Specs 8 of 10.pdf

Improve Potable Water Distribution System Project No. 528A4-16-205 Construction Documents VA Medical Center, Batavia, NY 06-08-2022

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SECTION 27 05 26

GROUNDING AND BONDING FOR COMMUNICATIONS SYSTEMS

PART 1 - GENERAL

1.1 DESCRIPTION

A. This section identifies common and general grounding and bonding requirements of communication installations and applies to all sections of Divisions 27.

1.2 RELATED WORK (NOT USED)

1.3 SUBMITTALS

A. Submit in accordance with all communication installation requirements.

B. Provide plan indicating location of system grounding electrode connections and routing of aboveground and underground grounding electrode conductors.

C. Provide the following close out submittals:

1. Certified test reports of ground resistance.

2. Certifications: Two weeks prior to final inspection, submit following to COR:

a. Certification materials and installation is in accordance with construction documents.

b. Certification complete installation has been installed and tested.

PART 2 - PRODUCTS

2.1 COMPONENTS

A. Grounding and Bonding Conductors:

1. Provide UL 83 insulated stranded copper equipment grounding conductors, with the exception of solid copper conductors for sizes

6 mm² (10 AWG) and smaller. Identify all grounding conductors with continuous green insulation color, except identify wire sizes 25 mm²

(4 AWG) and larger per NEC.

2. Provide ASTM B8 bare stranded copper bonding conductors, with the exception of ASTM B1 solid bare copper for wire sizes 6 mm² (10 AWG) and smaller.

B. Splices and Termination Components: Provide components meeting or exceeding UL 467 and clearly marked with manufacturer’s name, catalog number, and permitted conductor sizes.

C. Telecommunication System Ground Busbars:

1. Telecommunications Grounding Busbar (TGB):

a. 6.4 mm (1/4 inch) thick solid copper bar.

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b. Minimum 50 mm (2 inches) high and length sized in accordance application requirements and future growth of minimum 300 mm long

(12 inches) long.

c. Minimum nine predrilled attachment points (one row) for attaching standard sized two-hole grounding lugs.

1) 6 lugs with 15.8 mm (5/8 inch) hole centers.

2) 3 lugs with 25.4 mm (1 inch) hole centers.

d. Wall-mount stand-off brackets, assembly screws and insulators for 100 mm (4 inches) standoff from wall.

e. Listed as grounding and bonding equipment.

D. Ground Terminal Blocks: Provide screw lug-type terminal blocks at equipment mounting location (e.g. backboards and hinged cover enclosures) where rack-type ground bars cannot be mounted.

1. Electroplated tin aluminum extrusion.

2. Accept conductors ranging from #14 AWG through 2/0.

3. Hold conductors in place by two stainless steel set screws.

4. Two 6 mm (1/4 inch) holes spaced on 15.8 mm (5/8 inch) centers to allow secure two-bolt attachment.

5. Listed as a wire connector.

E. Splice Case Ground Accessories: Provide splice case grounding and bonding accessories manufactured by splice case manufacturer when available. Otherwise, use 16 mm² (6 AWG) insulated ground wire with shield bonding connectors.

F. Irreversible Compression Lugs:

1. Electroplated tinned copper.

2. Two holes spaced on 15.8 mm (5/8 inch) or 25.4 mm (1 inch) centers.

3. Sized to fit the specific size conductor.

4. Listed as wire connectors.

G. Antioxidant Joint Compound: Oxide inhibiting joint compound for copper-to-copper, aluminum-to-aluminum or aluminum-to-copper connections.

PART 3 - EXECUTION

3.1 EQUIPMENT INSTALLATION AND REQUIREMENTS

A. Install telecommunications bonding backbone conductor throughout building via telecommunications backbone pathways effectively bonding all interior telecommunications grounding busbars in telecommunications rooms, to telecommunications main grounding busbar in Demarc room after testing bond to verify bonding conductor for telecommunications from

27 05 26 - 3 grounding electrode conductor is installed per NEC. Size telecommunications bonding backbone conductor as specified in TIA-607-B.

B. Inaccessible Grounding Connections: Utilize exothermic welding for bonding of buried or otherwise inaccessible connections with the exception of connections requiring periodic testing.

