 FLEXIBLE LINES AND BELLOWS ........................................................................................ 3-20

3.2.1.2.5.5 UTILITY CABLE SPECIFICATIONS ...................................................................................... 3-20

3.2.1.2.5.5.1 DATA BUS CABLE SPECIFICATIONS ................................................................................. 3-20

3.2.1.2.5.5.2 POWER CABLE SPECIFICATIONS ..................................................................................... 3-20

3.2.1.2.6 ACCESS/PASSAGEWAYS ................................................................................................... 3-20 v

3.2.1.2.6.1 VESTIBULE CLEARANCES.................................................................................................. 3-20

3.2.1.2.6.2 INGRESS/EGRESS PASSAGEWAYS .................................................................................. 3-21

3.2.1.2.7 DELETED .............................................................................................................................. 3-22

3.2.1.2.8 GROUNDING ........................................................................................................................ 3-22

3.2.1.2.9 SHIELDING ........................................................................................................................... 3-22

3.2.1.3 FLUID INTERFACES ............................................................................................................ 3-22

3.2.1.3.1 SUPPLY COOLANT .............................................................................................................. 3-22

3.2.1.3.1.1 COOLANT CHARACTERISTICS .......................................................................................... 3-22

3.2.1.3.1.1.1 COOLANT SPECIFICATION ................................................................................................. 3-22

3.2.1.3.1.1.2 COOLANT SUPPLY TEMPERATURE .................................................................................. 3-22

3.2.1.3.1.1.3 COOLANT SUPPLY PRESSURE ......................................................................................... 3-22

3.2.1.3.1.1.4 COOLANT SUPPLY RATE.................................................................................................... 3-23

3.2.1.3.1.2 CONTROL COOLANT SUPPLY ............................................................................................ 3-23

3.2.1.3.1.3 COOLING AVAILABILITY ..................................................................................................... 3-23

3.2.1.3.2 RECEIVE RETURN COOLANT (NODE 2 OR NODE 3) ....................................................... 3-23

3.2.1.3.2.1 COOLANT CHARACTERISTICS .......................................................................................... 3-23

3.2.1.3.2.1.1 COOLANT SPECIFICATION ................................................................................................. 3-23

3.2.1.3.2.1.2 COOLANT RETURN RECEIVE TEMPERATURE ................................................................. 3-23

3.2.1.3.2.1.3 COOLANT RETURN RECEIVE PRESSURE ........................................................................ 3-23

3.2.1.3.2.1.4 COOLANT RETURN RECEIVE RATE .................................................................................. 3-23

3.2.1.3.2.1.5 HEAT TRANSPORT CAPABILITY ........................................................................................ 3-23

3.2.1.3.2.1.6 COOLANT RETURN RECEIVE PRESSURE DROP ............................................................. 3-23

3.2.1.3.2.1.7 PMM INTERFACE WATER LEAKAGE - DELETED .............................................................. 3-24

3.2.1.3.2.1.8 VOLUME ALLOCATION - DELETED .................................................................................... 3-24

3.2.1.3.2.2 CONTROL RETURN COOLANT ........................................................................................... 3-24

3.2.1.3.3 SUPPLY INTERMODULE ATMOSPHERE ........................................................................... 3-24

3.2.1.3.3.1 INTERMODULE ATMOSPHERE SUPPLY CHARACTERISTICS ......................................... 3-24

3.2.1.3.3.1.1 INTERMODULE ATMOSPHERE SUPPLY TEMPERATURE ............................................... 3-24

3.2.1.3.3.1.2 INTERMODULE ATMOSPHERE SUPPLY PRESSURE ....................................................... 3-24

3.2.1.3.3.1.3 INTERMODULE ATMOSPHERE SUPPLY RATE ................................................................. 3-25

3.2.1.3.3.1.4 INTERMODULE ATMOSPHERE SUPPLY HUMIDITY ......................................................... 3-25

3.2.1.3.3.1.5 MAXIMUM OXYGEN CONCENTRATION ............................................................................. 3-25

3.2.1.3.3.2 DELETED .............................................................................................................................. 3-26

3.2.1.3.3.3 CONTROL INTERMODULE ATMOSPHERE SUPPLY ......................................................... 3-26

3.2.1.3.4 RECEIVE RETURN INTERMODULE ATMOSPHERE .......................................................... 3-26

3.2.1.3.4.1 INTERMODULE ATMOSPHERE CHARACTERISTICS ........................................................ 3-26

3.2.1.3.4.1.1 INTERMODULE ATMOSPHERE RECEIVE RETURN PRESSURE ..................................... 3-26

3.2.1.3.4.1.2 INTERMODULE ATMOSPHERE RECEIVE RETURN RATE ............................................... 3-26

3.2.1.3.4.1.3 INTERMODULE ATMOSPHERE RECEIVE RETURN HEAT LOAD ..................................... 3-26

3.2.1.3.4.2 INTERMODULE ATMOSPHERE RECEIVE RETURN AVAILABILITY ................................. 3-26

3.2.1.3.4.3 CONTROL RETURN INTERMODULE ATMOSPHERE ........................................................ 3-26

3.2.1.3.5 RECEIVE ATMOSPHERE SAMPLE AIR .............................................................................. 3-26

