Att_1_Performance_Specification_amd2.xls

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Synchro Resolver VXI modules and Secondary Chassis Panel Assemblies
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Introduction

PERFORMANCE SPECIFICATION
FOR THE
THIRD ECHELON TEST SET (TETS)
MARCORSYSCOM-PD-02-001
1-Dec-03
Marine Corps Systems Command (MARCORSYSCOM PST)
Quantico, Virginia 22134-5080
1SCOPE
1.1Identification.
This Performance Specification (PS) identifies and establishes the minimum requirements for the Third Echelon Test Set (TETS). The purpose of the TETS is to provide a portable test capability for multi-role operations. The TETS shall be integrated using Open System Architecture (OSA) modular instrument technology, making the maximum use possible of Commercial Off-The-Shelf (COTS), modified COTS, or Non-Developmental Item (NDI) equipment.
The TETS has three primary roles:
a. Line Replaceable Unit (LRU) Testing. The TETS will have the capability to test, diagnose, and screen electronic and electro-mechanical LRU's to the faulty Secondary Reparable (SECREP) and/or Circuit Card Assembly (CCA) for a wide variety of weapon systems/equipment near the Forward Edge of the Battle Area (FEBA). This function will be performed from the tailgate of a High Mobility Multipurpose Wheeled Vehicle (HMMWV). The TETS will also provide LRU fault detection/verification and fault isolation capabilities at Intermediate Maintenance Activities (IMA) and shops.
b. CCA/SECREP Screening. The TETS will have the capability to screen electronic and electro-mechanical CCA's for a wide variety of weapon systems/equipment near the FEBA. This function will be performed from the tailgate of a HMMWV and at the IMA. This level of test will provide fault detection of CCA/SECREP containing analog, hybrid, and digital technologies for weapon systems and equipment that do not have an LRU type configuration. It will also be used where the fault ambiguity in the LRU cannot be resolved down to a single CCA.
c. The TETS must also function as Stand-Alone GPETE. This allows the operator to maximize the usage of all test assets available in TETS. The functions of a Digital Multimeter (DMM), Counter/Timer, Function Generator (FG), Digitizing Oscilloscope, and other test assets as specified in the PS will be available on a non-test program control basis, which will allow the operator to select the stim/response of the individual instrument. Software will allow the user to easily access each test asset, viewable on the display of the Instrument Controller (IC) as a "virtual instrument". This role will be available to the operator on or near the rear of a HMMWV and at IMA facilities.
Document Overview. The TETS is identified, described, and specified within this document in five major sections.
1.2
a. Section 1, Scope, provides identification and a brief description of the purpose of TETS and this PS's overview
b. Section 2, Referenced Documents, lists, by document number and title, all documents that form a part of this PS or are referenced by this PS.
c. Section 3, Requirements, identifies the functional requirements of TETS.
d. Section 4, Quality Assurance Provisions, identifies the testing requirements to ensure compliance of all functional requirements defined in Section 3.
e. Section 5, Notes, provides general information that may aid in the understanding of this document.
2.0APPLICABLE DOCUMENTS
2.1Government Documents
The following documents of the exact issue shown form a part of this document to the extent specified herein. In the event of conflict between the documents referenced herein and the contents of this PS, the contents of this PS shall take precedence.
2.1.1Specifications - Mandatory
MIL-PRF-28800FPerformance Specification Test Equipment for use with Electrical and Electronic Equipment General Specification for
MIL-STD-1472Department of Defense Design Criteria Standard
2.1.2Standards - Mandatory
MIL-STD-461ERequirements for the control of Electromagnetic Interference Characteristics of Subsystems and Equipment
MIL-STD-810F(3)Environmental Engineering Considerations and Laboratory Tests
MIL-STD-1553BDigital Time Division Command/Response Multiplex Data Bus
MIL-STD-188-220CInterface Standard Digital Message Transfer Device Subsystems (SP-TCIM)
MIL-STD-1472F(1)Human Engineering
2.1.3Standards - Guidance Only
MIL-HDBK-454AGeneral Guidelines for Electronic Equipment
MIL-HDBK-470ADesigning and Developing Maintainable Products and Systems
MIL-HDBK-1857Grounding, Bonding, and Shielding Design Practices
2.2Other Publications/Documents
The following documents of the exact issue shown form a part of this PS to the extent specified herein. In the event of conflict between the documents referenced herein and the contents of this PS, the contents of this document shall take precedence
2.2.1Specifications - Mandatory
IEEE-STD-716-1989IEEE Standard Common Abbreviated Test Language for All Systems (C/ATLAS)
IEEE-STD-488.1-1987IEEE Standard Digital Interface for Programmable Instrumentation
IEEE-STD-488.2-1987IEEE Standard Codes, Formats, Protocols and Common Commands
IEEE-STD-1155-1992VMEbus Extensions for Instrumentation: (VXIbus)
VXI-6Mainframe Extender Specification VXI-6, Revision 1.0
Multisystem Extension Interface (MXI)busMXIbus Specification Revision 1.2
Multisystem Extension Interface(MXI)busMXIbus Specification Revision 2.0
Modular Measurement System (MMS)MMS System Specifications Revision 1.0
ISO 9660Information Processing - Volume and File Structure of CD-ROM for Information Exchange, 1st Edition
ISO 9660 and "High Sierra"
IPC/EIA J-STD-001CRequirements for Soldered Electrical & Electronic Assemblies
IEEE-STD-802.3ABPhysical Layer Parameters & Specifications for 1000 Base-T
IEEE-STD-802.1QVirtual Bridged Local Area Network
ANSI-INCITS-248 1996Fiber Distributed Data Interface (FDDI)
ISO-11898Road Vehicles - Interchange of Digital Information - Controller Area Network for High-Speed Communication
EIA-232DInterface Between Data Terminal and Data
EIA-422AElectrical Characteristics of Balanced Voltage Digital Interface Circuits
EIA-485Electrical Characteristics of Generators and Receivers
EIA-170Electrical Performance Standards Monochrome Television Studio Facilities
EIA-343AElectrical Performance for High Resolution Monochrome Closed Circuit Television Camera
2.2.2Specifications - Guidance
IEEE/EIA 12207.0Software Life Cycle Processes
2.3Definitions
2.3.1Commercial Off The Shelf (COTS)
Items of equipment which can be purchased through commercial retail or wholesale distributors as is (for example, equipment that is available as a cataloged item).
2.3.2Modified COTS
COTS equipment that has been customized to meet functional requirements
2.3.3Non-developmental Items (NDI)
NDI equipment can be COTS, ruggedized or militarized. NDI shall be defined as any of the following:
a. Item of supply that is available in the commercial marketplace.
b. Previously developed item of supply that is in use by a department or agency of the United States, a state or local Government, or a foreign Government with which the United States has a mutual defense cooperation agreement.
c. Item described above that requires only minor modification to meet the procuring agency's requirements.
d. Item currently being produced that does not meet the above requirements solely because it is not yet in use, or not yet available in the commercial marketplace (section 907 of the Defense Acquisition Improvement Act of 1986).
2.3.4Objective and Threshold
Objectives and thresholds have been provided which define the Government's operational requirements. In those instances where both an objective and threshold characteristic are not specified, the objective characteristic is the threshold.
a. Objective is the desired operational characteristic or goal of the Government.
b. Threshold is the minimum operational characteristic or goal the Government will accept for compliance with this PS.
2.3.5Open System Architecture (OSA
OSA is the design approach whereby hardware/software are designed to non-proprietary standards to allow interfacing of components and systems manufactured by multiple vendors.

