Atch 1 14860 Circuit Card Performance Work Statement.pdf
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- Attached to
- 14860 Circuit Card Assembly
- Solicitation number
- 14860
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Performance-Based Work Statement Summary
This is a Performance-Based Work Statement (PWS) for a Circuit Card Assembly Blanket Purchase Agreement (BPA) issued by the U.S. Air Force Software Directorate, effective May 6, 2026 (Version 1). The BPA enables the ordering of Printed Circuit Board Assemblies (PCBAs) through a turn-key solution supporting the 516th Common Aircraft Portable Reprogrammable Equipment (CAPRE), Common Built-in-Test Reprogramming Equipment (CMBRE), Portable Automated Test Station (PATS), and similar Department of War (DoW) programs. The requirement addresses DoW obsolescence issues and provides state-of-the-art hardware and software solutions for developmental, prototype, and production electronics systems. The contractor must possess in-house capabilities for either PCB fabrication or assembly, or both.
The contract requirements include three primary performance objectives: (1) PCB Fabrication—producing PCBs to IPC Class 3 standards (or as specified) with documented circuit continuity testing and technical reports; (2) Component Procurement—sourcing materials and components from authorized distributors or Government-approved OEMs within 30 days of task order award, with Government approval required for alternative sources; and (3) PCB Assembly—assembling PCBAs to IPC Class 2 standards (or as specified) using J-STD-001 soldering standards and Tin-Lead (Sn-Pb) solder unless otherwise specified. Subcontracting of PCB fabrication is acceptable with Government approval. The contractor must return excess materials and PCBs to the Government upon completion. The period of performance is 60 months (one base year plus four one-year option periods) with performance at the contractor's facility. The Government will furnish electronic components and equipment as identified on a Government Furnished Material (GFM) list, which the contractor must review for suitability within five calendar days. Quality Control and Quality Assurance requirements mandate contractor establishment of a complete Quality Control Plan and Government right to inspect and increase quality inspections as deemed appropriate.
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i
PERFORMANCE-BASED WORK STATEMENT (PWS)
CIRCUIT CARD ASSEMBLY BLANKET PURCHASE AGREEMENT (BPA)
U.S AIR FORCE
5/6/2026 Version 1
PWS Modification History ii
Date Change Paragraph # iii
TABLE OF CONTENTS
1 DESCRIPTION OF SERVICES
2 SCOPE
3 Reference documents and Standards
3.1 Applicable Documents and Standards
3.2 Government Furnished Equipment (GFE)
4 REQUIREMENTS
4.1 GENERAL REQUIREMENTS
4.2 PCB FABRICATION REQUIREMENT
4.3 COMPONENT PROCUREMENT REQUIREMENT
4.4 PCB ASSEMBLY REQUIREMENT………………………………………………………..3
5 SERVICE SUMMARY
6 Place/ period of performance
6.1 Place of Performance
6.2 Period of Performance……………………………………………………………………….4
7 Program Management
7.1 Data Rights Management
7.2 Government Furnished Property
7.3 Quality Control Plan
7.4 Quality Assurance
7.5 Conflicts of Interest
1 DESCRIPTION OF SERVICES
This requirement is to obtain electronic parts and products from industry and commercial Printed Circuit Boards (PCB) Fabrication and/or Assembly companies. This supports the 516th Common Aircraft Portable Reprogrammable Equipment (CAPRE), Common Built-in-Test Reprogramming Equipment and Portable Automated Test Station (CMBRE), Portable Automated Test Station (PATS) and similar missions. The requirement includes developing electronics solutions that solve Department of War (DoW) obsolescence issues and/or provides state-of-the-art hardware and software solutions to DoW Programs. This Performance Work Statement (PWS) will fill the need to (1) rapidly produce Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high-quality PCBAs for use in DoW operational environments.
2 SCOPE
The scope of this PWS is to enable the ordering of Printed Circuit Board Assemblies (PCBAs) through a turn-key solution for Printed Circuit Board (PCB) Fabrication and Assembly with multiple vendors. This is applicable to developmental, prototype, and production electronics systems for use by Department of War (DOW) Programs.
3 REFERENCE DOCUMENTS AND STANDARDS
3.1 Applicable Documents and Standards: The following documents will be provided at time of task order. The contractor shall comply with the following documents.
