NIST Requirements.docx

NIST REQUIREMENTS DOCUMENT

Wafer bonder and lithography wafer aligner system

I. BACKGROUND/ SCOPE INFORMATION

In support of the CHIPS Act, the National Institute of Standards and Technology is acquiring nano fabrication and nano characterization equipment that will address the major metrology research and development grand challenges for the reliable production of next-generation microelectronic devices

The National Institute of Standards and Technology (NIST) seeks to acquire a wafer bonder and lithography wafer aligner system to support nanofabrication in the Center for Nanoscale Science and Technology (CNST) user facility. The system will be sited and used as a shared resource accessible to researchers from industry, academia, NIST, and other government agencies in the CNST NanoFab. The NanoFab currently operates an outdated wafer bonder and lithography aligner system which is more than 15 years old. After years of extreme thermal cycles and usage, mechanical fatigue has caused certain crucial components losing functions or precision. In the past five years, considerate amount of manpower was put in to maintain this system in usable condition and some replacement parts have been difficult to acquire. In order to increase NIST’s capacity to serve users and provide additional technical capabilities for nanofabrication, NIST has a need for a new wafer bonder and lithography wafer aligner system.

Wafer bonder is a unique fabrication tool that bring two wafers adhere to each other without the application of any macroscopic gluing layer or external mechanical force. It produces a mechanically stable interface and hermetically sealed encapsulation between two wafers. Bonding alignment is the precedent step before the actual wafer bonding. It places two substrates in particular positions relative to each other in order to combine the functions of both substrates. The bonding alignment requires a compatible optical wafer aligner. Lithography wafer aligner does wafer exposure which transfers patterns of photomasks onto resist-coated wafers, and also perform wafer alignment for both lithography and wafer bonding purposes. It is an essential exposure tool for micro-fabrication besides the function of supporting wafer bonding alignment. Its main components include a UV light source, beam shaping optical lens, wafer positioning system with top and bottom sides of microscopes for the upper and lower wafers. For the bonding purpose, it is also equipped with a clamping mechanism for the wafer pair in order to transport aligned wafer pair into wafer bonder without introducing an alignment shift.

II. MINIMUM REQUIREMENTS

The Contractor shall provide a system that meets all technical specifications identified below. All items must be new. Used or remanufactured equipment will not be considered for award. Experimental, prototype, or custom items will not be considered. The use of “gray market” components are not authorized for sale in the U.S. by the Contractor is not acceptable. All line items shall be shipped in the original manufacturer’s packaging and include all original documentation and software, when applicable.

Contract Line Item Number (CLIN) 0001:

Description: Wafer Bonder Quantity: one (1) A. Technical Specifications

1. The system shall be able to transfer and perform bonding process on substrates with various shapes and sizes ranged from 10 mm to at least 150 mm.

2. The system shall come with all accessories tools required for transferring and bonding substrates with various shapes and sizes ranged from 10 mm to at least 150 mm.

3. The system shall come with proper bonding plates for the following types of bonds: thermocompression, eutectic, adhesion, anodic and fusion bonds. For example, if adhesion bonding and fusion bonding require different type of bonding plates, both types of bonding plates shall be included.

4. The system shall be able to process 75 mm wafer, 100 mm wafer and 150 mm substrates with thickness 6 mm or larger.

5. The system shall have two independently controlled heating system for the top and bottom bonding plates.

6. The heating systems shall be able to perform controlled heating in the range of 40 ◦C to 550 ◦C

7. The heating systems shall be able to achieve temperature uniformity better than ± 2% in the range of 80 ◦C to 500 ◦C.

8. The heating systems shall have the capability of running a controlled ramping rate from 1 ◦C/min to 30 ◦C/min.

9. The process chamber shall have 2 or more gas ports available.

10. The pumping system for process chamber shall be able to achieve overpressure at least 2 bar and vacuum 5.0 x 10E-5 mbar or lower.

11. The pumping system shall have the option for house exhaust connection.

12. The system shall be capable of providing 20,000 N force with a repeatability ± 2% or better.

13. The system shall be equipped with a power supply providing at least 2000 V and 60 mA for anodic bonding purpose.

14. The system shall be provided with at least one recommended recipe for each of the following types of bonding: adhesion, fusion, eutectic and anodic.

15. The system shall be provided with a computer and MS based operating system to perform tool control and data logging.

16. The tool control software shall be GUI based and support different levels of user access.

17. Safety interlocks for the chamber door

CLIN 0002:

Description: Lithography wafer aligner Quantity: one (1) A. Technical Specifications

1. This system shall be compatible with the wafer bonder described above and manufactured by the same manufacturer to allow for compatibility.

