A.3 Drawings_SpecificationsIO-1889-1B_Fabrication.pdf

This document is a detailed engineering drawing for a Printed Circuit Board (PCB) - Dune CRU Patch Panel, created by Brookhaven National Laboratory. The drawing (FSCM No. 10-1889-1, Rev. B) specifies precise fabrication requirements for a multi-layer circuit board with specific dimensional and manufacturing tolerances. Key technical specifications include:

Fabrication details cover multiple layers with precise measurements, including layer thicknesses, tolerances of ±/-0.762(.003), and specific requirements for plating, materials, and surface mounting. The document is controlled by U.S. Department of Commerce Export Administration Regulations (15 CFR Parts 730-774) as EAR99 Technology, with an ESH&Q Risk level of A3. The final approval was given by Shanshan Gao, with revisions noted on 05/31/2022 and 12/07/2024 relating to changes in Cu thickness and layer configurations.