Document Number Document Title Date of Document
PCB Design and Layout Files As Provided
PCB Fabrication Specification As Provided
Sub-component Bill of Materials (BOM) As Provided
PCB Assembly Design Files As Provided
PCB Assembly Specifications As Provided
3.2 Government Furnished Equipment (GFE): The Government may provide Electronic Components necessary for the Contractor to assemble PCBAs. Any components provided by the Government to the contractor shall be identified in a Government Furnished Material (GFM) list, which is a subset of the production Bill of Materials (BOM) required to complete fabrication and assembly. The GFM and BOM may be consolidated into a single list (BOM) so long as quantities of GFM are sufficiently annotated within the
BOM.
4 REQUIREMENTS
4.1 GENERAL REQUIREMENTS: The contractors shall produce/procure the products described within Section 4, based on the required specification provided by the Government through individual BPA calls. The contractor shall have in-house capabilities for either PCB Fabrication or Assembly, or both.
4.2 PCB FABRICATION REQUIREMENT: The contractor shall produce requested quantities of PCBs IAW fabrication requirements and specification documents for board thickness, layer count, surface finish, trace tolerance, and any other pertinent fabrication specifications.
4.2.1 The contractor shall fabricate PCBs IAW specified IPC-A-600 classification; if
IPC Classification is not specified in the provided Technical Data Package (TDP), the contractor shall fabricate PCBs to IPC Class 3 requirements. 4.2.2 The contractor shall provide technical reports, as required, documenting electrical continuity test results, impedance matching test results, and results of Quality Control inspections.
4.2.2 Unless otherwise specified in the TDP, the contractor has control over penalization strategies, fiducial markings, and excess materials needed to account for production fall out.
4.2.3 If the contractor does not have internal PCB Fabrication capabilities, it is acceptable to sub-contract PCB Fabrication to another vendor. Any sub-contractors utilized shall be approved by the Government in advance of the initiation of PCB fabrication activities. PCB procurement is payable upon contractor evidence of Purchase Order (PO) placement, evidence of receipt by contractor, and evidence of acceptable PCB performance (circuit continuity or other test strategy).
4.2.4 The contractor shall return all excess PCB materials to the Government after completion of production activities.
4.3 COMPONENT PROCUREMENT REQUIREMENT: The contractor shall procure sufficient materials and components, as identified on the BOM, to enable the assembly of requested quantities of PCBAs (also referred to Circuit Card Assemblies (CCAs)). Any components that will be consigned to the contractor by the Government will be identified on the BOM.
4.3.1 The contractor shall review suitability of (GFM) and components and request any additional information, materials, and/or components within 5 days of receipt of the GFM
4.3.2 The contractor shall only use authorized distributors or (OEMs) to source electronic components. Any alternative sources, like third party distributors or brokers, shall be approved by the Government prior to components being procured.
4.3.3 The contractor shall have 30 days from task order award to execute component orders, to ensure supply chain disruptions can be immediately accounted for and lead times can be minimized. The contractor shall provide evidence of orders being placed and received. For component and material orders that are excessively costly, partial payments and/or early payments can be negotiated prior to award of the order, upon contractor request. Component procurement is payable upon contractor evidence of PO placement and evidence of receipt by contractor; project inventory shall be transferred to Govt if not used.
4.3.4 The contractor shall identify suitable alternates to components that are not immediately available, or that have prohibitively long lead times. Any alternate components shall be approved by the Government technical subject matter experts (SMEs) prior to procurement of the components.
4.3.5 Note: The Government may request some additional spares of critical components be procured, to support rework due to post-production test and validation activities; these spares will be identified in the TDP and BOM, when applicable.
4.3.6 Unless quantities of components are deliberately specified or limited in the TDP or BOM, the contractor has control over quantities of sufficient spares needed to accommodate losses possible in their PCB Assembly processes. Any alternate components shall be approved by the Government SMEs prior to procurement of the components.
4.3.7 The contractor shall return all excess materials and components to the
Government after completion of production activities, unless an agreement exists to maintain inventory in contractor inventory in anticipation of follow-on orders.
4.4 PCB ASSEMBLY REQUIREMENT: The contractor shall assemble requested quantities of PCBAs/CCAs IAW layout specifications and assembly requirement documents for solder selection, component placement, bill of materials, stencil design, and any other pertinent assembly specifications.
