Service contract/flip chip bonders

Synopsis:

NASA/NSSC has a requirement for SERVICE CONTRACT COVERING FLIP CHIP BONDERS. 

NASA/NSSC intends to issue a sole source contract to JB TECHNICAL SUPPORT SERVICES. under the authority of FAR 13.106-1(b)(1)(i). It has been determined that JB TECHNICAL SUPPORT SERVICES is the manufacturer of the instruments already in place and therefore, the only vendor capable of providing the maintenance services.

NASA/NSSC will be the procuring center for this effort.  Performance will be located at NASA/ Goddard Space Flight Center (GSFC).

The Government intends to acquire commercial items and services using the provisions, clauses and procedures prescribed in FAR Part 12 and FAR Part 13.

The NAICS Code for this procurement is 811219

Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact not later than 11:59 am EDT on April 4, 2022. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government.

Oral communications are not acceptable in response to this notice.

NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at http://prod.nais.nasa.gov/pub/pub_library/Omb.html .