3.2.1.3.5.1 ATMOSPHERE SAMPLE AIR RECEIVE FLOW RATE ........................................................ 3-27

3.2.1.3.5.2 ATMOSPHERE SAMPLE AIR RECEIVE PRESSURE DROP .............................................. 3-27 vi

3.2.1.3.6 RECEIVE FUEL CELL WATER (HTV) - DELETED ............................................................... 3-27

3.2.1.3.7 SUPPLY NITROGEN (SCAR) TBD ....................................................................................... 3-27

3.2.1.3.7.1 NITROGEN CHARACTERISTICS (SCAR) TBD ................................................................... 3-27

3.2.1.3.7.1.1 SUPPLY NITROGEN TEMPERATURE (SCAR) TBD ........................................................... 3-27

3.2.1.3.7.1.2 SUPPLY NITROGEN PRESSURE (SCAR) TBD .................................................................. 3-27

3.2.1.3.7.1.3 SUPPLY NITROGEN RATE (SCAR) TBD............................................................................. 3-27

3.2.1.3.8 RECEIVE WASTE WATER (SCAR) TBD .............................................................................. 3-27

3.2.1.3.8.1 WASTE WATER RECEIVE CHARACTERISTICS (SCAR) TBD ........................................... 3-27

3.2.1.3.8.1.1 WASTE WATER RECEIVE QUALITY (SCAR) TBD ............................................................. 3-27

3.2.1.3.8.1.2 WASTE WATER RECEIVE TEMPERATURE (SCAR) TBD .................................................. 3-27

3.2.1.3.8.1.2.1 NOMINAL (SCAR) TBD ......................................................................................................... 3-27

3.2.1.3.8.1.2.2 TRANSIENT (SCAR) TBD ..................................................................................................... 3-28

3.2.1.3.8.1.3 WASTE WATER RECEIVE PRESSURE (SCAR) TBD ......................................................... 3-28

3.2.1.3.8.1.4 WASTE WATER RECEIVE FLOW RATE (SCAR) TBD ........................................................ 3-28

3.2.1.3.8.1.4.1 NOMINAL (SCAR) TBD ......................................................................................................... 3-28

3.2.1.3.8.1.4.2 TRANSIENT (SCAR) TBD ..................................................................................................... 3-28

3.2.1.4 ELECTRICAL POWER INTERFACES .................................................................................. 3-28

3.2.1.4.1 PMMN1N/HTV-1 POWER OUTPUT CIRCUIT ...................................................................... 3-28

3.2.1.4.1.1 PMMN1N/HTV-1 POWER SOURCE CHARACTERISTICS .................................................. 3-29

3.2.1.4.1.2 PMMN1N/HTV-1 FAULT PROTECTION ............................................................................... 3-30

3.2.1.4.1.3 PMMN1N/HTV-1 POWER CONTROL ................................................................................... 3-30

3.2.1.4.1.3.1 PMMN1N/HTV-1 POWER ON/OFF CONTROL .................................................................... 3-30

3.2.1.4.1.3.2 DELETED .............................................................................................................................. 3-30

3.2.1.4.1.4 PMMN1N SOURCE AND LOAD IMPEDANCE ..................................................................... 3-30

3.2.1.4.1.5 PMMN1N SOURCE TURN−ON CHARACTERISTICS .......................................................... 3-31

3.2.1.4.2 PMMN2N/HTV−1 POWER OUTPUT CIRCUIT ..................................................................... 3-31

3.2.1.4.2.1 DELETED .............................................................................................................................. 3-32

3.2.1.4.2.2 PMMN2N/HTV−1 FAULT PROTECTION .............................................................................. 3-32

3.2.1.4.2.3 PMMN2N/HTV−1 POWER CONTROL .................................................................................. 3-32

3.2.1.4.2.3.1 PMMN2N/HTV−1 POWER ON/OFF CONTROL ................................................................... 3-32

3.2.1.4.2.4 PMMN2N/HTV−1 SOURCE AND LOAD IMPEDANCE ......................................................... 3-32

3.2.1.4.2.5 PMMN2N/HTV−1 USOS SOURCE TURN−ON CHARACTERISTICS .................................. 3-32

3.2.1.4.3 DELETED .............................................................................................................................. 3-33

3.2.1.4.3.1 DELETED .............................................................................................................................. 3-33

3.2.1.4.3.2 DELETED .............................................................................................................................. 3-33

3.2.1.4.3.3 DELETED .............................................................................................................................. 3-33

3.2.1.4.3.3.1 DELETED .............................................................................................................................. 3-33

3.2.1.4.3.4 DELETED .............................................................................................................................. 3-33

3.2.1.4.3.5 DELETED .............................................................................................................................. 3-33

3.2.1.4.4 HTV−2 POWER OUTPUT CIRCUIT...................................................................................... 3-33

3.2.1.4.4.1 HTV−2 POWER SOURCE CHARACTERISTICS .................................................................. 3-33

3.2.1.4.4.2 HTV−2 FAULT PROTECTION .............................................................................................. 3-33