4.4.1 The contractor shall assemble PCBAs IAW specified J-STD-001 and IPC-A-610 classification; if IPC Classification is not specified in the provided TDP, the contract shall assemble PCBAs to IPC Class 2 requirements.
4.4.2 The contractor shall provide technical reports, as required, documenting electrical continuity test results, and results of Quality Control inspections performed IAW specified IPC-A-610 inspections. Unless otherwise specified in the TDP, the contractor shall use Tin-Lead (Sn-Pb) solder in all applicable assembly process.
4.4.3 Note: Some components may be fabricated with Lead-free solder. Unless specified in the TDP, these components shall not be reballed. Hybrid soldering processes are acceptable in the attachment of these components.
5 SERVICE SUMMARY
PWS
Paragraph Performance Objective Performance Threshold
4.2 Fabricate PCBs according to
specifications.
All PCBs fabricated to IPC Class 3 (or as specified) with documented evidence of circuit continuity.
4.3 Procure all necessary components
for assembly.
All components procured from authorized distributors or other Government -approved sources.
4.4 Assemble PCBAs according to
specifications.
All PCBAs assembled to IPC Class 2 (or as specified) with documented evidence of QC inspections.
6 PLACE/ PERIOD OF PERFORMANCE
6.1 Place of Performance
The place of performance shall be the contractors facility.
6.2 Period Of Performance
The period of performance (PoP) shall be 60 Months (one (1) year base period plus four (4) option periods), beginning the date of BPA acceptance.
7 PROGRAM MANAGEMENT
7.1 Data Rights Management: All data rights under this contract shall be managed.
IAW applicable data rights clauses outlined in the FAR and DFARS. The U.S.
Government shall retain unlimited data and computer software rights to all items delivered under this contract. Any data delivered to the contractor shall remain property of the US Government.
7.2 Government Furnished Property: The Government may provide Electronic components necessary for the contractor to assemble PCBA’s. Any components that will be provided by the Government to the contractor shall be identified in a GFM list. The contractor shall review the suitability of GFM and request additional information or materials within five (5) Calendar days of receipt.
7.3 Quality Control Plan: The contractor shall establish a complete Quality Control
Plan (QCP) to ensure the requirements of this contract are provided as specified.
7.4 Quality Assurance: The Government will perform assessments of the contractor's performance. The Government may inspect each task as completed or increase the number of quality control inspections if deemed appropriate.
7.5 Conflicts of Interest: The Contractor shall not assign to the contract or task order performance, any person, if employing that person would create a conflict of interest under any law, regulation, or policy of the United States Government.
7.6 Government Observation: During the PoP, Government personnel other than the
Contracting Officer (CO) may, from time-to-time, observe contractor operations.
However, these personnel may not interfere with contractor performance.
| 1 DESCRIPTION OF SERVICES |
| 2 SCOPE |
| The scope of this PWS is to enable the ordering of Printed Circuit Board Assemblies (PCBAs) through a turn-key solution for Printed Circuit Board (PCB) Fabrication and Assembly with multiple vendors. This is applicable to developmental, prototype, and... |
| 3 Reference documents and Standards |
| 3.1 Applicable Documents and Standards: The following documents will be provided at time of task order. The contractor shall comply with the following documents. |
| 3.2 Government Furnished Equipment (GFE): The Government may provide Electronic Components necessary for the Contractor to assemble PCBAs. Any components provided by the Government to the contractor shall be identified in a Government Furnished Materi... |
| 4 REQUIREMENTS |
| 4.1 GENERAL REQUIREMENTS: The contractors shall produce/procure the products described within Section 4, based on the required specification provided by the Government through individual BPA calls. The contractor shall have in-house capabilities for e... |
| 4.2 PCB FABRICATION REQUIREMENT: The contractor shall produce requested quantities of PCBs IAW fabrication requirements and specification documents for board thickness, layer count, surface finish, trace tolerance, and any other pertinent fabrication ... |
| 4.2.1 The contractor shall fabricate PCBs IAW specified IPC-A-600 classification; if IPC Classification is not specified in the provided Technical Data Package (TDP), the contractor shall fabricate PCBs to IPC Class 3 requirements. 4.2.2 The contracto... |
| 4.2.2 Unless otherwise specified in the TDP, the contractor has control over penalization strategies, fiducial markings, and excess materials needed to account for production fall out. |
