Wafer bonder and lithography aligner system

The National Institute of Standards and Technology seeks a commercial item solution for a wafer bonder and lithography aligner system through this sources sought notice. The notice provides draft minimum specifications for wafer substrate processing size and thickness ranges, controlled heating and cooling, bonding voltage application, vacuum pumping, substrate holders, and safety interlocks for the wafer bonder. Minimum specifications are also given for substrate processing ranges, light sources and resolution, alignment accuracy, pattern recognition software, and safety measures for the lithography aligner. Responses to the notice by November 16, 2022 should include company and contact details, identified equipment, manufacturing details, performance capabilities, customization options, terms and conditions, references, and any other relevant information. Questions regarding the notice are due by October 31, 2022 to inform NIST's future solicitation for these requirements.

There is no set-aside designation for this potential award. The primary NAICS code would be 333298 for other industrial machinery manufacturing while the predominant PSC code could be J070 for semiconductor and related devices. No potential incumbents or current contractors are named in the notice but it seeks information from commercial sources capable of meeting the draft specifications. The notice does not provide any estimated award values, budget ranges, or quantities for the wafer bonder and lithography aligner system.