Statement of Work.docx

Statement of Work Title: CHIPS R&D Custom Diffractometry and Fourier Ptychography Endstation Lab: PML, NDCD 683.12

I. BACKGROUND INFORMATION

The Nanoscale Device Characterization Division (NDCD) develops and advances the measurement and knowledge infrastructure to characterize nano- and atom-scale engineered materials and solid-state devices for innovation in information processing, sensing, and future quantum technologies. The NDCD’s technical activities span atom scale devices, nanoscale spectroscopy, advanced electronics, nanoscale processes and measurements, and alternative computing. This acquisition will allow the NDCD to expand its measurement capabilities using extreme-ultraviolet (EUV) diffractometry and Fourier ptychography. The problem being solved by this EUV metrology technique is the non-destructive three-dimensional measurement of nanoscale periodic, non-periodic features in support of the American semiconductor industry.

To meet mission requirements, the NDCD needs to acquire a customized diffractometry end station, which will be a new experimental apparatus that will harness short wavelength EUV light for the non-destructive three-dimensional measurement of the smallest features of computer chips, their transistors. This procurement supports the CHIPS R&D Metrology Program's Grand Challenge 2 to advance metrology for future microelectronics manufacturing and project 2.07, “EUV Scatterometry.” The application of the required end station is the accurate quantitative reconstruction of dimensional structure of periodic and other patterned features from the reflective diffraction off a sample under test using EUV light, which will only propagate in a vacuum.

II. PURPOSE

The NDCD is developing capabilities for performing non-destructive optical three-dimensional measurements of the sizes of smallest features in a computer chips (its transistors) for industrial semiconductor manufacturing process control. We are using extreme-ultraviolet (EUV) wavelengths, 10x shorter than those used by the industry today, and current optical approaches using visible and UV wavelengths cannot adequately measure future semiconductor transistors. Our CHIPS project requires EUV-capable instrumentation, with the primary constraint that the apparatus must work in a vacuum, as air absorbs these wavelengths. This procurement is for a required custom diffractometry and Fourier ptychography endstation for our EUV HHG source, which will demonstrate the feasibility of EUV diffraction-based three-dimensional metrologies to the US semiconductor industry.

III. MINIMUM REQUIREMENTS

The Contractor shall provide a system that meets all technical specifications identified below. All items must be new. Used or remanufactured equipment will not be considered for award. Experimental, prototype, or custom items will not be considered. The use of “gray market” components are not acceptable. All line items shall be shipped in the original manufacturer’s packaging and include all original documentation and software, when applicable.

Line Item 0001:

Description: Custom Diffractometry and Fourier Ptychography Endstation Quantity: 1 Technical Specifications

a. The “Custom diffractometry and Fourier ptychography endstation shall be comprised of:

i. A custom vacuum chamber body

- Laterally square shape, 40”x40” (interior), Height 24” (interior).

- Capable of high vacuum (HV), defined herein as capable of attaining a 10-6 Torr base pressure.

- Materials: Stainless steel (SS) or Aluminum (Al) for body, Al for removable top side.

- Viewports:

(2) ISO-100 bulkhead

(2) ISO-160 bulkheads

(8) ISO-200 bulkheads Bulkheads can be converted to ConFlat ports or ISO-K by mutual consent.

- Base breadboard with 1” spaced tab holes made of 304 SS.

- All gaskets, blank flanges, and hardware (bolts, washers, nuts, etc.) required for the custom vacuum chamber to hold high vacuum.

ii. Sample stage with wafer chuck

- Electrostatic chuck for holding 300 mm Si wafer.

- Stage with 4 degrees of freedom in X-Y-Z-R.

X-Y: resolution of sub-μm, travel of ±3” Z: resolution of about 15 nm, travel of several mm R: resolution of sub min, travel 360 deg

- Vacuum-compatible for 10-6 Torr.

- Vacuum feedthrough(s) (ISO-160 or ISO-200) to connect sample stage to control electronics.

- Control electronics to allow a NIST-provided computer to control these stages.

- All cables (vacuum- and air-side) included.