3.2.1.4.4.3 HTV−2 POWER CONTROL .................................................................................................. 3-34

3.2.1.4.4.3.1 HTV−2 POWER ON/OFF CONTROL .................................................................................... 3-34 vii

3.2.1.4.4.4 HTV−2 SOURCE AND LOAD IMPEDANCE ......................................................................... 3-34

3.2.1.4.4.5 HTV−2 SOURCE TURN−ON CHARACTERISTICS .............................................................. 3-34

3.2.1.4.5 PMMN3 POWER OUTPUT CIRCUIT .................................................................................... 3-34

3.2.1.4.5.1 PMMN3 POWER SOURCE CHARACTERISTICS ................................................................ 3-34

3.2.1.4.5.2 PMMN3 FAULT PROTECTION ............................................................................................. 3-34

3.2.1.4.5.3 PMMN3 POWER CONTROL................................................................................................. 3-35

3.2.1.4.5.3.1 PMMN3 POWER ON/OFF CONTROL .................................................................................. 3-35

3.2.1.4.5.4 PMMN3 SOURCE AND LOAD IMPEDANCE ........................................................................ 3-35

3.2.1.4.5.5 PMMN3 SOURCE TURN−ON CHARACTERISTICS ............................................................ 3-36

3.2.1.4.6 PMMN3−3 POWER OUTPUT CIRCUIT (SCAR) – DELETED .............................................. 3-36

3.2.1.4.7 PMMN3−2 POWER OUTPUT CIRCUIT (SCAR) – DELETED .............................................. 3-36

3.2.1.5 COMMAND AND DATA HANDLING INTERFACES .............................................................. 3-36

3.2.1.5.1 MIL−STD−1553B INTERFACES ............................................................................................ 3-36

3.2.1.5.1.1 DATA BUS STANDARDS ...................................................................................................... 3-36

3.2.1.5.1.2 PMM−MDM TERMINAL ADDRESS ...................................................................................... 3-36

3.2.1.5.1.3 DELETED .............................................................................................................................. 3-37

3.2.1.5.1.4 DELETED .............................................................................................................................. 3-37

3.2.1.5.1.5 SPACE STATION LOCAL BUSES ......................................................................................... 3-37

3.2.1.5.1.5.1 TERMINAL OPERATIONS .................................................................................................... 3-37

3.2.1.5.1.5.2 SOFTWARE FUNCTIONAL INTERFACES ........................................................................... 3-38

3.2.1.5.1.5.3 PROVIDE OUTPUT AMPLITUDE ......................................................................................... 3-38

3.2.1.5.1.5.4 TERMINATIONS/JUMPERS ................................................................................................. 3-38

3.2.1.6 INDUCED ENVIRONMENTS ................................................................................................ 3-38

3.2.1.6.1 ELECTROMAGNETIC EFFECTS ......................................................................................... 3-38

3.2.1.6.1.1 ELECTROMAGNETIC COMPATIBILITY (EMC) .................................................................... 3-38

3.2.1.6.1.2 BONDING .............................................................................................................................. 3-39

3.2.1.6.2 THERMAL ............................................................................................................................. 3-39

3.2.1.6.2.1 THERMAL INTERFACE FOR PMM ....................................................................................... 3-39

3.2.1.6.2.2 THERMAL INTERFACE FOR HTV ........................................................................................ 3-39

3.2.1.6.2.2.1 PASSIVE INTERFACE TEMPERATURE .............................................................................. 3-39

3.2.1.6.2.2.2 CONDUCTIVE HEAT TRANSFER ........................................................................................ 3-39

3.2.1.6.2.2.3 RADIATIVE HEAT TRANSFER ............................................................................................. 3-39

3.2.1.6.3 DELETED .............................................................................................................................. 3-39

3.2.1.6.4 STRUCTURAL LOADS ......................................................................................................... 3-39

3.2.1.6.4.1 ON−ORBIT INDUCED LOADS .............................................................................................. 3-39

3.2.1.6.4.2 LOAD SPECTRA – DELETED .............................................................................................. 3-40

3.2.1.6.4.3 USOS (NODE 1, NODE 2) AND NODE 3 ON−ORBIT THERMAL STRUCTURAL

LOADS .................................................................................................................................. 3-40

3.2.1.6.4.3.1 ON−ORBIT THERMALLY INDUCED STRUCTURAL LOADS ............................................... 3-40

3.2.1.6.4.3.2 ON−ORBIT THERMALLY INDUCED LOADS SPECTRA ...................................................... 3-42

3.2.2 PMM INTERFACE REQUIREMENTS .................................................................................... 3-44

3.2.2.1 ENVELOPE REQUIREMENTS ............................................................................................. 3-44

3.2.2.1.1 ACCESS ENVELOPE ........................................................................................................... 3-44

3.2.2.1.2 PMM BERTHING STAY OUT ZONE ENVELOPE.................................................................. 3-44

3.2.2.2 STRUCTURAL/MECHANICAL ATTACHMENT ..................................................................... 3-47 viii

3.2.2.2.1 DELETED .............................................................................................................................. 3-48

