HAPPI_Proposers_Day_All_Slides.pdf

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Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) Dr. Anna Tauke-Pedretti, PM, DARPA/MTO

Proposers Day September 16, 2024

DARPA’s Role in S&T Ecosystem

• Create breakthrough, paradigm-shifting solutions.

• Accept and manage significant technology risk.

• Disrupt or massively accelerate technology roadmaps.

DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.

DARPA: The Defense Advanced Research Projects Agency Breakthrough Technologies and Capabilities for National Security

DARPA’s role: Pivotal early investments that change what’s possible

UAVs

1960 2020201020001990198019701950

Materials science Semiconductors, superalloys, carbon fibers, composites, thermoelectrics, ceramics Communications/networking

Information technology Timesharing, client/server, graphics, GUI, RISC, speech recognition ARPAnet/Internet

Stealth Microelectronics VLSI, CAD, manufacturing, IR, RF, MEMS

Precision guidance & navigation Radar arrays

IR night vision

© IEEE Spectrum

DARPA.mil DARPA.mil

© Apple

DARPA.mil

DARPA.mil

Biological Technologies

Office

• Maintain force readiness

• Tactical warfighter care and functional restoration

• Operational resilience and logistical security

• Biosensors and novel methods and materials

Defense Sciences

Office

• Novel materials and structures

• Sensing and measurement

• Computation and processing

• Enabling operations

• Collective intelligence

• Emerging threats

Information Innovation

Office

• Proficient AI

• Advantage in cyber operations

• Confidence in the information domain

• Resilient, adaptable, and secure systems

Strategic Technology

Office

• Advanced sensors and processing

• Battlefield effects

• Command, control, and communications

• System of autonomous systems

• Empowered human decision making

Tactical Technology

Office

DARPA Technical Offices

• Tactical systems

• Platforms, systems, and technologies that enable new warfighting constructs

• Reimagination of missions across maritime, ground, air, and space domains

Microsystems Technology

Office

• Disruptive microsystems

• Edge processing

• Microsystems manufacture

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Microsystem Information on Demand

1,000x increase in microsystem interconnect density

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Image: Getty Images

Light is the Ideal Information Carrier

Planar photonic routing on chip

State-of-the-art 300 mm microfabrication

Photonic Integrated Circuit (PIC)

Photonic Links (optical waveguides)

1,000x wires

300x wires

Bandwidth

Efficiency

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Image: IBM

Image: TeleGeography

Image: Georgia Tech Image: Nature Photonics 17, 2023

0%

20%

40%

60%

80%

100%

1 10 100 1,000 10,000 100,000

SOA Limits of Optical Link Density Scaling

Li nk e ffi cie nc y* surface couplers

Density of links (#/mm2) edge couplers

* Link efficiency proportional to 1/loss and spectral bandwidth waveguide crossing

40%

60%

80%

100%

1 10 100 1,000 10,000 100,000

SOA Limits of Optical Link Density Scaling

Li nk e ffi cie nc y* surface couplers

Density of links (#/mm2) edge couplers

* Link efficiency proportional to 1/loss and spectral bandwidth waveguide crossing

HAPPI Goal

40%

60%

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100%

1 10 100 1,000 10,000 100,000

SOA Limits of Optical Link Density Scaling

Li nk e ffi cie nc y* surface couplers

Density of links (#/mm2) edge couplers

* Link efficiency proportional to 1/loss and spectral bandwidth waveguide crossing

Today’s Optical Routing Technology

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Out-of-Plane Mode Conversion grating coupler

Out-of-Plane Routing Misalignment Tolerance patterned photoresist thermal reflow https://www.microresist.de/ assembly misalignment fabrication misalignment modal mismatch high-index substrate

Limitations: Large footprint, narrow spectral bandwidth

Limitations: Planar fabrication, high index substrates

Limitations: Trade off in mode size and alignment sensitivity

Innovation areas:

Sub-micron feature definition, process at-scale, few µm2 footprint

Innovation areas:

Out-of-plane confinement, large aspect ratios, high index contrast

Innovation areas:

Sub-micron material control, large scale actuation

Image: Ansys

40%

60%

80%

100%

1 10 100 1,000 10,000 100,000

SOA Limits of Optical Link Density Scaling

Li nk e ffi cie nc y* surface couplers

Density of links (#/mm2) edge couplers

* Link efficiency proportional to 1/loss and spectral bandwidth waveguide crossing

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Notional 3D Stacked Photonics

Multilayered waveguides

Out-of-plane transitions

Chip-to-chip coupling

Out-of-plane waveguides

Example 3D stacked photonics

100-500 µm substrate

a) ninety-degree routing layout b) non-ninety-degree routing layout

Light for Data Movement and Interaction with the Physical World

Digital Bandwidth

Processor

Memory Memory

Processor Processor

Seamless integration with microelectronics

Analog Density

Optical phased arrays

Quantum Spectrum

Quantum sensing systems

Image: Shutterstock Images: Freepik and Optica 6 2019 Images: Columbia U and UMass

HAPPI Broader Vision

HAPPI: Prove 3D adaptive optical links enable scaling of photonic connections within the microsystem

Enable access: Transfer process to foundry, Develop EDA design tools, Establish standards

Create new microsystems capabilities:

Process in real time, Form arbitrary optical beams, Sense at ultrahigh precision

Broaden technology: Integrate optoelectronic components, Expand to new materials and wavelengths

Images: Keysight and UMassImages: U. Twente and Shutterstock

HAPPI Program Structure

HAPPI Program Structure

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Phase 1 (18 months)HAPPI

Extend Dimensionality Density and Scale

Array

PDR

Array

CDR

Adaptive link demonstrated

Array demonstrated

Phase 2 (18 months)

Commercialization plan

• Single technical area

• Two program phases, 18 months each

• Down-select between phases is expected

• Anticipated funding:

• 6.2 funding

• $30M / 36 months

• Multiple awards

Phase 1 – Extend Dimensionality

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Objective

• Prove the feasibility of 3D routing in integrated photonics

• Demonstrate an out-of-plane guided optical path between two discrete photonic integrated circuits

• Assess mechanical and thermal robustness, scalability and manufacturability

Key Metrics and Deliverables

• Show 1 dB optical loss per link over 100 nm bandwidth

• Traverse chip-to-chip interface and > 100 µm of semiconductor substrate

• Show scalability via functional 10 x 10 array

• Deliver report on alignment tolerances of assemblies

• Deliver report on manufacturing viability of the approach

• Deliver a PDR for a 1000 x 1000 Phase 2 array

1,000x area reduction. 1,000x increase in vertical aspect ratio.

Goals:

arbitrary changes in directionality optical mode transformations chip to chip surface coupling

• 1 dB loss/link

• 3 x 3 µm2 footprint

• >100 µm out of plane waveguide

Phase 2 – Density and Scale

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Objective

• Demonstrate array density and size scaling

• Demonstrate optical alignment across arrays at various system scales (die-to-die, die-to-interposer, die-to-wafer)

• Prove the manufacturability of the 3D routing platform

Key Metrics and Deliverables

• Maintain 1 dB optical loss per link

• Show scalability via functional 1000 x 1000 array

• Demonstrate a non-blocking routing network on an arbitrary grid at a 3 μm x 3 μm center-to-center pitch

• Deliver commercialization plan

• Deliver platform performance characterization report

• Perform live final functional array demonstration(s)

100x increase in misalignment tolerance chip-chip, chip-interposer photonic packaging

Goals: • 1000 x 1000 array

• 1 dB loss/link

• manufacturable at scale

Program Metrics Table

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Metric Phase 1, Base Extend Dimensionality

