Wafer bonder and lithography aligner system

The National Institute of Standards and Technology seeks to procure a wafer bonder and lithography wafer aligner system through a total small business set-aside solicitation. NIST requires delivery and installation of one each of the specified equipment pieces within 20 months to replace aging assets and increase capacity at its Center for Nanoscale Science and Technology user facility. Quotations will be evaluated based on technical capability to meet requirements, past performance, and price factors, and must be submitted by April 27, 2023 to be considered.

The solicitation is set aside exclusively for small businesses under NAICS code 334516, photomask manufacturing, with a place of performance in Gaithersburg, Maryland. Trade-in credit for existing wafer bonder and aligner equipment will be considered. The firm-fixed price contract seeks to procure one each of a wafer bonder capable of substrates from 10mm to 150mm and a lithography aligner compatible with the bonder and achieving sub-micron resolution. Installation must be completed within 60 days of delivery, along with training.