3.2.2.2.2 BERTHING/ATTACHMENT MECHANISM(S) ....................................................................... 3-48

3.2.2.2.3 STRUCTURAL ...................................................................................................................... 3-48

3.2.2.2.4 FRACTURE CONTROL ........................................................................................................ 3-48

3.2.2.2.5 INTERCONNECTING UTILITY HARDWARE ........................................................................ 3-48

3.2.2.2.5.1 ACCESSIBILITY .................................................................................................................... 3-48

3.2.2.2.5.2 REDUNDANCY ..................................................................................................................... 3-48

3.2.2.2.5.3 ELECTRICAL CONNECTORS .............................................................................................. 3-48

3.2.2.2.5.4 FLUID FITTINGS ................................................................................................................... 3-48

3.2.2.2.5.4.1 FITTINGS MATING ................................................................................................................ 3-48

3.2.2.2.5.5 UTILITY CABLE SPECIFICATIONS ...................................................................................... 3-49

3.2.2.2.5.5.1 DATA BUS CABLE SPECIFICATIONS .................................................................................. 3-49

3.2.2.2.5.5.2 POWER CABLE SPECIFICATIONS ...................................................................................... 3-49

3.2.2.2.6 ACCESS/PASSAGEWAYS ................................................................................................... 3-49

3.2.2.2.6.1 VESTIBULE CLEARANCES.................................................................................................. 3-49

3.2.2.2.6.2 INGRESS/EGRESS PASSAGEWAYS ................................................................................... 3-49

3.2.2.2.7 DELETED .............................................................................................................................. 3-49

3.2.2.2.8 GROUNDING ........................................................................................................................ 3-49

3.2.2.2.9 SHIELDING ........................................................................................................................... 3-49

3.2.2.3 FLUID INTERFACES ............................................................................................................ 3-49

3.2.2.3.1 RECEIVE COOLANT (FROM NODE 2 OR NODE 3) - DELETED ........................................ 3-49

3.2.2.3.2 RETURN COOLANT (TO NODE 2 OR NODE 3) - DELETED .............................................. 3-49

3.2.2.3.3 RECEIVE INTERMODULE ATMOSPHERE .......................................................................... 3-50

3.2.2.3.3.1 INTERMODULE ATMOSPHERE RECEIVE CHARACTERISTICS ........................................ 3-50

3.2.2.3.3.1.1 INTERMODULE ATMOSPHERE RECEIVE TEMPERATURE .............................................. 3-50

3.2.2.3.3.1.2 INTERMODULE ATMOSPHERE RECEIVE PRESSURE ...................................................... 3-50

3.2.2.3.3.1.3 INTERMODULE ATMOSPHERE RECEIVE RATE ................................................................ 3-51

3.2.2.3.3.1.4 INTERMODULE ATMOSPHERE RECEIVE HUMIDITY ........................................................ 3-51

3.2.2.3.3.1.5 MAXIMUM OXYGEN CONCENTRATION ............................................................................. 3-51

3.2.2.3.3.2 DELETED .............................................................................................................................. 3-51

3.2.2.3.3.3 DELETED .............................................................................................................................. 3-51

3.2.2.3.4 RETURN INTERMODULE ATMOSPHERE ........................................................................... 3-51

3.2.2.3.4.1 INTERMODULE ATMOSPHERE CHARACTERISTICS ........................................................ 3-52

3.2.2.3.4.1.1 DELETED .............................................................................................................................. 3-52

3.2.2.3.4.1.2 INTERMODULE ATMOSPHERE RETURN RATE ................................................................. 3-52

3.2.2.3.4.1.3 INTERMODULE ATMOSPHERE RETURN HEAT LOAD ...................................................... 3-52

3.2.2.3.4.2 INTERMODULE ATMOSPHERE RETURN AVAILABILITY .................................................... 3-52

3.2.2.3.4.3 CONTROL INTERMODULE ATMOSPHERE ........................................................................ 3-52

3.2.2.3.5 ATMOSPHERE SAMPLING .................................................................................................. 3-52

3.2.2.3.5.1 ATMOSPHERE SAMPLE AIR SUPPLY PRESSURE DROP ................................................. 3-52

3.2.2.3.6 DELETED .............................................................................................................................. 3-52

3.2.2.4 ELECTRICAL POWER INTERFACES .................................................................................. 3-52

3.2.2.4.1 NOMINAL SECONDARY POWER INPUT CIRCUIT ............................................................. 3-52

3.2.2.4.1.1 POWER QUALITY ................................................................................................................. 3-53 ix

3.2.2.4.1.2 FAULT PROTECTION ........................................................................................................... 3-54

3.2.2.4.1.2.1 DELETED .............................................................................................................................. 3-54

3.2.2.4.1.3 INITIALIZATION SURGE CURRENT .................................................................................... 3-54

3.2.2.4.2 DELETED .............................................................................................................................. 3-55

3.2.2.4.2.1 DELETED .............................................................................................................................. 3-55

3.2.2.4.2.2 DELETED .............................................................................................................................. 3-55

