Wafer bonder and lithography aligner system
Awarded Award Notice Posted
- Solicitation number
- 1333ND23QNB680164
- Agency
- National Institute of Standards and Technology Department of Commerce
- Awarded
- to Suss Microtec Inc.
- Set-aside
- Total Small Business
Opportunity facts
- Contract number
- 1333ND23PNB680612 Federal contract award
- NAICS code
- 333242 Semiconductor Machinery Manufacturing
- PSC
- 6640 Laboratory Equipment And Supplies
- Place of performance
- Gaithersburg, Maryland 20899, United States
Notice details come from SAM.gov. Updated .
About this opportunity
The Award Notice was for a wafer bonder and lithography aligner system from SUSS MICROTEC INC. The National Institute of Standards and Technology awarded a firm fixed price contract valued at $946,837 on September 19, 2023 under full and open competition set aside for total small businesses. The contract provides for SUSS MICROTEC INC to supply its wafer bonder and lithography aligner system to support the National Institute of Standards and Technology's research and development efforts.
Notice text
This contract action was both firm fixed priced and competed under SAP.
Awarded contract 1333ND23PNB680612 to SUSS MICROTEC INC for 946837.00 on 2023-09-19.
Notice history
| Notice | Type | Posted |
|---|---|---|
| Wafer bonder and lithography aligner system | Award Notice | |
| Wafer bonder and lithography aligner system | Solicitation | |
| Wafer bonder and lithography aligner system | Pre-Solicitation |
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