HR001124S0038.pdf

HR001124S0038

Broad Agency Announcement Heterogenous Adaptively Produced Photonic Interfaces

(HAPPI)

Microsystems Technology Office

HR001124S0038

September 10, 2024

This publication constitutes a Broad Agency Announcement (BAA) as contemplated in Federal Acquisition Regulation (FAR) 6.102(d)(2) and 35.016 and 2 CFR § 200.203. Any resultant award negotiations will follow all pertinent law and regulation, and any negotiations and/or awards for procurement contracts will use procedures under FAR 15.4, Contract Pricing, as specified in the BAA.

OVERVIEW INFORMATION:

Federal Agency Name: Defense Advanced Research Projects Agency (DARPA), Microsystems Technology Office

Funding Opportunity Title: Heterogenous Adaptively Produced Photonic Interfaces (HAPPI)

Announcement Type: Initial Announcement

Funding Opportunity Number: HR001124S0038

Assistance Listing Number: Not applicable

Dates/Time: All Times are Eastern Time Zone (ET) o Draft BAA Posting Date: September 5, 2024 o Posting Date: September 10, 2024 o Proposers Day: September 16, 2024, at 09:00 a.m.

o Abstract Due Date: October 1, 2024, at 01:00 p.m.

o Question Submittal Closed: October 22, 2024, at 04:00 p.m.

o Proposal Due Date: October 29, 2024, at 01:00 p.m.

o Oral Presentation dates: November 18 - 22, 2024 o Estimated Period of Performance start: April 01, 2025

Anticipated Funding Available For Award: $30M

Anticipated Individual Awards: Multiple awards are anticipated

Anticipated funding type: 6.2

Types of Instruments That May Be Awarded: Procurement Contract, Research Other Transactions, or Prototype Other Transactions

NAICS Code: 541715

Agency Contact:

The BAA Coordinator for this effort may be reached at:

HR001124S0038@darpa.mil

DARPA/MTO

ATTN: HR001124S0038

675 North Randolph Street Arlington, VA 22203-2114 mailto:HR001124S0038@darpa.mil

Broad Agency Announcement

HR001124S0038

Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) Defense Advanced Research Projects Agency (DARPA)

Microsystems Technology Office (MTO)

Section I: Funding Opportunity Description

The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals in the following technical areas: Advanced concepts for high-density three-dimensional chip-to-chip and intra-chip optical routing in integrated photonic microsystems. Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices, or systems. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.

A. Background

The HAPPI program aims to create a 1000x increase in the information transmission density within a microsystem by exploiting photonic signaling. The ability to efficiently move and process information throughout a microsystem requires signal routing technology that is capable of high data rates and dense access points. Photonic links have a proven ability to support the high data bandwidths and diverse signal types needed. However, photonic links are sparse within the microsystem due to planar optical routing geometries. Increasing the density of photonic links requires moving to 3D optical routing within the chip (including multiple routing layers on chip) and between chips (enabling 3D stacking through advanced optical packaging). This will allow information to be delivered when and where it is needed in the microsystem; enabling new microsystem architectures for applications including signal processing, free-space communications, remote sensing, digital compute and atomic sensing.

Realizing this vision requires the creation of efficient, high-density photonic links within and between chips. Increasing the density of links gives a greater number of access points to the information within the microsystem. The link efficiency is a measure of the amount of information a given link is capable of moving and is inversely proportional to the losses within a given link. Today’s technology requires a tradeoff between the density of links and the efficiency of links limiting information movement within the microsystem. HAPPI seeks to break this limitation by maintaining the individual link efficiency while increasing the density of links.

