Technologies for Heat Removal in Electronics at the Device Scale (THREADS)

The Defense Advanced Research Projects Agency seeks proposals through solicitation number HR001123S0013 to develop technologies demonstrating an 8x reduction in transistor thermal resistance and output power density of 81 W/mm through its Technologies for Heat Removal in Electronics at the Device Scale program. Proposals are due February 17, 2023 and must meet aggressive 18-month milestones for power, reliability, and thermal resistance metrics across multiple transistor cell and power amplifier deliverables. Evaluation will consider the technical approach, claims, organization, costs, schedule, and potential deliverables.

There are no set-aside designations for this opportunity. Research areas involve nanotechnology (NAICS code 541712) and electronic and electrical engineering services for industrial and commercial machinery and equipment (PSC code R425). Multiple awards as procurement contracts or other transactions are anticipated to start in August 2023, though specific budget details were not provided. Evaluation of proposals will focus on the ability to achieve thermal resistance reductions and power density increases through multiple phases culminating in a 12-month Phase 3 option.