TPT semi-automatic heavy wire bonder
Ended Purchase Order Awarded
- Contract number
- 80NSSC25PB748
- Awardee
-
Cook And Weil, Inc. UEI GJMEHZQFN2D9
- Awarding agency
-
Shared Services Center
National Aeronautics and Space Administration
- Obligated
- $68,845
Award facts
- Opportunity
-
- TPT Semi-Automatic Heavy Wire Bonder Special Notice · 80NSSC25910374Q · Posted Aug 7, 2025
- Contract value 100% obligated
- $68,845.00 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- Contracting staff
- NAICS code
- 333242 Semiconductor Machinery Manufacturing
- Set-aside
- No set-aside
- Competition
- Not Competed under SAP · 1 offer Simplified Acquisition
- Pricing
- Firm Fixed Price
- Place of performance
- Cleveland, OH 44135, USA
Award details come from SAM.gov/FPDS.
About this award
On August 14, 2025, the National Aeronautics and Space Administration (NASA) Shared Services Center awarded a $68,845 firm fixed-price purchase order to Cook and Weil, Inc., a small business based in Morganville, New Jersey, for the procurement of a TPT semi-automatic heavy wire bonder. The contract, which carries an ultimate completion date of October 9, 2025, was awarded without a set-aside designation, despite originating from a total small business set-aside solicitation. Performance will be conducted in Cleveland, Ohio. Cook and Weil, Inc. specializes in advanced semiconductor and electronics manufacturing equipment and has an established track record of federal contracting with agencies including NASA, the National Institute of Standards and Technology, and the U.S. Army's Research, Development and Engineering Command.
The procurement was conducted as a simplified acquisition under FAR Part 12 and FAR Part 13 procedures, with the government's initial determination that Cook and Weil, Inc. was the sole provider of this specialized equipment. Wire bonding systems, including the semi-automatic thermosonic bonders supplied by this vendor, are critical precision instruments used in semiconductor manufacturing and research applications. The Special Notice published on August 7, 2025, provided interested contractors a five-day window to submit capabilities and qualifications, though the government ultimately proceeded with the award to Cook and Weil, Inc. under NAICS code 333242 for Semiconductor Machinery Manufacturing.
Quick answers
Who was awarded contract 80NSSC25PB748?
80NSSC25PB748 was awarded to Cook And Weil, Inc. by Shared Services Center (National Aeronautics and Space Administration) on August 14, 2025.
How much is contract 80NSSC25PB748 worth?
The government has obligated $68,845 on 80NSSC25PB748.
Was contract 80NSSC25PB748 competed?
The extent of competition for 80NSSC25PB748 was not competed under sap. The government received 1 offer.
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