State-of-the-Art Limit Today’s fabrication of planar photonic circuits is reaching the limits of integration density. The minimum feature sizes are fundamentally limited by the wavelength (~1 µm) of light and the refractive index contrast achievable in the optical materials. Technological limitations, such as the inability to achieve sharp mode conversions and out-of-plane waveguiding, limit the degrees of freedom required for next generation designs. State-of-the-art (SOTA) limitations include:

Inability to achieve optical out-of-plane routing and mode conversion in a compact footprint. One method to move light out of plane in photonic circuits is based on evanescent waveguide tapers and requires a very long interaction length to transition the optical mode from one layer to the next. SOTA evanescent tapers achieving low losses exceed 100 µm in length but only couple light to about a micron vertically. Another method uses diffraction gratings to deflect the light out of plane. However, achieving high efficiency is only possible over a long interaction length, causing structure footprints on the order of 100 µm2. They are also only efficient over a narrow spectral bandwidth (~tens of nanometers), limiting broadband applications.

Inability to construct efficient out-of-plane waveguides. A conventional waveguide requires a high-index core and a low-index cladding to confine the optical mode and low interface roughness to prevent scattering losses. While these conditions have been mastered for in-plane waveguides due to advanced lithography manufacturing, current methods for fabricating out-of-plane waveguides with high aspect ratio are limited.

Inability to simultaneously achieve high efficiency (low losses) and small footprint. Optical coupling efficiency is very sensitive to optical misalignment. Fabrication variability and assembly tolerances are on the order of the optical single-mode size, leading to significant optical losses in large assemblies composed of multiple chips. This is mitigated by expanding the modes, typically by a factor of 10 to 100, to reduce the fractional misalignment and therefore recover the efficiency.

The resulting photonic structures exhibit a footprint on the order of 100 µm2 or larger.

B. Program Description

The HAPPI program will develop advanced concepts for three-dimensional (3D) chip-to-chip and intra-chip optical routing. The program will seek hardware demonstrations of low-loss, high-density optical waveguiding and coupling utilizing a scalable manufacturing process that is compatible with microelectronics.

The metrics of the program target high-density 3D optical links. The program scope includes multiple routing layers within a photonic integrated circuit (PIC) or photonic interposer, connections between routing layers capable of traversing substrate thickness, and surface methods for coupling light from one photonic chip to another. Chip-to-fiber coupling and chip-to-chip edge coupling are excluded from the program scope.

A major thrust of the program will be the creation of optical interfaces that are robust to typical microsystem misalignments due to fabrication and assembly variability, especially for large link arrays that span reticle- or wafer-scale systems. The program will seek robust-by-design or adaptive interface solutions capable of achieving environmentally and mechanically stable optical performance, with an emphasis on compatibility with standard microelectronics manufacturing and assembly flows.

The material platform is unspecified; however, approaches should include coupling to a PIC platform with demonstrated optoelectronic components (sources, amplifiers, modulators, multiplexers, tuners, filters, detectors, and other optoelectronic components) while meeting the program loss and density metrics.

The development of active optoelectronic components and the use of optical-electrical-optical conversions are beyond the scope of the program. The operating wavelengths are proposer defined and may be within the visible or near-infrared bands. The choice of proposed wavelength span should be justified by specific technology application.

The program aims to develop robust and flexible photonic routing and packaging platform applicable to a broad set of use cases. The proposed platform should allow for 3D stacking of multiple photonic chips, combining passive (low-loss routing) and active optoelectronic materials (Figure 1). The 3D photonic routing fabric should support arbitrary directionality changes between routing layers (Figure 1a), any necessary optical mode transformations (Figure 1b), and the ability to mitigate misalignment errors due to manufacturing tolerances (Figure 1c).

Figure 1. Robust and flexible photonic packaging platform applicable to a broad set of use cases

Figure 2 is an example of key technical elements that would support the HAPPI vision. Each of the chips in the stack supports multiple waveguiding layers; low-loss, high-density, robust chip-to-chip coupling; out-of-plane waveguides capable of traversing typical thickness of substrates or interposers; and low-loss, small-footprint transitions from in-plane to out-of-plane waveguiding. DARPA encourages the proposal of any routing geometries that meet the loss/density metrics and are manufacturable, including ninety-degree (Figure 2a) and non-ninety-degree (Figure 2b) layouts. Proposals should clearly describe the associated fabrication and assembly flows that are scalable, reproducible, and manufacturable.