Contents

TABLE OF CONTENTS
3. REQUIREMENTS.
3.2 Design and Construction.
3.2.1 Operational Environment.
3.2.2 Electromagnetic Radiation.
3.2.3 Identification and Marking.
3.2.4 Workmanship.
3.2.4.1 Soldered Electrical/Electronic Assemblies.
3.2.5 Interchangeability
3.2.6 Safety
3.2.7 Human Performance/Human Engineering.
3.3 TETS Characteristics.
3.3.1 Size.
3.3.2 Weight.
3.3.3 Color.
3.3.4 Transportability Characteristics.
3.3.5 Handles.
3.3.6 Transit/Storage Case Structure
3.3.7 System Set-Up.
3.4 Hardware Performance Characteristics.
3.4.1 Power Distribution Unit (PDU)
3.4.1.1 Instrument Chassis Power Input.
3.4.1.2 Conversion Efficiency.
3.4.1.3 Power Protection.
3.4.1.4 Power Monitoring.
3.4.1.5 Power Status.
3.4.1.6 EO Power Connection.
3.4.1.7 Instrument Chassis Power Output.
3.4.1.8 Ten Programmable Power Sources.
3.4.1.9 PDU ON/OFF Switch and Indication.
3.4.1.10 Emergency Power Shutdown.
3.4.1.11 Physical Characteristics.
3.4.1.12 PDU to Receiver Interfacing.
3.4.2 Instrument Controller (IC).
3.4.2.1 Instrument Controller Power.
3.4.2.2 Replaceability.
3.4.2.3 MultiSystem Extension (MXI) Interface.
3.4.3 Instrument Chassis Functional Definition.
3.4.3.1 Instrument Chassis Ventilation Characteristics.
3.4.3.2 Power Cable.
3.4.3.3 Input Power Switch.
3.4.3.4 Protection Circuitry.
3.4.3.5 Receiver Interface.
3.4.3.6 The MXI Interface.
3.4.4 DMM Functional Definition.
3.4.4.1 Math Measurement Functions.
3.4.4.2 DC Voltage.
3.4.4.3 DC Voltage Ratio.
3.4.4.4 DC Current.
3.4.4.5 AC Voltage.
3.4.4.6 AC Current.
3.4.4.7 Resistance.
3.4.4.8 Frequency and Period.
3.4.4.9 The DMM Inputs.
3.4.4.10 Outputs.
3.4.5 Counter/Timer Functional Definition.
3.4.5.1 General Characteristics for Input 1 and Input 2.
3.4.5.2 Frequency Measurement.
3.4.5.3 Period Measurement.
3.4.5.4 Frequency Ratio Measurement.
3.4.5.5 Phase Measurement.
3.4.5.6 Rise and Fall Time Measurement.
3.4.5.7 Positive and Negative Pulse Width.
3.4.5.8 Totalize (Events Count).
3.4.5.9 Time Interval.
3.4.5.10 Timebase.
3.4.5.11 100 Gate Average Mode.
3.4.5.12 Input 1 and Input 2 Triggering Characteristics.
3.4.5.13 Arm In.
3.4.5.14 VXI Bus TTL Triggers 0 - 7 Input.
3.4.5.15 Internal/External Reference Input.
3.4.5.16 Internal/External Reference Output.
3.4.5.17 VXI Bus TTL Triggers 0 - 7 Output.
3.4.5.18 Simultaneous Operations.
3.4.6 Digitizing Oscilloscope Functional Definition.
3.4.6.1 General Characteristics for Input 1 and Input 2.
3.4.6.2 Vertical Characteristics for Input 1 and Input 2.
3.4.6.3 Horizontal Characteristics for Input 1 and Input 2.
3.4.6.4 Triggering Characteristics for Input 1 and Input 2.
3.4.6.5 Inputs.
3.4.6.6 Outputs.
3.4.6.7 Waveform Memory.
3.4.6.8 Shared RAM.
3.4.6.9 Digitizing Mode (Repetitive).
3.4.6.10 Digitizing Mode (Single Shot).
3.4.6.11 Digitizing Mode Sampling Rate.
3.4.6.12 Digitizing Mode Record Length.
3.4.6.13 Digitizing Mode Triggering.
3.4.6.14 Digitizing Mode Sensitivity (Internal and External).
3.4.6.15 Digitizing Mode Shared RAM
3.4.6.16 Digitizing Mode Input Coupling.
3.4.6.17 Digitizing Mode Vertical Resolution.
3.4.6.18 Digitizing Mode Waveform Processing.
3.4.6.19 Digitizing Mode Waveform Datum Analysis.
3.4.6.20 Digitizing Mode Waveform Built In Analysis.
3.4.6.21 Simultaneous Operations.
3.4.7 Function Generator (FG) Functional Definition.
3.4.7.1 General Amplitude Characteristics.
3.4.7.2 Sine Wave Amplitude Characteristics.
3.4.7.3 Square Wave Amplitude Characteristics.
3.4.7.4 DC Voltage Amplitude Range.
3.4.7.5 DC Offset Characteristics.
3.4.7.6 Output Filter Selection.
3.4.7.7 General Frequency Characteristics.
3.4.7.8 Adjustable Parameters.
3.4.7.9 Outputs.
3.4.7.10 Inputs.
3.4.7.11 Memory Characteristics.
3.4.7.12 Simultaneous Operations.
3.4.8 Arbitrary Waveform Generator (ARB) Functional Definition.
3.4.8.1 General Amplitude Characteristics.
