Technologies for Heat Removal in Electronics at the Device Scale (THREADS)
Awarded Award Notice Posted
- Solicitation number
- HR001123S0013
- Agency
- Air Force Research Laboratory Air Force Materiel Command, Department of Defense
- Set-aside
- No set-aside
Opportunity facts
- Contract number
- FA2385-24-C-B005 Federal contract award
- NAICS code
- 541715 Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
- Place of performance
- Merrimack, New Hampshire 03054, United States
Notice details come from SAM.gov. Updated .
About this opportunity
The Department of the Air Force Materiel Command Research Laboratory awarded BAE Systems Information & Electronic Systems Integration Inc. a $12,440,791 cost-plus fixed fee contract to develop technologies to improve heat removal at the microscale level in electronic devices through the Technologies for Heat Removal in Electronics at the Device Scale effort, aiming to address thermal management challenges. No set-aside provisions were applied to this competitive award made on November 17, 2023.
Notice text
This effort was competitive. This was awarded as a cost-plus fixed fee contract. In selecting the appropriate contract type, the contracting officer considered the factors in FAR 16.104.
Awarded contract FA2385-24-C-B005 to BAE SYSTEMS INFORMATION & ELECTRONIC SYSTEMS INTEGRATION INC for 12440791.00 on 2023-11-17.
Notice history
| Notice | Type | Posted |
|---|---|---|
| Technologies for Heat Removal in Electronics at the Device Scale (THREADS) | Award Notice | |
| Technologies for Heat Removal in Electronics at the Device Scale (THREADS) | Award Notice | |
| Technologies for Heat Removal in Electronics at the Device Scale (THREADS) | Pre-Solicitation |
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