Wafer Grinder and CMP Tools
Closed Solicitation Posted
- Solicitation number
- N0017325QMB04
- Agency
- Office of Naval Research Secretary of the Navy, Department of Defense
- Responses due
- Set-aside
- Total Small Business
Opportunity facts
- NAICS code
- 333242 Semiconductor Machinery Manufacturing
- Place of performance
- Washington, District of Columbia 20375, United States
- Points of contact
-
- Michael Broomfield michael.h.broomfield.civ@us.navy.mil (202) 875-9785
Notice details come from SAM.gov. Updated .
About this opportunity
The Department of the Navy's Office of Naval Research is seeking to procure a wafer grinder and chemical mechanical polishing (CMP) tool for the Naval Research Laboratory. The solicitation requires commercially available semiconductor machinery capable of processing wafers between 75-150mm in diameter, with the ability to remove up to 345 micrometers from bonded or unbonded wafers. Technical evaluation will consider the capability of the equipment, vendor past performance risk analysis using the Supplier Performance Risk System (SPRS), and pricing competitiveness. Vendors must be Original Equipment Manufacturers (OEMs) or authorized dealers/resellers who can provide OEM warranty and service. The solicitation allows for both new and refurbished equipment, with responses due by February 7, 2025 at 12 PM EDT, and questions to be submitted within 7 days of the January 23, 2025 posting date.
This solicitation is a total small business set-aside under NAICS code 333242 for Semiconductor Machinery Manufacturing, targeting equipment that can grind and polish SiC wafers with low total thickness variation. The place of performance is Washington, DC 20375, with equipment delivery required within 6 months of contract award. While specific award value was not disclosed, the procurement is structured as a firm-fixed price contract under FAR 13.5 procedures. The technical specifications demand precise grinding capabilities with differential pressure and automatic process controls, and CMP processes that achieve consistent surface roughness. Prohibited items include "gray market" equipment, emphasizing the government's focus on obtaining high-quality, warranty-backed semiconductor manufacturing tools that meet stringent technical specifications.
Notice text
5 versions
Update #5 · Latest ·
See attached combined Synopsis/Solicitation and System Specifications.
Note; The Government is accepting offers for both new and refurbished hardware. Contractors response needs to specify whether proposing new or refurbished.
Amendment #1 extends the due date for receipt of offers from 2/7/2025 to 2/14/2025
Amendment #2 responds to a question and posts a revised combined Synopsis/Solicitation changing the due date for offers to 2/14/2025.
Q. Regarding the RFQ for grind and CMP tools for Silicon Carbide – does the NRL intend to provide wafers for potential contractors to perform demonstrations, or are you just looking for data from previous demonstrations?
R. NRL will provide wafers for potential contractors to perform the demonstrations.
Amendment # 3 respond to following questions:
Q. Is NRL looking for automated functions or semi-automatic? Is the purpose for R&D or production?
A. Semi-automatic functions are acceptable. The purpose of the tools is for R&D.
Q. Few machines automatically move from coarse grind to fine grind. Does NRL require high production or are they looking to do
wafers one at a time?
A. One wafer at a time.
Amendment #4 Respond to questions;
For bonded wafers, what is the incoming total wafer stack thickness?
Our standard thickness gauge can measure up to 1,800um. If the wafer it thicker than that, we can upgrade to 2.7mm IPG.
A. The total wafer stack thickness will be approx. 700 – 750 um
- SiC wafers have Si plane and C plane. If you could confirm which side to grind/polish,
- Which plane (Si or C plane) will you polish?
In answer to 1 and 2 above with regard to single SiC wafers:
- For single SiC wafers, the Si- and/or C-planes will need to be ground and/or polished in order to achieve the bow and TTV specs
b) For bonded SiC/SiO2/Si stacks, the C-face of the SiC wafer will be ground and polished
c) For bonded SiC/SiO2/SiC stacks, the exterior faces will be C-plane and at least one face will need to be ground and polished. The other SiC surface may need to be ground/polished in order to meet the bow and TTV specs
- Are wafers single crystal or polycrystal?
Single crystal
Just for confirmation a multi-stage filtration system shall filter particles up to 0.1 μm in the waste water from the grinding tool at flow rates up to 12 gpm " in the Specifications => This is waste water from the grinder, correct?
Yes, correct, the waste water is from the grinder
Update #4 ·
See attached combined Synopsis/Solicitation and System Specifications.
Note; The Government is accepting offers for both new and refurbished hardware. Contractors response needs to specify whether proposing new or refurbished.
Amendment #1 extends the due date for receipt of offers from 2/7/2025 to 2/14/2025
Amendment #2 responds to a question and posts a revised combined Synopsis/Solicitation changing the due date for offers to 2/14/2025.
Q. Regarding the RFQ for grind and CMP tools for Silicon Carbide – does the NRL intend to provide wafers for potential contractors to perform demonstrations, or are you just looking for data from previous demonstrations?
R. NRL will provide wafers for potential contractors to perform the demonstrations.
Amendment # 3 respond to following questions:
Q. Is NRL looking for automated functions or semi-automatic? Is the purpose for R&D or production?
A. Semi-automatic functions are acceptable. The purpose of the tools is for R&D.
Q. Few machines automatically move from coarse grind to fine grind. Does NRL require high production or are they looking to do
wafers one at a time?
A. One wafer at a time.
Update #3 ·
See attached combined Synopsis/Solicitation and System Specifications.
Note; The Government is accepting offers for both new and refurbished hardware. Contractors response needs to specify whether proposing new or refurbished.
Amendment #1 extends the due date for receipt of offers from 2/7/2025 to 2/14/2025
Amendment #2 responds to a question and posts a revised combined Synopsis/Solicitation changing the due date for offers to 2/14/2025.
Q. Regarding the RFQ for grind and CMP tools for Silicon Carbide – does the NRL intend to provide wafers for potential contractors to perform demonstrations, or are you just looking for data from previous demonstrations?
R. NRL will provide wafers for potential contractors to perform the demonstrations.
Update #2 ·
See attached combined Synopsis/Solicitation and System Specifications.
Note; The Government is accepting offers for both new and refurbished hardware. Contractors response needs to specify whether proposing new or refurbished.
Amendment #1 extends the due date for receipt of offers from 2/7/2025 to 2/14/2025.
Update #1 ·
See attached combined Synopsis/Solicitation and System Specifications.
Note; The Government is accepting offers for both new and refurbished hardware. Contractors response needs to specify whether proposing new or refurbished.
Attachments
| File | Type | Posted |
|---|---|---|
| CSS N0017325RMB0401_wafergrinder.pdf | ||
| Grinder and CMP Tool Specifications_Attachment 1.pdf | ||
| CSS N0017325RMB04_wafergrinder.pdf |
Notice history
| Notice | Type | Posted |
|---|---|---|
| Wafer Grinder and CMP Tools | Solicitation | |
| Wafer Grinder and CMP Tools | Pre-Solicitation |
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