2. The system shall be able to perform lithography exposure on substrates with various shapes and sizes from 10 mm to at least 150 mm.

3. The system shall be able to process substrates with thickness 4 mm or larger.

4. Lithography alignment: the system shall be capable of perform top-side alignment on substrate sizes from 15 mm to 150 mm and back-side alignment on substrate sizes from 20 mm to 150 mm.

5. The alignment microscope system shall provide IR light source.

6. Bonding alignment:

a. the system shall be capable of perform bonding alignment on 50 mm, 75 mm, 100 mm and 150 mm diameters of wafers. The system shall come with all required accessories.

b. the system shall be capable of perform bonding alignment on sample sizes < 50 mm with specialized sample holder. All required accessories shall be either included in the standard set of holders or available for customized future order.

7. Light source: The system shall supply the LED exposure light source including 405 nm and 365 nm wavelengths with sufficient illumination power to expose 50 µm or thicker broadband photoresist.

8. The illumination system shall provide the light uniformity better than ± 3% over the 150 mm diameter round area.

9. Resolution: The system shall be able to expose 1 um thick photoresist with a resolution of 1 um or smaller.

10. Lithography alignment accuracy: the system shall have the alignment accuracy of 0.5 um for the top-side alignment and alignment accuracy of 1 um for the backside alignment.

11. Bonding alignment accuracy: the system shall have the alignment accuracy of 2 um for the bonding alignment.

12. The system shall come with all required accessories to secure and transfer the aligned wafer pair into the wafer bonder.

13. The system shall be capable of performing pattern recognition on the alignment marks for semiautomatic alignment while still allows manual alignment per the need of operators.

14. The system shall come with a motorized stage.

15. The system shall be provided with a computer to perform tool control and recipe creations and the tool control software shall be GUI based.

16. The system shall have safety interlocks in the illumination housing and proper UV light shielding for operators.

III. DELIVERABLES

Standards of Acceptance: The NIST TPOC or COR shall review (list deliverable) and respond with an acceptance or request for revision email to the Contractor Point of Contact (POC) within 21 days of receipt of deliverable. This section applies to deliverables which must be reviewed and approved for acceptances (draft plans, drawings, etc.)

IV. DELIVERY TERMS

Delivery shall be F.O.B Destination and shall occur in accordance with the delivery due dates provided in the above table.

FOB Destination means: The contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the purchase order, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery. The contractor shall deliver all Line Items to:

National Institute of Standards and Technology Shipping and Receiving 100 Bureau Drive, Building 301 Gaithersburg, MD 20899

V. INSTALLATION

The system shall be installed by the Contractor and meet contract specifications no later than 60 days after delivery. Installation, at a minimum, shall include uncrating/unpackaging of all equipment, rigging, set-up and hook-up of the system, demonstration of all specifications, and removal of trash. Onsite installation and demonstration shall be done at NIST, (Gaithersburg, MD). All installation requirements are identified below:

a. The Contractor shall provide a list of installation requirements, including house services and furniture, with explanations, as soon as the contract is awarded. NIST will provide any required connections to house services.

b. The Contractor shall provide qualified personnel to perform the installation, supervise the installation, and perform all activities necessary to ensure the System is 100% functional and meets or exceeds all required specifications.

c. The Contractor’s installation personnel shall also perform all diagnostic tests after installation in the presence of NIST personnel.

d. Diagnostic test data must clearly document that the equipment meets or exceeds all of the Government’s required specifications.

e. This test data will be reviewed by the NIST COR. Upon review, the COR shall provide final acceptance of the equipment, or advise the Contractor of performance weaknesses.

f. Any required rework and re-testing shall be completed at no additional cost to the Government within a timeline agreed upon by the COR, the Contracting Officer, and the Contractor.

VI. TRAINING

The contractor shall conduct training session for up to five (5) users at NIST. The training shall provide a thorough demonstration of all system/solution functions, maintenance, data administration, and basic troubleshooting. The training may be completed at NIST Monday – Friday during the operating hours of 8:00 am to 5:00 pm immediately after installation and demonstration of specifications and must be completed no later than five (5) days after installation. Further training requirements are identified below:

1. Wafer bonder: Vendor shall provide at least one day of application and basic tool maintenance training. Traveling cost shall be included. Vendor shall coordinate with the TPOC regarding the required training material.

2. Lithography wafer aligner: Vendor shall provide at least one day of application and basic tool maintenance training. Traveling cost shall be included. Vendor shall coordinate with the TPOC regarding the required training material.

