A.21 RFQ Qualifiers.pdf
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- Solicitation number
- 474299
- Issued by
-
Department of Energy Office of Science
About this file
This document is a qualification requirement for a PCB (Printed Circuit Board) assembly for the DUNE FD-VD CRP Patch Panel IO-1889-1B project. The document outlines strict technical and experience requirements for potential manufacturers, specifically for electronic assemblies that must operate at cryogenic temperatures (77 K) in a detector system. Manufacturers must demonstrate extensive experience, including a minimum of 20 years working with complex PCB assemblies and proven capability in building cryogenic electronics with specific technical qualifications: approximately 50 different component types, mixed surface mount and through-hole technologies, around 1,500 total components, IPC-A-610 class II compliance, and rigorous electrostatic discharge (ESD) handling procedures. Bidders are required to provide detailed reference documentation for at least three comparable past projects, including specific technical parameters and evidence of boards successfully used at cryogenic temperatures below 120 K. Failure to provide comprehensive documentation will result in a non-responsive offer.
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Text version
2025/12/23
DUNE FD-VD CRP Patch Panel IO-1889-1B PCB Assembly Qualifiers
CRP patch panel IO-1889-1B assembly must work with electronics operating at cryogenic temperature (77 K) in DUNE FD-VD detector, no alternation of bill of materials is allowed for the construction of these assemblies. Only manufacturers which have experience of building cryogenic electronics assemblies with similar complexity should be considered. Otherwise, extended delay to qualify the manufacturer is expected, which is not compatible with DUNE project schedule.
Extensive evaluation tests have been carried out at BNL to qualify PCB (Printed Circuit Board) assemblies produced by the manufacturer at cryogenic temperature (77 K). Manufacturer submitting the bid must demonstrate that it has experience of building cryogenic electronics assemblies with similar complexity (~50 different types of components with mix of surface mount and through hole technologies, ~1,500 components, certificate of compliance per IPC-A-610 class II, stringent handling procedure for ESD (ElectroStatic Discharge) sensitive components).
1. Offeror shall have a minimum of 20 years working experience in the areas of complex PCB assemblies.
The offeror shall provide reference documentation demonstrating 20 years or more of work experience in the areas of complex board assemblies.
2. Does the offeror have previous experience building cryogenic electronics assemblies with similar complexity (~50 different types of components with mix of surface mount and through hole technologies, ~1,500 components, certificate of compliance per IPC-A-610 class II, stringent handling procedure for ESD sensitive components) with reference to the assembly drawing package?
If YES, the offeror shall provide references for at least 3 successfully fabricated jobs with comparable complexity with key parameters listed below.
a. Board size
b. Number of different types of components
c. Number of components in surface mount technology
d. Number of components in through hole technology
e. Number of components mounted on board
f. Certificate of compliance per IPC-A-610 class II
g. Handling procedure for ESD sensitive components
h. Evidence of boards being used at cryogenic temperature (< 120 K)
The references shall include the name of the organization, contacts, phone numbers, and e-mail addresses.
Failure to provide the above information will render your offer non-responsive.
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