C. Conduit Systems:

1. Bond ferrous metallic conduit to ground.

2. Bond grounding conductors installed in ferrous metallic conduit at both ends of conduit using grounding bushing with #6 AWG conductor.

D. Boxes, Cabinets, and Enclosures:

1. Bond each pull box, splice box, equipment cabinet, and other enclosures through which conductors pass (except for special grounding systems for intensive care units and other critical units shown) to ground.

E. Corrosion Inhibitors: Apply corrosion inhibitor for protecting connection between metals used to contact surfaces, when making ground and ground bonding connections.

F. Telecommunications Grounding System:

1. Bond telecommunications grounding systems and equipment to facility’s electrical grounding electrode at Intersystem Bonding

Termination.

2. Provide hardware as required to effectively bond metallic cable shields communications pathways, cable runway, and equipment chassis to ground.

3. Install bonding conductors without splices using shortest length of conductor possible to maintain clearances required by NEC.

4. Provide paths to ground that are permanent and continuous with a resistance of 1 ohm or less from each raceway, cable tray, and equipment connection to telecommunications grounding busbar.

5. Above-Grade Bolted or Screwed Grounding Connections:

a. Remove paint to expose entire contact surface by grinding.

b. Clean all connector, plate and contact surfaces.

c. Apply corrosion inhibitor to surfaces before joining.

6. Bonding Jumpers:

a. Assemble bonding jumpers using insulated ground wire of size and type shown on drawings or use a minimum of 16 mm² (6 AWG)

27 05 26 - 4 insulated copper wire terminated with compression connectors of proper size for conductors.

b. Use connector manufacturer’s compression tool.

7. Bonding Jumper Fasteners:

a. Conduit: Connect bonding jumpers using lugs on grounding bushings or clamp pads on push-type conduit fasteners. Where appropriate, use zinc-plated external tooth lockwashers or Belleville Washers.

b. Wireway and Cable Tray: Fasten bonding jumpers using zinc-plated bolts, external tooth lockwashers or Belleville washers and nuts.

Install protective cover, e.g., zinc-plated acorn nuts, on bolts extending into wireway or cable tray to prevent cable damage.

c. Grounding Busbars: Fasten bonding conductors using two-hole compression lugs. Use 300 series stainless steel bolts, Belleville Washers, and nuts.

d. Slotted Channel Framing and Raised Floor Stringers: Fasten bonding jumpers using zinc-plated, self-drill screws and

Belleville washers or external tooth lock washers.

G. Communications Cable Grounding:

1. Bond all metallic cable sheaths in multi-pair communications cables together at each splicing or terminating location to provide 100 percent metallic sheath continuity throughout communications distribution system.

2. Install a cable shield bonding connector with a screw stud connection for ground wire, at terminal points. Bond cable shield connector to ground.

3. Bond all metallic cable shields together within splice closures using cable shield bonding connectors or splice case manufacturer’s splice case grounding and bonding accessories. When an external ground connection is provided as part of splice closure, connect to an effective ground source and bond all other metallic components and equipment at that location.

H. Communications Raceway Grounding:

1. Conduit: Use insulated 16 mm² (6 AWG) bonding jumpers to bond metallic conduit at both ends and intermediate metallic enclosures to ground.

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I. Ground Resistance:

1. Install telecommunications grounding system so resistance to grounding electrode system measures 5 ohms or less.

2. Measure grounding electrode system resistance using an earth test meter, clamp-on ground tester, or computer-based ground meter as defined in IEEE 81. Record ground resistance measurements before electrical distribution system is energized.

3. Backfill only after below-grade connection have been visually inspected by COR. Notify COR twenty-four hours before below-grade connections are ready for inspection.

3.2 FIELD QUALITY CONTROL

A. Perform tests per BICSI’s Information Technology Systems Installation

Methods Manual (ITSIMM), Recommended Testing Procedures and Criteria.

B. Perform two-point bond test using trained installers qualified to use test equipment.

C. Conduct continuity test to verify that metallic pathways in telecommunications spaces are bonded to TGB or TMGB.

D. Conduct electrical continuity test to verify that TMGB is effectively bonded to grounding electrode conductor.

E. Visually inspect to verify that screened and shielded cables are bonded to TGB or TMGB.

F. Perform a resistance test to ensure patch panel, rack and cabinet bonding connection resistance measures less than 5 Ohms to TGB or TMGB.

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