VII. INSPECTION & ACCEPTANCE

In addition to the inspection and acceptance terms articulated in 52.212-4, the Government reserves the right to perform such performance tests and evaluations as defined below to verify specified system performance. Such tests and evaluations, if performed, shall be conducted within the environment that the system is to be operated. The Contractor has the right to be present during the tests and evaluations, if performed, at the Contractor’s expense.

Performance Tests:

Factory Testing:

Following construction of the wafer bonder and lithography wafer aligner system at the factory, prior to shipping, factory testing shall be performed:

a. The wafer bonder and lithography wafer aligner system will be tested while in an operational state at the vendor’s factory prior to shipping to NIST.

b. The results of this testing shall be the basis of acceptance for delivery payment.

c. Testing shall be the final quality assurance testing prescribed by the vendor.

d. Testing will be repeated at NIST upon completion of installation.

e. Results of this testing shall be shared with the NIST TPOC.

f. NIST reserves the right to be present for this testing at its discretion.

Onsite Testing:

Following vendor installation, testing of the wafer bonder and lithography wafer aligner system will be performed on-site in the following manner:

a. Repeat of factory quality acceptance testing:

a. The quality assurance testing performed at the factory prior to shipping shall be repeated at NIST after the installation is complete.

b. Results obtained at NIST shall be within 1 % of the factory results.

b. Wafer bonder process performance:

a. Bonding force uniformity with 100 mm and 150 mm pressure plates will be verified by pressure paper (provided by TPOC).

b. Anodic bonding process test will be carried out using a 100 mm silicon wafer and a 100 glass wafer.

c. Fusion bonding process test will be carried out using a pair of 150 mm silicon wafers.

c. Lithography wafer aligner process performance:

a. The lithography resolution and overlay test will be performed with 100 mm and 150 mm semi-spec silicon wafers in 0.5 mm thicknesses. They will be coated with 1 µm broadband resist and expose with customer provided resolution test photomask. The first layer pattern will be dry etched and then coated with 3 µm broadband resist for the second layer exposure.

b. The bonding alignment test will be performed with 100 mm silicon wafers with customer designed alignment marks.

NIST may choose at its discretion to forego this part of acceptance testing.

A visual inspection of the equipment will be performed by the NIST TPOC to identify surface defects or any form of indication that any equipment was damaged during transport to NIST. The Government shall have sole discretion to require repair or replacement of damaged and/or nonconforming supplies at no cost to the Government. The Government at any time prior to acceptance shall reject the equipment due to defects and/or nonconformance. The vendor is responsible for latent defects discovered any time after final inspection. However, the extent of its liability shall be prorated over the useful life of the equipment.

Ownership of the equipment shall transfer to NIST upon acceptance by the Government.

The Government will test, inspect, and accept or reject the equipment within (insert working days it will take to inspect, accept or reject) of the receipt of the equipment unless otherwise indicated above. The Government reserves the right to conduct quality assurance testing to confirm that a given instrument(s) meets the manufacturer’s and/or the Government’s performance specifications. It is anticipated that the equipment will meet all manufacturer’s specifications and/or the Government’s performance specifications identified in the most recent operations and maintenance manual for each piece of equipment and/or in this document.

VIII. WARRANTY

The contractor shall warranty the entire system for a period of a minimum of 12 months after receipt of the equipment and shall be in accordance with terms in FAR 52.212-4. Warranty shall commence upon acceptance of the system by the Government and at a minimum shall include the following:

· The vendor shall repair or replace at its cost, any defective items without any additional cost to the government including travel, labor, parts or any other expense.

IX. PAYMENT SCHEDULE

Advance payment is not authorized. The Contractor shall be paid, in accordance with Net 30-day payment terms, upon receipt and acceptance of a proper invoice, in accordance with the following schedule:

Proposed payment schedules shall be submitted with vendor’s response to the RFQ for consideration.

X. MISCELLANEOUS INFORMATION

Safety: The Contractor employee must be responsible for knowing and complying with all installation safety prevention regulations. Such regulations include, but are not limited to, general safety, fire prevention, and waste disposal.

Security: NIST is a restricted campus. An identification badge is required for access for entry into buildings and is shown to the armed Security Police when entering the campus.

Regular Business Hours. Regular business hours are Monday through Friday, 8:00 am to 5:00 pm Eastern Time, excluding Federal holidays and NIST closures.

Identification Badges: Contractor employees must comply with NIST identification and access requirements. Each Contractor employee must wear a visible identification badge provided by the NIST Security Office.

Vehicle Registration: All Contractor employees must register their vehicles with the NIST Security Office to gain access to the campus. A valid driver’s license, Government-furnished civilian ID, proof of insurance and current registration must be presented to the NIST Security Office, at which time a NIST vehicle pass will be issued. The pass must be displayed on the vehicle in accordance with NIST Security Office instructions.