3.4.8.2 Sine Wave (Built-in) Amplitude Characteristics.
3.4.8.3 Square, Triangle and Ramp Wave
3.4.8.4 DC Offset Amplitude Characteristics.
3.4.8.5 DC Volt Function Amplitude Characteristics.
3.4.8.6 Output Filter Selection.
3.4.8.7 General Frequency Accuracy.
3.4.8.8 Sine Wave (Built-in) Frequency Characteristics.
3.4.8.9 Square Wave (Built-in) Frequency Characteristics.
3.4.8.10 Triangle and Ramp Wave
3.4.8.11 Arbitrary Wave Frequency Characteristics.
3.4.8.12 Frequency Agility Characteristics.
3.4.8.13 General Arbitrary Wave Capability.
3.4.8.14 Arbitrary Wave Capability (Sine).
3.4.8.15 Arbitrary Wave Capability (Square).
3.4.8.16 Arbitrary Wave Capability (Ramp).
3.4.8.17 Arbitrary Waveform Memory.
3.4.8.18 Sequence Memory.
3.4.8.19 Primary Output
3.4.8.20 Divide by 7 Output.
3.4.8.21 Marker Output Functions.
3.4.8.22 VXI Bus ECL Triggers 0 and 1.
3.4.8.23 All User Inputs.
3.4.8.24 Ref/Sample In Functions.
3.4.8.25 Start Arm In.
3.4.8.26 Stop Trig/FSK/Gate In.
3.4.8.27 VXI Bus ECL Triggers 0 and 1 Functions.
3.4.8.28 VXI Bus TTL Triggers 0 to 7 Functions.
3.4.8.29 Digital Port In.
3.4.9 Analog Probe.
3.4.9.1 Simultaneous Operations.
3.4.10 Digital Test Subsystem (DTS) Functional Definition.
3.4.10.1 Digital Test System Hardware Requirements.
3.4.10.2 Fault Detection Capabilities.
3.4.10.3 The Digital Test System User Clock.
3.4.10.4 Digital Test Capabilities.
3.4.10.5 Digital Relay Driver Requirements.
3.4.10.6 Digital Probe Capabilities.
3.4.10.7 Simultaneous Operations.
3.4.11 TETS Switching Functional Definition.
3.4.11.1 Switch Control.
3.4.11.2 DC Power Switches.
3.4.11.3 2 by 24, Dual Wire Switch Matrix.
3.4.11.4 1 by 1, Relay Switches.
3.4.11.5 1 by 4, Low Frequency Switches.
3.4.11.6 2 by 8, Low Frequency Switches.
3.4.11.7 1 by 2, Low Frequency Switches.
3.4.11.8 1 by 24, Dual Wire Low Frequency Switches.
3.4.11.9 1 by 8, Medium Frequency Switches.
3.4.11.10 RF Switches.
3.4.12 RF Functional Definition.
3.4.12.1 RF Stimulus Function.
3.4.12.2 RF Measurement Functions.
3.4.13 Stand Alone Instrument Fixture.
3.4.14 Self-Test Fixture.
3.4.15 System Calibration Fixture.
3.4.16 Bus Control and Monitoring.
3.4.16.1 Dual Port Modular Interface Connector (MIC).
3.4.16.2 Fiber Distributed Data Interface (FDDI).
3.4.16.3 Controller Area Network II (CAN II).
3.4.16.4 (SP-TCIM).
3.4.16.5 Giga-bit Ethernet.
3.4.16.6 MIL-STD-1553B Bus Interface.
3.4.16.7 EIA-232 Bus Interface.
3.4.16.8 EIA-422 Bus Interface.
3.4.16.9 RS-485 Bus Interface.
3.4.17 SRS (Synchro/Resolver Simulator).
3.4.18 Laser Modules.
3.4.18.1 Laser Safety.
3.4.19 Video Display.
3.4.20 Modes of Operation.
3.4.21 System Frequency Spectrum Capability.
3.4.22 Aperture Size.
3.4.23 Tripod.
3.4.24 Collimator.
3.4.25 EO Variant Functional Definition.
3.4.25.1 Power.
3.4.25.2 GPIB Cable.
3.4.25.3 EO Variant Instrument Controller (IC).
3.4.26 EO Variant Electro-Optical Functional Test Definition.
3.4.26.1 FLIR (Forward Looking Infrared) Test Requirements.
3.4.26.2 Laser Range Finder/Designator (LRF/D) Test Requirements.
3.4.26.3 Visible TV Test Requirements.
3.4.26.4 Direct View Optics (DVO) Test Requirements.
3.5 Software Performance Characteristics.
3.5.1 Operating System Software.
3.5.2 Startup Sequence Software.
3.5.3 Instrument Driver Software.
3.5.4 System Monitor Software.
3.5.4.1 Emergency Shutdown.
3.5.4.2 Warning Conditions.
3.5.4.3 Status Monitoring.
3.5.4.4 Receiver Interface ITA Interlock Monitoring.
3.5.5 System Menu Software.
3.5.6 Stand Alone Instrument Software (SAIS).
3.5.7 Fault History Database (FHDB) Software.
3.5.8 TPS Development Software (TPSDS).
3.5.8.1 ATLAS Software.
3.5.8.2 Digital Software.
3.5.9 System Confidence Test Software.
3.5.10 System Self-Test Software.
3.5.11 System Calibration Software.
3.5.12 Run-Time System (RTS) Software.
3.5.13 IETM Software.
3.5.14 Distance Support Software.
3.6 Reliability.
3.7 Maintainability.

