17R0028_App4_Mitsui_Compound_Conduit_Diagram.pdf

PDF 90 KB Posted

Attached to
Internet and IP Telephone project for US Embassy Tokyo, Japan
Solicitation number
SGE50017R0028
Issued by

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Appendix 4 to SGE50017R0028

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Other files

File Type Posted
SGE50017R0028_A001.pdf PDF
17R0028_Pre-Proposal_Notice_without_signature.pdf PDF
Solicitation_SGE50017R0028_(02-01-2017).pdf PDF
17R0028_SOW_Mitsui_Compound_Telecommunications_Infrastructure.pdf PDF
17R0028_App1_Mitsui_Compound_Telecommunication_Closet_and_Fiber_Runs.pdf PDF
17R0028_App5_Safety_Plan_template.docx DOCX document
17R0028_App2_Mitsui_Compound_Fiber_Optic_Installation_Locations.pdf PDF
17R0028_App3__Existing_Mitsui_Compound_Tower_Riser_Diagram.pdf PDF

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Mitsui Housing Compound Internet & Telephone Backbone Installation Project

Appendix 4: Mitsui Compound Conduit Diagram

Embassy of the United States of America Tokyo

Existing distribution systems to re-use

Mitsui Housing Compound Internet & Telephone Backbone Installation Project
Existing distribution systems to re-use

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