Phase 2, Option Density and Scale Notes

Optical loss per link (link efficiency) 1 dB 1 dB

Link contains: Out of plane guided optical path interconnecting the waveguide fabric of two discrete chips (see BAA Figure 3 )

Vertical waveguide length > 100 μm > 100 μm

The link optical path will traverse chip-to-chip interface and > 100 µm of semiconductor substrate

Link array size 10 x 10 1,000 x 1,000 Array area of 3 x 3 mm, signal I/O location will be government furnished (see BAA Figure 4)

Adjacent link crosstalk < 20 dB < 20 dB Measured at 3 µm x 3 µm pitch

Optical power handling > 1 mW > 10 mW Minimum number of routing layers > 4 > 4

Minimum 2 discrete PICs

Spectral bandwidth 100 nm 100 nm Demonstrate metrics across continuous spectral band within 400–1800 nm

Operating environment 0–85 °C 0–85 °C Steady-state, temperature cycling, thermal gradients

HAPPI Test Requirements By Phase

Phase 2: Characterize 1000 x 1000 array optical yield, thermal range and mechanical strength

Phase 1: Validate scalability of the approach via characterization of a representative 10 x 10 assembly

- Assess link optical performance and yield via automated, high-throughput screening and statistical analysis

- Assess mechanical and optical integrity under temperature cycling, gradients (hotspots), continuous temperature in the 0-85°C range

- Assess mechanical robustness via Bond Strength and Bond Pull standardized packaging test protocols

• Custom tooling for array probing, grippers, automated test controllers, or

• Usage of shared facilities test capabilities

• Leverage existing laboratory-grade, tabletop tests at performer’s site

• Develop test plans and specify testbed for Phase 2 testing

- Assess and characterize optical efficiency on a per link basis (absorption, scattering, leakage, and spectrally dependent losses)

- Assess optical crosstalk for adjacent optical links

- Assess mechanical, thermal and optical integrity of chip-to-chip assemblies via visual inspection, cross-sectioning and continuity tests

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Image: SystéAl Images: Ficontec

• The HAPPI program is deemed non-fundamental research.

• CUI protection is detailed in a program CUI guide.

• Subawardees may perform fundamental research. It is the prime’s responsibility to ensure compliance with the program CUI protection plan.

• Proposal submissions are anticipated to be unclassified.

• All inquiries should be addressed to the BAA inbox: HR001124S0038@darpa.mil

HAPPI Program Security

HAPPI BAA Details

• Abstracts are required (Attachments A and B)

• 6-page limit

• DARPA will provide feedback whether a full proposal is encouraged or discouraged

• Allows feedback to proposers on whether a proposed approach or technology fits within the BAA

• Prevents effort spent by proposers on assembling a proposal that may not be successful

Proposal Guidelines

Questions: HR001124S0038@darpa.mil

• Proposals (Attachments C, D, E + all other applicable attachments)

• Oral Presentations – 20 slide limit o DARPA will notify proposers of their scheduled time via email o Slides cannot be modified between proposal due date and oral presentation o 40-minute prepared presentation + 20-minute Q&A Session via MS Teams

• Written Content – 10-page limit o Expand and refine the Abstract content o Provide additional details in support of your oral presentation content o Provide detailed Statement of Work (or Task Description Document); does not count towards the page limit o Include all required attachments; attachment do not count towards the page limit

• Cost Proposal – no page limit

Proposal Guidelines

• Description of the photonic platform(s) that the proposed solution is based on

• Discuss materials included in the platform.

• Discuss optical properties across the proposed wavelength span.

• Describe optoelectronic components natively supported on the platform (development is out of scope).

• Describe current state of manufacturability.

• Discuss current and projected manufacturing tolerances.

• Describe the domestic ecosystem to include design tools, fabrication, assembly, packaging and test offerings.

• Discuss any potential supply chain issues.

Elements of a Successful Proposal (Attachment C, pg. 5)

• Detailed analysis on achieving and demonstrating low optical losses

• Baseline your analysis vs. inherent material and manufacturing limitations.