3.2.2.4.2.3 DELETED .............................................................................................................................. 3-55

3.2.2.5 COMMAND AND DATA HANDLING INTERFACES .............................................................. 3-55

3.2.2.5.1 MIL−STD−1553B INTERFACE .............................................................................................. 3-55

3.2.2.5.1.1 DATA BUS STANDARDS ...................................................................................................... 3-55

3.2.2.5.1.2 TERMINAL ADDRESS PINS ................................................................................................. 3-55

3.2.2.5.1.3 DELETED .............................................................................................................................. 3-55

3.2.2.5.1.4 DELETED .............................................................................................................................. 3-55

3.2.2.5.1.5 SPACE STATION LOCAL BUSES ......................................................................................... 3-55

3.2.2.5.1.5.1 TERMINAL OPERATIONS .................................................................................................... 3-55

3.2.2.5.1.5.2 SOFTWARE FUNCTIONAL INTERFACES ........................................................................... 3-56

3.2.2.5.1.5.3 PROVIDE OUTPUT AMPLITUDE ......................................................................................... 3-56

3.2.2.6 INDUCED ENVIRONMENTS ................................................................................................ 3-56

3.2.2.6.1 ELECTROMAGNETIC EFFECTS ......................................................................................... 3-56

3.2.2.6.1.1 EMC ...................................................................................................................................... 3-56

3.2.2.6.1.2 BONDING .............................................................................................................................. 3-56

3.2.2.6.2 THERMAL ............................................................................................................................. 3-56

3.2.2.6.3 DELETED .............................................................................................................................. 3-56

3.2.2.6.4 STRUCTURAL LOADS ......................................................................................................... 3-56

3.2.2.6.4.1 ON−ORBIT INDUCED LOADS .............................................................................................. 3-56

3.2.2.6.4.2 LOAD SPECTRA ................................................................................................................... 3-57

3.2.2.6.4.3 ON−ORBIT THERMAL STRUCTURAL LOADS .................................................................... 3-59

3.2.2.6.4.3.1 ON−ORBIT THERMALLY INDUCED STRUCTURAL LOADS ............................................... 3-59

3.2.2.6.4.3.2 ON−ORBIT THERMALLY INDUCED LOADS SPECTRA ...................................................... 3-62

APPENDIX

A SOFTWARE INTERFACES................................................................................................... A-i

B ABBREVIATIONS AND ACRONYMS ................................................................................... B-1

TABLE

3.1.1−1 HTV/PMM REQUIREMENTS APPLICABILITY MATRIX (6 PAGES) .................................... 3-2

3.1.2.2−1 USOS/PMM INTERFACE HARDWARE RESPONSIBILITIES .............................................. 3-17

3.1.4−1 LINEAR TOLERANCES ........................................................................................................ 3-18

3.2.1.2.5.4−1 FLUID FITTINGS ................................................................................................................... 3-19

3.2.1.4.1.2−1 OVERCURRENT PROTECTION(1) ....................................................................................... 3-30

3.2.1.4.2.2−1 OVERCURRENT PROTECTION(1) ....................................................................................... 3-32

3.2.1.4.3.2-1 DELETED .............................................................................................................................. 3-33

3.2.1.4.4.2−1 OVERCURRENT PROTECTION (1)....................................................................................... 3-33

3.2.1.4.5.2−1 OVERCURRENT PROTECTION(1) ....................................................................................... 3-34

3.2.1.4.6.2-1 DELETED .............................................................................................................................. 3-36 x

3.2.1.4.7.2-1 DELETED .............................................................................................................................. 3-36

3.2.1.5.1.5−1 USOS TO PMM/HTV LOCAL BUS LOCATION ..................................................................... 3-37

3.2.1.6.3−1 DELETED .............................................................................................................................. 3-39

3.2.1.6.4.1−1 INDUCED LOADS – DELETED ............................................................................................. 3-40

3.2.1.6.4.2−1 LOAD SPECTRA – DELETED .............................................................................................. 3-40

3.2.1.6.4.3.1−1 ON−ORBIT THERMALLY INDUCED STRUCTURAL LOADS .............................................. 3-40

3.2.1.6.4.3.1−2 ACBM/PCBM INTERFACE BOLT LOCATIONS .................................................................... 3-41

3.2.1.6.4.3.2−1 ON−ORBIT TRANSIENT THERMAL LOADS ........................................................................ 3-42

3.2.1.6.4.3.2−2 ON−ORBIT THERMALLY INDUCED LOADS SPECTRUM .................................................. 3-44

3.2.1.6.4.3.2−3 ON−ORBIT THERMALLY INDUCED MEAN BERTHING LOADS......................................... 3-44

3.2.2.4.1.1−1 POWER QUALITY REQUIREMENTS ................................................................................... 3-54

3.2.2.4.2.1-1 DELETED .............................................................................................................................. 3-55

3.2.2.6.4.1−1 ON−ORBIT TRANSIENT LOADS .......................................................................................... 3-57

3.2.2.6.4.1−2 PRESSURE LOAD CASES ................................................................................................... 3-57

