Attachment_0013_-_Thermal_Architecture_Diagram_(S)_(06FEB2019).pdf

(RESPONSES MUST BE APPROPRIATELY CLASSIFIED AND MARKED)

Attachment 0013 – 06 February 2019 Solicitation Number: W56HZV-18-R-0174

Thermal Architecture Diagram

Objective: The Diagram shows updates to the current Thermal Architecture design and the relationships between load components and sink components. The information on the diagrams is a reconciliation of the total energy budget.

Requirements:

1. Format: The plan shall be in contractor’s format. The contractor may submit artifacts in SysML format 1.4 or later.

2. Content: The Diagram shall contain the following:

2.1 The contractor shall deliver a thermal architecture diagram showing all heat generation, mechanical energy, fluid, and electrical energy connections of all components.

2.2 All components and connections shall be labeled with names, purpose of connection, maximum operating temperatures, ratings, maximum flowrates, efficiencies, and actual rating or flowrate.

2.3 Components capable of heat transfer as a sink shall include flow rates, inlet fluid temperatures and exit fluid temperatures for both hot and cold streams. A thermal architecture shall be submitted for the conditions of top speed and 0.7 tractive effort to weight ratio.

2.4 For each of these conditions a thermal architecture diagram shall be submitted at ambient temperature of 49o C at FCC weight, and at the maximum allowable ambient temperature at 20% growth weight.

DISTRIBUTION STATEMENT A: Approved for Public Release; distribution unlimited.

Attachment 0013 - Thermal Architecture Diagram to RFP Number W56HZV-18-R-1074