• Specifically discuss how your approach will address the size vs. loss tradeoff. Describe how the approach can meet the small physical footprint goals, while maintaining material-limited loss.

• Include analysis of all factors limiting efficiency including leakage, scattering, polarization-dependent loss, wavelength-dependent loss, mode mismatch loss, channel crosstalk, etc.

• Describe the optical loss measurement setup and specify any applicable de-embedding of testbed parasitic effects.

Elements of a Successful Proposal (Attachment C, pg. 5)

• Strategy for scaling from a single link to large, close-packed arrays

• Describe methods for non-crossing dense routing layout.

• Describe how your approach uses adaptive techniques and concepts to alleviate crosstalk and mitigate misalignment post-fabrication and post-assembly.

• Discuss how your approach is manufacturable at various system scales (i.e. die-to-die, die-to-interposer, die-to-wafer).

• Discuss the anticipated process yield, reproducibility, and environmental robustness of the packaged optical microsystems.

Elements of a Successful Proposal (Attachment C, pg. 5)

Not in scope HAPPI sandbox

• Chip-fiber coupling • Chip-chip, chip-interposer photonic packaging

• Edge coupling, linear arrays • Surface coupling, closely packed on a 2D grid

• Free-space relay optics • Hybrid integration of photonic ICs

• Coupling of surface normal sources/detectors • Waveguide to waveguide routing

• O-E-O conversion • All-optical routing

• Development of optoelectronic components (e.g. modulators, phase shifters, etc.)

• Optical routing, one or more layers in materials stack must support optoelectronics

• Adaptively produced chip-chip interfaces

Elements of a Successful Proposal

1. Overall Scientific and Technical Merit o Demonstrate that the proposed technical approach is innovative, feasible, achievable, and complete.

o Describe how the proposed approach will achieve each program metric with sufficient detail and supporting experimental measurements, modeling, calculations, and/or simulations.

2. Potential Contribution and Relevance to the DARPA Mission o Discuss how the proposed effort addresses the DARPA goals of technology transition and facilitates access to HAPPI technologies for DoD applications.

3. Cost Realism o Ensure proposed costs are realistic for the technical and management approach and accurately reflect the goals and objectives of the announcement.

o Verify that proposed costs are sufficiently detailed, complete, and consistent with the Statement of Work.

Evaluation Criteria (in order of importance, BAA, pg. 11)

• HAPPI BAA Posting Date: September 10, 2024

• Proposers Day: September 16, 2024

• Abstract Due Date: October 1, 2024, at 01:00 p.m.

• Question Submittal Closed: October 22, 2024, at 04:00 p.m.

o DARPA will post a consolidated Question and Answer (FAQ) document on a regular basis.

To access the posting go to: http://www.darpa.mil/work-with-us/opportunities.

• Proposal Due Date: October 29, 2024, at 01:00 p.m.

• Oral Presentation dates: November 18-22, 2024

• Estimated Period of Performance start: April 01, 2025

Important Dates (BAA, pg. 2)

• Submit early and often

• HAPPI abstracts are required

• Adhere to the abstract and full proposal guidance and templates provided as BAA Attachments A-E

• Corroborate all technical claims with analytical or experimental evidence

• Submit only one proposal per lead organization Organizations can be part of multiple proposing teams (as subs)

• When in doubt, refer to the BAA for guidance

Reminders

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• Anna Tauke-Pedretti, Program Manager

• Rocco Bogoslovov, Technical SETA

• Amil Patel, Technical SETA

• Terri Young, Programmatic SETA

• Joey Gilchrist, Program Security

The HAPPI Team www.darpa.mil

34Distribution A: Approved for public release: Distribution unlimited.