| 4.2.3 If the contractor does not have internal PCB Fabrication capabilities, it is acceptable to sub-contract PCB Fabrication to another vendor. Any sub-contractors utilized shall be approved by the Government in advance of the initiation of PCB fabri... |
| 4.2.4 The contractor shall return all excess PCB materials to the Government after completion of production activities. |
| 4.3 COMPONENT PROCUREMENT REQUIREMENT: The contractor shall procure sufficient materials and components, as identified on the BOM, to enable the assembly of requested quantities of PCBAs (also referred to Circuit Card Assemblies (CCAs)). Any component... |
| 4.3.1 The contractor shall review suitability of (GFM) and components and request any additional information, materials, and/or components within 5 days of receipt of the GFM |
| 4.3.2 The contractor shall only use authorized distributors or (OEMs) to source electronic components. Any alternative sources, like third party distributors or brokers, shall be approved by the Government prior to components being procured. |
| 4.3.3 The contractor shall have 30 days from task order award to execute component orders, to ensure supply chain disruptions can be immediately accounted for and lead times can be minimized. The contractor shall provide evidence of orders being plac... |
| 4.3.4 The contractor shall identify suitable alternates to components that are not immediately available, or that have prohibitively long lead times. Any alternate components shall be approved by the Government technical subject matter experts (SMEs)... |
| 4.3.5 Note: The Government may request some additional spares of critical components be procured, to support rework due to post-production test and validation activities; these spares will be identified in the TDP and BOM, when applicable. |
| 4.3.6 Unless quantities of components are deliberately specified or limited in the TDP or BOM, the contractor has control over quantities of sufficient spares needed to accommodate losses possible in their PCB Assembly processes. Any alternate compone... |
| 4.3.7 The contractor shall return all excess materials and components to the Government after completion of production activities, unless an agreement exists to maintain inventory in contractor inventory in anticipation of follow-on orders. |
| 4.4 PCB ASSEMBLY REQUIREMENT: The contractor shall assemble requested quantities of PCBAs/CCAs IAW layout specifications and assembly requirement documents for solder selection, component placement, bill of materials, stencil design, and any other per... |
| 4.4.1 The contractor shall assemble PCBAs IAW specified J-STD-001 and IPC-A-610 classification; if IPC Classification is not specified in the provided TDP, the contract shall assemble PCBAs to IPC Class 2 requirements. |
| 4.4.2 The contractor shall provide technical reports, as required, documenting electrical continuity test results, and results of Quality Control inspections performed IAW specified IPC-A-610 inspections. Unless otherwise specified in the TDP, the con... |
| 4.4.3 Note: Some components may be fabricated with Lead-free solder. Unless specified in the TDP, these components shall not be reballed. Hybrid soldering processes are acceptable in the attachment of these components. |
| Date of Document |
| Document Title |
| Document Number |
| As Provided |
| PCB Design and Layout Files |
| As Provided |
| PCB Fabrication Specification |
| As Provided |
| Sub-component Bill of Materials (BOM) |
| As Provided |
| PCB Assembly Design Files |
| As Provided |
| PCB Assembly Specifications |
| 5 SERVICE SUMMARY |
| 6 Place/ period of performance |
| 6.1 Place of Performance |
| 7 Program Management |
| 7.1 Data Rights Management: All data rights under this contract shall be managed. IAW applicable data rights clauses outlined in the FAR and DFARS. The U.S. Government shall retain unlimited data and computer software rights to all items delivered und... |
| 7.2 Government Furnished Property: The Government may provide Electronic components necessary for the contractor to assemble PCBA’s. Any components that will be provided by the Government to the contractor shall be identified in a GFM list. The contra... |
| 7.3 Quality Control Plan: The contractor shall establish a complete Quality Control Plan (QCP) to ensure the requirements of this contract are provided as specified. |
| 7.4 Quality Assurance: The Government will perform assessments of the contractor's performance. The Government may inspect each task as completed or increase the number of quality control inspections if deemed appropriate. |
| 7.5 Conflicts of Interest: The Contractor shall not assign to the contract or task order performance, any person, if employing that person would create a conflict of interest under any law, regulation, or policy of the United States Government. |
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