The HAPPI technologies will enable very-large scale integrated (VLSI) photonic circuits with thousands of components to directly impact both commercial and defense applications. These circuits will deliver disruptive advances for signal processing, compact sensors, microwave applications, and quantum systems. HAPPI aims to inspire the creation of a domestic ecosystem supported by foundry services, automated design flow tools, packaging, and assembly capabilities broadly available to government users, defense industrial base, and domestic research and development programs.

Figure 2. Notional concept for optical routing, illustrating key HAPPI component technologies.

C. Program Structure

The HAPPI program is a 36-month, two-phase program executing in a single technical area. Proposals should address both phases with Phase 1 as the Base period and Phase 2 as an Option period.

Organizations can be part of multiple proposing teams. DARPA anticipates down-selection at the end of Phase 1. Phase 2 Option awards may be exercised, at the Government’s sole discretion, based on meeting the Phase 1 program metrics, presentation of a compelling Phase 2 technical plan, and a clearly formulated strategy to maintain and sustain the HAPPI technology beyond program completion.

The 18-month Phase 1 will prove the feasibility of 3D routing in integrated photonics. Performers will demonstrate an out-of-plane guided optical path originating in the waveguide fabric of one discrete chip and terminating in the waveguide fabric of another discrete chip stacked on the initial chip. The link optical path will traverse chip-to-chip interface and > 100 µm of semiconductor substrate. The Phase 1 schedule allows for multiple design-fabrication-characterization cycles resulting in a demonstration of low loss link structures forming the foundations of a 3D photonic fabric. A demonstration of 10 x 10 arrays of functional links with low crosstalk is also required to show scalability. A preliminary design review (PDR) for a 1000 x 1000 Phase 2 array will capture full array modeling and simulation and incorporate key experimental learning from the Base effort.

The 18-month Phase 2 will focus on scaling the density and proving the manufacturability of the 3D routing platform demonstrated in Phase 1. The updated 1000 x 1000 array design will be reviewed at the critical design review (CDR) prior to committing to fabrication. A key challenge addressed in Phase 2 is maintaining low end-to-end optical loss over a large array subject to typical manufacturing and assembly misalignment tolerances. Performers will demonstrate a non-blocking routing network connecting nodes on an arbitrary grid at a 3 μm x 3 μm center-to-center pitch. The optical path of each link will traverse chip-to-chip interface(s) and > 100 µm of semiconductor substrate.

A summary of the program metrics by phase is presented in Table 1.

Table 1. Program Metrics

Metric Phase 1, Base Extend Dimensionality

Phase 2, Option Density and Scale Notes

Optical loss per link (link efficiency)

1 dB 1 dB

Link contains: Out of plane guided optical path interconnecting the waveguide fabric of two discrete chips (see Figure 3.

Testing at the end of Phase 1 will characterize individual link performance)

Vertical waveguide length

> 100 μm > 100 μm

The link optical path will traverse chip-to-chip interface and > 100 µm of semiconductor substrate

Link array size 10 x 10 1,000 x 1,000

Array area of 3 x 3 mm, signal I/O location will be government furnished (see Figure 4)

Adjacent link crosstalk

< 20 dB < 20 dB Measured at 3 µm x 3 µm pitch

Optical power handling

> 1 mW > 10 mW

Minimum number of routing layers

> 4 > 4 Minimum 2 discrete PICs

Spectral bandwidth 100 nm 100 nm Demonstrate metrics across continuous spectral band within 400–1800 nm

Operating environment 0–85 °C 0–85 °C

Steady-state, temperature cycling, thermal gradients

Each proposal should include a test and evaluation plan addressing the following key tests by Phase:

Phase 1 (Base) Testing at the end of Phase 1 will characterize individual link performance and assess the manufacturability and scaling potential of the platform:

Optical efficiency and loss on a per-link basis (absorption, scattering, leakage, and spectrally dependent losses); see Figure 3.

Optical crosstalk for adjacent optical links at 3 µm x 3 µm pitch.