- Basic software and drivers to enable control of this stage (python, C++, etc.)

iii. Optical/Camera Stage

- Vertical Arc Arm: Arc shape to hold the camera holding arm. The arm radius is at least 10” and no larger than 22” by mutual consent. The arm can hold the camera holding arm, which is movable along the arc line (from bottom to top: 10° – 70°) and motorized. The arc arm diameter must be at least half of the wafer stage size and its travel length. All parts must be HV compatible.

- Camera holding arm: attached to the Vertical Arc Arm and is comprised of vacuum compatible motorized stages with x,y,z, and two tilts. The specification is x-y-z axes with travel of about 1”, resolution of 1 μm and two tilts with travel of about 5 degrees, resolution of 1 min.

- A holder for camera is mounted to the camera stage.

- A holder for 1” optics element in front of the camera is attached to the camera holder. Element will be centered onto the camera sensor).

- Vacuum feedthrough (ISO-160 or ISO-200) to connect stages to their control electronics.

- Control electronics to allow a NIST-provided computer to control these stages.

- All cables (vacuum- and air-side) included.

-Software to enable control of this stage (python, C++, etc.).

iv. Full in-vacuum EUV camera

- High vacuum compatible.

- 2k x 2k pixel resolution or better with a depth of 16-bit or more.

- Sensor diagonal is 1” or larger.

- QE ~ 85% – 55% or higher for EUV wavelengths 13.5 nm ~ 55 nm.

- Frame rates of about 3 fps with 2kx2k resolution.

- Maximum readout frequency of 16 MHz.

- Chiller to cool down to -10 °C with feedthroughs.

- Vacuum feedthrough (ISO-160 or ISO-200) to connect camera electrically and cooling water to their control electronics.

- Read noise of 6.5 e- rms or less at about -10 °C.

- USB/DAQ interface.

- In-vacuum connection accessories included.

- Include control electronics to allow a NIST-provided computer to collect image data.

- All cables (vacuum- and air-side) included.

- Basic software and drivers to operate the camera (python, Matlab, C++, etc.).

v. A large o-ring gasket (Viton, vulcanized seams not glued) and bolts to connect the top plate to the chamber are to be included.

vi. Adjustable base

- The chamber shall be placed on this base, and the base is designed for placing next to the source optical table.

- The base shall be capable of adjusting height and level of the custom chamber. The height range is determined by mutual consent.

b. Contractor shall provide the specifications for the designs of the chamber as the computer-aided drawings (CAD) files and adjustments to the original design may be made to conform to the NIST design concept.

c. Safety:

i. The clear hole pattern for the rectangular chamber body shall have a minimum of four holes into which 5/8-11 Helical Inserts (or mutually agreed-upon equivalent) shall be installed for NIST-supplied Hoist Rings.

ii. The top Al flange shall have eight specially identified holes clear hole pattern for the rectangular body into which 1/2 -13 Keensert (or mutually agreed-upon equivalent) shall be installed for NIST-supplied Hoist Rings.

d. Consistent with industry practices, vendor shall generate more highly detailed three-dimensional CAD drawings beyond those provided by NIST. Approval by NIST of these detailed supplier-generated CAD drawings will be required prior to manufacturing components.

e. Finish Specifications:

i. Finish may be brushed, polished, or electropolished with confirmation of contamination free inside the chamber.

f. Chamber Geometry and Ports/Flanges Specifications:

i. All Ports and flanges shall be standard ISO or KF sizes as indicated in design drawings.

g. High Vacuum Specifications:

i. Must be leak tight in leak testing down to 1 x 10-6 Torr∙L/s

ii. Welds must be leak tested and exhibit no virtual leaks

iii. Must reach pressure < 7.5 x 10-7 Torr (< 1.0 x 10-4 Pa) in room temperature testing. Testing to be performed prior to shipment using vendor pumps (not included).

h. Industry-standard practices for maintaining vacuum cleanliness of these parts must be maintained through manufacturing and delivery. Blank flanges shall be installed for transport.