HAPPI

HR001124S0038

Proposers Day

September 16, 2024 Lon Wang

Contracting Officer DARPA Contracts Management Office

Proposers Day Disclaimer

Lots of information is made available to potential proposers to clarify program goals/objectives and proposal preparation instructions - those things that are stipulated in the BAA

However:

• Only the information/instructions in the BAA counts

• Proposals will only be evaluated in accordance with the instructions provided in the BAA

• Any response provided by the Government in the FAQ that’s different than what is provided in the BAA will be made formal by an amendment to the BAA

• Such responses will make note of an impending BAA amendment

Only a duly authorized Contracting Officer may obligate the Government

BAA Overview

BAAs allow for a variety of technical solutions

– The BAA defines the problem set, the proposer defines the solution (and SOW)

DARPA Scientific Review Process

– Proposals are evaluated on individual merit and relevance as it relates to the stated research goals/objectives rather than against one another

– Selections will be made to proposers whose proposals are determined to be most advantageous to the Government, all factors considered, including potential contributions to research program and availability of funding

Government may select for negotiation all, some, one, or none of the proposals received Government may accept proposals in their entirety or select only portions thereof Government may elect to establish portions of proposal as options

Procurement Contract, Other Transactions for Research/Prototype Restricted research for all primes (prime or subcontractor)

• BAA Attachments:

o Attachment A: Abstract Summary Slide Template o Attachment B: Abstract Instructions and Template o Attachment C: Proposal Instructions and Volume I Template (Technical and Management) o Attachment D: Proposal Instructions and Volume II Template (Cost) o Attachment E: DARPA Standard Cost Proposal Spreadsheet o Attachment F (for Other Transactions only): Other Transaction Certification Template o Attachment G (for Other Transactions only): Task Description Document (TDD) Template o Attachment H (for Other Transactions only): Schedule of Milestones and Payments o Attachment I: Proposer Checklist o Attachment J: HAPPI Controlled Unclassified Information (CUI) Guide signed September 3, 2024

BAA Process/Timeline

1. Draft DAA Posted: 5 September 2024

2. BAA published: 10 September 2024

3. Proposers Day: 16 September 2024, 09:00 am

4. Abstracts Due: 1 October 2024, 01:00 pm

4. Questions Submission Deadline: 22 October 2024, 04:00 pm

5. Proposals Due: 29 October 2024, 01:00 pm

6. Oral Presentations: 18-22 November 2024

7. Scientific Review Process

8. Contracts negotiated & awarded (performance start): ~ April 2025

(can assume 1 April 2025 for Pricing)

See BAA for complete date/time information Monitor SAM.gov for any BAA amendment(s)

Eligibility

All interested/qualified sources may respond subject to the parameters outlined in BAA Foreign participants/resources may participate to the extent allowed by applicable Security Regulations, Export Control Laws, Non-Disclosure Agreements, etc.

FFRDCs and Government entities:

- Are not prohibited by the BAA from proposing

- Are, however, subject to applicable direct competition limitations

- Are, however, required to demonstrate eligibility (sponsor letter) The burden to prove eligibility for all such team members rests with the proposer and all elements of a proposal (tech and cost, prime and subs – even FFRDC team members) must be included in the prime’s submission

Government entities/FFRDCs interested in participating in the HAPPI program or proposing to this BAA should first contact the Agency Contact listed in the “Overview Information” section of the BAA prior to the Abstract due date to discuss eligibility.

Real and/or Perceived Conflicts of Interest:

- Identify any conflict/s

- If any are identified, a mitigation plan must be included

Proposal Abstracts

The abstract provides a synopsis of the proposed project (tech and budget) Abstracts are REQUIRED:

1. They minimize unnecessary effort in proposal preparation and review

2. They reduce the potential expense of preparing an out of scope proposal

Government will reply by letter with one of two possible responses:

1. Encourage full proposal, and may provide feedback

2. Discourage full proposal, and will provide rationale DARPA will not communicate further (verbally or in writing)

Regardless of DARPA’s response to an abstract, proposers may submit a full proposal

DARPA will review all full proposals submitted without regard to abstract recommendation/feedback

See Attachment A and B: Abstract Instructions and Template

Submit ONLY to the DARPA BAA Website (https://baa.darpa.mil) https://baa.darpa.mil/

Full Proposal Submission

KEY POINTS:

Each proposal must address all phases and metrics.