3.2.2.6.4.2−1 ON−ORBIT TRANSIENT LOAD SPECTRA .......................................................................... 3-57

3.2.2.6.4.3.1−1 ON−ORBIT THERMALLY INDUCED STRUCTURAL LOADS .............................................. 3-60

3.2.2.6.4.3.1−2 ACBM/PCBM INTERFACE BOLT LOCATIONS (2 PAGES) ................................................. 3-61

3.2.2.6.4.3.2-1 ON−ORBIT TRANSIENT THERMAL LOADS ........................................................................ 3-63

3.2.2.6.4.3.2−2 ON−ORBIT THERMALLY INDUCED LOADS SPECTRUM .................................................. 3-63

3.2.2.6.4.3.2−3 ON−ORBIT THERMALLY INDUCED MEAN BERTHING LOADS......................................... 3-64

FIGURE

3.1.1−1 ON−ORBIT CONFIGURATION OF THE PERMANENT MULTI-PURPOSE MODULE ......... 3-8

3.1.1−2 ON-ORBIT CONFIGURATION OF MODULES TO NODE 1 AND NODE 2 NADIR

(NOTIONAL) .......................................................................................................................... 3-9

3.1.1-3 NODE/PMM FUNCTIONAL INTERFACE DIAGRAM ............................................................ 3-10

3.1.1−4 NODE 1/NODE 2/HTV FUNCTIONAL INTERFACE DIAGRAM ............................................ 3-11

3.1.1.3−1 UTILITY AND STRUCTURAL/MECHANICAL INTERFACE PLANES ................................... 3-12

3.1.1.4-1 NODE ELEMENT REFERENCE COORDINATE SYSTEM ................................................... 3-13

3.1.1.4-2 RESOURCE NODE 2 & 3 COORDINATE SYSTEM ............................................................. 3-14

3.1.1.4-3 PMM COORDINATE SYSTEM .............................................................................................. 3-15

3.2.1.2.6.1−1 PASSAGEWAY ENVELOPE ................................................................................................. 3-21

3.2.1.4−1 NODE TO PMM/HTV ELECTRICAL INTERFACE ................................................................ 3-29

3.2.1.4.1.4−1 INTERFACE IMPEDANCE MAGNITUDE ............................................................................. 3-31

3.2.1.4.1.4−2 SOURCE IMPEDANCE PHASE ............................................................................................ 3-31

3.2.1.4.3.4−1 DELETED .............................................................................................................................. 3-33

3.2.1.4.3.4−2 DELETED .............................................................................................................................. 3-33

3.2.1.4.5.4-1 INTERFACE IMPEDANCE MAGNITUDE ............................................................................. 3-35

3.2.1.4.5.4-2 SOURCE IMPEDANCE PHASE ............................................................................................ 3-36

3.2.1.5.1.4−1 DELETED .............................................................................................................................. 3-37

3.2.1.5.1.4−2 DELETED .............................................................................................................................. 3-37

3.2.1.6.4.1−1 LOAD APPLICATION DIAGRAM – DELETED ...................................................................... 3-40

3.2.1.6.4.3.1−1 ACBM/PCBM INTERFACE PLANE ATTACHMENT BOLT LOCATIONS ............................. 3-41

3.2.2.1.2−1 BERTHING STAY OUT ZONE ............................................................................................... 3-45

3.2.2.1.2−1 BERTHING STAY OUT ZONE (CONTINUED)....................................................................... 3-46 xi

3.2.2.1.2−1 BERTHING STAY OUT ZONE (CONCLUDED) ..................................................................... 3-47

3.2.2.1.2−2 DELETED .............................................................................................................................. 3-47

3.2.2.1.2−3 DELETED .............................................................................................................................. 3-47

3.2.2.5.1.4−1 DELETED .............................................................................................................................. 3-55

3.2.2.5.1.4−2 DELETED .............................................................................................................................. 3-55

3.2.2.6.4.1−1 LOAD APPLICATION DIAGRAM .......................................................................................... 3-58

3.2.2.6.4.1−2 PRESSURE LOAD CASES DIAGRAM PMM ........................................................................ 3-59

3.2.2.6.4.3.1−1 ACBM/PCBM INTERFACE PLANE ATTACHMENT BOLT LOCATIONS ............................... 3-61

1-1

1.0 INTRODUCTION

1.1 PURPOSE & SCOPE

The purpose of this document is to provide definition of the structural/mechanical, electrical, thermal, fluid, and data interface functional requirements between the United States On−Orbit Segment, Nodes 1, 2 and 3, and the Permanent Multi-purpose Module

(PMM).

This document further defines and controls the physical and functional interfaces on the Node 2 side, between Node 2 and the H−II Transfer Vehicle (HTV) and between Node 1 and the HTV. Appendix A (software interfaces) is applicable for PMM only. HTV software interfaces are defined in SSP 41178−35.

In previous documents, United States On-orbit Segment (USOS) refers to Nodes 1 and

2. This document includes Node 3 in all references to USOS except where indicated.

The scope of this document is limited to the interfaces between Node 1, Node 2 and Node 3 and the PMM, and Node 1 and Node 2 and the HTV.