OPTION Line Item 0002:

Description: Installation and Training Quantity: 1

a. The system shall be installed by the Contractor and meet contract specifications no later than 2 weeks after delivery. Installation, at a minimum, shall include uncrating/unpackaging of all equipment, rigging, set-up and hook-up of the system, demonstration of all specifications, and removal of trash. Onsite installation and demonstration shall be done at NIST, Gaithersburg, MD.

b. The contractor shall conduct training session for up to two users at NIST. The training shall provide a thorough demonstration of all system/solution functions, maintenance, data administration, and basic troubleshooting. The training may be completed at NIST Monday – Friday during the operating hours of 8:00 am to 5 00 pm immediately after installation and demonstration of specifications and must be completed no later than 5 days after installation.

I. SCHEDULE OF DELIVERABLES

Place of Delivery

endstation

Standards of Acceptance: The NIST POC or COR shall review all the above deliverables and respond with an acceptance or request for revision email to the Contractor Point of Contact (POC) within 5 business days of receipt of deliverable.

PERIOD OF PERFORMANCE

13 months from the date of award. This does not include warranty.

II. DELIVERY TERMS

Delivery shall be FOB Destination (or equivalent terms, such as INCOTERMS Delivered Duties Paid) are required and shall occur not later than (NLT) 120 days after receipt of order (ARO).

FOB Destination means: The contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the purchase order, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery. The contractor shall deliver all Line Items to:

National Institute of Standards and Technology 100 Bureau Drive, BLDG 301 (Receiving) Gaithersburg, MD 20899

III. INSPECTION & ACCEPTANCE

In addition to the inspection and acceptance terms articulated in the specific FAR clause that allows the Government reserves the right to perform such performance tests and evaluations as defined below to verify specified system performance. Such tests and evaluations, if performed, shall be conducted within the environment that the system is to be operated. The Contractor has the right to be present during the tests and evaluations, if performed, at the Contractor’s expense.

Performance Tests:

A. The endstation must be vacuum tested by the manufacturer prior to shipping to ensure that it is leak tight and meets the geometric specifications of the design.

B. The system will be inspected for damage and contamination and then inspected for compliance with the machine drawing design.

C. If the manufactured endstation matches the design, the chamber will be blanked off at its ports and pumped out to test if it can reach the required room temperature base pressure of < 7.5 x 10-7 Torr.

NIST may choose at its discretion to forego this part of acceptance testing.

A visual inspection of the equipment will be performed by the NIST POC to identify surface defects or any form of indication that any equipment was damaged during transport to NIST. The Government shall have sole discretion to require repair or replacement of damaged and/or nonconforming supplies at no cost to the Government. The Government at any time prior to acceptance shall reject the equipment due to defects and/or nonconformance. The vendor is responsible for latent defects discovered any time after final inspection. However, the extent of its liability shall be prorated over the useful life of the equipment.

Ownership of the equipment shall transfer to NIST upon acceptance by the Government.

The Government will test, inspect, and accept or reject the equipment within 10 business days of the receipt of the equipment unless otherwise indicated above. The Government reserves the right to conduct quality assurance testing to confirm that a given instrument(s) meets the manufacturer’s and/or the Government’s performance specifications. It is anticipated that the equipment will meet all manufacturer’s specifications and/or the Government’s performance specifications identified in the most recent operations and maintenance manual for each piece of equipment and/or in this document.

IV. WARRANTY

The contractor shall warranty the entire system for a period of a minimum of 1 year in accordance with terms in FAR 52.212-4. Warranty shall commence upon acceptance of the system by the Government.

V. PAYMENT SCHEDULE

The Contractor will be paid, in accordance with the payments clause in the contract and as otherwise noted in this document, upon receipt of a proper invoice.

1. 100% after installation and acceptance by the POC of fully installed system, AND

2. After the successful completion of the testing requirements set forth in this document under section set forth in this document, AND

3. After successful demonstration by the instrumentation that it performs in accordance with the requirements set forth in this document.

NOTE: Partial shipments and partial invoices will not be accepted, unless otherwise requested and accepted by the Contracting Officer prior to award offer. Proposed payment schedules shall be submitted with vendor’s response to the RFQ for consideration.

ATTACHMENTS:

1) Basic schematics for the vacuum chamber component.pdf 2 | Page image1.jpeg