CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates
Closed Solicitation Posted
This opportunity was awarded. See the award notice from .
- Solicitation number
- 1333ND26QNB030031
- Agency
-
National Institute of Standards and Technology
Department of Commerce
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 334413 Semiconductor and Related Device Manufacturing
- PSC
- 6640 Laboratory Equipment And Supplies
- Place of performance
- Gaithersburg, Maryland 20899, United States
Notice details come from SAM.gov. Updated .
About this opportunity
The National Institute of Standards and Technology (NIST), a component of the Department of Commerce, is seeking a High-Throughput High-Resolution X-ray Laminography/Tomography System to support the CHIPS Metrology program. The system must meet stringent technical specifications including 1 micrometer resolution for metal/non-metal line and space patterns, a scan speed of at least 0.5 mm³/min, and capability to process samples up to 100 mm × 100 mm × 20 mm with automatic handling for at least 5 samples. The procurement will be evaluated based on three factors: technical capability (Factor 1) and demonstrated prior experience (Factor 2) are weighted as more important than price (Factor 3), with confidence ratings assigned as high, some, or low. The Government reserves the right to award without discussions based on initial quotations. Quotations must be submitted electronically no later than March 9, 2026 (extended from the original February 26, 2026 deadline), with technical questions required to be submitted within five calendar days of solicitation issuance.
This is a full and open competition with no set-aside designation, issued under FAR Part 12 for commercial products and services with a NAICS code of 334413 and a small business size standard of 1,250 employees. There are no named incumbents or current contractors referenced in this solicitation. The contract includes four primary line items: CLIN 0001 for the analytical instrument system, CLIN 0002 for shipping, installation, and training, CLIN 0003 for transportation-related expenses (not-to-exceed), and optional service contract CLINs 1001-1004 for years 2-5 of system maintenance, with the entire contract term not to exceed five years and 34 weeks. The contractor must deliver the system within 32 weeks of award and complete installation within 2 weeks of delivery at NIST's Gaithersburg campus in Building 216. The place of performance is Gaithersburg, Maryland 20899, with the contracting officer being Donald Collie.
Notice text
2 versions
Update #2 · Latest ·
Amendment 0001:
Amendment changes include the following:
- The required response date is extended from February 26, 2026 to March 9, 2026
- No Statement of work change
- Questions and Answers:
Question1: Is there a cleanroom specification?
NIST Response: No. The instrument will be installed in a general purpose lab in the advanced measurement laboratory facility, but not within a cleanroom.
Question 2: Are you flexible on the footprint (size/dimension)
NIST Response: NIST expects the analytical instrument (source, stages, detectors, and shielded enclosure) to fit within the footprint specified by 10.2. Additional space is available in the lab around the instrument for service access, and for support equipment (including chase space for air compressor/dryer if required, and a work area in the lab for control and analysis PCs).
Question 3: Are the devices in JEDEC Trays?
NIST Response: Typically no. NIST requires significant flexibility to load samples that are within the size envelope described by specification 5. Samples will include full wafers, coupons (partial wafers), individual or groups of packaged devices, as well as atypical sample geometries. To meet requirement 5.1, vendors must include 5 sample carriers that are compatible with the automated loading system. Carriers supporting a JEDEC tray is only one possible way to meet that requirement.
See Combined Synopsis Solicitation_1333ND26QNB030031, Attachment 1 - Statement of Work, and Attachment 2 - Applicable Provisions and Clauses attachments for solicitation details.
Update #1 ·
See Combined Synopsis Solicitation_1333ND26QNB030031, Attachment 1 - Statement of Work, and Attachment 2 - Applicable Provisions and Clauses attachments for solicitation details.
Files
| File | Type | Posted |
|---|---|---|
| Attachment 2- Applicable Provisions and Clauses.docx | DOCX document | |
| Combined Synopsis Solicitation_1333ND26QNB030031_final.docx | DOCX document | |
| Attachment 1-Statement of Work.docx | DOCX document |
Notice history
| Notice | Type | Posted |
|---|---|---|
| CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates | Award Notice | |
| This notice | Solicitation | |
| Sources Sought Notice for CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates | Pre-Solicitation |
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