1.2 PRECEDENCE

In the event of conflict between SSP 41000, Space Station System Specification, and the contents of this Interface Control Document (ICD), the requirements of SSP 41000, shall take precedence.

1.3 RESPONSIBILITY AND CHANGE AUTHORITY

This document is prepared and maintained in accordance with SSP 30459, International Space Station Interface Control Plan. National Aeronautics and Space Administration (NASA) shall delegate the responsibility for preparation and maintenance of this ICD.

2-1

2.0 DOCUMENTS

2.1 APPLICABLE DOCUMENTS

The following documents of the exact issue shown form a part of this document to the exte30219t specified herein.

683−16348 Revision D (PMM, Drawing Node 2, Node 3)

ADCN 8444

Revision G (Node 1) January 27, 1998

References

Coupling, Quick Disconnect, Fluid, Self−Sealing, Internal Envelope

(Table: 3.2.1.2.5.4−1)

ASTM E380

Revision A References

Standard Practice for Use of the International System of Units (SI) (the Modernized Metric System) January 1, 1993 (3.1.3, 3.1.4)

MIL−STD−1553

Multiplex Revision B, Notice 2 September 8, 1986 References

Digital Time Division Command/Response Databus

(Table: 3.1.2.3−1, 3.2.1.2.5.2, 3.2.1.2.5.5.1, 3.2.1.2.9, 3.2.1.5.1, 3.2.1.5.1.1, 3.2.1.5.1.5, 3.2.1.5.1.5.1, 3.2.1.5.1.5.3, 3.2.2.2.5.2,3.2.2.2.5.5.1, 3.2.2.2.9, 3.2.2.5.1, 3.2.2.5.1.1, 3.2.2.5.1.5, 3.2.2.5.1.5.1, 3.2.2.5.1.5.3)

20M02540 Vibration Revision C February 28, 1990

Assessment of Flexible Lines for Flow Induced

(3.2.1.2.5.4.2)

NSTS 08123

Revision B June 3, 1994 References

Certification of Flex Hoses and Bellows for Flow Induced Vibration

(3.2.1.2.5.4.2)

SSP 30219

Revision F (Node 2) October 26, 2001

Revision H (Node 3) June 01, 2005

Space Station Reference Coordinate Systems

(3.1.1.4)

2-2

SSP 30237

Revision B (PMM)

DCN 011, 012, 013, 014,

015, 017 June 15, 1994

Revision F (Node 2)

DCN 016, 017, 019, 020,

040, 021, 022, TBD (006154)

May 17, 2007

Revision G (Node 3)

DCN 037

May 3, 2002

Revision D (Node 1)

DCN 004, 005, 014

June 12, 1998

References

Space Station Electromagnetic Emission and Susceptibility Requirements

(3.2.2.4.1.4)

SSP 30240

Revision C (PMM)

DCN 003, TBD (3282),

Revision C (Node 2, Node 3)

DCN 002, 010

December 22, 1998

Revision C (Node 1)

DCN 005

September 30, 1998

Space Station Grounding Requirements

(3.2.1.2.8, 3.2.2.2.8)

2-3

SSP 30243

Revision C (PMM)

DCN 006, 007, 008

April 17,1994

Revision G (Node 2, Node 3) July 31, 2002

Revision E (Node 1)

DCN 003, 008, 015

June 9, 1998

References

Space Station Requirements for Electromagnetic Compatibility

(3.2.1.6.1.1, 3.2.2.6.1.1)

SSP 30245

Revision B (PMM)

DCN 009, 010, 011, 013

June 3, 1994

Revision E (Node 2)

DCN 009, 010, 011, 013,

015, 016, 032, 018, TBD

(006154) September 15, 1999

Revision F (Node 3) May 2, 2002

Revision D (Node 1)

DCN 004, 005, 011

June 4, 1998

Space Station Electrical Bonding Requirements

(3.2.1.6.1.2, 3.2.2.6.1.2)

SSP 30459

Revision F March 23, 1994

International Space Station Alpha Interface Control Plan

(1.3, A.1.2)

2-4

SSP 30482 Volume 1 Revision A (PMM)

CN−001

January 1, 1994

Revision C (Node 2, Node 3) July 7, 1997

Revision C (Node 1)

DCN 003

July 7, 1997

References

Electrical Power Specifications and Standards Volume 1:

EPS Electrical Performance Specifications

(3.2.1.4.1.1, 3.2.1.4.3.1, 3.2.1.4.4.1, 3.2.1.4.5.1, 3.2.1.4.6.1, 3.2.1.4.7.1, 3.2.2.4.1.1, 3.2.2.4.2.1,)

SSP 30482, Volume 2 Revision A (PMM)

DCN 001, 002

January 1, 1994

Revision A (Node 2, Node 3)

DCN 001, 002, 003

January 1, 1994

Revision A (Node 1)

DCN 001, 002, 003, 004

January 1, 1994

Electrical Power Specifications and Standards Volume 2:

Consumer Constraints

(3.2.2.4.1.1)

SSP 30558

Revision B (PMM, Node 2, Node 3) June 30, 1994

Revision C (Node 1)