3. REQUIREMENTS.

3.2 Design and Construction.

3.2.1 Operational Environment.

3.2.2 Electromagnetic Radiation.

3.2.3 Identification and Marking.

3.2.4 Workmanship.

3.2.4.1 Soldered Electrical/Electronic Assemblies.

3.2.5 Interchangeability

3.2.6 Safety

3.2.7 Human Performance/Human Engineering.

3.3 TETS Characteristics.

3.3.1 Size.

3.3.2 Weight.

3.3.3 Color.

3.3.4 Transportability Characteristics.

3.3.5 Handles.

3.3.6 Transit/Storage Case Structure

3.3.7 System Set-Up.

3.4 Hardware Performance Characteristics.

3.4.1 Power Distribution Unit (PDU)

3.4.1.1 Instrument Chassis Power Input.

3.4.1.2 Conversion Efficiency.

3.4.1.3 Power Protection.

3.4.1.4 Power Monitoring.

3.4.1.5 Power Status.

3.4.1.6 EO Power Connection.

3.4.1.7 Instrument Chassis Power Output.

3.4.1.8 Ten Programmable Power Sources.

3.4.1.9 PDU ON/OFF Switch and Indication.

3.4.1.10 Emergency Power Shutdown.

3.4.1.11 Physical Characteristics.

3.4.1.12 PDU to Receiver Interfacing.

3.4.2 Instrument Controller (IC).

3.4.2.1 Instrument Controller Power.

3.4.2.2 Replaceability.

3.4.2.3 MultiSystem Extension (MXI) Interface.

3.4.3 Instrument Chassis Functional Definition.

3.4.3.1 Instrument Chassis Ventilation Characteristics.

3.4.3.2 Power Cable.

3.4.3.3 Input Power Switch.

3.4.3.4 Protection Circuitry.

3.4.3.5 Receiver Interface.

3.4.3.6 The MXI Interface.

3.4.4 DMM Functional Definition.

3.4.4.1 Math Measurement Functions.

3.4.4.2 DC Voltage.

3.4.4.3 DC Voltage Ratio.

3.4.4.4 DC Current.

3.4.4.5 AC Voltage.

3.4.4.6 AC Current.

3.4.4.7 Resistance.

3.4.4.8 Frequency and Period.

3.4.4.9 The DMM Inputs.

3.4.4.10 Outputs.

3.4.5 Counter/Timer Functional Definition.

3.4.5.1 General Characteristics for Input 1 and Input 2.

3.4.5.2 Frequency Measurement.

3.4.5.3 Period Measurement.

3.4.5.4 Frequency Ratio Measurement.

3.4.5.5 Phase Measurement.

3.4.5.6 Rise and Fall Time Measurement.

3.4.5.7 Positive and Negative Pulse Width.

3.4.5.8 Totalize (Events Count).

3.4.5.9 Time Interval.

3.4.5.10 Timebase.

3.4.5.11 100 Gate Average Mode.

3.4.5.12 Input 1 and Input 2 Triggering Characteristics.

3.4.5.13 Arm In.

3.4.5.14 VXI Bus TTL Triggers 0 - 7 Input.

3.4.5.15 Internal/External Reference Input.

3.4.5.16 Internal/External Reference Output.

3.4.5.17 VXI Bus TTL Triggers 0 - 7 Output.

3.4.5.18 Simultaneous Operations.

3.4.6 Digitizing Oscilloscope Functional Definition.

3.4.6.1 General Characteristics for Input 1 and Input 2.

3.4.6.2 Vertical Characteristics for Input 1 and Input 2.

3.4.6.3 Horizontal Characteristics for Input 1 and Input 2.

3.4.6.4 Triggering Characteristics for Input 1 and Input 2.

3.4.6.5 Inputs.

3.4.6.6 Outputs.

3.4.6.7 Waveform Memory.

3.4.6.8 Shared RAM.

3.4.6.9 Digitizing Mode (Repetitive).

3.4.6.10 Digitizing Mode (Single Shot).

3.4.6.11 Digitizing Mode Sampling Rate.

3.4.6.12 Digitizing Mode Record Length.

3.4.6.13 Digitizing Mode Triggering.

3.4.6.14 Digitizing Mode Sensitivity (Internal and External).

3.4.6.15 Digitizing Mode Shared RAM

3.4.6.16 Digitizing Mode Input Coupling.

3.4.6.17 Digitizing Mode Vertical Resolution.

3.4.6.18 Digitizing Mode Waveform Processing.

3.4.6.19 Digitizing Mode Waveform Datum Analysis.

3.4.6.20 Digitizing Mode Waveform Built In Analysis.

3.4.6.21 Simultaneous Operations.

3.4.7 Function Generator (FG) Functional Definition.

3.4.7.1 General Amplitude Characteristics.

3.4.7.2 Sine Wave Amplitude Characteristics.

3.4.7.3 Square Wave Amplitude Characteristics.

3.4.7.4 DC Voltage Amplitude Range.

3.4.7.5 DC Offset Characteristics.

3.4.7.6 Output Filter Selection.

3.4.7.7 General Frequency Characteristics.

3.4.7.8 Adjustable Parameters.

3.4.7.9 Outputs.

3.4.7.10 Inputs.

3.4.7.11 Memory Characteristics.

3.4.7.12 Simultaneous Operations.

3.4.8 Arbitrary Waveform Generator (ARB) Functional Definition.

3.4.8.1 General Amplitude Characteristics.

3.4.8.2 Sine Wave (Built-in) Amplitude Characteristics.

3.4.8.3 Square, Triangle and Ramp Wave

3.4.8.4 DC Offset Amplitude Characteristics.

3.4.8.5 DC Volt Function Amplitude Characteristics.

3.4.8.6 Output Filter Selection.

3.4.8.7 General Frequency Accuracy.

3.4.8.8 Sine Wave (Built-in) Frequency Characteristics.

3.4.8.9 Square Wave (Built-in) Frequency Characteristics.

3.4.8.10 Triangle and Ramp Wave

3.4.8.11 Arbitrary Wave Frequency Characteristics.

3.4.8.12 Frequency Agility Characteristics.

3.4.8.13 General Arbitrary Wave Capability.

3.4.8.14 Arbitrary Wave Capability (Sine).

3.4.8.15 Arbitrary Wave Capability (Square).

3.4.8.16 Arbitrary Wave Capability (Ramp).

3.4.8.17 Arbitrary Waveform Memory.

3.4.8.18 Sequence Memory.

3.4.8.20 Divide by 7 Output.

3.4.8.21 Marker Output Functions.

3.4.8.22 VXI Bus ECL Triggers 0 and 1.

3.4.8.23 All User Inputs.

3.4.8.24 Ref/Sample In Functions.

3.4.8.25 Start Arm In.

3.4.8.26 Stop Trig/FSK/Gate In.

3.4.8.27 VXI Bus ECL Triggers 0 and 1 Functions.

3.4.8.28 VXI Bus TTL Triggers 0 to 7 Functions.

3.4.8.29 Digital Port In.

3.4.9 Analog Probe.

3.4.9.1 Simultaneous Operations.

3.4.10 Digital Test Subsystem (DTS) Functional Definition.

3.4.10.1 Digital Test System Hardware Requirements.

3.4.10.2 Fault Detection Capabilities.

3.4.10.3 The Digital Test System User Clock.

3.4.10.4 Digital Test Capabilities.

3.4.10.5 Digital Relay Driver Requirements.

3.4.10.6 Digital Probe Capabilities.

3.4.10.7 Simultaneous Operations.

3.4.11 TETS Switching Functional Definition.

3.4.11.1 Switch Control.

3.4.11.2 DC Power Switches.

3.4.11.3 2 by 24, Dual Wire Switch Matrix.

3.4.11.4 1 by 1, Relay Switches.

3.4.11.5 1 by 4, Low Frequency Switches.

3.4.11.6 2 by 8, Low Frequency Switches.

3.4.11.7 1 by 2, Low Frequency Switches.

3.4.11.8 1 by 24, Dual Wire Low Frequency Switches.

3.4.11.9 1 by 8, Medium Frequency Switches.

