Wafer bonder and lithography wafer aligner system

Ended Purchase Order Awarded

Contract number
1333ND23PNB680612
Awardee
Awarding agency
Obligated
$946,837

Award facts

Opportunity
Contract value 100% obligated
$946,837.00 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
Contracting staff
NAICS code
333242 Semiconductor Machinery Manufacturing
PSC
6640 Laboratory Equipment And Supplies
Set-aside
Total Small Business
Competition
Competed under SAP · 2 offers Simplified Acquisition
Pricing
Firm Fixed Price
Place of performance
Germany

Award details come from SAM.gov/FPDS.

About this award

The Department of Commerce's National Institute of Standards and Technology awarded a $946,837 firm fixed price purchase order to Suss Microtec Inc. of Germany. The contract calls for delivery and installation of a wafer bonder capable of substrates from 10mm to 150mm and a lithography aligner compatible with the bonder and achieving sub-micron resolution. Installation at NIST's Center for Nanoscale Science and Technology user facility is required within 60 days of each delivery, along with associated training. The solicitation sought these items through a total small business set-aside to replace aging research equipment and increase capacity. The contract furthers NIST's mission to develop measurement science, standards, and technology to enhance productivity, facilitate trade, and improve quality of life.

Quick answers

Who was awarded contract 1333ND23PNB680612?

1333ND23PNB680612 was awarded to Suss Microtec Inc. by National Institute of Standards and Technology (Department of Commerce) on September 19, 2023.

How much is contract 1333ND23PNB680612 worth?

The government has obligated $946,837 on 1333ND23PNB680612.

Was contract 1333ND23PNB680612 competed?

The extent of competition for 1333ND23PNB680612 was competed under sap. The government received 2 offers. It was set aside: Total Small Business.

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