Wafer bonder and lithography aligner system
Closed Solicitation Posted
This opportunity was awarded. See the award notice from .
- Solicitation number
- 1333ND23QNB680164
- Agency
-
National Institute of Standards and Technology
Department of Commerce
- Responses due
- Set-aside
- Total Small Business
Opportunity facts
- NAICS code
- 333242 Semiconductor Machinery Manufacturing
- PSC
- 6640 Laboratory Equipment And Supplies
- Place of performance
- Gaithersburg, Maryland 20899, United States
Notice details come from SAM.gov. Updated .
About this opportunity
The National Institute of Standards and Technology seeks to procure a wafer bonder and lithography wafer aligner system through a total small business set-aside solicitation. NIST requires delivery and installation of one each of the specified equipment pieces within 20 months to replace aging assets and increase capacity at its Center for Nanoscale Science and Technology user facility. Quotations will be evaluated based on technical capability to meet requirements, past performance, and price factors, and must be submitted by April 27, 2023 to be considered.
The solicitation is set aside exclusively for small businesses under NAICS code 334516, photomask manufacturing, with a place of performance in Gaithersburg, Maryland. Trade-in credit for existing wafer bonder and aligner equipment will be considered. The firm-fixed price contract seeks to procure one each of a wafer bonder capable of substrates from 10mm to 150mm and a lithography aligner compatible with the bonder and achieving sub-micron resolution. Installation must be completed within 60 days of delivery, along with training.
Notice text
2 versions
Update #2 · Latest ·
Amendment 0001: Combined Synopsis Solicitation amended to allow for trade-in option and extended response date. See Amended Combined Synopsis Solicitation document for details.
See Combined Synopsis Solicitation and NIST Requirements for solicitation details.
Update #1 ·
See Combined Synopsis Solicitation and NIST Requirements for solicitation details.
Files
| File | Type | Posted |
|---|---|---|
| Amended Combined Synopsis Solicitation.docx | DOCX document | |
| NIST Requirements.docx | DOCX document | |
| Combined Synopsis Solicitation_final.docx | DOCX document |
Notice history
| Notice | Type | Posted |
|---|---|---|
| Wafer bonder and lithography aligner system | Award Notice | |
| This notice | Solicitation | |
| Wafer bonder and lithography aligner system | Pre-Solicitation |
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