Purchase Order 80NSSC22PA564

The National Institute of Standards and Technology (NIST), a civilian agency within the Department of Commerce, has awarded a firm-fixed-price purchase order to Finetech for the purchase of an automated flip-chip die bonder and extended warranty. The contract award, valued at $643,110, does not have a set-aside designation. The contract was issued under a pre-solicitation notice (NIST-SS24-CHIPS-0021) seeking proposals for a fully automated flip-chip die bonder capable of precise placement and...

<p>This is a firm fixed-price purchase order awarded by a U.S. government agency to Kulicke and Soffa Industries, Inc. for the delivery of a wedge bonder, microscope kit for 4500 series bonders, and an adjustable height rotary heated workhold, with a total ceiling value of $24,160.00. The contract has an ultimate completion date of December 7, 2005 and was awarded on September 29, 2005. The place of performance is Pennsylvania, USA. No set-aside designation was used for this contract.</p>

This is a firm-fixed-price purchase order awarded by the U.S. Air Force to Finetech, a leading equipment manufacturer for sub-micron die bonding and advanced SMD rework. The contract, valued at $118,450.00, is for the delivery of a FINEPLACER MANUAL LAMBDA DIE-BONDER. The award does not have a set-aside designation. Finetech has previously provided equipment to the Department of Justice Federal Bureau of Investigation and the National Aeronautics and Space Administration Shared Services Center...

This is a sole-source, firm-fixed-price purchase order awarded by the Department of the Navy's Naval Information Warfare Center (NIWC) Pacific to F&amp;K Delvotec Inc., a foreign-owned for-profit organization, for various wire bonding equipment items. The contract has a potential value of $276,753.73 and a completion date of July 23, 2024. The required items include an automatic wire bonder, heat controller, heated work stage and vacuum, visual tool inspection kit, and a deep access wedge bond...

This $31,270 firm-fixed-price purchase order was awarded by the Shared Services Center of the National Aeronautics and Space Administration (NASA) to JB Technical Support Service LLC, a self-certified small disadvantaged business, for maintenance of FC150 and FC300 flip chip bonders. The contract has an ultimate completion date of April 30, 2025. JB Technical has previously provided maintenance, extended warranties, and preventative upkeep for NASA's and the Department of Commerce's flip chip...

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This is a firm fixed-price purchase order contract awarded by the U.S. Navy's NAVSUP Engineering Logistics Office to Luna Technical Sales LTD, a veteran-owned limited liability company, for preventative maintenance and training services on a Questar Q7700 Automatic Gold Ball Bonder. The total ceiling value of the contract is $94,128.00 and it runs from June 22, 2022 through June 21, 2027. The contract was not set aside for any specific business category. The requested services include regular...

<p>This is a firm fixed-price purchase order contract awarded by the Goddard Space Center, a civilian agency, to F &amp; K Delvotec Inc., a for-profit foreign-owned company, for a bonder machine bondhead, gold ball bond head, pattern recognition software, and digital generator. The total ceiling value of the contract is $147,742.34, and the ultimate completion date is August 30, 2015. The contract is not associated with a set-aside program.</p>

This is a firm fixed-price purchase order awarded by the National Institute of Standards and Technology (NIST), a civilian agency, to West Bond, Inc., a veteran-owned small business manufacturer of semiconductor wire bonding machines and accessories. The contract is for the purchase of a wire bond station, with a total potential value of $117,932.00 and a performance completion date of January 31, 2017. West Bond, Inc. has previously received multiple federal contract awards from agencies such...