3.4.11.10 RF Switches.

3.4.12 RF Functional Definition.

3.4.12.1 RF Stimulus Function.

3.4.12.2 RF Measurement Functions.

3.4.13 Stand Alone Instrument Fixture.

3.4.14 Self-Test Fixture.

3.4.15 System Calibration Fixture.

3.4.16 Bus Control and Monitoring.

3.4.16.1 Dual Port Modular Interface Connector (MIC).

3.4.16.2 Fiber Distributed Data Interface (FDDI).

3.4.16.3 Controller Area Network II (CAN II).

3.4.16.4 (SP-TCIM).

3.4.16.5 Giga-bit Ethernet.

3.4.16.6 MIL-STD-1553B Bus Interface.

3.4.16.7 EIA-232 Bus Interface.

3.4.16.8 EIA-422 Bus Interface.

3.4.16.9 RS-485 Bus Interface.

3.4.17 SRS (Synchro/Resolver Simulator).

3.4.18 Laser Modules.

3.4.18.1 Laser Safety.

3.4.19 Video Display.

3.4.20 Modes of Operation.

3.4.21 System Frequency Spectrum Capability.

3.4.22 Aperture Size.

3.4.23 Tripod.

3.4.24 Collimator.

3.4.25 EO Variant Functional Definition.

3.4.25.1 Power.

3.4.25.2 GPIB Cable.

3.4.25.3 EO Variant Instrument Controller (IC).

3.4.26 EO Variant Electro-Optical Functional Test Definition.

3.4.26.1 FLIR (Forward Looking Infrared) Test Requirements.

3.4.26.2 Laser Range Finder/Designator (LRF/D) Test Requirements.

3.4.26.3 Visible TV Test Requirements.

3.4.26.4 Direct View Optics (DVO) Test Requirements.

3.5 Software Performance Characteristics.

3.5.1 Operating System Software.

3.5.2 Startup Sequence Software.

3.5.3 Instrument Driver Software.

3.5.4 System Monitor Software.

3.5.4.1 Emergency Shutdown.

3.5.4.2 Warning Conditions.

3.5.4.3 Status Monitoring.

3.5.4.4 Receiver Interface ITA Interlock Monitoring.

3.5.5 System Menu Software.

3.5.6 Stand Alone Instrument Software (SAIS).

3.5.7 Fault History Database (FHDB) Software.

3.5.8 TPS Development Software (TPSDS).

3.5.8.1 ATLAS Software.

3.5.8.2 Digital Software.

3.5.9 System Confidence Test Software.

3.5.10 System Self-Test Software.

3.5.11 System Calibration Software.

3.5.12 Run-Time System (RTS) Software.

3.5.13 IETM Software.

3.5.14 Distance Support Software.

3.6 Reliability.

3.7 Maintainability.

3.4.8.19 Primary Output

RVTM

REQUIREMENTSREQUIREMENTSMOFFERORS SPEC/COMMENTSOFFERORS SPEC/COMMENTSWHERE REQUIREMENT IS FOUND IN OFFEROR'S PROPOSALMEETEXCEEDNOT METGOVERNMENT USE
3. REQUIREMENTS. The requirements for TETS will comply with the following:
3.1 System Architecture. The system architecture for TETS will comply with the following:
a. The TETS shallbe integrated using Open System Architecture (OSA) modular instrument technology.
b. TETS shallmake the maximum use possible of COTS, modified COTS, or NDI equipment.
c. The objective for the TETS architecture shallconform to specified requirements for Class 2 equipment as defined by MIL-PRF-28800F.
3.2 Design and Construction. The design and construction for TETS shallcomply with the following:
a. The design and construction of TETS shallbe in accordance with the requirements identified herein.
b. The design and construction shallcomply with the mechanical and electrical specifications and standards identified in paragraphs 2.1 and 2.2 and their subparagraphs.
c. The TETS shalloperate primarily from the 28 Volts Direct Current (VDC), 100 Amp North Atlantic Treaty Organization (NATO) connector.
d. The TETS shallaccommodate reconfigurability and expansion.
3.2.1 Operational Environment. The anticipated operating environment for TETS is expected to be in the vicinity of tracked and wheeled vehicles. When the alarm sounds of a possible exposure to nuclear, biological, or chemical weapons, the TETS emergency power shutdown procedure will be initiated and the covers placed on TETS. The testing of LRU's exposed to rainfall is considered impractical; however, light dust due to wind and vehicle operations is reasonable to expect. Temperature extremes are likely as are climatic variations (i.e., desert and tropical humidity conditions). Electromagnetic Interference (EMI) is expected to be relatively high. This high level is a result of wheeled/tracked vehicles, radars, radios, and other electromagnetic emitters operating within close proximity of TETS. Effective EMI protection/shielding is required during support operations. Shop operations are anticipated as being non-controlled environments, with a lack of air conditioning; therefore, Class 3 environments are expected.M
a. TETS shallbe capable of being used while the operator is in Mission Oriented Protective Posture (MOPP) gear.
b. The TETS shallbe capable of operating in these environments stated in paragraph 3.2.1M
The TETS shallcomply with the following environmental requirements:M
(1) Operating temperature:M
Objective:-10°C (14°F) to 55°C (131°F)M
Threshold:-10°C (14°F) to 55°C (131°F)M
As per 3.8.2.2 & 3.8.2.2.2 of MIL-PRF-28800FM
(2) Non-Operating temperature:-40°C (-40°F) to 71°C (161°F)
As per 3.8.2.1 & 3.8.2.1.2 of MIL-PRF-28800F
(3) Relative Humidity (non-condensing):95% +/- 5%
As per 3.8.2.3 & 3.8.2.3.2 of MIL-PRF-28800F
(4) Dust resistance, non-operating:As per 3.8.10 of MIL-PRF-28800F
(5) Functional Shock:As per 3.8.5.1 of MIL-PRF-28800F
(6) Transit Drop (non-operating):As per 3.8.5.2 of MIL-PRF-28800F
(7) Bounce, loose cargo (non-operating):As per 3.8.4.3 of MIL-PRF-28800F
(8) Vibration, Random (non-operating):As per 3.8.4.1 of MIL-PRF-28800F
(9) Altitude:As per 3.8.3 of MIL-PRF-28800FM
(10) Salt Fog:As per 3.8.8.1 of MIL-PRF-28800F
(11) Dripproof, covers on (non-operating):As per 3.8.6.3 of MIL-PRF-28800F
3.2.2 Electromagnetic Radiation. The electromagnetic radiation requirements for TETS shallcomply with the following:M
a. The contractor shallensure that the TETS is EMI compatible with itself and the intended operating environment.M
b. The objective of the EMI protection shallbe no interference with an unwaiverable threshold.M
c. Electrical grounding, bonding, and shielding of the TETS components shallbe in accordance with MIL-HDBK-1857 to insure that no personal injury or equipment damage results from stray voltage or discharges.M
d. The TETS shalluse sufficient filtering and shielding to operate in close proximity to other communication equipment without causing or being susceptible to EMI.M
e. The contractor shallinsure the TETS will comply with the following EMI requirements as defined in:M
(1) MIL-STD-461EM
(2) CE102M
(3) CS101 [30KHz - 50KHz]M
(4) CS114 [10KHz - 30MHz]M
(5) CS116M
(6) RE102M
(7) RS103 [3MHz - 18GHz].M
3.2.3 Identification and Marking. The TETS shallbe marked in accordance with MIL-PRF-28800F, paragraph 3.11.
3.2.4 Workmanship. MIL-HDBK-454A, General Guidelines for Electronic Equipment, contains guidance and lessons learned in the selection of documentation for the design of electronic equipment. The following guidelines are relevant to the design and construction of all TETS variants, and are provided as guidance:
a. Guideline 1 - Safety Design Criteria - Personnel Hazards
b. Guideline 5 - Soldering
c. Guideline 7 - Interchangeability
d. Guideline 8 - Electrical Overload Protection
e. Guideline 9 - Workmanship
f. Guideline 10 - Electrical connectors
g. Guideline 11 - Insulating materials, Electrical
h. Guideline 12 - Fastener Hardware
i. Guideline 18 - Derating of Electronic Parts and Materials
j. Guideline 27 - Batteries
k. Guideline 28 - Controls
l. Guideline 35 - Reliability
m. Guideline 37 - Circuit Breakers
n. Guideline 54 - Maintainability
o. Guideline 55 - Enclosures
p. Guideline 62 - Human Engineering
q. Guideline 74 - Grounding Bonding & Shielding
r. Guideline 77 - Integrated Diagnostics
3.2.4.1 TETS Variants Soldered Electrical/Electronic Assemblies. All TETS variants soldered electrical and electronic assemblies shallmeet the requirements of IPC/EIA J-STD-001C Class 2.
3.2.5 Interchangeability. The TETS shallcomply with the interchangeability requirements listed in MIL-PRF-28800F.
3.2.6 Safety. The TETS shallcomply with the safety requirements listed in MIL-PRF-28800F, paragraphs 3.10.
3.2.7 Human Performance/Human Engineering. The human performance/human engineering requirements for TETS shallcomply with the following:
a. All TETS variants shallbe designed to ensure safe, reliable and effective performance by operators and maintenance personnel and to minimize personnel skill requirements and training.
b. All TETS variants shallbe designed to meet the general requirements of MIL-STD-1472 in the following areas:
(1) Standardization: Controls, displays, marking, coding, labeling, and arrangement schemes (equipment and panel layout) shallbe uniform for common functions of all equipment.
Criterion for selecting off-the-shelf commercial or Government equipment shallbe the degree to which the equipment conforms to MIL-STD-1472. Redesign of off-the-shelf equipment shall not be required
(2) Function allocation: Design shallreflect allocation of functions to personnel, equipment, and personnel-equipment combinations to achieve:
(a) Required sensitivity, precision, time and safety.
(b) Required reliability of system performance.
(c) Minimum number and levels of skills of personnel required to operate and maintain the system.
(d) Required performance in a cost-effective manner.
(3) Human design engineering: Design shallreflect human engineering and biomedical factors that affect human performance, including:
(a) Protection from thermal, toxicological, radiological, mechanical, electrical, electromagnetic, visual and other hazards.
(b) Adequate physical, visual, auditory, and other communication links between personnel, and between personnel and their equipment, under normal conditions.
(c) Efficient arrangement of operation and maintenance workplaces, equipment, controls and displays.
(d) Design features to assure rapidity, safety, ease and economy of operation and maintenance in normal, adverse and emergency maintenance environments.
(4) Simplicity of design: the equipment shallrepresent the simplest design consistent with functional requirements and expected service conditions. It shall be capable of being operated, maintained, and repaired in its operational environment by personnel with a minimum of training.
It shallbe capable of being operated, maintained, and repaired in its operational environment by personnel with a minimum of training.
(5) Safety: Design shallreflect applicable system and personnel safety factors, including minimizing potential human error in the operation and maintenance of the system.
3.3 TETS Characteristics.
The TETS characteristics shallcomply with the following:
3.3.1 Size. The TETS size shallcomply with the following:
a. The TETS, shallhave an objective system size of 30.47 ft³, with dimensions of 33 inches high, 42 inches wide, and 38 inches deep [33" x 42" x 38"] [83.82 cm x 106.68 cm x 96.52 cm].
b. The threshold system size shallbe 38.5 ft³, with dimensions of 33 inches high, 42 inches wide, and 48 inches deep [33" x 42" x 48"] [83.82 cm x 106.68 cm x 121.92 cm].
3.3.2 Weight. The TETS weight shallcomply with the following:
a. The TETS shallhave an objective system weight of 425 pounds [193.18 kg] with a threshold system weight of 650 pounds [295.45 kg].
b. Each hardware component of the TETS, in its transport mode, shallhave an objective weight of 40 kg (88 lbs) with a threshold weight of 59.2 kg (131 lbs).
c. No individual component/assembly of the Electro Optical (EO) hardware shallexceed a weight of 59.2 kg (131 lbs).
3.3.3 Color. The color of all TETS components shallbe non-reflective, lusterless, olive drab green. Chemical Agent Resistant Coating "CARC" paint shall not be used
3.3.4 Transportability Characteristics.
The TETS shallbe designed to be transported as loose cargo per 3.8.4.3 of MIL-PRF-28800F over unimproved surfaces.
Transport of TETS to an area near FEBA operations is anticipated to be over unimproved roads; therefore, shock and vibration protection for TETS is required. The TETS will be transported by commercial and military air, land, and sea vehicles.
3.3.5 Handles. The TETS handles shallcomply with the following:
a. Handles shallbe provided using MIL-PRF-28800F paragraph 3.7.3 as a guide.
b. Handles shallbe located to preclude uncontrolled swinging and tilting when lifted, provide at least 50 millimeters (2 inches) of clearance from obstructions during handling.
c. The handles shallnot interfere with installing, removing, operating, or maintaining the equipment.
d. Handles shallbe suitable for gloved or mittened hands.
e. The handles shallbe designed so that any one transit case can carry its own load plus any other system components stacked in its operational configuration.
3.3.6 Transit/Storage Case Structure. The transit/storage case structure maybe modified to permit the top and/or bottom panels to be removed as well as the front and rear panels.
a. TETS transit case shallbe a ruggedized combination case.
b. If the transit case has more than one cover, the front cover shallbe marked "FRONT".
c. Transit cases for other TETS components shallprovide protection for those items with limited environmental resistance.
d. The transit/storage cases shallwithstand changes in altitude up to 15,000 feet and meet all other system environmental requirements.
e. The TETS shallbe shock isolated from the transit case, when the transit case is subjected to vibration as specified in 3.8.4.1 of MIL-PRF-28800F.
3.3.7 System Set-Up. The TETS shallhave an objective set-up time of 30 minutes or less, and threshold set-up time of 45 minutes. Setup will be accomplished by two Marines.
3.4 Hardware Performance Characteristics. All instrument functions shallhave the capability to function in a real time, continuous manner.M