Mechanical, thermal, and optical integrity of chip-to-chip assemblies via visual inspection, cross-sectioning, and continuity tests.

Validate scalability of the approach via characterization of a representative 10 x 10 array.

Expected 80% or better yield of links in array.

Figure 3. Testing at the end of Phase 1 will characterize individual link performance.

It is anticipated that testing in Phase 1 will leverage existing laboratory-grade, tabletop equipment at the performer’s site to the maximum extent possible. At the conclusion of Phase 1, performers will be expected to develop test plans and specify testbed for Phase 2 testing and evaluation.

Phase 2 (Option) Testing at the end of Phase 2 will characterize HAPPI platform capability and assess manufacturability and environmental robustness of the resulting assemblies:

Assess link optical performance and yield via automated, high-throughput screening and statistical analysis.

Report on link yield across the 1000 x 1000 array based on statistical analysis of loopback and daisy-chain optical link tests.

Assess mechanical and optical integrity under temperature cycling, thermal gradients, continuous temperature in the 0–85 °C range. Thermal gradient tests should plan to include a 500 µm x 500 µm centered hotspot and a temperature gradient falling off to the edge of the 3 mm chip. Proposers are encouraged to specify test protocols that demonstrate the environmental robustness of the assemblies.

Assess mechanical robustness via Bond Strength and Bond Pull standardized packaging test protocols. Proposers are encouraged to specify test protocols that demonstrate the mechanical robustness of the assemblies.

Demonstrate 3D photonic routing (“obstacle course”) – non-blocking routing network connecting nodes on an arbitrary grid at a 3 μm center-to-center pitch. The optical path of each link will traverse chip-to-chip interface(s) and > 100 µm of semiconductor substrate and will require more than four routing layers. Input/output (I/O) maps (i.e., “obstacle course” pinout maps) will be provided to performers at the start of Phase 2. A notional map for illustration purposes only is provided in Figure 4.

Figure 4. A notional pinout map for illustration purposes only. Phase 2 will demonstrate arbitrary optical routing networks with Government provided “obstacle course” pinout maps.

Proposers should identify the facilities that they will use for large-scale array testing. Proposers should discuss their needs for developing a testbed or acquiring custom tooling, array probers, grippers, automated test controllers, etc. Any such equipment and associated materials should be identified in the cost proposal.

Schedule, Milestones and Deliverables

Figure 5. Program schedule.

Phase 1 technical deliverables and results are due 30 days prior to the phase-end to allow for Phase 1 evaluation and phase transition administrative actions.

All proposals must include the following meetings and travel in the proposed schedule and costs:

To foster collaboration between teams and disseminate program developments, a two-day

Principal Investigator (PI) meeting will be held approximately every six months, with locations split between the east and west coasts of the United States. For budgeting purposes, plan for 3 two-day meetings over the course of each program phase.

Regular teleconference meetings will be scheduled with the Government team for progress reporting as well as problem identification and mitigation. Proposers should also anticipate at least two site visit per phase by the DARPA Program Manager, during which they will have the opportunity to demonstrate progress towards experimental milestones.

A summary of required program milestones and deliverables is presented in Table 2. Performers are expected to include additional milestones based on their technical execution plan. Examples include planned tapeout dates and key hardware performance demonstrations.

Table 2. Program Milestones and Deliverables

Milestone/Deliverables Months after Base/Option Award

Phase 1, Base MS-1a, b,…: Critical tapeouts and hardware performance milestones (required) Performer defined

MS-2: On-site demonstration of Phase 1 results 16–17 D-1: Report on the alignment tolerances of assemblies 17 D-2: Report on manufacturing viability of the approach 17 MS-3: Phase transition meeting and 1000 x 1000 array

PDR 17

Phase 2, Option (if awarded) MS-3: 1000 x 1000 array CDR 4 MS-4a, b, c…: Critical tapeouts and hardware performance milestones (required) Performer defined

D-3: Commercialization Plan 16 D-4: Final HAPPI platform characterization report 17–18 MS-4: Final demonstration at performer facility 17–18

D. Intellectual Property

Proposers responding to this announcement shall follow the applicable rules and regulations and, in all cases, should appropriately identify any potential restrictions on the Government’s use of any intellectual property. This includes both noncommercial items and commercial items. The Government expects to retain unlimited data rights for the intellectual property developed under the HAPPI program.

