Silicon wafer ball bonder

Ended Purchase Order Awarded

Contract number
80NSSC25PB486
Awardee
Awarding agency
Obligated
$30,793

Award facts

Opportunity
Contract value 100% obligated
$30,793.20 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
Contracting staff
NAICS code
334516 Analytical Laboratory Instrument Manufacturing
PSC
6640 Laboratory Equipment And Supplies
Set-aside
No set-aside
Competition
Not Competed under SAP · 1 offer Simplified Acquisition
Pricing
Firm Fixed Price
Place of performance
Morganville, Marlboro, NJ, USA

Award details come from SAM.gov/FPDS.

About this award

The U.S. National Aeronautics and Space Administration (NASA) Shared Services Center (NSSC) awarded a $30,793.20 firm-fixed-price purchase order contract to Cook & Weil Inc., a for-profit small business based in Morganville, New Jersey. The contract is for the delivery of a Silicon Wafer Ball Bonder, including a gold wire bonder system with wedge and ball bonding capabilities, a Leica Ivesta 3 microscope, and associated accessories. This procurement was originally announced as a sole-source opportunity, but NASA provided the opportunity for other qualified small businesses to demonstrate their capabilities. The equipment will be delivered to the NASA Marshall Space Flight Center (MSFC) to support the agency's research and engineering activities. Cook & Weil Inc. has a history of securing federal contracts for specialized semiconductor and electronics-related equipment from various defense and research agencies.

Quick answers

Who was awarded contract 80NSSC25PB486?

80NSSC25PB486 was awarded to Cook And Weil, Inc. by Shared Services Center (National Aeronautics and Space Administration) on July 22, 2025.

How much is contract 80NSSC25PB486 worth?

The government has obligated $30,793 on 80NSSC25PB486.

Was contract 80NSSC25PB486 competed?

The extent of competition for 80NSSC25PB486 was not competed under sap. The government received 1 offer.

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