Questions and Answers 1 Circuit Card Assembly.pdf

Questions and Answers 1

1. Representative CCA characteristics.

Can the Government provide representative ranges for anticipated CCA complexity, including approximate layer count, board dimensions, component density, mixed SMT/through-hole content, technology generation, and expected annual or surge-production quantities?

YES

LAYERS: 1 to 30 BOARD DIMENSIONS: 0.75” x 0.75” up to 18” x 24” ANNUAL PRODUCTION: QTY-100 (High Mix Low Volume) to QTY-2M (Low Mix High Volume) COMPONENT DENSITY & TECHNOLOGY CONTENT vs. GENERATION

2. Government-furnished hardware and technical information.

For a typical task order, does TYAD anticipate providing known-good assemblies, failed assemblies, bare boards, schematics, drawings, manuals, firmware, interface-control information, or existing manufacturing files?

YES – VARIES DEPENDING ON THE TASK ORDER

Should offerors assume that some efforts may begin with only a physical assembly and limited documentation?

YES

3. Destructive analysis.

Does the Government anticipate authorizing targeted destructive analysis when nondestructive methods cannot resolve internal layer structures, materials, component construction, or other critical design details?

YES

If so, should ROM pricing assume that multiple specimens may be made available?

YES

4. Manufacturing-equipment compatibility.

Will TYAD provide selected offerors with the relevant capabilities and constraints of its existing SMT & PTH equipment, including accepted data formats, panel requirements, stencil practices, feeder limitations, inspection capabilities, minimum feature sizes, and test-interface requirements?

YES

5. Representative ROM pricing.

For Phase 1, does the Government prefer a single ROM price for a representative end-to-end CCA reverse-engineering and production-readiness effort, a complexity-based pricing model, or a schedule of milestone-based engineering rates and deliverables?

PRE-AWARD - COMPLEXITY-BASED PRICING MODEL

POST-AWARD - SINGLE ROM PRICE FOR A REPRESENTATIVE END-TO-END

CCA REVERSE ENGINEERING & PRODUCTION READINESS EFFORT

6. Pilot or demonstration scope.

Should the Phase 1 Solution Brief propose a pilot involving a representative Government-furnished CCA, or may the offeror demonstrate the maturity of its commercial process through prior comparable work and propose that the specific pilot board be selected after award?

PROCESS MATURITY DEMONSTRATION BASED ON PRIOR COMPARABLE WORK W/

POST-AWARD PILOT

7. Technical Data Package content.

In addition to the expressly identified Gerber files, BOMs, drill templates, firmware deliverables, and TDPs, does the Government expect delivery of editable native design-source files, such as Altium schematic and PCB files, component libraries, three-dimensional models, design-rule configurations, and manufacturing-output configurations?

YES – THIS ACCURATELY CAPTURES THE TDP COMPLEXITY. SPECIFICS WILL BE

DEFINED POST-AWARD

8. Existing Army BOA.

Because RAMP already holds an Army BOA awarded through the BOAST program, would the Government consider using that existing agreement for resulting work if its scope and ordering authority are determined to be suitable?

YES – IF USING THE BOAST PROGRAM EXPEDITES THE PROCESS AND IS COST

COMPETITIVE

or should offerors assume that a separate agreement will be established under this Call?

NO - NOT A MANDATED REQUIREMENT

9. Supporting letters and attachments.

May letters confirming access to specialized commercial manufacturing or university Core Facility resources be included as attachments to the Phase 1 submission, and would such letters count against the five-page written limit?

NOT APPLICABLE – ALL PROCESS DEVELOPMENT & MANUFACTURING ACTIVITIES WILL

BE EXECUTED ONSITE AT TYAD

10. Cybersecurity documentation.

Should the current SPRS score and, where applicable, the CMMC Level 2 Plan of Action and Milestones be included within the five-page Solution Brief, or may they be submitted as separate administrative attachments?

SEPARATE ADMINISTRATIVE ATTACHEMENTS

11. Controlled hardware and data at external facilities.

Does the Government anticipate that CUI, CTI, export-controlled hardware, or other restricted material may need to be processed at approved subcontractor or specialized laboratory facilities?

YES

If so, will the applicable handling, facility, personnel, and data-environment requirements be defined at the task-order level?

YES

12. Submission mechanics.

Please confirm the required electronic submission method, acceptable file format, maximum file size, and whether the Solution Brief, intellectual-property statement, cybersecurity documentation, and OCI analysis should be submitted as one consolidated file or as separate attachments.

DOD-SAFE, ADOBE PDF, SINGLE FILE TRANSFER (8GB & 25 FILES MAXIMUM),

SEPARATE ATTACHMENTS