Section II: Evaluation Criteria

Proposals will be evaluated using the following criteria listed in descending order of importance:

Overall Scientific and Technical Merit; Potential Contribution and Relevance to the DARPA Mission;

and Cost Realism.

o Overall Scientific and Technical Merit: The proposed technical approach is innovative, feasible, achievable, and complete. All claims for meeting the program goals and metrics are derived analytically from models, simulations or prior experimental work. The proposed technical team has the expertise and experience to accomplish the proposed tasks. Task descriptions and associated technical elements provided are complete and in a logical sequence with all proposed deliverables clearly defined. The proposal identifies major technical risks and planned mitigation efforts are clearly defined and feasible. The proposal outlines hardware test and evaluation plans by program phase addressing the complete set of program metrics and requirements.

o Potential Contribution and Relevance to the DARPA Mission: The potential contributions of the proposed effort bolster the national security technology base and support DARPA’s mission to make pivotal early technology investments that create or prevent technological surprise. The proposer outlines a clear plan to create and sustain a new differentiating domestic photonic manufacturing capability with direct impact to economic security and national security. The proposer clearly demonstrates its capability to transition the technology to the research, industrial, and/or operational military communities in such a way as to enhance U.S. defense. In addition, the evaluation will take into consideration the extent to which the proposed intellectual property rights structure will potentially impact the Government’s ability to transition the technology.

o Cost Realism: The proposed costs are realistic for the technical and management approach and accurately reflect the technical goals and objectives of the announcement. The proposed costs are consistent with the proposer’s Statement of Work and reflect a sufficient understanding of the costs, skill mix, and level of effort needed to successfully accomplish the proposed technical approach. The costs for the prime proposer and proposed sub awardees are substantiated by the details provided in the proposal (e.g., the type and number of labor hours proposed per task, the types and quantities of materials, equipment and fabrication costs, travel and any other applicable costs and the basis for the estimates). The effort leverages all available relevant prior research in order to obtain the maximum benefit from the available funding. For efforts with a likelihood of commercial application, appropriate direct cost sharing has been proposed.

Unless otherwise specified in this announcement, for additional information on how DARPA reviews and evaluates proposals through the Scientific Review Process, please visit: Proposer Instructions and General Terms and Conditions.

https://www.darpa.mil/work-with-us/proposer-instructions

Section III: Submission Information

This announcement allows for multiple award instrument types to be awarded to include Procurement Contracts, Research Other Transactions and Prototype Other Transactions. Some award instrument types have specific cost-sharing requirements. The following websites are incorporated by reference and contain additional information regarding overall proposer instructions, general terms and conditions, and each specific award instrument type o Proposer Instructions and General Terms and Conditions: Proposer Instructions and General Terms and Conditions o Procurement Contracts: Proposer Instructions: Procurement Contracts o Other Transaction agreements: Proposer Instructions: Other Transactions

This announcement contains an abstract phase. Abstracts are required. Abstracts are due no later than the due date and time stated in the Overview section. Additional instructions for abstract submission are contained within Attachments A and B.

Full proposals are due no later than the due date and time stated in the Overview section.

Attachments C, D, and E (plus F, G, and H for Other Transactions) contain specific instructions and templates and constitute a full proposal submission. Please visit Proposer Instructions and General Terms and Conditions for specific information regarding submission methods (under Unclassified Submission Instructions) through the Broad Agency Announcement Tool (BAAT).

