Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) BAA

The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals for the Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) program, seeking advanced concepts for high-density three-dimensional chip-to-chip and intra-chip optical routing in integrated photonic microsystems. The solicitation aims to enable revolutionary advances in science, devices, or systems, explicitly excluding research that primarily results in evolutionary improvements. Proposals will be evaluated on scientific and technical merit, relevance to DARPA's mission, and cost realism. The BAA requires proposers to address a two-phase program, with an initial 18-month phase focused on proving the feasibility of 3D routing in integrated photonics, followed by an 18-month phase demonstrating array density and manufacturability. Abstract submissions are due by October 1, 2024, with full proposals required by November 6, 2024, and an anticipated period of performance start date of April 1, 2025.

The solicitation has no specific set-aside designation and is open to both U.S. and non-U.S. sources, with DARPA anticipating multiple awards. The total program funding is $30 million, with potential award instruments including procurement contracts, research other transactions, and prototype other transactions. The program requires proposers to demonstrate specific technical metrics, including optical loss per link less than 1 dB, link arrays up to 1,000 x 1,000 channels, and operation within a 400-1800 nm wavelength range. Performers must integrate active material platforms into functional links and provide a minimum of 4 waveguide layers per chip. The program is designed to create a 1000x increase in information transmission density within microsystems by exploiting photonic signaling, with potential applications in both commercial and defense technology domains.