This capability shallbe available in automated and stand-alone modes of operation.M
The TETS shallcomply with the hardware performance characteristics given in the following subparagraphs:M
3.4.1 Power Distribution Unit (PDU) Functional Definition.
The PDU functions as the system power distributor to all components of TETS. The PDU shallhave front access to power switches and incorporate a soft-start technique to minimize in-rush current.
3.4.1.1 Instrument Chassis Power Input.
The PDU shalloperate from one of three available input power sources, determined by the input power cable, including DC, AC Single Phase, and AC Three Phase Power.
a. DC Input Power shallbe 28 VDC nominal from the standard NATO connector.
(1) The objective shallbe 18 - 32 VDC at 100 amps.
(2) The threshold shallbe 24 - 29 VDC at 100 amps.
b. Single Phase AC Input Power shallbe 120 VAC nominal.
(1) The objective shallbe 102 - 138 VAC at 48 - 440 Hz.
(2) The threshold shallbe 108 - 132 VAC at 58 - 62 Hz.
c. Three Phase AC Input Power shallbe 208 VAC nominal Wye configuration.
(1) The objective shallbe 180 - 250 VAC at 48 - 440 Hz.
(2) The threshold shallbe 185 - 230 VAC at 58 - 62 Hz.
(3) The PDU shalloperate with a voltage imbalance of +/- 5 percent. Voltage Imbalance is defined by {[VLine(max) - VLine(min)]/ VLine(nom)}X100.
(4) The PDU line current imbalance shallnot exceed 5 percent when the source voltage is balanced within 1 percent between input lines. Current Imbalance is defined by {[ILine(max) - ILine(min)]/ ILine(ave)}X100.
d. For AC source power, the PDU shalloperate with 0.80 lagging power factor to 0.95 leading power factor for all power frequencies.
e. For AC source power, the TETS maximum power consumption objective shallbe 3300 Watts with a threshold not to exceed 4000 Watts.
3.4.1.2 Conversion Efficiency.
The PDU's power conversion units shalloperate at not less than 80 percent efficiency at nominal output.
a. The DC Input Power to DC Output Power conversion efficiency objective shallbe 85 percent with a threshold of 80 percent.
b. The AC Input Power to DC Input Power equivalency or DC Output Power conversion efficiency objective shallbe 85 percent with a threshold of 80 percent.
3.4.1.3 Power Protection.
The PDU shallhave resettable type circuit breakers that will not function as an On/Off switch.
a. The PDU shallhave front panel lamps indicating power protection circuitry status.
b. The PDU shallturn off if an under or overvoltage condition exists in compliance with the Input Power Source requirements.
c. The PDU shallhave an accessible panel for replacing internal power protection components.
d. Separation between the PDU turn-on voltage threshold and turn-off voltage threshold (hysteresis) shallbe a minimum of 5 percent of the nominal input voltage.
e. The loss of source power (AC or DC) or loss of neutral or one or more phases of AC power shallnot damage the TETS or any connected equipment.
f. A failure of the PDU shallnot cause damage to the Input Power Source.
g. Source Power polarity reversal, phase reversal, or incorrect phase and neutral connection shallnot damage the PDU.
h. The PDU shallnot be damaged by Source Power voltage transients (surges, impulses, or spikes).
i. Transient suppression circuitry shallbe monitored for functional status.
j. The PDU shallhave front panel lamps indicating power protection circuitry status.
k. The PDU shallhave an accessible panel for replacing necessary internal power protection components.
3.4.1.4 Power Monitoring.
The PDU shallmonitor Input Power characteristics including under and overvoltage detection, missing phase or neutral detection, protection circuits, and hours of operation per input source.
3.4.1.5 Power Status.
The TETS power status shallcomply with the following:
a. The PDU shallhave lamps indicating powered status.
b. The PDU lamps shallbe viewable to the operator when in use.
c. The displays indicating input and output voltage and current shallbe available to the operator.
3.4.1.6 EO Power Connection.
The TETS shalluse a circular MS style connector located on the system to power the EO components.
3.4.1.7 Instrument Chassis Power Output.
The TETS instrument chassis power output shallcomply with the following:
a. The PDU shallprovide a regulated DC output to the Instrument Chassis.
b. The Instrument Chassis/PDU power supplies shallcomply with the IEEE-STD-1155-1992 Section B.8.1, B.8.2, and B.8.3.
c. DC load, ripple, and noise shallcomply with Section B.8.4 and Table B.7 of the IEEE-STD-1155-1992.
3.4.1.8 Ten Programmable Power Sources.M
The PDU shallcontain ten programmable power supplies to power a Unit Under Test (UUT) and meet the following specifications:M
a. Each shallbe of the floating output type, allowing the output to be configured as a positive or negative power source.M
b. There shallalso be the capability to put the sources in series for voltage and parallel for current considerations under test program control.M
c. Nine sources shallhave a variable output from 0.0 VDC to 40.0 VDC @ 5A.M
d. One source shallhave a variable output from 0.0 VDC to 65.0 VDC @ 5A.M
e. All sources shallbe capable of regulating the output to ± 0.1 VDC of the set output.M
f. All tolerances shallbe measured at the receiver interface.M
g. All sources shallbe independently programmable.M
h. All sources shallbe capable of simultaneous operation with each of the other power sources.M
i. There shallbe sense lines at the receiver interface for each power source.M
j. The power supplies shallbe isolated at the receiver when not in use.M
k. All power sources shallhave the capability of enabling/disabling/adjusting its output under program control by the Test Program Set (TPS) developer.M
l. Each power source shallhave output ripple and noise of 80 mVp-p or less.M
m. Each power source shallhave a protection circuit on the power output side.M
(1) Each power source shallhave over current and over voltage protection on its output side.M
(2) Each power source shallhave a "fail-safe" mode that ensures that the loss of power source control will cause the power source to disable all of the outputs until re-enabled under operator and/or program control.M
(3) Each power source shallallow for surge current when power is applied to a UUT to be controlled by the program.M
(4) Power supply error generation and reporting shallbe software controllable.M
(5) All power supplies shallinsure that there is no voltage present at the receiver until programmed for a voltage.M
(6) All power supplies shallhave the capability to store the calibration data for each supply on the supply its self.M
