Purchase Order 1333ND25PNB680595

Award Date 9/22/25
Potential Completion Date 11/17/25
Potential Value $46K
Ultimate Awardee
Not listed
Federal Contract Vehicle
Set-Aside Type
Total Small Business
Extent Competed
Competed under SAP
Major Defense Program
Not listed
Pricing Type
Firm Fixed Price
Place of Performance
Germany
Solicitation Procedures
Simplified Acquisition
Number Of Offers Received
6
Legislative Mandate
Not listed
National Interest Action
Not listed
Research Type
Not listed
Primary Consortia Member
Not listed
Similar Awards
This is a firm fixed-price purchase order awarded by the National Institute of Standards and Technology (NIST), a civilian agency, to West Bond, Inc., a veteran-owned small business manufacturer of semiconductor wire bonding machines and accessories. The contract is for the purchase of a wire bond station, with a total potential value of $117,932.00 and a performance completion date of January 31, 2017. West Bond, Inc. has previously received multiple federal contract awards from agencies such...
The Department of Commerce's National Institute of Standards and Technology awarded a $946,837 firm fixed price purchase order to Suss Microtec Inc. of Germany. The contract calls for delivery and installation of a wafer bonder capable of substrates from 10mm to 150mm and a lithography aligner compatible with the bonder and achieving sub-micron resolution. Installation at NIST's Center for Nanoscale Science and Technology user facility is required within 60 days of each delivery, along with...
The U.S. Department of Commerce's National Institute of Standards and Technology (NIST) awarded a firm fixed price purchase order to Set North America, LLC, a manufacturing and service organization, for an automatic die bonder system. The $776,490.00 contract supports NIST's Boulder Micro-Fabrication Facility, which requires the die bonder system to build complex hybrid structures for research in areas like integrated photonics, quantum information, sensors, and microfluidics. The purchase order...
This is a $558,362.46 firm fixed-price purchase order awarded by the National Institute of Standards and Technology (NIST) to Formfactor, Inc. to provide a fully autonomous wafer probing system up to 110 GHz for NIST's microwave materials lab. The award supports NIST's CHIPS program to develop and disseminate measurement best practices. The contract includes Wincal software, on-wafer and DC probes, a capacitor sensor, an autoprober system, installation, training, and a 3-year warranty and...
The Department of Commerce National Institute of Standards and Technology (NIST) awarded a firm fixed-price purchase order for $135,093.01 to JB Technical Support Service LLC of Boulder, Colorado. The award is for preventative maintenance services for the FC150 flip chip bonder set over a potential three-year period from March 2022 through February 2025. As a self-certified small disadvantaged business, JB Technical will leverage its expertise maintaining specialized chip bonding equipment to...
This federal contract award to Finetech, a for-profit organization based in Mesa, Arizona, is for the purchase of an automated flip-chip die bonder and extended warranty, valued at $643,110.00. The contract was awarded by the National Institute of Standards and Technology (NIST), a civilian agency within the Department of Commerce. The original solicitation, NIST-SS24-CHIPS-0021, sought proposals for an automated flip-chip die bonder capable of precision placement and bonding of silicon dies...
This $290,798.30 firm-fixed-price purchase order was awarded by the National Institute of Standards and Technology (NIST) to Technical Communities, Inc., a small business prime contractor, on September 6, 2024. The contract requires the delivery of two 110 GHz extender heads with low-frequency extension and integrated bias tees, as well as two 110 GHz extender head desktop positioners, all from Keysight. These items are needed to support NIST's CHIPS program and on-wafer measurement capabilities...
<p>The Department of Commerce National Institute of Standards and Technology (NIST) awarded a firm-fixed-price purchase order contract to Tresky Corp, a for-profit organization, for a Semi-Automatic Die Bonder Station. The contract has a potential value of $158,565.00 and a completion date of March 22, 2024. The contract does not have a set-aside designation. The award was made on September 15, 2023.</p>
The U.S. National Institute of Standards and Technology (NIST) awarded a $124,098.00 firm-fixed-price purchase order contract to Bluefors Cryocooler Technologies Inc., a small business, for the delivery of a low temperature electrical measurement system. The system will support NIST's Nanoscale Device Characterization Division's research into atomic-scale dopant devices, quantum information processing, and advanced semiconductor electronics. The contract has a period of performance through April...
This is a $93,920.00 firm fixed-price purchase order contract awarded by the U.S. Army Research, Development and Engineering Command (RDECOM) to V-Tek Inc., a small business manufacturer, for the procurement of one Bond Tester system with specialized testing capabilities including wire bond pull tests, ball bond shear tests, and bond tweezer pull sets for various specimen sizes. The contract has a total small business set-aside and requires delivery and installation of the Bond Tester system...

The National Institute of Standards and Technology (NIST) awarded a $46,000.00 firm fixed price purchase order contract to Cook And Weil, Inc., doing business as Cook & Weil Inc., for a manual wedge/ball wire bonder. The contract is a total small business set-aside and has an ultimate completion date of November 17, 2025.

The wire bonder is required to support NIST's Physical Measurement Laboratory's Quantum Measurement Division in the development and repair of single-photon devices used in optical metrology and quantum networking applications. The equipment must accommodate gold and aluminum wires ranging from 18-75 millimeters in diameter, as well as ribbons up to 25 millimeters by 250 millimeters, and be capable of chip-to-chip and chip-to-board bonding in hermetic and cryogenic environments. The contract also includes a compatible stereo microscope system, work illumination, heated work holder, tools, and training.

Generated 9/28/25, 2:00 AM