Attachment 1-Technical Requirements.pdf
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- Attached to
- Automatic Thin Film Mapping Tool
- Solicitation number
- 6-B187-Q-00311-00
- Issued by
-
Department of Energy Office of Science
About this file
This is a Technical Requirements and Specifications document for RFQ No. 6-B187-Q-00311-00 issued by Argonne National Laboratory for an Automatic Thin Film Mapping Tool. The solicitation requires vendors to have an installed base of at least 50 units with three U.S. references, 24-hour support availability, and field service engineers based in the United States. The system must operate on 100-240 VAC, 50-60Hz power and feature a spectrometer with 190-1100nm wavelength capability using D2 and Halogen light sources. Key hardware specifications include a minimum 1.4GHz processor, USB 2.0 interface, Windows 11 compatibility, 250µm microscope aperture, motorized turret with 10X and 20X objectives, integrated autocalibration without user intervention, safety enclosure with door interlock, one set of spare lamps, 300nm oxide standard, and high pass filter wheel for light-sensitive materials.
The software must support multiple user account layers (Admin/Tech/User) and include fully automated pattern recognition capable of deskew correction, center offset compensation, edge exclusion, multi-site within-die measurements, and external coordinate import. The system shall measure multilayer stacks of 10 to 50+ layers using spectrum-matching algorithms and retain full measurement spectrum data for at least the previous 500 measurements. An automated X-Y stage accommodates maximum 200mm samples with vacuum chuck capability, achieving 5-point navigation in 5 seconds and 25-point navigation in 14 seconds, with +/10 micron accuracy. The 10X objective provides 25-micron spot size with 4nm-115µm thickness range, while the 20X objective offers 13-micron spot size with 4nm-85µm range. Measurement specifications require 1nm or 0.2% accuracy, 0.02nm precision, and 0.05nm stability. Delivery must occur within three months of award to Argonne National Laboratory, Argonne, Illinois, building 440 loading dock, with the vendor responsible for all packaging, transportation, and delivery costs. Documentation shall include layout drawings, system and user manuals for hardware and software, and a full materials library containing 500+ semiconductors, dielectrics, and metals.
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RFQ No. 6-B187-Q-00311-00
TECHNICAL REQUIREMENTS & SPECIFICATIONS
Automatic Thin Film Mapping Tool
June 12, 2026
1. General Specific Requirements
• Installed base:
o Vendors shall have an installed base of at least 50 units.
o The Vendor shall provide 3 references in the US.
o 24hr support availability o US service availability: Field service engineers based in the US.
• Power: 100-240 VAC, 50-60Hz, 1.3A
• Spectrometer Wavelength o 190-1100nm
• Light source: D2 and Halogen
• Processor clock speed: Min 1.4GHz
• Interface USB 2.0
• Windows 11 compatible
• Microscope Aperture 250µm
• Turret: Motorized for multiple objectives (10X and 20X)
• Autocalibration o The system must include an integrated automatic wavelength calibration system, without requiring user intervention, external standards, or factory recalibration
• One set of spare lamps
• 300nm Oxide standard
• High Pass Filter Wheel for light sensitive materials
• Safety: The system shall be fully enclosed with a safety door interlock that halts stage motion when the enclosure door is opened, to protect users from moving mechanical components
2. Software
• Software: Must have multiple layers of user accounts. Admin/Tech/User
• Pattern recognition capable:
o The system shall have the option to include, fully automated pattern recognition software capable of: (a) automatic deskew correction for wafer rotation and offset; (b) center offset compensation; (c) edge exclusion; (d) multi-site, within-die measurement capability; and (e) the ability to import external coordinate sets or configure through a guided visual setup procedure.
• Recipe creation: single and multilayer:
o The system shall be capable of simultaneous measurement of film thicknesses for multilayer stacks of no fewer than 10 and up to 50+ individual layers using spectrum-matching algorithms o The software shall retain the full measurement spectrum and analysis results for at least the previous 500 measurements, allowing for re-analysis of historical data without requiring re-measurement of samples
• Full materials library; Semiconductors, dielectrics. Metals: 500+
3. Stage: Automated
• Max Sample Size 200mm
• Sample Stage : X-Y automated
• Speed with Vacuum chuck o 5 points: 5s o 25 points: 14s
• Navigation accuracy +/10 microns
• Vacuum option for chuck
4. Objectives/spot size
• 10x: Spot Size : 25 microns
• 20x: Spot Size: : 13 microns
5. Measurement Specifications
• 10X Objective : Thickness range 4nm-115µm
• 20X Objective: Thickness range 4nm-85µm
• Min Thickness to measure n and k: 50nm
• Accuracy: 1nm or 0.2%
• Precision: 0.02nm
• Stability: 0.05 nm
6. Documentation: Vendor shall supply layout drawings, system manuals for hardware and software, user manuals for hardware and software.
7. Deliverables:
• Delivery location will be Argonne National Laboratory, Argonne, IL, building 440 loading dock.
• Delivery should be complete 3 months from Award
• The vendor will be responsible for all packaging, transportation and delivery to the CNM facility, Argonne National Laboratory.
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