(7) Visual status indicators for each power source, denoting the source having an active output, shallbe viewable to the operator during system operation.M
(8) Each power source shallhave full range programmable operation in both current and voltage modes.M
(9) There shallbe sufficient overcurrent protection for the PDU input.M
3.4.1.9 PDU ON/OFF Switch and Indication.
The TETS PDU ON/OFF switch and indication shallcomply with the following:
a. There shallbe a power switch on the front of PDU.
b. This switch shallcontrol the regulated DC power to the Instrument Chassis and PPU.
c. The PDU shallhave an indicator lamp near the PDU ON/OFF switch to indicate the PDU has been turned on.
3.4.1.10 Emergency Power Shutdown.
The TETS emergency power shutdown shallcomply with the following:
a. In the event of an emergency and/or a catastrophic failure, the operator shallbe provided with a switch to remove power from all items connected to the PDU and shutdown the PDU at once. This feature is not the ON/OFF switch.
b. The emergency switch shallbe a mushroom type and readily accessible to the operator while the TETS is functioning.
3.4.1.11 Physical Characteristics.
The TETS physical characteristics shallcomply with the following:
a. The PDU case shallhave a lid (or lids) that, when closed, cover all input/output connectors, ON/OFF switches, indicator display(s), and any input/output ventilation ports.
b. All circuit breakers shallbe of the resettable type.
c. The PDU shallbe a multi-module device, with individual modules delivering required DC voltages.
d. Each module shallbe easily accessible and removable.
e. The PDU shallallow for reconfiguration of the power modules and provide potential for expansion.
f. All power producing receptacles on the PDU shallbe of the socket type, with no protruding, powered connector pins exposed.
g. All power connectors (with the exception of the NATO connector) and receptacles shallbe positive lock, quick disconnect, water and corrosion resistant type connectors.
h. The connector and receptacle provided by the PDU shallmate with the power cable provided by the Instrument Chassis.
i. Electrical connections shallbe in accordance with MIL-PRF-28800F, paragraph 3.3.1.9.
3.4.1.12 PDU to Receiver Interfacing.M
All UUT power, sense and return lines shallbe routed to the receiver interface.M
3.4.2 Instrument Controller (IC).
The TETS instrument controller shallcomply with the following:M
a. The IC shallhave the following specifications:
(1) The IC display shallbe readable in direct sunlight.
(2) Minimum1 GHz Mobile Pentium III Processor, 512 KB on-die L2 cache.
(3) Minimum256 MB RAM, expandable to a minimum of 512 MB.
(4) Minimum30GB HDD.
(5) Minimum1.44MB FDD.M
(6) 24x8x4 CD-RW CD authoring software shall Change to minimum requirement to 24X DVD with authoring software.be includedM
(7) Integrated56 Kbps modem & full duplex 10/100 Mbps Ethernet UTP NIC.
(8) Minimum13.3" 1024 x 768 (XGA.) Transmissive, anti-reflect TFT Active Matrix External Video support up to 1024x768 at 16 Million colors (24 bit color depth).M
(9) Integratedwater & dust resistant pointing device.
(10) Integratedwater & dust resistant keyboard
(11) MinimumLithium Ion Battery.
(12) Interfaces include1 each of the following: Serial, Parallel, and USB ports.
3.4.2.1 Instrument Controller Power.
The TETS instrument controller power shallcomply with the following:
a. The IC provided shallobtain operating power from either the PDU or Instrument Chassis.
b. A power back-up method shallbe provided which will permit sufficient operating power to allow the IC to accomplish an orderly system shut down in the event of primary power interruption or failure. If an emergency power shutdown is initiated, the IC will remain on under backup power to perform orderly shutdown of the operating system.
c. Visual battery indications shallbe provided to display the amount of battery charge remaining.
d. The use of Lithium Batteries shallbe in accordance with the TETS Statement of Work.
3.4.2.2 Replaceability.
The TETS replaceability shallcomply with the following:
a. The IC shallbe configured in such a manner that a minimum effort should be expended to replace the computer with the latest version from the MCHS.
b. The objective time to perform reconfiguration shallbe 30 minutes with a threshold of 45 minutes.
3.4.2.3 MultiSystem Extension (MXI) Interface.
The TETS MultiSystem Extension (MXI) Interface shallcomply with the following:
a. The TETS shallcontain an MXI Interface Card supported by the IC.
b. The MXI Interface card shallimplement MXI-2 specification as reflected by the MXIbus Specification Revision 1.2, 2.0 or higher.
3.4.3 Instrument Chassis Functional Definition.
The TETS instrument chassis shallcomply with the following:
a. The Instrument Chassis shallprovide the basic platform for the system VXIbus instrumentation and the interface to the UUT.
b. The Instrument Chassis shallbe controlled by the IC.
c. The Instrument Chassis shallderive power from the PDU.
d. The Instrument Chassis shallcomply with all mechanical, electrical, and performance requirements identified in the IEEE-STD-1155-1992 for C size chassis.
3.4.3.1 Instrument Chassis Ventilation Characteristics.
The TETS instrument chassis ventilation characteristics Interface shallcomply with the following:
a. The Instrument Chassis shallprovide a filtered, positive pressure, forced air system.
b. The air filters shallbe washable/reusable and easily removed without the use of special tools for cleaning.
c. Heating for the Instrument Chassis, if required shallnot interfere with or degrade instrument operation.
d. There shallbe a minimum of 50 W up to the maximum requirement of the occupant of cooling air per slot.
e. The cooling air shallnot allow more than 10° C temperature rise across the instrument slot.
3.4.3.2 Power Cable.
The Instrument Chassis shallbe provided with a detachable quick disconnect DC power cable that is a minimum of 243 cm (8 ft) in length. This cable will be used to provide system power to the TETS.
3.4.3.3 Input Power Switch.
The TETS input power switch shallcomply with the following:
a. The Instrument Chassis shallbe provided with an input power switch that provides input power over-current protection.
b. This power switch shallbe on the PDU accessible from the front of the chassis with the receiver or Interface Device (ID) installed.
3.4.3.4 Protection Circuitry.
The TETS protection circuitry shallcomply with the following:
a. The Instrument Chassis shallmonitor all VXIbus required DC power supply voltages and exhaust temperature and airflow.
b. The Instrument Chassis shallindicate faults to the operator via front panel indicators and/or via MXI or VXIbus interrupt signal to the instrument controller.

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