Fracture Control Requirements for Space Station

(3.2.1.2.4, 3.2.2.2.4)

2-5

SSP 30559

Revision B (PMM, Node 2)

DCN 001

June 30, 1994

Revision C (Node 3)

DCN 012, TBD (9111)

September 29, 2000

Revision C (Node 1)

DCN (SSCN 9111)

Structural Design and Verification Requirements

(3.2.1.2.3, 3.2.2.2.3)

SSP 30573

Revision A (PMM)

DCN 004

August 10, 1994

Revision B (Node 2)

TBD (5417)

March 1, 1998

Revision B (Node 3) April 15, 2001

Revision B (Node 1) March 1, 1998

Space Station Fluid Procurement and Use Specification

(3.2.1.3.1.1.1, 3.2.1.3.2.1.1, 3.2.2.3.1.1.1, 3.2.2.3.2.1.1)

SSP 41004

Revision H (PMM) October 25, 2005

Revision G (Node 2, Node 3) June 1, 1999

Revision F (Node 1) IRN 41004−1465, 1594, 1481, 1555 April 30, 1998

References

Common Berthing Mechanism to Pressurized Elements Interface Control Document, Part 1

(3.2.1.1.1, 3.2.1.2.2, 3.2.2.1.1, 3.2.2.2.2)

2-6

SSP 41148

Basic Revision (PMM, Node 2, Node 3) April 12, 1994

Revision D (Node1) September 30, 1998

References

Active Common Berthing Mechanism to Passive Common Berthing Mechanism Interface Control Document, Part 1

3.1.1.3, 3.2.1.2, 3.2.1.2.2, 3.2.2.2.2

SSP 50005

Revision B (PMM) August 9, 1995

Revision B (Node2)

DCN 001, 004, 011, 010

August 9, 1995

Revision C (Node3)

DCN 001, 008, 011, TBD

(10331), TBD (9086)

December 15, 1999

Revision B (Node1)

DCN 001, 002, 003, 004,

005, 006, (SSCN 009086)

August 9, 1995

International Space Station Flight Crew Integration Standard

(3.2.1.1.1, 3.2.1.2.5.1, 3.2.2.1.1, 3.2.2.2.5.1)

SSP 50539

Rev A 01 Sep 2002

References

Application Process Identifier and Logical Data Path Identifier Definition

(A.3.3.2.1.3, A.3.4.7.5)

2-7

SSQ 21635

Revision J (PMM) January 15, 2000

Revision H (Node 2)

DCN 001, 011, 012, 013,

014, TBD (000918), TBD

(002588), TBD (005645)

January 10, 1997

Revision K (Node 3) October 29, 2002

Revision H (Node 1) DCN 001, 011, 012, 013, 014, 015, 017 August 1, 1997

References

Connectors and Accessories, Electrical, Circular, Miniature, IVA/EVA/Robot Compatible, Space Quality, General Specification for

(3.2.1.2.5.3, 3.2.2.2.5.3)

SSQ 21652

Revision F (PMM, Node 2, Node 3) January 15, 2000

Revision E (Node 1) July 15, 1998

References

General Specification for Wire, Electric, Silicon−Insulated, Nickel Coated Copper, Space Quality

(3.2.1.2.5.5.2, 3.2.2.2.5.5.2)

SSQ 21655

Revision F (PMM) January 15, 2000

Revision E (Node 2, Node 3)

TBD (002588)

September 24, 1998

Revision E (Node 1) July 15, 1998

References

General Specification for Cable, Electrical, MIL−STD−1553B Data Bus, Space Quality

(3.2.1.2.5.5.1, 3.2.2.2.5.5.1)

2-8

MS 27115

Revision C September 2, 1986

References

Coupling Clamp, Grooved V−Band 1.750 to 6.250 Flange OD (−450° to +200° F) ”Validated”

Table 3.2.1.2.5.4−1

2.2 REFERENCE DOCUMENTS

The following documents are referenced in this ICD for context and user convenience:

SSP 41000 International Space Station System Specification

SSP 41178-35 Software Interface Control Document Internal Multiplexer/De-multiplexer to International Space Station, Book 35, H−II Transfer Vehicle Command Data Processor Interface (for HTV Interface Only)

SSP 50438 International Space Station to H−II Transfer Vehicle (HTV) Interface Control Document (for HTV Interface Only)

3-1

3.0 INTERFACES

3.1 GENERAL

3.1.1 INTERFACE DESCRIPTION

In accordance with ISS Program decisions authorized and directed by ISS Change Directive (CD) 013565, Permanent Multipurpose Module (PMM) Relocation and Second Docking Port at Node 2 Zenith, the PMM will permanently berth to the forward radial port of Node 3. The capability to berth the PMM at the Common Berthing Mechanism locations on Node 1 Nadir and Node 2 Nadir will remain; however, the configuration directed by CD 013565 will be the primary focus depicted in this document. Node 1 and Node 2 Nadir interface requirements and configurations for the PMM remain in the document as reference material in the event that future ISS relocation of the PMM back to these nodes is required.

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