Submit unclassified proposals ONLY to the DARPA BAA Website (https://baa.darpa.mil)

Click “Finalize Full Proposal” button (otherwise you have not submitted)

Do not submit classified proposals (or classified parts of otherwise unclassified proposals) to the BAA Website Send email to the BAA email address for submission information

Propose to the program (goals, objectives, metrics, schedule, deliverables) the BAA has defined, not to the program you desire https://baa.darpa.mil/

Volume 1: Oral Presentations/Technical and Management Proposal - Attachment C

– Be mindful of the limitations

• Oral Presentation: 20 Slides; 40 min presentation; 20 min Q&A

• Written Content: 10 pages

– Be sure to respond to all required items in the template (including, but not limited to):

• Technical Approach – is the centerpiece of the technical proposal

• Statement of Work – Organize Phase, then by Tasks. Define all tasks (what you are doing, not how you are doing it) and deliverables (data, software, and material items, as applicable)

Volume 2: Cost Proposal- Attachment D

– No page limitations

– Fully detailed cost build-ups/estimates (Prime & Subcontractors)(All instrument types)

• Summary Cost Build-up: By phase and performer fiscal year

• Detailed Cost Build-up: By phase, technical task, and month

• Attachment E: DARPA Standard Cost Proposal Spreadsheet (Required)

– https://www.darpa.mil/attachments/DARPAStandardCostProposalSpreadsheetSingleTA11-2021-v2.xlsx

– Questions are welcomed. Please direct them to costproposal@darpa.mil

– All necessary supporting information (BoE, BoM, vendor quotes, rate agreements, etc.)

– Full subcontractor proposals are required (to include SOW)

• No Rough Order of Magnitudes (ROMs)

Full Proposal Preparation https://www.darpa.mil/attachments/DARPAStandardCostProposalSpreadsheetSingleTA11-2021-v2.xlsx

Data Rights

Government desires as few restrictions as possible - however….

If asserting less than Unlimited Rights (e.g., Restrictions):

– Provide and justify basis of assertions using the prescribed format

– Explain how each item will be used to support the proposed research project

– Explain how the Government will be able to reach its program goals (including technology transition)

The proposer (prime) must submit a Data Rights Cert covering the entire team (prime and subcontractors), as applicable Provide a Data Rights Cert no matter the instrument type being proposed This information is assessed during evaluations (barriers to transition)

– https://www.darpa.mil//work-with-us/proposer-instructions (Click on the award instrument type you are requesting on the right) https://www.darpa.mil/work-with-us/proposer-instructions

Pitfalls That Delay Proposal Review or Result in Non-Conforming

Failure to submit proposal on time - noncompliant!

– Proposal due date and BAA closing date are the same – so, late is late!

Failure to submit using the correct mechanism - noncompliant!

– Unclassified proposals (for procurement contract or OT) ONLY to DARPA BAA website

– CAs to grants.gov- do not submit to BAA website

– Classified proposals/information ONLY per “Security Information” section of the BAA

Failure to submit both proposal volumes - noncompliant!

– OT proposals must also include a full cost volume (Cost Realism is an evaluation criterion for all proposals)

– OT proposals must also include a detailed list of payment milestones (Milestone Plan)

Pages beyond the page limitation (tech prop) - pages will not be reviewed (or could result in being deemed noncompliant!)

ROM/s instead of full subcontract cost proposal/s - noncompliant!

– “I didn’t have time to get the subcontract proposal/s” will not change the outcome

– “My subcontractor/s would not give me a proposal” will not change the outcome

Missing FFRDC or Government Entity cost proposal – noncompliant!

