Call For Solutions: Circuit Card Assembly (CCA) Production Support and Scalability Solutions
Closed Solicitation Posted
- Solicitation number
- CCA_26_01
- Agency
-
Department of the Army
Department of Defense
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 334418 Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Place of performance
- Tobyhanna, Pennsylvania 18466, United States
- Points of contact
Notice details come from SAM.gov. Updated .
About this opportunity
The Army Contracting Command-Aberdeen Proving Ground (ACC-APG), Tobyhanna Division, on behalf of Tobyhanna Army Depot (TYAD), seeks innovative commercial methodologies and technologies to rapidly scale Circuit Card Assembly production using existing Surface Mount Technology automated lines and through-hole component machinery, with Phase 1 Solution Briefs due August 10, 2026 at 2 PM EST.
Place of performance is Tobyhanna, Pennsylvania. The procurement addresses reverse engineering, obsolescence management, and supply chain resilience to close internal capability gaps. TYAD anticipates CCA work spanning 1 to 30 layers with board dimensions from 0.75" × 0.75" up to 18" × 24", supporting annual production quantities ranging from 100 units to 2 million units. Reverse engineering and Technical Data Package generation may be performed at contractor facilities with government approval; some cases may require onsite performance at TYAD. Government-furnished materials will vary by task order and may include known-good or failed assemblies, bare boards, documentation, firmware, or physical assemblies with limited documentation.
Required attributes include high-fidelity 3D scanning, material analysis, signal integrity simulation, and rapid development of manufacturing-ready Technical Data Packages compatible with existing equipment. Explicitly out of scope are proposals for new manufacturing lines, retainer-based pricing, traditional labor without innovation, commodity production, and proprietary ecosystems. Awards may be made under FAR-based contracts (IDIQ or BOA) or non-FAR Other Transactions per DFARS 212.70. Offerors must demonstrate CMMC Level 2 readiness or a compliant plan within 180 days of award, grant the Government robust license rights to all technical deliverables, and accept an as-needed task-order-based pricing structure with no retainers or capacity fees. Phase 1 evaluation uses three graded criteria in descending importance: Technical Merit & Innovation, Operational Agility & Schedule, and Viability & Cost Realism. The Government reserves the right to make multiple awards, a single award, or no award. NAICS code is 334418, Printed Circuit Assembly Manufacturing.
Notice text
3 versions
Update #3 · Latest ·
The Army Contracting Command- Aberdeen Proving Ground (ACC-APG), Tobyhanna Division on behalf of Tobyhanna Army Depot (TYAD) is seeking innovative solutions Circuit Card Assembly (CCA) Production Support and Scalability Solutions.
TYAD seeks innovative commercial methodologies, processes, and technologies to rapidly scale Circuit Card Assembly (CCA) production using our existing Surface Mount Technology (SMT) automated lines and through-hole component machinery. We are soliciting novel approaches to design, reverse engineering, obsolescence management, and supply chain resilience that will close internal capability gaps and accelerate timelines for building essential CCA manufacturing data.
The Call for Solutions document (.pdf), outlining the full problem statement, required solution attributes, submission requirements, and evaluation phases can be found in the "Attachments" section below.
The following shall be utilized in the email subject line: "Call for Solution-CCA_26_01"
The Army Open Solicitation (AOS) that this Call for Solution is associated with can be found at: https://sam.gov/workspace/contract/opp/a827ea963c6c4344b3494ad83a08d25c/view
Please review the AOS posting and associated attachments, in addition to the attachment for this call, for further information on how the AOS is structured.
7/28/2026: Questions and Answers 1 Posted
8/5/2026: Questions and Answers 2 Posted
Update #2 ·
The Army Contracting Command- Aberdeen Proving Ground (ACC-APG), Tobyhanna Division on behalf of Tobyhanna Army Depot (TYAD) is seeking innovative solutions Circuit Card Assembly (CCA) Production Support and Scalability Solutions.
TYAD seeks innovative commercial methodologies, processes, and technologies to rapidly scale Circuit Card Assembly (CCA) production using our existing Surface Mount Technology (SMT) automated lines and through-hole component machinery. We are soliciting novel approaches to design, reverse engineering, obsolescence management, and supply chain resilience that will close internal capability gaps and accelerate timelines for building essential CCA manufacturing data.
The Call for Solutions document (.pdf), outlining the full problem statement, required solution attributes, submission requirements, and evaluation phases can be found in the "Attachments" section below.
The following shall be utilized in the email subject line: "Call for Solution-CCA_26_01"
The Army Open Solicitation (AOS) that this Call for Solution is associated with can be found at: https://sam.gov/workspace/contract/opp/a827ea963c6c4344b3494ad83a08d25c/view
Please review the AOS posting and associated attachments, in addition to the attachment for this call, for further information on how the AOS is structured.
7/28/2026: Questions and Answers 1 Posted
Update #1 ·
The Army Contracting Command- Aberdeen Proving Ground (ACC-APG), Tobyhanna Division on behalf of Tobyhanna Army Depot (TYAD) is seeking innovative solutions Circuit Card Assembly (CCA) Production Support and Scalability Solutions.
TYAD seeks innovative commercial methodologies, processes, and technologies to rapidly scale Circuit Card Assembly (CCA) production using our existing Surface Mount Technology (SMT) automated lines and through-hole component machinery. We are soliciting novel approaches to design, reverse engineering, obsolescence management, and supply chain resilience that will close internal capability gaps and accelerate timelines for building essential CCA manufacturing data.
The Call for Solutions document (.pdf), outlining the full problem statement, required solution attributes, submission requirements, and evaluation phases can be found in the "Attachments" section below.
The following shall be utilized in the email subject line: "Call for Solution-CCA_26_01"
The Army Open Solicitation (AOS) that this Call for Solution is associated with can be found at: https://sam.gov/workspace/contract/opp/a827ea963c6c4344b3494ad83a08d25c/view
Please review the AOS posting and associated attachments, in addition to the attachment for this call, for further information on how the AOS is structured.
Files
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