BAA Attachments:

o Attachment A: Abstract Summary Slide Template o Attachment B: Abstract Instructions and Template o Attachment C: Proposal Instructions and Volume I Template (Technical and Management) o Attachment D: Proposal Instructions and Volume II Template (Cost) o Attachment E: DARPA Standard Cost Proposal Spreadsheet o Attachment F (for Other Transactions only): Other Transaction Certification Template o Attachment G (for Other Transactions only): Task Description Document (TDD) Template o Attachment H (for Other Transactions only): Schedule of Milestones and Payments o Attachment I: Proposer Checklist o Attachment J: HAPPI Controlled Unclassified Information (CUI) Guide signed September 3, 2024

All technical, contractual, and administrative questions regarding this notice must be emailed to HR001124S0038@darpa.mil. Emails sent directly to the Program Manager or any other address may result in delayed or no response. All questions must be in English and must include the name, email address, and telephone number of a point of contact. DARPA will attempt to answer all questions in a timely manner and post an FAQ list on the DARPA/MTO Opportunities page at (http://www.darpa.mil/work-with-us/opportunities). The list will be updated on an ongoing basis until two weeks prior to the proposal due date.

https://www.darpa.mil/work-with-us/proposer-instructions https://www.darpa.mil/work-with-us/proposer-instructions https://www.darpa.mil/work-with-us/procurement-contracts https://www.darpa.mil/work-with-us/other-transaction-agreements https://www.darpa.mil/work-with-us/proposer-instructions https://www.darpa.mil/work-with-us/proposer-instructions mailto:HR001124S0038@darpa.mil http://www.darpa.mil/work-with-us/opportunities

Section IV: Special Considerations

This announcement, stated attachments, and websites incorporated by reference constitute the entire solicitation. In the event of a discrepancy between the announcement, attachments, or websites, the announcement shall take precedence.

All responsible sources capable of satisfying the Government's needs, including both U.S. and non- U.S. sources, may submit a proposal that shall be considered by DARPA. Historically Black Colleges and Universities, Small Businesses, Small Disadvantaged Businesses and Minority Institutions are encouraged to submit proposals and join others in submitting proposals; however, no portion of this announcement will be set aside for these organizations’ participation due to the impracticality of reserving discrete or severable areas of this research for exclusive competition among these entities.

Non-U.S. organizations and/or individuals may participate to the extent that such participants comply with any necessary nondisclosure agreements, security regulations, export control laws, and other governing statutes applicable under the circumstances.

As of the time of publication of this announcement, all proposal submissions are anticipated to be unclassified.

When an abstract or proposal includes a classified portion, and when able, according to security guidelines, we ask that proposers send an e-mail to HR001124S0038@darpa.mil as notification that there is a classified portion to the submission and to request instructions on how to submit the classified portion.

This program is subject to Attachment J: HAPPI Controlled Unclassified Information (CUI) Guide signed September 3, 2024. All individuals accessing CUI agree to protect CUI in accordance with DoD Instruction 5200.48 CONTROLLED UNCLASSIFIED INFORMATION (CUI) and NIST Special Publication 800-171 Protecting Controlled Unclassified Information in Nonfederal Systems and Organizations.

Federally Funded Research and Development Centers (FFRDCs), University Affiliated Research Centers, and Government entities interested in participating in the HAPPI program or proposing to this BAA should first contact the Agency Point of Contact (POC) listed in the Overview section prior to the Proposal due date to discuss eligibility. Complete information regarding eligibility can be found at Proposer Instructions and General Terms and Conditions.

As of the date of publication of this announcement, the Government expects that program goals as described herein either cannot be met by proposers intending to perform fundamental research or the proposed research is anticipated to present a high likelihood of disclosing performance characteristics of military systems or manufacturing technologies that are unique and critical to defense. Therefore, the Government anticipates restrictions on the resultant research that will require the awardee to seek DARPA permission before publishing any information or results relative to the program. For additional information on fundamental research, please visit Proposer Instructions and General Terms and Conditions.