Communications

Prior to Receipt of Proposals (Solicitation Phase): No restrictions, however Gov’t (PM/PCO) shall not dictate solutions Typically handled through the Q&A

After Receipt of Proposals/Prior to Selections (Scientific Review Phase):

Limited to Contracting Officer or BAA Coordinator (with approval) to address clarifications requested by the review team Proposal cannot be changed in response to clarification requests

After Selection/Prior to Award (Negotiation Phase): Negotiations are conducted by the Contracting Officer PM and/or COR typically tasked with finalizing the SOW/Milestone Plan (with PI) PM and/or COR typically involved in any technical discussions (i.e., partial selection discussions)

Informal Feedback Sessions (Post Selection): May be requested/provided once the selection(s) are made

– If made on a timely basis (~1 wk after letter), all requests will be accepted

Referenced Links http://www.darpa.mil/work-with-us/proposer-instructions (general BAA info pertaining to all instrument types) (DARPA Standard Cost Proposal Spreadsheet) http://www.darpa.mil/work-with-us/procurement-contracts (info pertaining to contracts) https://www.darpa.mil/work-with-us/other-transaction-agreements (info pertaining to OTs) http://www.darpa.mil/work-with-us/reps-certs (DARPA-specific reps and certs for all instrument types) http://www.darpa.mil/work-with-us/proposer-instructions http://www.darpa.mil/work-with-us/procurement-contracts https://www.darpa.mil/work-with-us/other-transaction-agreements http://www.darpa.mil/work-with-us/reps-certs

HAPPI Proposer’s Day Commercial Strategy Briefing Dr. Brad Pietras Senior Advisor DARPA Commercial Strategy

16 September 2024

Commercial Strategy | 2024 Playbook Distribution Statement “A” (Approved for Public Release, Distribution Unlimited)

For over 60+ years, DARPA has pivotally invested in breakthrough technologies.

Computer Mouse & GUI s s s s

0s s

TCP/IP &

The Internet

Microelectronics

CAD, IR, RF, MEMS

AI, Computer Vision Speech Recognition

Self-Driving Cars MRNa Vaccines

Material Science

Lithium Ion Batteries

LCD Screens DNA Sequencing Syn. Bio

Personal Assistant Quantum Computing & Devices s

Realizing the full value of DARPA-technologies for national and economic security, with High-Risk Investments that has changed what’s possible.

FutureG and Advanced Materials

BACKGROUND: DARPA COMMERCIAL STRATEGY

Accelerate the commercialization of top DARPA-funded technologies (40-50 performers/year).

Prevent problematic foreign investment in strategic DARPA-funded technologies.

Scaling the ‘Gold-Standard’ model that ensures key strategic products, services, and capabilities are developed for national and economic security deployment.

DARPA Commercial Strategy Objectives DARPA’s Commercial Strategy launches DARPA’s R&D technology into products, services, and future capabilities for both the Department of Defense and commercial markets.

BACKGROUND: DARPA COMMERCIAL STRATEGY

DARPA Commercial Strategy’s Embedded Entrepreneur Initiative

TALENT

Embedded Entrepreneurs & Senior Commercialization Advisors

Tap into top tier commercial and entrepreneurial talent who provide training, mentoring, coaching, and deal sourcing to DARPA performers.

TECH TO MARKET

Techno-Economic Market Mapping and Financial Modeling

Identify strategies and approaches that create the highest opportunity for commercial products derived from DARPA funded technologies.

CURATED CAPITAL

Strategic Partnerships, Family Offices, Corporate Ventures

Connect DARPA-funded teams with non-adversarial private investment capital, while leverage existing regional business and economic development ecosystems.

DARPA TECHNOLOGY COMMERCIALIZATION

DARPA Program Managers Identify Strong Technical Performers for the EEI

Address and de-risk the highest market inefficiencies that prevent DARPA-funded technologies from transitioning and ensure DARPA technology is available in the future, with zero adversarial capital.

