CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates
Awarded Award Notice Posted
- Solicitation number
- 1333ND26PNB030089
- Agency
- National Institute of Standards and Technology Department of Commerce
- Awarded
- to Sigray, Inc.
- Set-aside
- No set-aside
Opportunity facts
- Contract number
- 1333ND26PNB030089 Federal contract award
- NAICS code
- 334413 Semiconductor and Related Device Manufacturing
- PSC
- 6640 Laboratory Equipment And Supplies
- Place of performance
- Gaithersburg, Maryland 20899, United States
- Points of contact
-
- Donald Collie donald.collie@nist.gov (301) 975-6458
- Tracy Retterer tracy.retterer@nist.gov (301) 575-8448
Notice details come from SAM.gov. Updated .
About this opportunity
The National Institute of Standards and Technology (NIST), a civilian agency under the Department of Commerce, awarded contract 1333ND26PNB030089 to SIGRAY, INC. on April 15, 2026, for the procurement of a CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System designed for advanced packaged semiconductor devices and substrates. The contract award value totals $2,050,999.00 and was selected based on best value evaluation criteria as specified in the original solicitation. This system will support NIST's capabilities in semiconductor inspection and analysis, enabling detailed imaging and analysis of complex semiconductor packaging and substrate materials at high resolution.
Notice text
Contract awarded in accordance with the solicitation evaluation criteria of the proposed item that offerred the best value to the Government.
Awarded contract 1333ND26PNB030089 to SIGRAY, INC. for 2050999.00 on 2026-04-15.
Notice history
| Notice | Type | Posted |
|---|---|---|
| CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates | Award Notice | |
| CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates | Solicitation | |
| Sources Sought Notice for CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates | Pre-Solicitation |
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