Proposers should indicate in their proposal whether they believe the scope of the research included in their proposal is fundamental or not. While proposers should clearly explain the intended results of their research, the Government shall have sole discretion to determine whether the proposed research shall be considered fundamental and to select the award instrument type. Appropriate mailto:HR001124S0038@darpa.mil https://www.darpa.mil/work-with-us/proposer-instructions https://www.darpa.mil/work-with-us/proposer-instructions https://ddmdraft.darpa.mil/work-with-us/proposer-instructions language will be included in resultant awards for non-fundamental research to prescribe publication requirements and other restrictions, as appropriate. This language can be found at Proposer Instructions and General Terms and Conditions.

For certain research projects, it may be possible that although the research to be performed by a potential awardee is non-fundamental research, its proposed subawardee’s effort may be fundamental research. In all cases, it is the potential awardee’s responsibility to explain in its proposal which proposed efforts are fundamental research and why the proposed efforts should be considered fundamental research.

DARPA has utilized an alternate structured approach for the determination of a reasonable fee basis for Cost-Plus-Fixed-Fee (CPFF) procurement contracts under HAPPI, in accordance with DFARS 215.404-4(b)(1)(C). The fee calculation percentage range determined reasonable for procurement contract awards under HAPPI is 6.0% - 8.4%. This was determined based on consideration of factors such as: performance risk; contract type risk; facilities capital employed; anticipated award size;

available transition path; markets (commercial, Government, international); IP rights; chances of award; time to production; and solicitation complexity.

Proposers seeking a CPFF procurement contract should propose a fee that falls within the above range.

Because that fee range already has been determined to be reasonable relative to HAPPI, proposals need not include any further fee justification. Elimination of fee as a negotiation item is expected to result in reduced contracting timelines for any proposal selected for award negotiation. It should be noted that this structured approach only applies to CPFF procurement contracts and not to other transactions.

The APEX Accelerators program, formerly known as the Procurement Technical Assistance Program (PTAP), focuses on building a strong, sustainable, and resilient U.S. supply chains by assisting a wide range of businesses that pursue and perform under contracts with the DoD, other federal agencies, state and local governments and with government prime contractors. See https://www.apexaccelerators.us/ for more information. APEX Accelerators helps businesses:

o Complete registration with a wide range of databases necessary for them to participate in the government marketplace (e.g., SAM).

o Identify which agencies and offices may need their products or services and how connect with buying agencies and offices.

o Determine whether they are ready for government opportunities and how to position themselves to succeed.

o Navigate solicitations and potential funding opportunities.

o Receive notifications of government contract opportunities on a regular basis.

o Network with buying officers, prime contractors, and other businesses.

o Resolve performance issues and prepare for audit, only if the service is needed, after receiving an award.

Project Spectrum is a nonprofit effort funded by the DoD Office of Small Business Programs to help educate the Defense Industrial Base (DIB) on compliance. Project Spectrum is vendor-neutral and available to assist businesses with their cybersecurity and compliance needs. Their mission is to improve cybersecurity readiness, resilience, and compliance for small/medium-sized businesses and the federal manufacturing supply chain. Project Spectrum events and programs will enhance awareness of cybersecurity threats within the manufacturing, research, and development, as well as https://www.darpa.mil/work-with-us/proposer-instructions https://www.apexaccelerators.us/ knowledge-based services sectors of the industrial base. Project Spectrum will leverage strategic partnerships within and outside of the DoD to accelerate the overall cybersecurity compliance of the DIB. www.Projectspectrum.io is a web portal that will provide resources such as individualized dashboards, a marketplace, and Pilot Program to help accelerate cybersecurity compliance.

DARPAConnect offers free resources to potential performers to help them navigate DARPA, including “Understanding DARPA Award Vehicles and Solicitations,” “Making the Most of Proposers Days,” and “Tips for DARPA Proposal Success.” Join DARPAConnect at https://www.darpaconnect.us to leverage on-demand learning and networking resources.

DARPA has streamlined our Broad Agency Announcements and is interested in your feedback on this new format. Please send any comments to DARPAsolicitations@darpa.mil.

http://www.projectspectrum.io/ http://www.darpaconnect.us/ mailto:DARPAsolicitations@darpa.mil