Commercial Strategy’s Embedded Entrepreneur Initiative provides access to entrepreneurial talent, techno-economic market mapping and curated capital for DARPA technologies seeking commercial transition pathways.

BACKGROUND: THE EMBEDDED ENTREPRENEUR INITIATIVE

Closing the Gap with Curated Capital

ECONOMIC IMPACT

Commercial Strategy | 2024 Playbook Distribution Statement “A” (Approved for Public Release, Distribution Unlimited)

We are finding the "sweet spot" between market realities and DoD critical needs by developing high-value, dual-use opportunities.

FAMILY OFFICES, CORPORATE

VENTURE, TRADITIONAL

VENTURE, AND M&A

NAVIGATING GOVERNMENT

PROCUREMENT

ROBUST GO-TO-MARKET

STRATEGY WITH 1st

CUSTOMER USER VALIDATION

*Only reporting publicly available data *Private investment reported per PitchBook & SCAs

In 2 years, the Commercial Strategy Team has secured over $1.57B in private funding, with 0 adversarial capital.

~109 Private Funding Rounds Closed

March 2024

As of 3.24

~$935M Private Investment

Capital Raised

As of 3.24

~$639M Total merger and acquisition value

As of 3.24

ECONOMIC IMPACT

~29 Private Funding Rounds Closed

As of 2.22

~203M Private Funding Rounds Closed

As of 2.22

~0 Total merger and acquisition value

As of 2.22

As of Q2 2024

In 2022 after the EEI pilot expansion:

Commercial Strategy | 2024 Playbook

~$344M Government Awards

As of 3.24

~$70M Government

Awards

As of 2.22

HAPPI Proposer’s Day Commercial Strategy Briefing Dr. Brad Pietras Senior Advisor DARPA Commercial Strategy

16 September 2024 www.DARPAConnect.us DARPAConnect@darpa.mil

Regional and Virtual Events

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Training and Development

Supporting Untapped Innovators:

Breaking Down Barriers to Entry

Breaking Down Barriers to Entry for Nontraditional Performers

Distribution Statement “A” (Approved for Public Release, Distribution Unlimited) www.DARPAConnect.us

Customized Support and Mentoring

Join the LinkedIn Group

Join at DARPAConnect.us

Pop-UpsDARPAConnect

Full day events covering the breadth of your DARPA journey

• Engaging DARPA Program Managers

• Heilmeier Catechism: Understanding Effective DARPA

Communication

• Understanding DARPA Announcements and Contract Vehicles

• Reviewing and Analyzing a DARPA Opportunity

• DARPA SBIR and STTR Program

• Understanding DARPA Security Resources

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• Tying It All Together: Strategies for Success

• Opportunities for Networking

Sessions Include:

Nebraska Albany, NY September 18, 2024 November 14, 2024

CurriculumDARPAConnect

• Understanding BAAs

• SBIR/STTR

• DARPA 101

• DARPA Award Vehicles &

Solicitations

• Proposal Tips

• Preparing for

Proposers Day

• Heilmeier Catechism

• Engaging DARPA Program

Managers

• Becoming a PM

• DARPA Innovation Fellows

• Introduction to Security

• Global Participation &

Engagements

Lessons Include:

www.DARPAConnect.us

CornerConnect

AMA: Mike Smith Deputy Director Security and Intelligence Directorate

September 30th, 2024

SupportCustomized

AVAILABLE THROUGH DARPACONNECT.US

NAVIGATE THE DARPA

ENTERPRISE

ENGAGE PROGRAM

MANAGERS SPEAK THE HEILMEIER1 2 3

We offer a one-stop-shop to navigate the changes and opportunities at DARPA

Identify and engage PMs whose research interests align with your research

Frame your ideas using DARPA’s Heilmeier Catechism

For Your DARPA Journey

NOT FOR QUESTIONS SPECIFIC TO AN OPEN BAA.

For more information or to request assistance, please visit:

www.DARPAConnect.us

Thank You.