Wafer Grinder and CMP Tools

The Office of Naval Research (ONR) is seeking information on commercially available wafer grinding systems and chemical mechanical polisher (CMP) tools for the Naval Research Laboratory (NRL) Code 6880. The Sources Sought Notice/Request for Information (RFI) targets semiconductor manufacturing equipment capable of processing wafers between 75-150mm in diameter with specific technical requirements. Interested vendors must submit detailed capability statements not exceeding 10 pages, which should include contact information, technical capabilities, product commerciality evidence, product descriptions, and relevant past performance. The RFI will be used to assess industry's ability to provide grinding and CMP tools that can remove up to 345 micrometers from semiconductor substrates with a total thickness variation of 1 micrometer for single SiC wafers. Responses are due by January 14, 2025, and will be evaluated based on technical specifications and vendors' demonstrated capabilities in semiconductor manufacturing equipment.

This opportunity is not currently set aside for any specific small business category and falls under NAICS code 333242 for Semiconductor Machinery Manufacturing. The work will be performed at both NRL-DC and the contractor's facility, with the procurement process categorized under Product Service Code 3670 for specialized semiconductor and microcircuit manufacturing machinery. While the RFI explicitly states that it is not a solicitation and does not guarantee a future contract award, it represents a critical step in market research for potential procurement. The document does not specify a precise budget range or award value, but the technical complexity and specialized nature of the required equipment suggest a potentially significant investment. Vendors responding to the RFI should be prepared to demonstrate comprehensive technical capabilities, commerciality of their products, and past performance in semiconductor manufacturing equipment production.